WO2013008435A1 - 回路モジュール - Google Patents
回路モジュール Download PDFInfo
- Publication number
- WO2013008435A1 WO2013008435A1 PCT/JP2012/004400 JP2012004400W WO2013008435A1 WO 2013008435 A1 WO2013008435 A1 WO 2013008435A1 JP 2012004400 W JP2012004400 W JP 2012004400W WO 2013008435 A1 WO2013008435 A1 WO 2013008435A1
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- WIPO (PCT)
- Prior art keywords
- circuit
- substrate
- filter element
- module
- duplexer
- Prior art date
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
Definitions
- the present invention relates to a circuit module including a duplexer having a first filter element and a second filter element having different pass bands.
- a front end module such as an antenna switch including a duplexer that demultiplexes transmission signals and reception signals having different frequencies.
- the first and second filter units 503 and 505 having different signal passbands are arranged close to each other so that the characteristics of the filter units 503 and 505 are not deteriorated.
- the duplexer 500 with improved performance is mounted on a module substrate included in the circuit module, thereby reducing the size and performance of the circuit module.
- a conventional duplexer 500 shown in FIG. 6 has a package structure, and includes a package substrate 501 made of a resin, ceramic, or polymer material such as a printed circuit board, an LTCC substrate, an alumina substrate, a glass substrate, or a composite material substrate, and a package.
- a first filter portion 503 and a second filter portion 505 provided on the mounting surface of the substrate 501 are provided.
- the first and second filter sections 503 and 505 are chips as SAW (surface acoustic wave) filter elements 502 and 504 and peripheral circuit elements that complement the electrical characteristics of the SAW filter elements 502 and 504, respectively.
- Passive elements such as an inductor 506 and a chip capacitor 507 are provided.
- Each of the SAW filter elements 502 and 504 mounted on the duplexer 500 shown in FIG. 6 includes an element substrate made of a piezoelectric body provided with a comb electrode in a predetermined region on one main surface, and comb teeth of the element substrate.
- An airtight sealing frame provided to surround a predetermined region where the electrode is provided, and a base substrate (cover layer) laminated on one main surface of the element substrate via the airtight sealing frame, The tooth electrode is enclosed in an airtight space formed between the element substrate and the base substrate and surrounded by an airtight sealing frame.
- the comb-tooth electrode (piezoelectric body) disposed in the airtight space properly excites, so that the surface acoustic wave generated by the input of the signal normally transmits the surface of the element substrate, Deterioration of the comb electrode disposed in the airtight space is prevented.
- a boundary part 508 between the first filter unit 503 and the second filter unit 505 is used.
- the adjacent chip inductors 506 are arranged on the package substrate 501 so that the directions of the magnetic fluxes are substantially orthogonal to each other. With this configuration, even when the filter units 503 and 505 are arranged close to each other, signal interference between the first and second filter units 503 and 505 is prevented, and the characteristics of the filter units 503 and 505 are changed. Reduced.
- the conventional duplexer 500 with reduced size and higher performance is mounted on the module substrate, and the first and second filter sections 503 and 505 of the duplexer 500 are respectively used as a transmission filter and a reception filter.
- a circuit module such as an antenna switch is formed.
- JP 2006-279604 A paragraphs 0022 to 0025, FIG. 1, etc.
- the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a technique capable of further reducing the height and size of a circuit module including a duplexer.
- a circuit module includes an element substrate, an insulating layer disposed so as to surround a predetermined region of one main surface of the element substrate, and a stacked arrangement on the insulating layer.
- a cover layer forming a space surrounded by the insulating layer with the element substrate; a first filter element and a second filter element having different pass bands; and the first and second filters.
- the second circuit element may be a chip component mounted on a mounting surface of the module substrate (claim 2).
- circuit elements having large values such as a resistance value, an inductance value, and a capacitance value can be easily provided in the circuit module.
- the second circuit element includes a circuit pattern in the module substrate, and the chip component and the circuit pattern are arranged so as to overlap in a plan view (Claim 3).
- the second circuit element may be formed by a circuit pattern in the module substrate (claim 4).
- the duplexer and the circuit pattern may be arranged so as to overlap in a plan view (Claim 5).
- the second circuit element can be arranged below the mounting position of the duplexer and the module substrate can be miniaturized, so that the circuit module can be miniaturized.
- a shield electrode disposed between the duplexer and the second circuit element is provided on the module substrate (Claim 6). With such a structure, it is possible to prevent the second circuit element and the first circuit element or the first and second filter elements from interfering with each other due to electromagnetic coupling or capacitive coupling.
- first and second circuit elements may be arranged without overlapping in a plan view (Claim 7). With this structure, it is possible to prevent the first and second circuit elements from interfering with each other due to electromagnetic coupling or capacitive coupling.
- each of the first and second circuit elements may be disposed immediately below the first filter element and connected to the first filter element (claim 8).
- the first circuit element may be formed by a circuit pattern in the cover layer (claim 9).
- the duplexer is very practical because the first circuit element is provided on the cover layer and does not increase in height.
- the element substrate is formed of a piezoelectric body, and the first and second filter elements are SAW filter elements formed by providing comb electrodes in the predetermined region, respectively.
- One circuit element is a resonator for adjusting the attenuation characteristic of a filter formed by a coil, and may be connected to the first or second filter element.
- the second circuit element forms a matching circuit, and the second circuit element is connected to an input side or an output side of each of the first and second filter elements.
- Good (claim 11).
- the second circuit element can be easily formed by a coil having a large inductance value, which is very practical and efficient.
- the first filter element and the second filter element having different pass bands in a predetermined region of the element substrate are formed in the space formed by being surrounded by the insulating layer between the element substrate and the cover layer. Since the duplexer is not provided with a package substrate as in the prior art, the circuit module formed by mounting the duplexer on the module substrate is further reduced in height and size. Can do.
- FIG. 1 is a diagram showing a first embodiment of a circuit module including a duplexer according to the present invention.
- FIG. 2 is a block diagram showing the internal configuration of the circuit module of FIG. In FIGS. 1 and 2, only main components according to the present invention are shown, and other components are not shown. 3 to 5 showing the first to fourth embodiments described later are also illustrated in the same manner as in FIG. 1, and the description thereof will be omitted below.
- circuit module The circuit module 1 shown in FIGS. 1 and 2 is mounted on a mother board provided in a communication portable terminal such as a mobile phone or a portable information terminal.
- a transmission filter element 14 and a reception filter element 15 are provided.
- a duplexer 10, a module substrate 2, a matching circuit 3, a shield electrode 4, and various components (not shown) such as a switch IC, a filter, a resistor, a capacitor, and a coil are provided as a high-frequency antenna switch module Is formed.
- Components such as the duplexer 10 and the chip coil 3 a are mounted on the electrode 2 b provided on the mounting surface 2 a of the module substrate 2, and the module substrate 2 is connected via the internal wiring pattern 5 provided on the module substrate 2.
- various signal lines and power lines such as the antenna line ANT, the ground line GND, the transmission signal line Tx, and the reception signal line Rx provided in the mother board, and the circuit module 1 are arranged.
- transmission / reception signals are input / output between the mother board and the circuit module 1.
- the module substrate 2 is integrally formed as a ceramic laminate by laminating and firing a plurality of dielectric layers formed of ceramic green sheets. That is, the ceramic green sheet forming each dielectric layer is a sheet in which a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent is formed into a sheet by a molding machine. So that it can be fired at a low temperature. Then, via holes are formed on the ceramic green sheet cut into a predetermined shape by laser processing, etc., and the formed via holes are filled with a conductive paste containing Ag, Cu, etc. Via conductors are formed, various electrode patterns are formed by printing with a conductive paste, and each dielectric layer is formed.
- a wiring pattern for connecting the duplexer 10 mounted on the module substrate 2 and components such as the chip coil 3a to the module substrate 2 5, the shield electrode 4, the mounting electrode 6, and the like are formed. That is, the electrode pattern and the via conductor are appropriately provided in each dielectric layer to form the shield electrode 4, the wiring pattern 5, the mounting electrode 6, and the like, so that the duplexer 10 mounted on the module substrate 2 and Components such as the chip coil 3a and the mounting electrode 6 are electrically connected to each other.
- circuit elements such as capacitors and coils are formed by the electrode patterns and via conductors formed in each dielectric layer, and filter circuits and matching circuits are formed by the formed circuit elements such as capacitors and coils. 3 or the like may be formed.
- the matching circuit 3 is formed by a chip coil 3a (corresponding to the “second circuit element” of the present invention) that is a chip component mounted on the mounting surface 2a of the module substrate 2, and is output on the output side of the transmission filter element 14. And connected to the input side of the reception filter element 15 via the common terminal 17 c of the duplexer 10.
- the shield electrode 4 is provided on the mounting surface 2a of the module substrate 2 and is electrically connected to the ground line GND.
- the duplexer 10 has a wafer level-chip size package (WL-CSP) structure, an element substrate 11, an insulating layer 12, a cover layer 13, and a transmission filter element 14 and a reception that have different high-frequency signal pass bands.
- a filter element 15 and a resonator 16 provided in the cover layer 13 are provided.
- the element substrate 11 is formed of a piezoelectric body such as lithium niobate, lithium tantalate, or quartz.
- comb electrodes 14a and 15a IDT electrodes
- comb electrodes 14a and 15a IDT electrodes
- Al, Cu, or the like are provided in a predetermined region of one main surface 11a of the element substrate 11 to constitute a SAW (surface acoustic wave) filter element.
- the SAW filter element constituted by the comb electrodes 14a and 15a is used to respectively transmit and receive the transmission filter element 14 (corresponding to the “first filter element” of the present invention) and the reception filter element 15 (“second filter of the present invention” Corresponding to “element”).
- the duplexer 10 includes a transmission terminal 17 a connected to the input side of the transmission filter element 14, a reception terminal 17 b connected to the output side of the reception filter element 15, and the output side and reception of the transmission filter element 14.
- a common terminal 17c (antenna terminal) connected to the input side of the filter element 15 and a ground terminal 17d are provided.
- the reception filter element 15 has a balanced output type reception filter.
- a terminal electrode 14b connected to the comb electrode 14a forming the transmission filter element 14 and a terminal connected to the comb electrode 15a forming the reception filter element 15 are provided on one main surface 11a of the element substrate 11.
- An electrode 15b is provided on one main surface 11a of the element substrate 11.
- the insulating layer 12 is disposed so as to surround a predetermined area where the comb electrodes 14a and 15a of the one main surface 11a of the element substrate 11 are provided.
- the insulating layer 12 is formed by forming a resin layer on one main surface 11a of the element substrate 11 provided with the comb electrodes 14a and 15a and the terminal electrodes 14b and 15b by using a photosensitive epoxy resin or polyimide resin. Later, through a photolithography process, the resin layer is removed from the predetermined region where the comb electrodes 14a and 15a are provided and the region of the terminal electrodes 14b and 15b.
- the cover layer 13 is laminated on the insulating layer 12 to form a space surrounded by the insulating layer 12 between the cover layer 13 and the element substrate 11, and the comb electrodes 14a and 15a (transmission filter elements) are formed in the formed space. 14 and the reception filter element 15) are arranged.
- a resonator 16 is provided by a coil 16a formed by a circuit pattern provided in the inner layer.
- the resonator 16 is connected to the transmission filter element 14 composed of a SAW filter element, and the attenuation characteristic of the transmission filter element 14 is adjusted by arbitrarily forming an attenuation pole.
- the cover layer 13 is formed by laminating a resin layer made of a photosensitive epoxy resin or polyimide resin on the insulating layer 12, and forming an electrode pattern for forming the coil 16a on the laminated resin layer. After forming the electrodes 14c and 15c connected to the terminal electrodes 14b and 15b by filling the connection holes formed in the resin layer with Cu or Al paste or via fill plating, the resin layer is formed.
- the duplexer 10 is formed by forming mounting solder balls 14d and 15d on the electrodes 14c and 15c that are connected to the connection terminals 14b and 15b and exposed from the cover layer 13, respectively.
- the transmission filter element 14 and the reception filter element 15 included in the duplexer 10 are formed by SAW filter elements.
- the element substrate 11 from, for example, a Si substrate, the transmission filter element is formed.
- 14 and the reception filter element 15 may be formed of BAW filter elements.
- via holes are formed on a ceramic green sheet formed in a predetermined shape with a laser or the like, and a conductor paste is filled inside or via fill plating is performed to form a via conductor (wiring pattern 5) for interlayer connection.
- Electrode patterns such as the mounting electrode 2a on the mounting surface 2a, the shield electrode 4, the land-like wiring pattern 5 and the mounting electrode 6 are printed with a conductive paste to form each dielectric layer constituting the module substrate 2.
- a ceramic green sheet is prepared. Each ceramic green sheet is provided with a plurality of via conductors and electrode patterns so that a large number of module substrates 2 can be formed at a time.
- each dielectric layer is laminated to form a laminate.
- substrate 2 after baking is formed so that the area
- the assembly of the module substrates 2 is formed by firing the laminate at a low temperature.
- the mounting surface 2a is filled with a mold resin, and this is heated and cured, whereby a mold layer (not shown) is provided on each module substrate 2 to form an assembly of circuit modules 1.
- the assembly of the circuit modules 1 is divided individually to complete the circuit module 1.
- the transmission signal output from the transmission signal line Tx of the mother board to the transmission terminal 17a of the duplexer 10 via the mounting electrode 6 and the internal wiring pattern 5 is transmitted as a transmission filter.
- the signal is input to the element 14, subjected to a predetermined filtering process, output from the common terminal 17 c to the module substrate 2 side, and the antenna line ANT of the mother substrate via the internal wiring pattern 5 (matching circuit 3) and the mounting electrode 6. Is output.
- a reception signal input from the antenna line ANT of the mother board to the common terminal 17c of the duplexer 10 via the mounting electrode 6 and the internal wiring pattern 5 (matching circuit 3) is input to the reception filter element 15.
- a predetermined filtering process is performed, and the signal is output from the reception terminal 17 b to the module substrate 2 side, and then output to the reception signal line Rx of the mother substrate via the internal wiring pattern 5 and the mounting electrode 6.
- the module substrate 2 provided with the internal wiring pattern 5 and the circuit module 1 including the duplexer 10 having the WL-CSP structure are not limited to the above-described manufacturing method, and may be formed by a known general manufacturing method.
- the module substrate 2 can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc. using resin, ceramic, polymer material, etc. What is necessary is just to select the optimal material suitably according to the intended purpose of the module 1, and to form the module board
- the duplexer 10 mounted on the module substrate 2 includes the cover layer 13 on the insulating layer 12 disposed so as to surround a predetermined region of the one main surface 11a of the element substrate 11. It is formed by stacking. In the space formed by being surrounded by the insulating layer 12 between the element substrate 11 and the cover layer 13, the transmission filter element 14 and the reception band having different pass bands in a predetermined region of the one main surface 11 a of the element substrate 11. A filter element 15 is provided.
- the duplexer 10 does not include a package substrate as in the prior art, the circuit module 1 formed by mounting the duplexer 10 on the module substrate 2 is further reduced in height and size. Can do.
- Circuit elements such as a coil 16a that forms the resonator 16 connected to the transmission filter element 14 and a chip coil 3a that forms a matching circuit connected to the common terminal 17c of the transmission filter element 14 and the reception filter element 15 are Conventionally, it is provided on the package substrate provided in the duplexer 10.
- the coil 16a and the chip coil 13a are respectively distributed on the cover layer 13 and the module substrate 2 of the duplexer 10, thereby providing a large-scale demultiplexing having a large-area package substrate. Even if the device 10 is not used, the coil 16a and the chip coil 13a can be arranged apart from each other, and the coil 16a and the chip coil 13a can be prevented from interfering with each other by electromagnetic coupling.
- the inductance value is relatively small as compared with the chip coil 3 a forming the matching circuit 3, the coil 16 a having a large influence on the transmission filter element 14 due to the parasitic inductance parasitic on the wiring pattern 5 is replaced by the duplexer 10. Since the cover layer 13 is provided, the transmission filter element 14 and the coil 16a can be arranged close to each other, and the parasitic inductance generated in the wiring pattern 5 from the coil 16a to the transmission filter element 14 has an influence on the transmission filter element 14. Is practical because it can be reduced.
- the chip coil 3 a for forming the matching circuit 3 having a relatively large inductance value is provided in a circuit element arrangement space as compared with the cover layer 13 of the duplexer 10. Since it is provided on the module substrate 2 having a margin, the degree of freedom in designing the circuit module 1 can be increased.
- the matching circuit 3 formed by mounting the chip coil 3a on the mounting surface 2a of the module substrate 2 is connected to the output side and the input side of the transmission filter element 14 and the reception filter element 15, respectively. Since 3a is provided on the module substrate 2 having a sufficient space for arranging circuit elements, for example, the matching circuit 3 can be easily formed in the circuit module 1 with a practical configuration by the chip coil 3a having a large inductance value. Moreover, it is possible to easily cope with a design change of the circuit module 1 by exchanging chip components such as the chip coil 3a.
- the shield electrode 4 disposed between the duplexer 10 and the chip coil 3a is provided on the module substrate 2, the chip coil 3a is connected to the transmission filter element 14, the reception filter element 15, the coil 16a and the magnetic field. It is possible to prevent mutual interference by coupling or capacitive coupling.
- the coil 16a is formed by the circuit pattern in the cover layer 13, but the minimum necessary electrode pattern connected to the transmission filter 14 is formed on the cover layer 13, so that the thickness of the cover layer 13 is reduced.
- the duplexer 10 can be prevented from increasing, and the duplexer 10 is very practical because the coil 16a is not provided in a high height by being provided on the cover layer 13.
- the element substrate 11 is formed of a piezoelectric body, and the transmission filter element 14 and the reception filter element 15 are each formed by providing comb electrodes 14a and 15a in predetermined regions on one main surface 11a of the piezoelectric body. Since the resonator 16 for adjusting the attenuation characteristic of the SAW filter is connected to the transmission filter element 14, the attenuation characteristic of the transmission filter element 14 can be improved. In general, the inductance value of the coil 16a that forms the resonator 16 for adjusting the attenuation characteristic of the SAW filter element may be smaller than that of the chip coil 3a for the matching circuit 3, and so on. Even if the coil 16a is provided on the ten cover layers 13, the duplexer 10 does not increase in size and is practical.
- the chip coil 3a is mounted on the mounting surface 2a of the module substrate 2 in order to form the matching circuit 3 connected to the transmission filter element 14 and the reception filter element 15, but the transmission filter element 14 or a chip component such as a chip capacitor is mounted on the mounting surface 2a together with the chip coil 3a or in place of the chip coil 3a according to the configuration of the circuit connected to the reception filter element 15 or 14. Also good.
- the coil 16a is provided in the cover layer 13 of the duplexer 10 in order to form the resonator 16 connected to the transmission filter element 14, but the transmission filter element 14 or the reception filter element is also provided.
- a circuit pattern that forms a resistor or a capacitor may be provided in the cover layer 13 together with the coil 16a or instead of the coil 16a.
- a circuit element such as a chip component connected to the transmission filter element 14 or the reception filter element 15 may be provided in the cover layer 13 of the duplexer 10.
- FIG. 3 is a diagram showing a second embodiment of the circuit module of the present invention.
- This embodiment differs from the first embodiment described above in that the coil 103a forming the matching circuit 3 is formed by a circuit pattern in the module substrate 2 as shown in FIG. Since the configuration is the same as that of the first embodiment described above, the description of the configuration is omitted by giving the same reference numerals.
- the coil 103 a forming the matching circuit 3 is formed in the module substrate 2. Further, although the duplexer 10 and the coil 103a are arranged on the module substrate 2 so as to overlap in a plan view, the coil 16a provided on the cover layer 13 and the coil 103a provided on the module substrate 2 are planar. They are arranged without overlapping in view.
- the coil 103a can be disposed below the mounting position of the duplexer 10 and the module substrate 2 can be downsized.
- the circuit module 1 can be downsized.
- the coils 16a and 103a are arranged without overlapping in a plan view, the coils 16a and 103a can be prevented from interfering with each other due to magnetic field coupling or capacitive coupling. Thereby, the mutual interference between the transmission filter element 14 and the reception filter element 15 can also be prevented, and the isolation between the transmission and reception filters can be improved.
- the shield electrode 4 is disposed between the coil 16a provided in the cover layer 13 and the coil 103a provided in the module substrate 2, the coil 103a is provided with the coil 16a, the transmission filter element 14, and the reception. It is possible to prevent mutual interference by magnetic field coupling or capacitive coupling to the filter element 15.
- the shield electrode 4 may be connected to a ground electrode formed on the inside of the module substrate 2 or on the back surface facing the mounting surface 2a of the module substrate 2.
- the coil 103a is provided in the module plate 2 in order to form the matching circuit 3 connected to the transmission filter element 14 and the reception filter element 15, but the transmission filter element 14 or the reception filter Depending on the configuration of the circuit connected to the element 15, a circuit pattern that forms a resistor or a capacitor may be provided in the module substrate 2 together with the coil 103a or instead of the coil 103a.
- FIG. 4 is a diagram showing a third embodiment of the circuit module of the present invention.
- this embodiment differs from the first embodiment described above in that a coil 103a is provided in the module substrate 2, and the matching circuit 3 is formed by the chip coil 3a and the coil 103a.
- the chip coil 3a and the coil 103a are arranged so as to overlap each other in plan view, and the other configurations are the same as those in the first embodiment described above. Description of is omitted.
- the chip coil 3a can be reduced in size by combining the chip coil 3a and the coil 103a to form the matching circuit 3, and the chip coil 3a and the coil 103a are arranged so as to overlap in plan view. Since the occupied area in the circuit module 1 of 3a and the coil 103a can be reduced, the circuit module 1 can be reduced in size.
- the matching circuit 3 is formed by the chip coil 3a and the coil 103a in the module substrate 2.
- a circuit different from the matching circuit 3 connected to the transmission filter element 14 or the reception filter element 15 may be configured by the coil 103a.
- a circuit pattern for forming a resistor or a capacitor is formed in the module substrate 2 together with the coil 103a or in place of the coil 103a. It may be provided.
- FIG. 5 is a diagram showing a fourth embodiment of the circuit module of the present invention.
- this embodiment differs from the second embodiment described above in that the coil 16a provided in the cover layer 13 and the coil 103a provided in the module substrate 2 are each of the transmission filter element 14.
- the other configuration is the same as that of the first and second embodiments described above, and the same reference numerals are used to describe the configuration. Omitted.
- the same effects as those of the first embodiment described above can be achieved, and the following effects can be achieved. That is, since the coil 16a provided in the cover layer 13 and the coil 103a provided in the module substrate 2 are respectively disposed immediately below the transmission filter element 14 and connected to the transmission filter element 14, the transmission filter element 14 Can be prevented from leaking to the reception filter element 15, and the isolation characteristics of the transmission filter element 14 and the reception filter element 15 can be improved.
- the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention.
- the first filter element of the present invention is formed by the transmission filter element 14 and the second filter element of the present invention is formed by the reception filter element 15, but the first and second filters The elements may be formed by the reception filter element 15 and the transmission filter element 14, respectively.
- the shield electrode 4 described above is not necessarily provided, and the first circuit element and the second circuit element are arranged by separating the first circuit element and the second circuit element sufficiently apart from the conventional one. It is possible to prevent the circuit elements from interfering with each other by magnetic field coupling or capacitive coupling.
- the circuit module in which one duplexer is mounted on the module substrate has been described as an example.
- two or more duplexers are mounted on the module substrate to form a circuit module.
- a switch IC may be mounted on the module substrate, and the duplexer to be used may be selected and switched by the switch IC from a plurality of duplexers mounted on the module substrate.
- the first and second filter elements are arranged in the same space, but two spaces surrounded by an insulating layer are formed between the element substrate and the cover layer, and each space is formed. The first and second filter elements may be arranged respectively.
- the duplexer formed as the WL-CSP integrally including the first and second filter elements has been described as an example. However, a plurality of element substrates, cover layers, and insulating layers are described. In this case, an element having a WL-CSP structure in which a first filter element is arranged in a space surrounded by an insulating layer formed between the element substrate and the cover layer may be formed. Two WL-CSP structure elements in which a second filter element is arranged in a space surrounded by an insulating layer formed between the element substrate and the cover layer are prepared. You may comprise the splitter of this invention by mounting in a board
- the present invention can be widely applied to circuit modules including a duplexer having a first filter element and a second filter element having different pass bands.
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- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
本発明の分波器(デュプレクサ)を備える回路モジュールの第1実施形態について、図1および図2を参照して説明する。図1は本発明の分波器を備える回路モジュールの第1実施形態を示す図である。図2は図1の回路モジュールの内部構成を示すブロック図である。なお、図1および図2では、本発明にかかる主要な構成のみ図示されており、その他の構成は図示省略されている。また、後で説明する第1~第4実施形態を示す図3~図5についても、図1と同様に図示されているため、以下ではその説明は省略する。
図1および図2に示す回路モジュール1は、携帯電話や携帯情報端末などの通信携帯端末が備えるマザー基板に搭載されるものであり、この実施形態では、送信フィルタ素子14および受信フィルタ素子15を有する分波器10と、モジュール基板2と、整合回路3と、シールド電極4と、スイッチICやフィルタ、抵抗、コンデンサ、コイルなどの各種の部品(図示省略)とを備え、高周波アンテナスイッチモジュールとして形成されている。
分波器10は、ウェハレベル-チップサイズパッケージ(WL-CSP)構造を有し、素子基板11と、絶縁層12と、カバー層13と、高周波信号の通過帯域が異なる送信フィルタ素子14および受信フィルタ素子15と、カバー層13に設けられた共振器16とを備えている。
次に、図1の回路モジュール10の製造方法の一例についてその概略を説明する。
次に、図3を参照して本発明の第2実施形態について説明する。図3は本発明の回路モジュールの第2実施形態を示す図である。
次に、図4を参照して本発明の第3実施形態について説明する。図4は本発明の回路モジュールの第3実施形態を示す図である。
次に、図5を参照して本発明の第4実施形態について説明する。図5は本発明の回路モジュールの第4実施形態を示す図である。
2 モジュール基板
2a 実装面
3 整合回路
3a チップコイル(第2の回路素子、チップ部品)
103a コイル(第2の回路素子)
4 シールド電極
10 分波器
11 素子基板
11a 一方の主面
12 絶縁層
13 カバー層
14 送信フィルタ素子(第1のフィルタ素子)
15 受信フィルタ素子(第2のフィルタ素子)
14a,15a くし歯電極
16 共振器
16a コイル(第1の回路素子)
Claims (11)
- 素子基板と、
前記素子基板の一方の主面の所定領域を囲繞して配置された絶縁層と、
前記絶縁層に積層配置されて前記素子基板との間に前記絶縁層により囲繞された空間を形成するカバー層と、
通過帯域が異なる第1のフィルタ素子および第2のフィルタ素子とを有し、前記第1、第2のフィルタ素子が前記空間内の前記所定領域に設けられた分波器と、
前記分波器が実装されるモジュール基板と、
前記カバー層に設けられ、前記第1のフィルタ素子または前記第2のフィルタ素子に接続される第1の回路素子と、
前記モジュール基板に設けられ、前記第1のフィルタ素子または前記第2のフィルタ素子に接続される第2の回路素子と
を備えることを特徴とする回路モジュール。 - 前記第2の回路素子は、前記モジュール基板の実装面に実装されたチップ部品であることを特徴とする請求項1に記載の回路モジュール。
- 前記第2の回路素子は、前記モジュール基板内の回路パターンを含み、
前記チップ部品および前記回路パターンが、平面視において重なるように配置されていることを特徴とする請求項2に記載の回路モジュール。 - 前記第2の回路素子は、前記モジュール基板内の回路パターンにより形成されていることを特徴とする請求項1または2に記載の回路モジュール。
- 前記分波器および前記回路パターンが、平面視において重なるように配置されていることを特徴とする請求項4に記載の回路モジュール。
- 前記分波器と前記第2の回路素子との間に配置されるシールド電極が前記モジュール基板に設けられていることを特徴とする請求項4または5に記載の回路モジュール。
- 前記第1、第2の回路素子が、平面視において重なることなく配置されていることを特徴とする請求項1ないし6のいずれかに記載の回路モジュール。
- 前記第1、第2の回路素子は、それぞれ前記第1のフィルタ素子の直下に配置されて、前記第1のフィルタ素子に接続されていることを特徴とする請求項4ないし7のいずれかに記載の回路モジュール。
- 前記第1の回路素子は、前記カバー層内の回路パターンにより形成されていることを特徴とする請求項1ないし8のいずれかに記載の回路モジュール。
- 前記素子基板は圧電体により形成されており、前記第1、第2のフィルタ素子は、それぞれ、前記所定領域にくし歯電極が設けられることにより形成されたSAWフィルタ素子であり、前記第1の回路素子は、コイルにより形成されたフィルタの減衰特性の調整用の共振器であり、前記第1または第2のフィルタ素子に接続されることを特徴とする請求項1ないし9のいずれかに記載の回路モジュール。
- 前記第2の回路素子は整合回路を形成するものであり、
前記第2の回路素子は、前記第1、第2のフィルタ素子それぞれの、入力側または出力側に接続されることを特徴とする請求項1ないし10のいずれかに記載の回路モジュール。
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JP2013523817A JP5510613B2 (ja) | 2011-07-08 | 2012-07-06 | 回路モジュール |
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JP (1) | JP5510613B2 (ja) |
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CN103636124A (zh) | 2014-03-12 |
DE112012002879B4 (de) | 2018-03-01 |
JPWO2013008435A1 (ja) | 2015-02-23 |
US20140118084A1 (en) | 2014-05-01 |
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