WO2013032216A3 - 이미지 센서의 단위 화소 및 수광 소자 - Google Patents
이미지 센서의 단위 화소 및 수광 소자 Download PDFInfo
- Publication number
- WO2013032216A3 WO2013032216A3 PCT/KR2012/006882 KR2012006882W WO2013032216A3 WO 2013032216 A3 WO2013032216 A3 WO 2013032216A3 KR 2012006882 W KR2012006882 W KR 2012006882W WO 2013032216 A3 WO2013032216 A3 WO 2013032216A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light receiving
- receiving portion
- shaped groove
- oxidized layer
- drain
- Prior art date
Links
- 230000005641 tunneling Effects 0.000 abstract 3
- 230000005684 electric field Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
- H01L27/14616—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
빛을 흡수하는 수광 소자는, 일정 각도의 V형 홈이 형성되는 기판, V형 홈의 상부에 플로팅된 구조로 형성되어 빛이 입사되는 수광부, 수광부와 상기 V형 홈 사이에 형성되고 터널링이 발생하는 산화막, V형 홈의 일측의 경사면에 산화막과 인접하여 형성되고, 산화막을 경계로 수광부와 이격되는 소스, V형 홈의 타측의 경사면에 산화막과 인접하여 형성되고, 산화막을 경계로 수광부와 이격되는 드레인 및 소스와 드레인 사이에서 V형 홈을 따라 형성되어, 소스와 드레인 간에 전류의 흐름을 형성하는 채널을 포함하되, 수광부에 입사된 빛에 의해 수광부에서 전자-정공쌍이 생성되고, 소스 또는 드레인 중 하나 이상과 수광부의 사이에서 산화막에서의 집중된 전계에 의한 터널링이 발생하고, 전자-정공쌍의 전자는 터널링에 의해 수광부로부터 소스 또는 드레인 중 하나 이상으로 방출되어, 전자의 방출에 의한 수광부의 전하량의 변화에 의해 채널의 전류 흐름이 제어된다.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280040524.2A CN103828052B (zh) | 2011-09-02 | 2012-08-29 | 图像传感器的单位像素及其光电探测器 |
JP2014528274A JP6015976B2 (ja) | 2011-09-02 | 2012-08-29 | イメージセンサーの単位画素及びその受光素子 |
EP12828199.5A EP2752877B1 (en) | 2011-09-02 | 2012-08-29 | Unit pixel and light receiving element for image sensor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/225,070 | 2011-09-02 | ||
US13/225,070 US8610234B2 (en) | 2011-09-02 | 2011-09-02 | Unit pixel of image sensor and photo detector thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013032216A2 WO2013032216A2 (ko) | 2013-03-07 |
WO2013032216A3 true WO2013032216A3 (ko) | 2013-05-02 |
Family
ID=47752412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/006882 WO2013032216A2 (ko) | 2011-09-02 | 2012-08-29 | 이미지 센서의 단위 화소 및 수광 소자 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8610234B2 (ko) |
EP (1) | EP2752877B1 (ko) |
JP (1) | JP6015976B2 (ko) |
KR (1) | KR101377649B1 (ko) |
CN (1) | CN103828052B (ko) |
TW (1) | TWI499050B (ko) |
WO (1) | WO2013032216A2 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8653618B2 (en) * | 2011-09-02 | 2014-02-18 | Hoon Kim | Unit pixel of color image sensor and photo detector thereof |
US9391189B2 (en) | 2012-09-16 | 2016-07-12 | Sensor Electronic Technology, Inc. | Lateral/vertical semiconductor device |
US9660038B2 (en) | 2012-09-16 | 2017-05-23 | Sensor Electronic Technology, Inc. | Lateral/vertical semiconductor device |
US9166048B2 (en) * | 2012-09-16 | 2015-10-20 | Sensor Electronic Technology, Inc. | Lateral/vertical semiconductor device |
KR101626121B1 (ko) * | 2013-12-13 | 2016-06-13 | 주식회사 비욘드아이즈 | 이미지 센서의 단위 화소 |
CN104218043B (zh) * | 2014-09-05 | 2018-03-16 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
JP6484513B2 (ja) | 2014-10-08 | 2019-03-13 | 株式会社テクノロジーハブ | 画像センサ |
US9735188B2 (en) | 2015-01-15 | 2017-08-15 | Hoon Kim | Image sensor with solar cell function |
MY174333A (en) * | 2015-10-14 | 2020-04-08 | Hoon Kim | Image sensor with solar cell function |
MY176378A (en) * | 2015-10-14 | 2020-08-04 | Hoon Kim | Image sensor with solar cell function and electronic device thereof |
CN106331541B (zh) * | 2016-09-18 | 2019-06-21 | 首都师范大学 | 可收集寄生光生电荷的图像传感器 |
US10530334B2 (en) * | 2018-05-10 | 2020-01-07 | Globalfoundries Singapore Pte. Ltd. | Acoustic wave filter formed on a V-groove topography and method for producing the same |
CN108766973B (zh) * | 2018-05-31 | 2020-09-08 | 广州锋尚电器有限公司 | 增强型cmos传感器发光二极管单元结构 |
KR102593949B1 (ko) * | 2018-07-25 | 2023-10-27 | 삼성전자주식회사 | 이미지 센서 |
CN113743152B (zh) * | 2020-05-27 | 2024-04-16 | 京东方科技集团股份有限公司 | 纹路识别装置 |
Citations (4)
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JPH11312798A (ja) * | 1998-04-28 | 1999-11-09 | Seiko Instruments Inc | リニアイメージセンサ |
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-
2011
- 2011-09-02 US US13/225,070 patent/US8610234B2/en active Active
-
2012
- 2012-01-06 KR KR1020120002153A patent/KR101377649B1/ko active IP Right Grant
- 2012-08-29 CN CN201280040524.2A patent/CN103828052B/zh active Active
- 2012-08-29 JP JP2014528274A patent/JP6015976B2/ja active Active
- 2012-08-29 EP EP12828199.5A patent/EP2752877B1/en active Active
- 2012-08-29 WO PCT/KR2012/006882 patent/WO2013032216A2/ko unknown
- 2012-08-31 TW TW101131889A patent/TWI499050B/zh active
Patent Citations (4)
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JPH11312798A (ja) * | 1998-04-28 | 1999-11-09 | Seiko Instruments Inc | リニアイメージセンサ |
KR20050054059A (ko) * | 2003-12-03 | 2005-06-10 | 전자부품연구원 | 나노 사이즈의 전자채널을 이용한 고감도 이미지 센서 및그 제조방법 |
KR100558527B1 (ko) * | 2003-12-03 | 2006-03-10 | 전자부품연구원 | 고감도 이미지 센서 및 그 제조방법 |
KR20090043737A (ko) * | 2007-10-30 | 2009-05-07 | 플래닛팔이 주식회사 | 씨모스 이미지 센서의 단위 픽셀 |
Also Published As
Publication number | Publication date |
---|---|
KR101377649B1 (ko) | 2014-03-25 |
JP6015976B2 (ja) | 2016-10-26 |
TW201314880A (zh) | 2013-04-01 |
EP2752877A2 (en) | 2014-07-09 |
CN103828052B (zh) | 2016-07-20 |
KR20130025791A (ko) | 2013-03-12 |
EP2752877A4 (en) | 2015-07-01 |
US8610234B2 (en) | 2013-12-17 |
US20130056709A1 (en) | 2013-03-07 |
EP2752877B1 (en) | 2019-11-20 |
WO2013032216A2 (ko) | 2013-03-07 |
TWI499050B (zh) | 2015-09-01 |
CN103828052A (zh) | 2014-05-28 |
JP2014527307A (ja) | 2014-10-09 |
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