WO2012173238A1 - 半導体装置の製造方法及び半導体装置 - Google Patents
半導体装置の製造方法及び半導体装置 Download PDFInfo
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- WO2012173238A1 WO2012173238A1 PCT/JP2012/065400 JP2012065400W WO2012173238A1 WO 2012173238 A1 WO2012173238 A1 WO 2012173238A1 JP 2012065400 W JP2012065400 W JP 2012065400W WO 2012173238 A1 WO2012173238 A1 WO 2012173238A1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
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- G—PHYSICS
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
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- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/702—Masking faults in memories by using spares or by reconfiguring by replacing auxiliary circuits, e.g. spare voltage generators, decoders or sense amplifiers, to be used instead of defective ones
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- G—PHYSICS
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- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/88—Masking faults in memories by using spares or by reconfiguring with partially good memories
- G11C29/883—Masking faults in memories by using spares or by reconfiguring with partially good memories using a single defective memory device with reduced capacity, e.g. half capacity
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Definitions
- the present invention relates to a semiconductor device manufacturing method and a semiconductor device manufactured by the manufacturing method.
- TSV Through Silicon Via
- Patent Document 1 a semiconductor device provided with a spare through-hole electrode for relief that penetrates a stacked semiconductor chip.
- a chip stacking method in which a wafer on which a device (circuit) is formed is cut out into semiconductor chips and stacked, and a wafer that is stacked at the wafer level before cutting out into semiconductor chips.
- NAND flash memory chips may be stacked and one of them may be used as a buffer. In this way, even if there is one defective chip out of the five, the target specification can be achieved, so that it can be shipped as a product.
- NAND flash memory chips when NAND flash memory chips are stacked, it may be commercialized as a device having a storage capacity proportional to the number of stacked non-defective chips.
- the plurality of stacked semiconductor chips are electrically connected by through electrodes, so that the defective semiconductor chips are affected by the defective semiconductor chips. It may extend to. In such a case, a non-defective semiconductor chip becomes a defective product, and the semiconductor device itself becomes a defective product. Therefore, the yield of the semiconductor device is reduced.
- the present invention has been made in view of such a point, and in a semiconductor device in which a plurality of semiconductor chips are stacked, the influence of a defective semiconductor chip on other semiconductor chips is suppressed, and the yield of the semiconductor device is increased.
- the purpose is to improve.
- the present invention provides a method for manufacturing a semiconductor device, comprising a through hole forming step for forming a through hole for an electrode that penetrates in a thickness direction of a substrate on which a circuit is formed, and for the electrode.
- the through electrode and the wiring are not electrically connected, and the circuit
- a selective connection step of electrically connecting the through electrode and the wiring by bonding with a conductive material, and the through electrode and the wiring Multiple substrates with formed It is characterized by having a lamination step of the layer, the.
- a substrate and a device such as a circuit formed on the substrate constitute a semiconductor chip.
- the defective product circuit since the through electrode and the wiring are not electrically connected, the defective product circuit and the through electrode are not electrically connected.
- the non-defective circuit since the through electrode and the wiring are electrically connected by bonding with a conductive material, the non-defective circuit and the through electrode are electrically connected.
- a defective semiconductor chip hereinafter sometimes referred to as “defective product chip” and a non-defective semiconductor chip (hereinafter also referred to as “good product chip”) are electrically separated. Therefore, the influence of defective chips does not reach other good chips. Therefore, even if there is a defective chip, the semiconductor device can be made non-defective and the yield of the semiconductor device can be improved.
- Another aspect of the present invention is a semiconductor device, in which a circuit is formed and a plurality of substrates formed by penetrating through-holes for electrodes in the thickness direction are stacked, and a conductive material is placed in the through-holes for electrodes.
- a through electrode that penetrates the plurality of stacked substrates is formed, connected to the circuit, not connected to the through electrode, and at least a part of the through electrode is exposed to the surface of the substrate.
- the non-defective circuit determined as non-defective is characterized in that the through electrode and the wiring are electrically connected by bonding with a conductive material.
- Another aspect of the present invention is a semiconductor device, which includes a plurality of stacked substrates, a selection through electrode that is formed through the plurality of substrates and transmits a selection signal, and the plurality of substrates. And a data through electrode for transmitting a data signal, and the substrate is connected to the predetermined circuit formed on the substrate from the data through electrode based on the selection signal. A selection circuit for controlling the output of the data signal is formed.
- the substrate and devices such as a predetermined circuit and a selection circuit formed on the substrate constitute a semiconductor chip.
- the selection signal from the selection through electrode is output to the selection circuit of each substrate.
- the selection circuit can control the output of the data signal from the data through electrode to a predetermined circuit of each substrate based on the selection signal. That is, the data signal from the data through electrode can be output only to the semiconductor chip to be selected. Therefore, in the semiconductor device of the present invention, a semiconductor chip can be appropriately selected. Moreover, in the semiconductor device of the present invention, only two through electrodes, that is, the selection through electrode and the data through electrode may be formed as the through electrode. Therefore, since a semiconductor chip is selected, there is no need to form a plurality of through electrodes as in the prior art, and there is no need to connect a wire to each semiconductor chip. Therefore, the configuration of the semiconductor device can be simplified.
- a semiconductor device manufacturing method wherein a selection through hole and a data through hole penetrating in a thickness direction of a substrate are formed, and a conductive material is formed in the selection through hole.
- Filling and forming a selection through electrode for transmitting a selection signal filling the data through hole with a conductive material, forming a data through electrode for transmitting a data signal, and forming the selection signal on the substrate
- a plurality of substrates on which are formed are stacked.
- Another aspect of the present invention is a semiconductor device, comprising: a plurality of semiconductor chips including a plurality of electronic elements; and a redundancy chip including a redundant electronic element for replacing a defective electronic element of the semiconductor chip.
- a plurality of stacked semiconductor chips and redundant chips are formed, and a plurality of stacked semiconductor chips and redundant chips are formed by passing through the plurality of stacked semiconductor chips and redundant chips to transmit a positional information signal of the electronic element.
- a through-electrode for determination that transmits a determination signal output from the redundancy chip is formed through the chip, and the redundancy chip includes a defective position information recording unit in which position information of the defective electronic element is recorded.
- the electronic element in the present invention is, for example, a memory element (memory cell) or a logic element.
- the position information in the present invention is information for identifying an electronic element, for example, and is an address of the electronic element, for example.
- the redundant chip determination circuit it is determined whether or not the position information signal of the electronic element from the position information through electrode and the position information of the defective electronic element from the defective position information recording unit match. If the determination circuit determines that they match, the redundant electronic element is enabled in the redundant chip. That is, the defective electronic element of the semiconductor chip is replaced with the redundant electronic element. On the other hand, if the determination circuit determines that there is a mismatch, the semiconductor chip can operate electronic elements other than defective electronic elements based on the position information signal from the position information through electrode and the determination signal from the determination through electrode. To be.
- a defective electronic element of the semiconductor chip can be replaced with the redundant electronic element of the redundancy chip and relieved, and the good electronic element of the semiconductor chip can be operated. Therefore, the yield of the semiconductor device and the utilization efficiency in the semiconductor chip can be improved.
- Another aspect of the present invention is a method of manufacturing a semiconductor device, a semiconductor chip having a plurality of electronic elements, and a redundant chip having a redundant electronic element for replacing a defective electronic element of the semiconductor chip;
- the position information through hole and the determination through hole penetrating in the thickness direction are respectively formed, the position information through hole is filled with a conductive material, and the position information signal of the electronic element is transmitted.
- the influence of a defective semiconductor chip on other semiconductor chips can be suppressed, and the yield of the semiconductor device can be improved.
- FIG. 5 shows a method for manufacturing a defective chip according to another embodiment, wherein (a) shows a state in which two electrode through holes and two selection through holes are formed, and (b) shows two pieces of through holes for selection.
- FIG. 5A shows a state in which two through electrodes and two through holes for selection are formed
- FIG. 5B shows a mode that the insulating material was filled into the through-hole.
- FIG. 6 shows a method for manufacturing a non-defective chip according to another embodiment, in which (a) shows a wiring for connecting one electrode through hole and a circuit, and a selection is made between the other electrode through hole and the circuit.
- FIG. 9B is a diagram illustrating a state in which a through hole is formed
- FIG. 9B is an explanatory diagram illustrating a state in which a through electrode is formed in another electrode through hole and a conductive material is filled in an upper portion of the selection through hole.
- FIG. 6 shows a method for manufacturing a defective chip according to another embodiment, in which (a) shows a wiring that connects one electrode through hole and a circuit, and is selected between the other electrode through hole and the circuit.
- (B) is explanatory drawing which shows a mode that the through-electrode was formed in the other electrode through-hole, and the selection through-hole was filled with the insulating material. It is explanatory drawing in planar view which shows the outline of a structure of the device layer of the good quality chip
- FIG. 11 is an explanatory diagram showing a state where a defective memory cell is replaced with a redundant memory cell and repaired in the semiconductor device. It is explanatory drawing which shows a mode that the device layer was formed on the wafer in the semiconductor chip. It is explanatory drawing which shows a mode that the through-hole for addresses, the through-hole for determination, and the through-hole for connection were formed in the semiconductor chip.
- a device layer 11 is formed on the surface of a wafer 10 as a substrate.
- the wafer 10 and the device layer 11 constitute a semiconductor chip 12.
- a plurality of semiconductor chips 12 are formed in a horizontal plane with respect to one wafer 10.
- a wafer stacking method is used in which the wafer 10 is stacked at the wafer level before the wafer 10 is cut into the semiconductor chips 12.
- a circuit 13 and a wiring 14 are formed in the device layer 11 on the wafer 10.
- the wiring 14 has conductivity, and is a wiring for connecting the circuit 13 and a through electrode 32 described later.
- the wiring 14 itself is connected to the circuit 13, is not connected to the through electrode 32, and is formed so as to be exposed on the surface of the wafer 10.
- various circuits and wirings are formed in addition to the circuits 13 and the wirings 14.
- the through-hole 20 for electrodes and the through-hole 21 for selection are formed through the wafer 10 and the device layer 11 in the thickness direction.
- the electrode through hole 20 is a through hole for forming a through electrode 32 described later.
- the electrode through hole 20 is formed at the end of the wiring 14 (the end opposite to the circuit 13).
- the selection through hole 21 is a through hole for selecting connection or non-connection between a through electrode 32 and a circuit 13 described later.
- the selection through hole 21 is formed to divide the wiring 14 into the wiring 14.
- the electrode through hole 20 and the selection through hole 21 are simultaneously formed by, for example, a photolithography process and an etching process. That is, after a predetermined resist pattern is formed on the device layer 11 by photolithography, the device layer 11 and the wafer 10 are etched using the resist pattern as a mask to form the electrode through hole 20 and the selection through hole 21. Is done.
- the electrical characteristics of the circuit 13 are tested.
- This test is performed by various methods. For example, by bringing a probe (not shown) into contact with the electrode of the circuit 13 and applying a test signal from each probe to the circuit 13, the electrical characteristics of the circuit 13 are measured. Is inspected. This test may be performed at any timing as long as the device layer 12 is formed on the wafer 10. Therefore, the electrical characteristics of the circuit 13 may be tested before the above-described electrode through hole 20 and selection through hole 21 are formed.
- the circuit 13 determined as a non-defective product by the test of the electrical characteristics may be referred to as a non-defective circuit 13a
- the circuit 13 determined as a defective product may be referred to as a defective product circuit 13b
- the semiconductor chip 12 having the non-defective circuit 13a may be referred to as a non-defective chip 12a
- the semiconductor chip 12 having the defective circuit 13b may be referred to as a defective chip 12b.
- the non-defective chip 12 a is filled with the conductive material 30 in the electrode through holes 20, and bumps 31 are formed at both ends of the electrode through holes 20.
- a through electrode 32 is formed by the conductive material 30 and the bumps 31 in the electrode through holes 20.
- the conductive material 30 is filled in the electrode through hole 20, but the supply of the conductive material 30 is not limited to this method, and the inside of the electrode through hole 20 is conductive. Just do it.
- the conductive material 30 may be supplied to the inner side surface of the electrode through-hole 20 to form a film of the conductive material 30.
- the conductive material 40 is filled in the upper part of the selection through hole 21 and the insulating material 41 is put in the lower part of the selection through hole 21. Fill.
- the conductive material 40 is filled so as to be connected to the wiring 14.
- the through electrode 32 and the non-defective circuit 13a are electrically connected through the wiring 14 and the conductive material 40. Since the insulating material 41 is filled in the lower portion of the selection through-hole 21 as described above, even if the semiconductor chips 12 are stacked in the subsequent process, the selection is not performed between the stacked semiconductor chips 12.
- the circuit 13 is not electrically connected through the through hole 21.
- the defective chip 12b is filled with the conductive material 30 in the electrode through hole 20 as shown in FIG. 5 and FIG.
- a bump 31 is formed on the substrate.
- a through electrode 32 is formed by the conductive material 30 and the bumps 31 in the electrode through holes 20.
- the insulating material 41 is filled into the selection through-hole 21 in parallel with the formation of the through-electrode 32. Then, the wiring 14 is electrically insulated by the insulating material 41, and the through electrode 32 and the defective product circuit 13b are not electrically connected.
- the filling of the conductive material 30, 40 and the insulating material 41 into the electrode through hole 20 and the selection through hole 21 may be performed by, for example, an ink jet method.
- a plurality of nozzles may be arranged corresponding to the formation pattern of the electrode through holes 20 and the selection through holes 21, and the conductive materials 30 and 40 and the insulating material 41 may be supplied from each nozzle.
- the non-defective chip 12a and the defective chip 12b are respectively manufactured. Thereafter, as shown in FIG. 7, the non-defective chip 12a and the defective chip 12b are stacked and bonded in the vertical direction. At this time, the plurality of semiconductor chips 12 are stacked so that the through electrodes 32 are conductive, that is, the through electrodes 32 penetrate through the plurality of semiconductor chips 12.
- the semiconductor device 50 is manufactured as shown in FIG. As described above, a plurality of semiconductor chips 12 are formed in the horizontal plane of the wafer 10, and the semiconductor chips 12 are stacked in units of the wafer 10. That is, the plurality of wafers 10 are laminated at the wafer level before being cut into semiconductor chips 12.
- the semiconductor chips 12 are stacked in five layers, but the number of stacked layers can be arbitrarily set. Further, the position of the defective chip 12b in the semiconductor device 50 is not limited to the illustrated example, and the semiconductor device 50 can be made non-defective as will be described later, regardless of the layer where the defective chip 12b is arranged.
- the wafer 10 is thinned. For this reason, a support substrate (wafer or glass substrate) may be provided on the wafer 10 to support the wafer 10 for processing.
- a support substrate wafer or glass substrate
- a predetermined data signal is transmitted to the through electrode 32.
- the data signal is, for example, a signal including the address of a memory cell in the circuit 13 and data such as a memory recorded in the memory cell.
- the penetration electrode 32 and the good product circuit 13a are electrically connected, the data signal from the penetration electrode 32 is output to the good product circuit 13a.
- the through electrode 32 and the defective product circuit 13b are not electrically connected, the data signal from the through electrode 32 is not output to the defective product circuit 13b.
- the semiconductor device 50 thus operates.
- the through electrode 32 and the defective product circuit 13b are electrically connected. Not connected to.
- the conductive material 40 is filled in the upper portion of the selection through hole 21 between the through electrode 32 and the good product circuit 13a, the through electrode 32 and the good product circuit 13a are electrically connected. Since the insulating material 41 is filled in the lower portion of the selection through hole 21, the wafer 10 is interposed between the stacked semiconductor chips 12 via the selection through hole 21 even when the semiconductor chips 12 are stacked. The upper circuit 13 is not electrically connected.
- the semiconductor device 50 can be made non-defective and the yield of the semiconductor device 50 can be improved.
- the selection means for selecting connection or non-connection between the through electrode 32 and the circuit 13 can be formed by a simple method. That is, the selection through hole 21 is formed together with the other electrode through holes 20. For this reason, it is not necessary to perform the process of forming the selection through-hole 21 separately. Further, the wiring 14 may be patterned at the same time as the circuit 13 or the like. Furthermore, the filling of the conductive material 40 and the insulating material 41 into the selection through-hole 21 can be easily performed by, for example, an inkjet method. Thus, since the selection means can be formed by a simple method, the semiconductor device 50 can be manufactured efficiently.
- one electrode through hole 20 and one selection through hole 21 are formed in one semiconductor chip 12, but a plurality of these electrode through holes 20 and a plurality of selection through holes 21 are formed. May be.
- FIG. 9 shows a state where the non-defective chip 12a is manufactured
- FIG. 10 shows a state where the defective chip 12b is manufactured.
- a plurality of, for example, two electrode through holes 20 and two selection through holes 21 are formed on the non-defective chip 12a. Accordingly, two wirings 14 are also provided.
- each electrode through-hole 20 is filled with a conductive material 30, and a bump 31 is formed to form a through-electrode 32.
- the conductive material 40 is filled in the upper part of each selection through hole 21, and the insulating material 41 is filled in the lower part of the selection through hole 21. In this way, the through electrode 32 and the non-defective circuit 13a are electrically connected.
- a plurality of, for example, two electrode through holes 20 and two selection through holes 21 are formed on the defective chip 12b as shown in FIG.
- the electrode through hole 20 is filled with the conductive material 30, and the bumps 31 are further formed, whereby the through electrode 32 is formed.
- the insulating material 41 is filled into the selection through hole 21.
- the non-defective chip 12a and the defective chip 12b are stacked and joined in the vertical direction so that the two through electrodes 32 are conducted.
- the semiconductor device 50 is manufactured.
- each through electrode 32 and defective product circuit 13b are not electrically connected, and each through electrode 32 and non-defective product circuit 13a are electrically connected. For this reason, since the good chip 12a and the defective chip 12b are electrically separated, the influence of the defective chip 12b does not reach the other good chips 12a. Therefore, even if there is a defective chip 12b, the semiconductor device 50 can be made non-defective and the yield of the semiconductor device 50 can be improved.
- the two through electrodes 32 are connected through the plurality of semiconductor chips 12, even if any one of the through electrodes 32 is defective, the other through electrodes 32 can be used for relief. Therefore, the yield of the semiconductor device 50 can be further improved.
- two electrode through holes 20 and two selection through holes 21 are formed in the semiconductor chip 12, but the numbers of these electrode through holes 20 and selection through holes 21 are the same. It is not limited and 3 or more may be sufficient. However, as a result of intensive studies by the inventors, it is extremely rare that defects occur in both of the two through electrodes 32, and even when two electrode through holes 20 and two selection through holes 21 are formed, the semiconductor device It has been found that a sufficient yield of 50 can be secured.
- the conductive material 40 is filled in the upper portion of one of the two selection through holes 21 as shown in FIG.
- the insulating material 41 may be filled in the lower portion of the one selection through hole 21a, and the insulating material 41 may be filled in the other selection through hole 21b.
- the through electrode 32 is formed in one electrode through hole 20a, and the through electrode 32 is formed in the other electrode through hole 20b. You may make it not. Note that not forming the through electrode 32 in the electrode through hole 20b means a state in which at least the bump 31 is not formed.
- the selection through hole 21a connected to the through electrode 32 is filled with the conductive material 40 at the top and the insulating material at the bottom. 41 is filled.
- an insulating material 41 is filled in the selection through hole 21b connected to the electrode through hole 20b in which the through electrode 32 is not formed.
- the insulating material 41 is filled in the two through holes 21a and 21b for selection.
- the through electrodes 32 and the defective product circuit 13b are not electrically connected, and the through electrodes 32 and the good product circuit 13a are electrically connected. Therefore, the non-defective chip 12a and the defective chip 12b are electrically separated, so that the semiconductor device 50 can be made non-defective.
- FIG. 14 shows a state where the non-defective chip 12a is manufactured
- FIG. 15 shows a state where the defective chip 12b is manufactured.
- the conductive material 30 is filled into the two electrode through holes 20, and the bumps 31 are formed to form the through electrodes 32, respectively. Is done. Thereafter, as shown in FIG. 14B, the conductive material 40 is filled in the upper portion of the selection through hole 21, and the insulating material 41 is filled in the lower portion of the selection through hole 21.
- the through-electrodes 32 are formed in the two through-holes 20 for the electrodes as shown in FIG. Thereafter, as shown in FIG. 15B, the insulating material 41 is filled into the selection through-hole 21.
- each through electrode 32 and the defective product circuit 13b are not electrically connected, and each through electrode 32 and the good product circuit 13a are electrically connected. Is done. Therefore, the non-defective chip 12a and the defective chip 12b are electrically separated, so that the semiconductor device 50 can be made non-defective. Even if any one of the through electrodes 32 has a defect, the other through electrodes 32 can be used for repair. Therefore, the yield of the semiconductor device 50 can be improved.
- FIG. 16 shows a state where the non-defective chip 12a is manufactured
- FIG. 17 shows a state where the defective chip 12b is manufactured.
- a conductive wiring 60 is formed when the device layer 10 is formed on the wafer 10 as shown in FIG. Thereafter, two electrode through holes 20 and a selection through hole 21 are formed. That is, the wiring 60 is provided between the one electrode through hole 20a and the circuit 13 (non-defective circuit 13a). Further, between the other electrode through hole 20b and the circuit 13 (non-defective circuit 13a), a wiring 14 and a selection through hole 21 are provided.
- the through electrode 32 is not formed in the electrode through hole 20a, but the through electrode 32 is formed in the electrode through hole 20b.
- the conductive material 40 is filled in the upper portion of the selection through hole 21, and the insulating material 41 is filled in the lower portion of the selection through hole 21.
- the wiring 60 is formed between the one electrode through hole 20a and the circuit 13 (defective product circuit 13b). Further, between the other electrode through hole 20b and the circuit 13 (defective product circuit 13b), a wiring 14 and a selection through hole 21 are provided.
- the through electrode 32 is not formed in the electrode through hole 20a, but the through electrode 32 is formed in the electrode through hole 20b.
- the insulating material 41 is filled into the selection through hole 21.
- the through electrode 32 is not formed in the electrode through hole 20a connected to the wiring 60, so that the through electrode 32 and the defective product circuit 13b are not electrically connected. .
- the through electrode 32 formed in the electrode through hole 20b and the non-defective circuit 13a are electrically connected. Therefore, the non-defective chip 12a and the defective chip 12b are electrically separated, so that the semiconductor device 50 can be made non-defective.
- the through electrode 32 may be formed in the one electrode through hole 20a.
- the through electrode 32 may be formed in the other electrode through hole 20 b and the conductive material 40 may be filled in the upper part of the selection through hole 21.
- a through electrode 32 may be formed in another electrode through hole 20 b and the selection through hole 21 may be filled with an insulating material 41. Further, as shown in FIG.
- the through electrode 32 may not be formed in the other electrode through hole 20 b, and the insulating material 41 may be filled in the selection through hole 21. In any case, since the through electrode 32 formed in the electrode through hole 20a and the non-defective circuit 13a are electrically connected by the wiring 60, the semiconductor device 50 can be made non-defective.
- the present invention can be applied to other electronic elements such as a logic element.
- the wafer stacking method in which the wafer 10 is stacked at the wafer level before the wafer 10 is cut into the semiconductor chip 12 has been described.
- the wafer 10 is cut into the semiconductor chip 12.
- the present invention can also be applied to a chip stacking method in which the semiconductor chips 12 are stacked.
- selection of connection or non-connection between the through electrode 32 and the circuit 13 is performed by filling the selection through hole 21 with the conductive material 40 or the insulating material 41.
- the selection means may be used.
- a pair of through electrodes and a pair of vertical electrodes may be formed on the wafer 10, and wirings connecting the through electrodes and the electrodes may be selectively formed.
- FIG. 21 to FIG. 34 used in the description of the present embodiment the dimensions of the constituent elements do not necessarily correspond to the dimensions in the drawings described in the above embodiments in order to give priority to the understanding of the technology. Not done.
- bumps (not shown) used as lead electrodes are formed on the surface 11a of the device layer 11.
- the front bump 100 is formed simultaneously.
- the front bump 100 is formed so as to short-circuit the through electrode 110a and the through electrode 110b as will be described later.
- the bumps referred to here are formed even in a normal semiconductor process, so no special process is required. Note that a shared wiring 101 connected to the circuit 13 is formed in the device layer 11.
- a support substrate 170 is bonded to the surface 11a of the device layer 11 on which the front bump 100 is formed, for example, with an adhesive.
- a wafer or a glass substrate is used as the support substrate 170.
- the back surface 10b of the wafer 10 is polished to thin the wafer 10.
- illustration of the support substrate 170 provided on the device 11 side is omitted in FIG. Similarly, in FIG. 24 to FIG. 28 described later, the support substrate 170 is not shown.
- a vertical electrode 111 is formed.
- the pair of through electrodes 110 are connected to the front bump 100, and the pair of electrodes 111 are connected to the shared wiring 101.
- a through electrode connected to the outside and transmitting a signal is referred to as a through electrode 110a
- the other through electrode is referred to as a through electrode 110b.
- an electrode to which a backside wiring 150 described later is connected is referred to as an electrode 111a, and the other electrode is referred to as an electrode 111b.
- the method for forming the pair of through electrodes 110 and the pair of electrodes 111 is the same as the method for forming the electrode through hole 20 and the method for forming the through electrode 32 in the above embodiment, and thus detailed description thereof is omitted.
- the shared wiring 101 and the electrode 111 constitute a wiring in the present invention. That is, the shared wiring 101 and the electrode 111 are connected to the circuit 13, not to the through electrode 110, and at least a part is exposed on the back surface 10 b of the wafer 10.
- the vertical positions of the wafer 10 and the device layer 11 are reversed, and the plating solution 120 is supplied onto the back surface 10 b of the wafer 10.
- the back surface 10b of the wafer 10 for example, the periphery of the through electrode 110 and the electrode 111 on which plating is formed and the place where the back surface wiring 150 described later is formed are relatively compared to other places. Hydrophilized.
- the place where the back surface wiring 150 can be formed is, for example, a straight line portion connecting the through electrode 110b and the electrode 111a.
- the plating solution 120 may be supplied to the entire back surface 10b.
- the plating solution 120 is relatively supplied in this way, a current path is efficiently formed in the subsequent plating step and wiring is performed accurately. Is possible. In this relative hydrophilization, a place where plating is formed may be positively hydrophilized, or a place where other plating is not formed may be hydrophobized. Or you may perform both the said hydrophilic treatment and hydrophobic treatment. In this way, the plating solution 120 is supplied around the through electrode 110 and the electrode 111 on the back surface 10b of the wafer 10 as shown in FIG.
- the template 130 is disposed on the back surface 10b side of the wafer 10.
- the template 130 includes a base 131 having a surface facing the wafer 10 and a plurality of pairs of electrodes 132 and 133 as a pair of counter electrodes which are arranged on the surface of the base 131 and whose polarity can be switched.
- Each pair of electrodes 132 and 133 is disposed at a position corresponding to each pair of through electrodes 110 and a pair of electrodes 111. That is, the pair of first electrodes 132 corresponds to the pair of through electrodes 110, and the pair of second electrodes 133 corresponds to the pair of electrodes 111.
- a voltage is applied to each of the pair of electrodes 132 and 133, and a voltage is applied to each of the pair of through electrodes 110 and the pair of electrodes 111.
- a bridge 140 is formed between each of the electrodes 132 and 133 and the corresponding through electrode 110 and electrode 111.
- These bridges 140 are formed by the plating growing from the electrode on the cathode side among the electrodes in contact with the plating solution 120 and reaching the electrode on the opposite anode side. At this time, the bridge 140 can be efficiently formed by switching the polarities of the pair of electrodes 132 and 133 in the template 130 as necessary.
- the back surface wiring 150 is formed.
- a bias is applied to the first electrode 132 and the second electrode 133 corresponding to the through electrode 110b and the electrode 111a. Since a current path via the bridge 140 is formed between the first electrode 132 and the second electrode 133, the back surface wiring 150 is formed by plating growth during this time.
- the back surface wiring 150 that connects the through electrode 110b and the electrode 111a can be formed.
- a bias is applied only to the through electrode 110a and the electrode 111b, a current path indicated by an arrow in FIG. 27 is formed, so that the back surface wiring 150 is formed between the through electrode 110b and the electrode 111a.
- no bias is applied to the electrodes facing the through electrode 110b and the electrode 111a.
- the template 130 is evacuated as shown in FIG.
- the bridges 140 between the electrodes 132 and 133 and the corresponding through electrodes 110 and 111 are removed.
- the back surface wiring 150 is formed, and the pair of through electrodes 110, the pair of electrodes 111, and the circuit 13 are connected.
- the next wafer 10 (non-defective chip 12a in FIG. 29 is used as the non-defective chip 12a) on the wafer 10 (non-defective chip 12a) on which the back surface wiring 150 is formed.
- an inspection for discriminating between a non-defective product and a defective product is performed.
- the former wafer 10 is referred to as a first wafer 10 and the latter wafer 10 is referred to as a second wafer 10.
- the second wafer 10 is laminated on the first wafer 10 in a state where the device layer 11 is formed on the surface 10a thereof, that is, the state of the wafer 10 shown in FIG.
- the back surface 10 b of the second wafer 10 is polished and thinned, and then a pair of through electrodes 110 and a pair of electrodes 111 are formed on the second wafer 10.
- the through electrode 110 of the second wafer 10 is electrically connected to the through electrode 110 of the first wafer 10. Since the through electrode 110 and the electrode 111 are the same as the method for forming the electrode through hole 20 and the method for forming the through electrode 32 in the above embodiment, detailed description thereof is omitted.
- the template 130 is disposed on the back surface 10 b side of the second wafer 10.
- a back surface wiring 150 that connects the through electrode 110b and the electrode 111a is formed on the second wafer 10 by a method similar to the method shown in FIG. Specifically, a bias is applied only to the through electrode 110a and the electrode 111b. As a result, a current path indicated by an arrow in FIG. 30 is formed, so that the back surface wiring 150 is formed between the through electrode 110b and the electrode 111a.
- the back surface wiring 150 may be formed by a method similar to the method shown in FIG.
- the back surface wiring 150 as shown in FIG. 26 is not formed on the defective chip 12b including the defective circuit 13b determined to be defective by the electrical characteristic test.
- This electrical property test is performed by the same method as that shown in FIGS. 25 and 26 when the template 130 is disposed on the back surface 10b side of the second wafer 10.
- the non-defective chips 12a and the defective chips 12b are stacked in the vertical direction as shown in FIG.
- the plurality of semiconductor chips 12 are stacked so that the through electrode 110 is conductive, that is, the through electrode 110 penetrates the plurality of semiconductor chips 12.
- the semiconductor device 160 in which the non-defective chip 12a and the defective chip 12b are mixedly mounted is manufactured.
- the front bumps 100 of the semiconductor chips 12 other than the lowermost semiconductor chip 12 can be omitted.
- the semiconductor chip 12 is laminated in three layers, but the number of laminated layers can be arbitrarily set.
- the position of the defective chip 12b in the semiconductor device 160 is not limited to the illustrated example, and the semiconductor device 160 can be made non-defective as will be described later, regardless of the layer where the defective chip 12b is arranged.
- a predetermined data signal is transmitted to the through electrode 110.
- the data signal is, for example, a signal including the address of a memory cell in the circuit 13 and data such as a memory recorded in the memory cell. Since the through electrode 110 and the non-defective circuit 13a are electrically connected, the data signal from the through electrode 110 is output to the non-defective circuit 13a. On the other hand, since the through electrode 110 and the defective product circuit 13b are not electrically connected, the data signal from the through electrode 110 is not output to the defective product circuit 13b. Thus, the semiconductor device 160 operates.
- the back surface wiring 150 that connects the through electrode 110b and the electrode 111a can function as a programmable wiring. That is, by selectively forming the back surface wiring 150 on the back surface 10 b of the wafer 10, the circuit 13 connected to the back surface wiring 150 can be selected. Therefore, the semiconductor chip 12 can be selected appropriately. As described above, since the non-defective chip 12a and the defective chip 12b are electrically separated, the influence of the defective chip 12b does not affect the other non-defective chips 12a. Therefore, even if the defective chip 12b exists, the semiconductor device 160 can be made non-defective, and the yield of the semiconductor device 160 can be improved.
- the stacked semiconductor chips 12 have the same structure except for the position of the back surface wiring 150. Therefore, each semiconductor chip 12 including the mask for patterning can be mass-produced by the same process.
- the selection means for selecting connection or non-connection between the through electrode 110 and the circuit 13 can be formed by a simple method. That is, the back surface wiring 150 can be appropriately and easily formed on the desired wafer 10 by switching the polarities of the pair of electrodes 132 and 133 of the template 130. As described above, since the selection means can be formed by a simple method, the semiconductor device 160 can be manufactured efficiently.
- the place where plating is formed is relatively hydrophilic compared to the place where other plating is not formed, so the electrodes 132 and 133, the through electrode 110 and the electrode 111 are formed. Can be formed efficiently. Thereby, the bridge 140 and the back surface wiring 150 can be appropriately formed.
- the semiconductor device 160 of the present embodiment can also exhibit other functions.
- the program can be recorded on the entire laminated wafers 10.
- the address of a defective memory cell can be recorded.
- the semiconductor device 160 has a redundant circuit including a redundant memory cell for replacing and repairing the defective memory cell, the defective memory is based on the address of the recorded defective memory cell. The cell can be rescued. Therefore, the yield of the semiconductor device 160 can be improved.
- the method of forming the through electrode 110 from the back surface 11b side of the wafer 10 where the circuit 13 is not formed the so-called Back-Via method has been described. Since the through electrode 110 is exposed on the back surface 10 b side of the wafer 10 where the circuit 13 is not formed, the back surface wiring 150 (programmable wiring) is also formed on the back surface 10 b side of the wafer 10.
- the through electrode forming process is not limited to the Back-Via method, and various methods have been proposed.
- a so-called Front-Via method is proposed in which a through electrode is formed from the surface 11a on which the circuit 13 is formed (the through electrode can be formed at various timings before and after the formation of the circuit 13). Even in such a case, the present invention can be applied.
- a through-hole is formed by etching in the surface 11a on which the circuit 13 is formed, and then a conductive material is embedded to form an electrode 111 perpendicular to the through-electrode 110.
- the through electrode 110 does not penetrate the wafer 10 and the device layer 11, but the through electrode 110 penetrates the wafer 10 and the device layer 11 by polishing the back surface 10b of the wafer 10 as will be described later.
- the shared wiring 101 may be formed in advance in the process of forming the circuit 13, that is, a so-called BEOL (Back End Of Line).
- the through electrode 110 and the electrode 111 are formed at the same time, but the electrode 111 may also be formed in the process of forming the circuit 13 in the same manner as the shared wiring 101. As is apparent from FIG. 32, since the electrode 111 and the shared wiring 101 are all in the device layer 11, they can be built in the process of forming the circuit 13.
- the back surface 10b of the wafer 10 is polished with the wafer 10 bonded to the support substrate 170 to thin the wafer 10, and the back bumps 180 that connect the through electrodes 110a and 110b are formed.
- the support substrate 170 is bonded to the circuit forming surface 11a of the wafer 10, but the other series of steps is the same as the previous embodiment.
- the support substrate 170 is replaced from the front surface 11a of the wafer 10 to the back surface 10b.
- the support substrate 170 is bonded to the front surface 11a of the wafer 10
- the support substrate 170 bonded to the front surface 11a is peeled off, thereby supporting the support substrate. 170 can be replaced.
- the inspection using the template 130 and the back surface wiring 150 are performed as in the previous embodiment. Can be formed.
- the present invention is not limited to the formation method of the through electrode.
- the essence of the present invention is to prepare a shorted through electrode pair and a vertical electrode pair and form a wiring between them to function as a programmable wiring.
- a plurality of wafers 210 as a plurality of substrates are stacked and arranged in the semiconductor device 200 of the present embodiment.
- a device layer 211 is formed on each wafer 210.
- the wafer 210 and the device layer 211 constitute a semiconductor chip 212.
- the wafer 210 and the device layer 211 are stacked in five layers, but the number of stacked layers can be arbitrarily set.
- a plurality of semiconductor chips 212 are formed in a horizontal plane with respect to one wafer 210. That is, the semiconductor device 200 has a configuration in which a plurality of semiconductor chips 212 are arranged in the vertical direction and the horizontal direction.
- the semiconductor device 200 includes a plurality of stacked wafers 210 and a plurality of device layers 211 (a plurality of semiconductor chips 212) in the thickness direction and a selection through electrode 220 that serially transmits a selection signal, and a data signal. And the data through electrode 221 for transmitting.
- the selection signal of the selection through electrode 220 is a signal indicating which of the stacked semiconductor chips 212 is to be selected.
- the data signal of the data through electrode 221 is a signal including an address of a memory cell in a memory circuit 230 as a predetermined circuit described later, data recorded in the memory cell, and the like.
- the selection through electrode 220 and the data through electrode 221 are provided for each of the semiconductor chips 212 arranged in the horizontal direction.
- the device layer 211 on the wafer 210 includes a memory circuit 230, a serial / parallel conversion circuit 231, a selection circuit 232, and a gate circuit 233 in addition to the selection through electrode 220 and the data through electrode 221, as shown in FIG. Is formed. In addition to these circuits, various wirings (not shown) are also formed in the device layer 211.
- a plurality of volatile memory cells are arranged in the memory circuit 230. These memory cells are arranged in a grid so as to be specified by a row address and a column address. That is, the memory cell is connected to the word line and the bit line, respectively.
- the serial / parallel conversion circuit 231 converts the serial selection signal from the selection through electrode 220 into parallel as shown in FIG.
- the converted selection signal is output from the serial / parallel conversion circuit 231 to the selection circuit 232.
- the selection circuit 232 determines whether the data signal transmitted through the data through electrode 221 is a signal for the semiconductor chip 212 provided with the selection circuit 232. select. That is, the selection circuit 232 controls the output of the data signal from the data through electrode 221 to the memory circuit 230 based on the selection signal. Specifically, the control signal is output from the selection circuit 232 to the gate circuit 233 so that the gate circuit 233 controls the output of the data signal from the data through electrode 221 to the memory circuit 230. Note that a case where the selection through electrode 220 of the present embodiment transmits only a True signal, for example, as a selection signal will be described. Therefore, in order to generate the False signal, the selection circuit 232 is provided with an inverter 242 as will be described later.
- first signal lines 240 for transmitting a selection signal and a plurality of second signal lines 241 for transmitting an inverted signal of the selection signal are formed.
- the pair of first signal line 240 and second signal line 241 is provided with an inverter 242 that inverts a selection signal, that is, converts a “0” signal and a “1” signal into each other.
- a connection electrode 243 is formed on the first signal line 240 and the second signal line 241.
- the connection electrode 243 is connected to the gate circuit 233 through the wiring 244 and the AND circuit 245.
- the selection signal from the selection through electrode 220 is output to the AND circuit 245 without being inverted.
- a data signal is output from the AND circuit 245 to the gate circuit 233 and from the data through electrode 221 to the memory circuit 230 (selection of the data signal), or from the data through electrode 221 to the memory circuit 230.
- a control signal indicating whether or not to output (a non-selection of the data signal) is output. Specifically, for example, when a data signal is selected, a control signal “1” is output, and when a data signal is not selected, a control signal “0” is output.
- connection through hole 246 that penetrates the wafer 210 and the device layer 211.
- the upper part of the connection through hole 246 is filled with a conductive material 247, and the lower part of the connection through hole 246 is filled with an insulating material 248.
- the first signal line 240 or the second signal line 241 is connected to the gate circuit 233 through the connection electrode 243 and the wiring 244. Since the insulating material 248 is filled in the lower portion of the connection through hole 246 as described above, even if the semiconductor chips 212 are stacked, the connection through holes 246 are formed between the stacked semiconductor chips 212.
- the first signal line 240 and the second signal line 241 are not electrically connected to each other.
- the filling of the conductive material 247 and the insulating material 248 into the connection through hole 246 may be performed by, for example, an ink jet method.
- a plurality of nozzles may be arranged corresponding to the formation pattern of the connection through holes 246, and the conductive material 247 and the insulating material 248 may be supplied from the nozzles to the corresponding connection through holes 246.
- the connection electrode 243 may be formed at a location where the serial / parallel conversion circuit 231 is connected to the first signal line 240 and the second signal line 241.
- the connection electrode 243 may be formed at a location where the inverter 242 is connected to the first signal line 240 and the second signal line 241.
- the selection signal is specified by three signals in this embodiment, the number of signals is not limited, and the selection circuit 232 can convert the selection signal specified by an arbitrary number of signals into a control signal.
- the selection signal from the selection through electrode 220 is output to the AND circuit 245 without being inverted, and the control signal is output from the AND circuit 245 to the gate circuit 233.
- a control signal converted by a different method is output from the selection circuit 232 to the gate circuit 233.
- the selection circuit 232 of another semiconductor chip 212 inverts the first selection signal and outputs the other second and third selection signals as they are.
- the selection circuit 232 of each semiconductor chip 212 outputs a different control signal to the selection signal from the selection through electrode 220, so that the semiconductor chip 212 is appropriately selected.
- the gate circuit 233 controls the output of the data signal from the data through electrode 221 to the memory circuit 230 based on the control signal from the selection circuit 232 as shown in FIG. That is, the data signal is output from the gate circuit 233 to the memory circuit 230 only when the control signal from the selection circuit 232 is a signal indicating selection (a signal “1”).
- the selection signal transmitted through the selection through electrode 220 is output to the selection circuit 232 via the serial / parallel conversion circuit 231.
- the selection signal is converted in a unique pattern for each semiconductor chip 212, and it is determined whether or not to select the data signal from the data through electrode 221.
- a control signal indicating selection or non-selection of the data signal is output from the selection circuit 232 to the gate circuit 233.
- a data signal is input from the data through electrode 221 to the gate circuit 233 together with a control signal from the selection circuit 232.
- a data signal is output from the gate circuit 233 to the memory circuit 230 only when the control signal from the selection circuit 232 is a signal indicating selection.
- an appropriate semiconductor chip 212 is selected based on the selection signal from the selection through electrode 220.
- the device layer 211 includes a memory circuit 230, a serial / parallel conversion circuit 231, a selection circuit 232 (a first signal line 240, a second signal line 241, an inverter 242, a wiring 244, and an AND circuit 245), and a gate circuit. 233 is formed.
- a selection through-hole 250, a data through-hole 251 and a connection through-hole 246 are formed so as to penetrate the wafer 210 and the device layer 211 in the thickness direction.
- the selection through hole 250, the data through hole 251, and the connection through hole 246 are simultaneously formed by, for example, a photolithography process and an etching process. That is, after a predetermined resist pattern is formed on the device layer 211 by photolithography, the device layer 211 and the wafer 210 are etched using the resist pattern as a mask, and the selection through hole 250, the data through hole 251, and the connection A through-hole 246 for use is formed.
- the selection through-hole 250 and the data through-hole 251 are filled with a conductive material to form the selection through-electrode 220 and the data through-electrode 221, respectively.
- the connection through hole 246 is filled with a conductive material 247 at the top and with an insulating material 248 at the bottom to form a connection electrode 243.
- the filling of the conductive material and the insulating material into the selection through hole 250, the data through hole 251, and the connection through hole 246 may be performed by, for example, an inkjet method.
- a plurality of nozzles may be arranged corresponding to the formation pattern of the selection through hole 250, the data through hole 251, and the connection through hole 246, and the conductive material and the insulating material may be supplied from each nozzle.
- the semiconductor chip 212 of each layer is manufactured. Thereafter, as shown in FIG. 35, a plurality of semiconductor chips 212 are stacked and bonded in the vertical direction. At this time, the plurality of semiconductor chips 212 are stacked so that the selection through electrode 220 and the data through electrode 221 are electrically connected. Thus, the semiconductor device 200 is manufactured. As described above, a plurality of semiconductor chips 212 are formed in the horizontal plane of the wafer 210, and the semiconductor chips 212 are stacked in units of the wafer 210.
- the wafer 210 is thinned. For this reason, a support substrate (wafer or glass substrate) may be provided on the wafer 210, and the wafer 210 may be supported for processing.
- a support substrate wafer or glass substrate
- wire bonding method in the three-dimensional integration technology, a so-called wire bonding method is conventionally used.
- wire bonding method wires are provided between semiconductor chips stacked one above the other or between a semiconductor chip and an electrode on a substrate, etc., and these are electrically connected (Japanese Patent Laid-Open No. 2-290048). Publication).
- TSV Through Silicon Via
- the through electrode is formed so as to penetrate the stacked semiconductor chips.
- the semiconductor chips and the semiconductor chip and the electrodes on the substrate are electrically connected through the through electrodes (Japanese Patent Laid-Open No. 6-291250).
- the semiconductor chips are electrically connected in series. Then, a plurality of through electrodes for selecting a semiconductor chip are required. That is, as many through electrodes as the number of stacked semiconductor chips are required. Therefore, even in such a case, the structure of the semiconductor device is complicated.
- the selection signal from the selection through electrode 220 is output to the selection circuit 232 on each wafer 210.
- the selection circuit 232 outputs a control signal to the gate circuit 233 based on the selection signal, and controls the output of the data signal from the data through electrode 220 to the memory circuit 230 via the gate circuit 233. it can. That is, the data signal from the data through electrode 221 can be output only to the semiconductor chip 212 to be selected. Therefore, in the semiconductor device 200 of the present embodiment, the semiconductor chip 212 can be appropriately selected.
- the semiconductor device 200 of the present embodiment only two through electrodes of the selection through electrode 220 and the data through electrode 221 may be formed as the through electrodes.
- the serial-parallel conversion circuit 231 is provided on the wafer 210, the selection signal can be transmitted serially in the selection through electrode 220, and it is not necessary to form a plurality of the selection through electrodes 220. Therefore, since the semiconductor chip 212 is selected, there is no need to form a plurality of through electrodes as in the prior art, and there is no need to connect a wire to each semiconductor chip 212. Therefore, the configuration of the semiconductor device 200 can be simplified.
- the selection circuit 233 can be formed by a simple method. That is, the connection through hole 246 of the selection circuit 232 is formed together with other through holes (the selection through hole 250 and the data through hole 251) of the semiconductor chip 212. For this reason, it is not necessary to perform the process of forming the connection through-hole 246 separately. Further, for example, the connection electrode 243 can be easily formed by filling the connection through hole 246 with the conductive material 247 and the insulating material 248 by an inkjet method. Since the selection circuit 232 can be formed by a simple method in this way, the semiconductor device 200 can be manufactured efficiently.
- the selection through electrode 220 transmits the selection signal serially, but the selection signal may be transmitted in parallel.
- a plurality of, for example, three through electrodes 220 for selection are formed.
- the plurality of selection through electrodes 220 transmit selection signals in parallel. Note that a case where the selection through electrode 220 of the present embodiment transmits only a True signal, for example, as a selection signal will be described. Therefore, an inverter 242 is provided in the selection circuit 232 in order to generate the False signal.
- the serial-parallel conversion circuit 231 of the above embodiment is omitted.
- the selection signal from the selection through electrode 220 is directly output to the selection circuit 232.
- the selection circuit 232 includes a first signal line 240, a second signal line 241, an inverter 242, a connection electrode 243, a wiring 244, and an AND circuit 245. Further, in the selection circuit 232 in one semiconductor chip 212, the selection signal from the selection through electrode 220 is output to the AND circuit 245 without being inverted as shown in FIG. On the other hand, the selection circuit 232 in the other semiconductor chip 212 inverts the first selection signal as shown in FIG.
- the selection circuit 232 of each semiconductor chip 212 outputs different control signals. Note that the configuration of the selection circuit 232 is the same as that of the above embodiment, and thus the description thereof is omitted. Further, since the other configuration of the semiconductor device 200 is the same as that of the above embodiment, the description thereof is omitted.
- the selection circuit 232 and the gate circuit 233 can control the output of the data signal from the data through electrode 221 to the memory circuit 230 based on the selection signal from the selection through electrode 220. . Therefore, the semiconductor chip 212 can be appropriately selected.
- the selection signal can be quickly output to the selection circuit 232. For this reason, selection of the semiconductor chip 212 can be performed more quickly. Therefore, the processing speed of the semiconductor device 200 can be improved.
- the plurality of selection through electrodes 220 transmit only the True signal as the selection signal in parallel, but the False signal may also be transmitted in parallel.
- the selection through electrode 220 is formed twice as many as the selection through electrode 220 in the example shown in FIGS.
- the serial-parallel conversion circuit 231 of the above embodiment is omitted in the device layer 211 on the wafer 210.
- the selection signal from the selection through electrode 220 is directly output to the selection circuit 232.
- the inverter 242 can be omitted in the selection circuit 232. Therefore, the selection circuit 232 includes the first signal line 240, the second signal line 241, the connection electrode 243, the wiring 244, and the AND circuit 245. In the selection circuit 232 in one semiconductor chip 212, only the True signal is output from the selection through electrode 220 to the AND circuit 245 as shown in FIG.
- the selection circuit 232 in the other semiconductor chip 212 As shown in FIG. 50, the first is output as a True signal, and the other second and third are output as a False signal. As described above, the selection circuit 232 of each semiconductor chip 212 outputs different control signals. Note that the configuration of the selection circuit 232 is the same as that of the above embodiment, and thus the description thereof is omitted. Further, since the other configuration of the semiconductor device 200 is the same as that of the above embodiment, the description thereof is omitted.
- the selection circuit 232 and the gate circuit 233 can control the output of the data signal from the data through electrode 221 to the memory circuit 230 based on the selection signal from the selection through electrode 220. . Therefore, the semiconductor chip 212 can be appropriately selected.
- the semiconductor chip 212 can be selected more quickly. For this reason, the processing speed of the semiconductor device 200 can be further improved.
- the selection signal is specified by three signals.
- the number of signals is not limited, and the selection circuit 232 selects the selection signal specified by an arbitrary number of signals. Can be converted to a control signal.
- a redundant wafer 260 as a redundant substrate may be further stacked on a plurality of wafers 210 as shown in FIG.
- a device layer 261 is formed on each redundant wafer 260.
- the redundancy wafer 260 and the device layer 261 constitute a redundancy chip 262.
- the selection through electrode 220 and the data through electrode 221 formed in the semiconductor device 200 are formed so as to also penetrate the redundancy wafer 260 and the device layer 261 (redundancy chip 262).
- a plurality of redundancy chips 262 are formed in a horizontal plane with respect to one redundancy wafer 260. These redundant chips 262 are formed at positions corresponding to the plurality of semiconductor chips 212 arranged in the horizontal direction.
- the redundancy chip 262 is arranged in the upper layer of the plurality of semiconductor chips 212.
- the arrangement of the redundancy chip 262 and the semiconductor chip 212 can be arbitrarily set.
- the redundancy circuit 270 In the device layer 261 of the redundancy chip 262, in addition to the selection through electrode 220 and the data through electrode 221, as shown in FIG. 52, the redundancy circuit 270, the serial / parallel conversion circuit 271, the selection circuit 272, and the gate circuit 273 are provided. Is formed. In addition to these circuits, various wirings (not shown) are also formed in the device layer 262.
- the redundant circuit 270 is a circuit for replacing a defective memory circuit 230 among the memory circuits 230 of the stacked semiconductor chips 212.
- a plurality of volatile redundant memory cells (not shown) are arranged.
- the arrangement of redundant memory cells in the redundant circuit 270 is the same as the arrangement of memory cells in the memory circuit 230.
- the configuration of the other serial / parallel conversion circuit 271, selection circuit 272, and gate circuit 273 is the same as the configuration of the serial / parallel conversion circuit 231, selection circuit 232, and gate circuit 233 in the above embodiment, so that description will be given. Omitted.
- the electrical characteristics of the memory circuit 230 are tested. This test is done in various ways. For example, a probe (not shown) is brought into contact with an electrode of the memory circuit 230, and a test signal is applied from each probe to the memory circuit 230, whereby the electrical characteristics of the memory circuit 230 are inspected.
- the selection circuit 232 of the semiconductor chip 212 and the redundancy chip are replaced with the redundancy circuit 270 so that the memory circuit 230 (hereinafter, referred to as “defective circuit 230”) determined to be defective as a result of the test is replaced.
- a selection circuit 272 of 262 is formed. Specifically, when the selection signal indicating the semiconductor chip 212 including the defective circuit 230 (hereinafter, sometimes referred to as “defective chip 212”) is transmitted through the selection through electrode 220, the defective chip 212 is selected. As a result, the selection circuit 232 of the defective chip 212 is formed.
- the selection circuit 272 of the redundancy chip 262 is formed so that the redundancy chip 262 is selected when the selection signal indicating the defective chip 212 is transmitted through the selection through electrode 220. Then, the semiconductor chip 212 including the defective chip 212 and the redundant chip 262 are stacked as shown in FIG. 51, and the defective circuit 230 is replaced with the redundant circuit 270 to be rescued. In other words, the defective chip 212 is replaced with the redundant chip 262 and repaired.
- the semiconductor device 200 when the defective chip 212 is not relieved, the semiconductor device 200 itself becomes defective.
- the defective chip 212 can be relieved by the redundant chip 262
- the other non-defective semiconductor chip 212 can be used effectively, and the semiconductor device 200 can be manufactured satisfactorily. it can. Therefore, the yield of the semiconductor device 200 can be improved.
- the conductive through-hole 247 and the insulating material 248 are filled in the connection through hole 246.
- the method of connecting the wirings in the selection circuit 232 is not limited to the case where the connection through hole 246 is used as described above, and various methods can be used.
- a fuse element or a flash memory may be used instead of using the connection through hole 246, for example, a fuse element or a flash memory may be used.
- the present invention is also applied to other electronic elements such as logic elements. be able to. That is, by using the method of the present invention, a circuit including a defective logic element can be replaced with a redundant circuit and repaired.
- a plurality of semiconductor chips 310 and one redundant chip 320 are stacked and arranged.
- the semiconductor chip 310 has a configuration in which a device layer 312 is formed on a wafer 311.
- the device layer 312 includes a plurality of memory cells 400 as volatile electronic elements.
- the redundancy chip 320 has a configuration in which a device layer 322 is formed on a wafer 321.
- the device layer 322 includes a plurality of redundant memory cells 350 as volatile redundant electronic elements as will be described later.
- the semiconductor chips 310 are stacked in five layers, but the number of the semiconductor chips 310 can be arbitrarily set.
- the redundancy chip 320 is arranged in the upper layer of the plurality of semiconductor chips 310, the arrangement of the redundancy chip 320 and the semiconductor chip 310 can be arbitrarily set.
- the semiconductor device 300 serially transmits an address as a position information signal (position information) of the memory cell 400 inputted from the outside through the plurality of stacked semiconductor chips 310 and the redundant chip 320 in the thickness direction.
- An address through electrode 330 as a position information through electrode and a determination through electrode 331 that serially transmits a determination signal output from a redundancy chip 320 to be described later are formed.
- the device layer 322 of the redundancy chip 320 includes a redundancy circuit 340, a defective address recording unit 341 as a defective position information recording unit, a determination circuit 342, a control signal generation circuit 343, and a first circuit as a gate circuit.
- Gate circuit 344, an address conversion circuit 345 as a position information conversion circuit, and a second gate circuit 346 are formed.
- various wirings (not shown) are also formed in the device layer 322.
- a redundant memory cell 350 for replacing a defective memory cell as a defective electronic element among a plurality of memory cells 400 of the semiconductor chip 310 is arranged. Redundant memory cells 350 are arranged in a grid so as to be specified by row addresses and column addresses. That is, the redundant memory cell 350 is connected to the word line 351 and the bit line 352, respectively.
- the redundancy circuit 340 is connected to a row address decoder 353 and a column address decoder 354 that decode the address converted by the address conversion circuit 345.
- the row address decoder 353 decodes the row address and selects the word line 351.
- the column address decoder 354 decodes the column address and selects the bit line 352.
- the defective address recording unit 341 records the address of the defective memory cell. As shown in FIG. 56, the defective address recording unit 341 is formed through the wafer 321 and the device layer 322, and the first redundant through hole 360a for connecting the power supply line and the second redundant for connecting the ground line. A plurality of redundant through holes 360 having a plurality of through holes 360b are provided.
- the device layer 322 in the defective address recording unit 341 is provided with an address line 361 and a power line 362 as output position information lines on both sides of the first redundant through hole 360a. Further, an address line 363 and a ground line 364 as position information lines for output are wired on both sides of the second redundant through hole 360b.
- the address of the defective memory cell is recorded by signals “1” and “0”.
- the address line 361 and the power supply line 362 are connected through the first redundant through hole 360a as shown in FIGS.
- the upper portion of the first redundant through hole 360a is filled with the conductive material 365
- the lower portion of the first redundant through hole 360a is filled with the insulating material 366
- the second redundant through hole 360a is filled.
- the through hole 360b is filled with an insulating material 366.
- the address line 363 and the ground line 364 are connected via the second redundant through hole 360b as shown in FIGS.
- the upper portion of the second redundant through hole 360b is filled with the conductive material 365
- the lower portion of the second redundant through hole 360b is filled with the insulating material 366
- the first redundant through hole 360b is filled.
- the through-hole 360a is filled with an insulating material 366.
- Each of the ground lines 364 is not conductive.
- the filling of the conductive material 365 and the insulating material 366 into the first redundant through hole 360a and the second redundant through hole 360b may be performed by, for example, an ink jet method. Alternatively, a plurality of nozzles are arranged corresponding to the formation pattern of the first redundant through hole 360a and the second redundant through hole 360b, and the corresponding first redundant through hole 360a or second
- the conductive material 365 and the insulating material 366 may be supplied to the redundant through hole 360b.
- the determination circuit 342 compares the address from the outside output from the address through electrode 330 with the address of the defective memory cell recorded in the defective address recording unit 341, and determines the match or mismatch of these addresses. That is, in the determination circuit 342, as shown in FIG. 60, the input matrix address from the outside is compared with the matrix address of the defective memory cell.
- the determination circuit 342 has an input matrix address bus 370 for transmitting an input matrix address A from the outside and a defective matrix address bus 371 for transmitting a matrix address B of a defective memory cell. is doing. Then, the input matrix address A is compared with the matrix address B of the defective memory cell. For example, when they match, “1” is output as the signal Y, and when they do not match, “0” is output as the signal Y. Is output. In other words, “1” or “0” is output as the signal Y in consideration of the match / mismatch between the row address and the column address. When the signal Y is “1”, the memory cell 400 at the corresponding address is determined as a defective memory cell. On the other hand, for example, when the signal Y is “0”, it is determined that the memory cell 400 at the corresponding address is not defective.
- the control signal generation circuit 343 generates a control signal for controlling the operation of the memory cell 400 or the redundant memory cell 350.
- a control signal for example, a chip enable signal, a write enable signal, a read enable signal, or the like is generated.
- the memory cell 400 of the semiconductor chip 310 can be operated based on the determination result in the determination circuit 342 and the control signal generated by the control signal generation circuit 343, or the redundant memory of the redundant circuit 340 can be operated. Controls whether cell 350 is enabled.
- the first gate circuit 344 replaces the defective memory cell with the redundant memory cell 350 and relieves the redundant memory cell. Enable cell 350. Specifically, the first gate circuit 344 outputs the control signal from the control signal generation circuit 343 to the second gate circuit 346.
- the first gate circuit 344 enables the memory cell 400 of the semiconductor chip 310 to operate. Specifically, the first gate circuit 344 outputs a control signal from the control signal generation circuit 343 to the determination through electrode 331 as a determination signal.
- the address conversion circuit 345 converts the address (address from the outside) from the address through electrode 330 into the address of the redundant memory cell 350 in the redundant circuit 340.
- the arrangement of the redundant memory cells 350 in the redundant circuit 340 is the same as the arrangement of the memory cells 400 in the circuit 390 of the semiconductor chip 310 described later. Therefore, when replacing the defective memory cell of the semiconductor chip 310 with the redundant memory cell 350, the address conversion circuit 345 performs redundancy so that the plurality of replaced redundant memory cells 350 are continuously arranged in the redundant circuit 340.
- the address of the memory cell 350 is converted. In the present embodiment, a case will be described in which the address conversion circuit 345 converts, for example, the address (0, 0, 0) into the address (1, 0, 0) of the redundant memory cell 350 as shown in FIG.
- the address which is a serial signal from the address through electrode 330 is converted into an address of a parallel signal in the serial / parallel conversion circuit 380 and input to the address conversion circuit 345.
- the address conversion circuit 345 includes a first signal line 381 as a position information signal line for transmitting an address (“0” signal) and an inverted position information signal for transmitting an inverted signal (“1” signal).
- a plurality of, for example, three second signal lines 382 as lines are formed.
- An inverter 383 that inverts a signal is provided between the pair of first signal line 381 and the second signal line 382.
- connection electrode 384 is formed on the first signal line 381 and the second signal line 382.
- the connection electrode 384 is connected to the second gate circuit 346 through the wiring 385.
- a connection electrode 384 is formed on the first second signal line 382, the second and third first signal lines 381.
- connection through holes 386 are formed in the address conversion circuit 345, and the connection electrodes 384 are selectively provided in one connection through hole 386. It is formed. That is, at the address (1, 0, 0) of the redundant memory cell 350, six connection through holes are provided for each “0” or “1” signal (for each of the first signal line 381 and the second signal line 382). A hole 386 is formed in advance.
- the connection is made to the connection through hole 386 in the first second signal line 382.
- the electrode 384 is formed, and the connection electrode 384 is not formed in the connection through hole 386 in the other five signal lines 381 and 382.
- the connection in the second and third first signal lines 381 is performed.
- the connection electrode 384 is formed in each of the through holes 386 for connection, and the connection electrode 384 is not formed in the connection through holes 386 of the other signal lines 381 and 382.
- connection electrode 384 When the connection electrode 384 is formed as described above, a connection through hole 386 is formed in the address conversion circuit 345 through the wafer 321 and the device layer 322 as shown in FIG.
- the upper part of the connection through hole 386 is filled with a conductive material 387, and the lower part of the connection through hole 386 is filled with an insulating material 388.
- the first signal line 381 or the second signal line 382 is connected to the second gate circuit 346 through the connection electrode 384 and the wiring 385.
- the conductive material 387 and the insulating material 388 may be filled into the connection through hole 386 by, for example, an ink jet method.
- connection electrode 384 may be formed at a location where the serial / parallel conversion circuit 380 is connected to the first signal line 381 and the second signal line 382. Further, the connection electrode 384 may be formed at a location where the inverter 383 is connected to the first signal line 381 and the second signal line 382.
- the address conversion circuit 345 converts the address specified by an arbitrary number of signals into the address of the redundant memory cell 350. it can.
- the address conversion circuit 345 can convert the address from the address through electrode 330 into the address of various redundant memory cells 350.
- the address conversion circuit 345 shown in FIG. 64 can convert the address (0, 0, 0) into the address (1, 1, 0) of the redundant memory cell 350.
- a plurality of connection through holes 386 are formed in the address conversion circuit 345, and the connection electrodes 384 are selectively formed in one connection through hole 386. Is done.
- the control signal from the first gate circuit 344 and the address of the redundant memory cell 350 converted by the address conversion circuit 345 are output to the second gate circuit 346. Based on these outputs, the second gate circuit 346 outputs a signal to the redundant circuit 340 so that the redundant memory cell 350 in the redundant circuit 340 can operate.
- a circuit 390, a selection circuit 391, and a gate circuit 392 as another gate circuit are formed in the device layer 312.
- various wirings are also formed in the device layer 312.
- a plurality of memory cells 400 are arranged in the circuit 390 as shown in FIG.
- the memory cells 400 are arranged in a lattice shape so as to be specified by a row address and a column address. That is, the memory cell 400 is connected to the word line 401 and the bit line 402, respectively.
- the arrangement of the memory cells 400 in the circuit 390 is the same as the arrangement of the redundant memory cells 350 in the redundant circuit 340 of the redundancy chip 320 described above.
- a row address decoder 403 and a column address decoder 404 for decoding the address of the memory cell 400 input from the gate circuit 392 are connected to the circuit 390.
- the row address decoder 403 decodes the row address and selects the word line 401.
- the column address decoder 404 decodes the column address and selects the bit line 402.
- the selection circuit 391 selects whether or not the determination signal (control signal) from the determination through electrode 331 is a signal for the memory cell 400 of the semiconductor chip 310 provided with the selection circuit 391. That is, the selection circuit 391 controls address output from the address through electrode 330 to the circuit 390 based on the determination signal from the determination through electrode 331. Specifically, an output signal is output from the selection circuit 391 to the gate circuit 392 so that the gate circuit 392 controls the output of the address from the address through electrode 330 to the circuit 390.
- the serial determination signal from the determination through electrode 331 is converted into a parallel determination signal by the serial / parallel conversion circuit 410 and input to the selection circuit 391.
- the selection circuit 391 includes a plurality of first signal lines 411 as determination signal lines for transmitting determination signals and a plurality of second signal lines 412 as inversion determination signal lines for transmitting inverted signals of determination signals, for example, Three are formed.
- the pair of first signal line 411 and second signal line 412 is provided with an inverter 413 that inverts a determination signal, that is, converts a “0” signal and a “1” signal into each other.
- a connection electrode 414 is formed on the first signal line 411 and the second signal line 412.
- the connection electrode 414 is connected to the gate circuit 392 through the wiring 415 and the AND circuit 416.
- the determination signal from the determination through electrode 331 is output to the AND circuit 416 without being inverted.
- the address is output from the AND circuit 416 to the gate circuit 392 and the address through electrode 330 to the circuit 390 (address selection), or the address is not output from the address through electrode 330 to the circuit 390.
- An output signal indicating whether or not (address is not selected) is output. Specifically, for example, when an address is selected, an output signal “1” is output, and when an address is not selected, an output signal “0” is output.
- connection electrode 384 of the address conversion circuit 345 shown in FIG. 62 a plurality of connection through holes 417 are formed in the selection circuit 391 for the connection electrode 414 of the selection circuit 391.
- a connection electrode 414 is selectively formed in the connection through hole 417.
- connection electrode 414 When forming the connection electrode 414, as shown in FIG. 67, the selection circuit 391 is formed with a connection through hole 417 as another connection through hole penetrating the wafer 311 and the device layer 312. .
- the upper part of the connection through hole 417 is filled with a conductive material 418, and the lower part of the connection through hole 417 is filled with an insulating material 419.
- the first signal line 411 or the second signal line 412 is connected to the gate circuit 392 through the connection electrode 414 and the wiring 415. Since the insulating material 419 is filled in the lower portion of the connection through-hole 417 in this way, even if the semiconductor chips 310 are stacked, the connection through-holes 417 are formed between the stacked semiconductor chips 310.
- the first signal line 411 and the second signal line 412 are not electrically connected to each other.
- the filling of the conductive material 418 and the insulating material 419 into the connection through hole 417 may be performed by, for example, an ink jet method.
- a plurality of nozzles may be arranged corresponding to the formation pattern of the connection through holes 417, and the conductive material 418 and the insulating material 419 may be supplied from the nozzles to the corresponding connection through holes 417.
- the connection electrode 414 may be formed at a location where the serial / parallel conversion circuit 410 is connected to the first signal line 411 and the second signal line 412. Further, the connection electrode 414 may be formed at a location where the inverter 413 is connected to the first signal line 411 and the second signal line 412.
- the determination signal is specified by three signals.
- the number of signals is not limited, and the selection circuit 391 can convert a determination signal specified by an arbitrary number of signals into an output signal.
- the determination signal from the determination through electrode 331 is output to the AND circuit 416 without being inverted, and further, the output signal is output from the AND circuit 416 to the gate circuit 392.
- an output signal converted by a different method is output from the selection circuit 391 to the gate circuit 392.
- the selection circuit 391 of another semiconductor chip 310 inverts the first signal and outputs the other second and third signals as they are.
- the selection circuit 391 of each semiconductor chip 310 outputs a different output signal to the determination signal from the determination through electrode 331, so that the semiconductor chip 310 is appropriately selected.
- the gate circuit 392 controls the output of the address from the address through electrode 330 to the circuit 390 based on the output signal from the selection circuit 391 as shown in FIG. That is, the address is output from the gate circuit 392 to the circuit 390 only when the output signal from the selection circuit 391 is a signal indicating selection (a signal of “1”). In the circuit 390, the memory cell 400 at the corresponding address becomes operable.
- the address of the memory cell 400 is input to the address through electrode 330 from the outside.
- the address from the outside is transmitted through the address through electrode 330 and output to the determination circuit 342 of the redundancy chip 320.
- the determination circuit 342 compares an external address output from the address through electrode 330 with the address of the defective memory cell recorded in the defective address recording unit 341, and determines whether these addresses match or not.
- the determination result in the determination circuit 342 is output to the first gate circuit 344.
- the control signal generated by the control signal generation circuit 343 is also output to the first gate circuit 344.
- the determination circuit 342 determines that the address from the outside matches the address of the defective memory cell, that is, if the memory cell 400 at the corresponding address is determined to be a defective memory cell, the first gate circuit 344 to the second memory cell
- the control signal from the control signal generation circuit 343 is output to the second gate circuit 346.
- the address conversion circuit 345 the external address output from the address through electrode 330 is converted into the address of the redundant memory cell 350 in the redundant circuit 340.
- the address of the redundant memory cell 350 converted by the address conversion circuit 345 is output to the second gate circuit 346.
- the control signal from the first gate circuit 344 and the address of the redundant memory cell 350 from the address conversion circuit 345 are output to the second gate circuit 346.
- a signal is output from the second gate circuit 346 to the redundant circuit 340 so that a predetermined redundant memory cell 350 in the redundant circuit 340 can operate.
- the defective memory cell of the semiconductor chip 310 is replaced with the redundant memory cell 350 and repaired.
- the defective memory 400a in the semiconductor chip 310 is replaced with a redundant memory cell 350a.
- the other defective memory cells 400b and 400c are also replaced with redundant memory cells 350b and 350c, respectively.
- the address conversion circuit 345 converts the address of the redundant memory cell 350 so that the replacement redundant memory cells 350 are continuously arranged in the redundant circuit 340. Therefore, the redundant memory cells 350a, 350b, and 350c described above are continuously arranged in the redundant circuit 340. In such a case, all the redundant memory cells 350 in the redundant circuit 340 can be used effectively.
- the determination circuit 342 determines that the address from the outside does not match the address of the defective memory cell, that is, if it is determined that the memory cell 400 at the corresponding address is a good memory cell
- the first circuit A control signal from the control signal generation circuit 343 is output as a determination signal from the gate circuit 344 to the determination through electrode 331.
- the determination signal transmitted through the determination through electrode 331 is output to the selection circuit 391 of the semiconductor chip 310.
- the selection circuit 391 the determination signal is converted in a unique pattern for each semiconductor chip 310, and it is determined whether or not to select an address from the address through electrode 330.
- An output signal indicating selection or non-selection of the address is output from the selection circuit 391 to the gate circuit 392.
- the gate circuit 392 receives an address from the address through electrode 330 together with an output signal from the selection circuit 391.
- the address is output from the gate circuit 392 to the circuit 390 only when the output signal from the selection circuit 391 is a signal indicating selection.
- the memory cell 400 corresponding to the output address can be operated.
- the defective memory cell of the semiconductor chip 310 is replaced by the redundant memory cell 350 and repaired, and the memory cell 400 that is not defective of the semiconductor chip 310 is used as it is and can operate.
- a method for manufacturing the semiconductor chip 310 will be described.
- a device layer 312 is formed on the wafer 311.
- the device layer 312 includes a circuit 390, a selection circuit 391 (a first signal line 411, a second signal line 412, an inverter 413, a wiring 415, and an AND circuit 416), a gate circuit 392, and a serial / parallel conversion circuit 410. Is formed.
- an address through hole 420, a determination through hole 421, and a connection through hole 417 are formed as through holes for position information so as to penetrate the wafer 311 and the device layer 312 in the thickness direction.
- the address through-hole 420, the determination through-hole 421, and the connection through-hole 417 are simultaneously formed by, for example, a photolithography process and an etching process. That is, after a predetermined resist pattern is formed on the device layer 312 by photolithography, the device layer 312 and the wafer 311 are etched using the resist pattern as a mask, and the address through hole 420, the determination through hole 421, and the connection A through-hole 417 for use is formed.
- the address through-hole 420 and the determination through-hole 421 are filled with a conductive material, respectively, and the address through-electrode 330 and the determination through-electrode 331 are formed.
- the connection through hole 417 is filled with a conductive material 418 and filled with an insulating material 419 to form a connection electrode 414.
- the filling of the conductive material and the insulating material into the address through hole 420, the determination through hole 421, and the connection through hole 417 may be performed by, for example, an inkjet method.
- a plurality of nozzles may be arranged corresponding to the formation pattern of the address through hole 420, the determination through hole 421, and the connection through hole 417, and the conductive material and the insulating material may be supplied from each nozzle.
- the electrical characteristics of the circuit 390 are tested. This test may be performed at any timing as long as the device layer 312 is formed on the wafer 311. For example, it may be performed before or after the formation of the address through hole 420, the determination through hole 421, and the connection through hole 417, or after the formation of the address through electrode 330, the determination through electrode 331, and the connection electrode 414. Good. This test is performed by various methods. For example, a probe (not shown) is brought into contact with an electrode of the circuit 390, and an inspection signal is applied to the circuit 390 from each probe, whereby the electrical characteristics of the circuit 390 are inspected.
- the device layer 322 is formed on the wafer 321 in the redundant chip 320.
- the device layer 322 includes a redundancy circuit 340, a defective address recording unit 341 (address line 361, power supply line 362, address line 363, ground line 364), a determination circuit 342, a control signal generation circuit 343, a first gate circuit 344, An address conversion circuit 345 (a first signal line 381, a second signal line 382, an inverter 383, a wiring 385), and a second gate circuit 346 are formed.
- the device layer 322 is formed in the same manner as in FIG.
- an address through-hole 420, a determination through-hole 421, a redundancy through-hole 360, and a connection through-hole 386 are formed so as to penetrate the wafer 321 and the device layer 322 in the thickness direction.
- the address through-hole 420, the determination through-hole 421, the redundancy through-hole 360, and the connection through-hole 386 are simultaneously formed by, for example, a photolithography process and an etching process.
- the formation of the address through hole 420, the determination through hole 421, the redundancy through hole 360, and the connection through hole 386 is the same as that shown in FIG.
- the address through hole 420 and the determination through hole 421 are filled with a conductive material, respectively, and the address through electrode 330 and the determination through electrode 331 are formed.
- the redundant through hole 360 is filled with the conductive material 365 and the insulating material 366 as shown in FIGS.
- the redundant through-hole 360 is electrically conductive so that the address of the defective memory cell is recorded with the signals “1” and “0”.
- the material 365 and the insulating material 366 are filled. Further, as shown in FIG.
- connection through-hole 386 is filled with a conductive material 387 and filled with an insulating material 388 to form a connection electrode 384.
- the filling of the conductive material and the insulating material into the address through hole 420, the determination through hole 421, the redundant through hole 360, and the connection through hole 386 may be performed by, for example, an ink jet method.
- a plurality of nozzles are arranged corresponding to the formation pattern of the address through hole 420, the determination through hole 421, the redundancy through hole 360, and the connection through hole 386, and a conductive material and an insulating material are supplied from each nozzle. May be.
- the filling of the conductive material or the insulating material is the same as that in FIG.
- a plurality of semiconductor chips 310 and a redundant chip 320 are stacked in the vertical direction and joined.
- the plurality of semiconductor chips 310 and the redundant chip 320 are stacked such that the address through electrode 330 and the determination through electrode 331 are electrically connected to each other.
- the semiconductor device 300 is manufactured.
- the wafer 311 is thinned. For this reason, a support substrate (wafer or glass substrate) may be provided on the wafer 311, and the wafer 311 may be supported to perform processing.
- a support substrate wafer or glass substrate
- the conventional repair of defective memory cells is performed by, for example, laser trimming processing using a plurality of fuse elements that can be blown by laser light.
- the address of the defective memory cell determined to be defective by the electrical test of the circuit is held by fusing a fuse element provided on the circuit side of the semiconductor chip with laser light.
- the defective memory cell is replaced with a redundant memory cell (Japanese Patent Laid-Open No. 2007-299939).
- defective memory cells can be remedied within the same semiconductor chip.
- defective memory cells are removed between three-dimensionally stacked semiconductor chips. It cannot be rescued. If there are more defective memory cells than redundant memory cells, they cannot be remedied within the same semiconductor chip, so that the semiconductor chip becomes a defective chip.
- it is sufficient to increase the area of the redundant memory cell. In this case, however, the utilization efficiency in the semiconductor chip is lowered. For this reason, the yield of the semiconductor device or the utilization efficiency of the semiconductor chip is reduced.
- the determination circuit 342 of the redundancy chip 320 the address of the memory cell 400 from the address through electrode 330 and the address of the defective memory cell from the defective address recording unit 341 are calculated. Match or mismatch is determined.
- the determination circuit 342 determines that they match, the defective memory cell of the semiconductor chip 310 is replaced with the redundant memory cell 350 by the control signal from the control signal generation circuit 343 and the first gate circuit 344, and the redundant memory Cell 350 is enabled.
- the control signal from the control signal generation circuit 343 and the first gate circuit 344 output a determination signal to the determination through electrode 331, and the determination signal and the address through electrode Based on the address from 330, the non-defective memory cell 400 is enabled.
- the defective memory cell of the semiconductor chip 310 can be replaced with the redundant memory cell 350 of the redundancy chip 320 and repaired, and the good memory cell 400 of the semiconductor chip 310 can be operated. Therefore, the yield of the semiconductor device 300 and the utilization efficiency in the semiconductor chip 310 can be improved.
- the defective memory cell of the semiconductor chip 310 is relieved by the redundant memory cell 350 of the redundancy chip 320 in this way, a circuit for relieving the defective memory cell is separately formed in the device layer 312 of the semiconductor chip 310. There is no need. Since the configuration of the semiconductor chip 310 that occupies most of the semiconductor device 300 can be simplified, the manufacturing efficiency of the semiconductor device 300 can be improved. Redundant memory cells 350 that can cover the expected amount of defective memory cells from the entire memory cell region of the plurality of stacked semiconductor chips 310 may be formed in the redundant chip 320. This makes it possible to relieve more efficiently than relieving defective memory cells generated in individual chips. Alternatively, since the amount of defective memory cells in each chip is known when the electrical characteristics of the circuit 390 are inspected, stacking may be performed so that the total number of defective memory cells does not exceed the redundant memory cells 350.
- the address exchange circuit 345 as in the present embodiment. Otherwise, the addresses of the redundant memory cells 350 in which the defective memory cells 400a and 400b are replaced are the same. Then, even when the redundant memory cell 350 remains in the redundant circuit 340, any one of the defective memory cells 400a and 400b cannot be relieved, and the semiconductor device 300 becomes a defective product. That is, when the semiconductor device 300 is viewed as a whole, the semiconductor device 300 becomes defective even though the redundant memory cell 350 remains.
- the address exchange circuit 345 of the redundancy chip 320 from the address through electrode 330 so that the redundant memory cells 350 to be replaced are continuously arranged in the redundancy circuit 340. Is converted into the address of the redundant memory cell 350. That is, in the example of FIG. 69, the defective memory cells 400a, 400b, and 400c are replaced with redundant memory cells 350a, 350b, and 350c that are continuously arranged in the redundant circuit 340.
- the degree of freedom for using the redundant memory cells 350 is improved. Therefore, the yield of the semiconductor device 300 can be further improved.
- the address exchange circuit 345 can be formed by a simple method. That is, the connection through hole 386 of the address exchange circuit 345 is formed together with the other through holes (the address through hole 420, the determination through hole 421, and the redundancy through hole 360) of the redundancy chip 320. For this reason, it is not necessary to perform the process of forming the connection through-hole 386 separately.
- the connection electrode 384 can be easily formed by filling the connection through hole 386 with the conductive material 387 and the insulating material 388 by, for example, an ink jet method. As described above, since the address exchange circuit 345 can be formed by a simple method, the semiconductor device 300 can be manufactured efficiently.
- the defective address recording unit 341 can be similarly formed by a simple method. That is, the redundant through hole 360 of the defective address recording unit 341 is formed together with the other through holes (the address through hole 420, the determination through hole 421, and the connection through hole 386) of the redundancy chip 320. For this reason, it is not necessary to perform the process of forming the redundant through-hole 360 separately. Also, for example, by filling the redundant through-hole 360 with the conductive material 365 and the insulating material 366 by the ink jet method, the address of the defective memory cell can be easily recorded in the defective address recording unit 341.
- the address of the defective memory cell can be recorded in the defective address recording unit 341. Therefore, for example, a volatile semiconductor chip such as a DRAM. Functionally, a non-volatile defective address recording unit 341 can be formed in the semiconductor device 300 provided with 310.
- the address output from the address through electrode 330 to the circuit 390 is controlled by the selection circuit 391 and the gate circuit 392 based on the determination signal from the determination through electrode 331. That is, an address is output only to the circuit 390 of the semiconductor chip 310 to be selected. Therefore, when the determination circuit 342 of the redundancy chip 320 determines that there is no failure, the memory cell 400 corresponding to the address can be appropriately operated.
- the selection circuit 391 of the semiconductor chip 310 can be formed by a simple method. That is, the connection through hole 417 of the selection circuit 391 is formed together with the other through holes (address through hole 420, determination through hole 421) of the semiconductor chip 310. For this reason, it is not necessary to perform the process of forming the connection through-hole 417 separately. Further, for example, the connection electrode 414 can be easily formed by filling the connection through hole 417 with the conductive material 418 and the insulating material 419 by an ink jet method. As described above, since the selection circuit 391 can be formed by a simple method, the semiconductor device 300 can be manufactured efficiently.
- the arrangement of the redundant memory cells 350 in the redundancy circuit 340 of the redundancy chip 320 is the same as the arrangement of the memory cells 400 in the circuit 390 of the semiconductor chip 310.
- the arrangement may be different.
- the redundant circuit 450 of the redundant chip 320 shown in FIG. 73 is formed after the electrical characteristics of the circuits 390 of all the semiconductor chips 310 are tested. That is, as a result of the test, the redundancy circuit is arranged so that the redundant memory cells 350 to be replaced are continuously arranged after the addresses of all the defective memory cells determined to be defective are grasped. 450 is formed. In such a case, the address conversion circuit 345 in the above embodiment can be omitted.
- the yield of the semiconductor device 300 can be further improved.
- the address conversion circuit 345 is provided outside the redundancy circuit 340.
- the address conversion in the address conversion circuit 345 is performed in the second gate circuit 346. Also good.
- the address conversion in the address conversion circuit 345 may be performed in the row address decoder 353 and the column address decoder 354. In either case, the address conversion circuit 345 is omitted in such a case.
- a redundant memory cell 460 as another redundant electronic element for replacing a defective memory cell is arranged as shown in FIG. It may be.
- the circuit 390 is divided into a normal cell array region 461 in which a plurality of memory cells 400 are arranged and a redundant cell array region 462 in which a plurality of redundant memory cells 460 are arranged.
- a defective address recording unit (not shown) may be formed in the semiconductor chip 310 in order to record the address of the defective memory cell to be replaced with the redundant memory cell 460.
- the defective address recording unit has the same configuration as the defective address recording unit 341 of the redundancy chip 320, for example.
- the address of the defective memory cell replaced by the redundant memory cell 460 may be recorded in the defective address recording unit 341 of the redundancy chip 320.
- the number of redundant memory cells 460 in the redundant cell array region 462 is one column. However, the number of columns is not limited to this embodiment, and may be two or more columns. May be.
- the defective memory cell of the semiconductor chip 310 may be relieved by being replaced with the redundant memory cell 460 in the redundant cell array region 462 of the semiconductor chip 310, or the redundant memory 50 in the redundant circuit 340 of the redundant chip 320. It may be replaced and rescued.
- the degree of freedom to use redundant memory cells 350 and 460 is improved with respect to defective memory cells. Therefore, the yield of the semiconductor device 300 can be improved.
- the defective address recording unit 341 is provided with the first redundant through hole 360a for connecting the power supply line and the second redundant through hole 360b for connecting the ground line separately.
- a redundant through hole 470 that serves both as a power line connection and a ground line connection may be provided.
- the address line 361 and the power supply line 362 are wired on both sides of the redundant through hole 470.
- Address lines 363 and ground lines 364 are provided on both sides of the redundant through-hole 470 and above the address lines 361 and the power supply lines 362.
- the address line 361 and the power supply line 362 are connected via the redundant through hole 470 as shown in FIG.
- the conductive material 365 is filled in a portion corresponding to the power supply line 362 of the redundant through hole 470, and from the portion corresponding to the ground line 364 and the portion corresponding to the power supply line 362 of the redundant through hole 470.
- the lower portion is filled with an insulating material 366.
- the address line 363 and the ground line 364 are connected via the redundant through hole 470 as shown in FIG.
- the conductive material 365 is filled in the portion corresponding to the ground line 364 of the redundant through hole 470, and the insulating material 366 is formed in the portion corresponding to the power line 362 of the redundant through hole 470 and the lower portion thereof. Fill.
- the number of redundant through holes 470 is half the number of redundant through holes 360 in the above embodiment, and the address of the defective memory cell can be recorded using the redundant through holes 470.
- the address line 363 and the ground line 364 are provided above the address line 361 and the power line 362.
- the address line 361 and the power line 362 are provided above the address line 363 and the ground line 364. May be.
- the redundancy through hole 360, the connection through hole 386, and the connection through hole 417 respectively.
- the method of connecting the wirings in the defective address recording unit 341, the address conversion circuit 345, and the selection circuit 391 is such that the redundant through hole 360, the connecting through hole 386, and the connecting through hole 417 are used.
- various methods can be used. For example, instead of using the redundant through hole 360, the connecting through hole 386, and the connecting through hole 417, for example, a fuse element or a flash memory may be used.
- the present invention can also be applied to other electronic elements such as a logic element. That is, by using the method of the present invention, a defective logic element can be replaced with a redundant logic element and repaired.
- defective memory cells are relieved in units of memory cells, but defective aggregates may be relieved in units of aggregates of memory cells 400.
- an aggregate of the memory cells 400 an aggregate of an arbitrary unit is selected. For example, a so-called block which is an aggregate of circuits 390 from which the same address is selected is used. In such a case, the defective block can be replaced with a redundant block and repaired using the method of the present invention.
- the present invention is not limited to such examples. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.
- the present invention is not limited to this example and can take various forms.
- the present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.
- FPD flat panel display
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Abstract
Description
良品回路においては、導電性材料で接合することにより、貫通電極と配線とが電気的に接続されるので、当該良品回路と貫通電極とが電気的に接続される。以上のように不良品の半導体チップ(以下、「不良品チップ」と呼ぶ場合がある。)と良品の半導体チップ(以下、「良品チップ」と呼ぶ場合がある。)が電気的に分離されるので、不良品チップの影響が他の良品チップに及ばない。したがって、不良品チップが存在しても半導体装置を良品にすることができ、半導体装置の歩留まりを向上させることができる。
11 デバイス層
12 半導体チップ
12a 良品チップ
12b 不良品チップ
13 回路
13a 良品回路
13b 不良品回路
14 配線
20 電極用貫通孔
21 選択用貫通孔
30 導電性材料
31 バンプ
32 貫通電極
40 導電性材料
41 絶縁性材料
50 半導体装置
60 配線
101 共有配線
110 貫通電極
111 電極
120 めっき液
130 テンプレート
132 第1の電極
133 第2の電極
150 裏面配線
160 半導体装置
200 半導体装置
210 ウェハ
211 デバイス層
212 半導体チップ
220 選択用貫通電極
221 データ用貫通電極
230 メモリ回路
231 シリアルパラレル変換回路
232 選択回路
233 ゲート回路
240 第1の信号線
241 第2の信号線
243 接続用電極
246 接続用貫通孔
247 導電性材料
248 絶縁性材料
250 選択用貫通孔
251 データ用貫通孔
260 冗長用ウェハ
261 デバイス層
262 冗長用チップ
270 冗長回路
271 シリアルパラレル変換回路
272 選択回路
273 ゲート回路
300 半導体製造装置
310 半導体チップ
311 ウェハ
312 デバイス層
320 冗長用チップ
321 ウェハ
322 デバイス層
330 アドレス用貫通電極
331 判定用貫通電極
340 冗長回路
341 不良アドレス記録部
342 判定回路
343 制御信号生成回路
344 第1のゲート回路
345 アドレス変換回路
346 第2のゲート回路
350(350a~350c) 冗長メモリセル
360 冗長用貫通孔
360a 第1の冗長用貫通孔
360b 第2の冗長用貫通孔
361 アドレス線
362 電源線
363 アドレス線
364 接地線
365 導電性材料
366 絶縁性材料
381 第1の信号線
382 第2の信号線
384 接続用電極
386 接続用貫通孔
387 導電性材料
388 絶縁性材料
390 回路
391 選択回路
392 ゲート回路
400 メモリセル
400a~400c 不良メモリセル
411 第1の信号線
412 第2の信号線
414 接続用電極
417 接続用貫通孔
418 導電性材料
419 絶縁性材料
420 アドレス用貫通孔
421 判定用貫通孔
450 冗長回路
460 冗長メモリセル
461 通常セルアレイ領域
462 冗長セルアレイ領域
Claims (58)
- 半導体装置の製造方法であって、
回路が形成された基板の厚み方向に貫通する、電極用貫通孔を形成する貫通孔形成工程と、
前記電極用貫通孔に導電性材料を供給して、貫通電極を形成する貫通電極形成工程と、
前記回路には接続されて、前記貫通電極には接続されておらず、少なくとも一部が前記基板の表面に露出している配線を形成する工程と、
前記回路の電気的試験の結果、不良品と判定された不良品回路においては、前記貫通電極と前記配線とを電気的に接続せず、
前記回路の電気的試験の結果、良品と判定された良品回路においては、導電性材料で接合することにより、前記貫通電極と前記配線とを電気的に接続する選択的接続工程と、
前記貫通電極及び前記配線が形成された基板を複数積層する積層工程と、を有する。 - 請求項1に記載の半導体装置の製造方法であって、
前記貫通孔形成工程において、基板の厚み方向に貫通する選択用貫通孔をさらに形成し、
前記選択的接続工程では、前記不良品回路において、前記選択用貫通孔に絶縁性材料を充填して、前記貫通電極と前記配線とを電気的に接続せず、
前記良品回路において、前記選択用貫通孔の上部に導電性材料を充填して、前記貫通電極と前記配線とを電気的に接続する。 - 請求項2に記載の半導体装置の製造方法であって、
前記基板には複数の回路が形成され、
前記積層工程において、前記複数の回路が形成された基板を複数積層する。 - 請求項2に記載の半導体装置の製造方法であって、
前記選択的接続工程において、前記回路の電気的試験の結果、良品と判定された良品回路が形成された基板に対して、前記選択用貫通孔の下部に絶縁性材料を充填する。 - 請求項2に記載の半導体装置の製造方法であって、
前記貫通孔形成工程において、前記電極用貫通孔と前記選択用貫通孔はそれぞれ複数形成され、
前記貫通電極形成工程において、複数の前記電極用貫通孔のうち、少なくとも1本の前記電極用貫通孔に前記貫通電極を形成する。 - 請求項5に記載の半導体装置の製造方法であって、
前記貫通電極形成工程において、前記複数の電極用貫通電極にそれぞれ前記貫通電極を形成する。 - 請求項5に記載の半導体装置の製造方法であって、
前記選択的接続工程において、前記良品回路が形成された基板に対して、一の前記選択用貫通孔の上部に導電性材料を充填し、且つ当該一の選択用貫通孔の下部に絶縁性材料を充填し、他の前記選択用貫通孔に絶縁性材料を充填する。 - 請求項2に記載の半導体装置の製造方法であって、
前記貫通孔形成工程において、前記電極用貫通孔は複数形成され、
前記貫通電極形成工程の前に、一の前記電極用貫通孔と前記回路との間を接続する導電性の配線を形成し、
前記貫通電極形成工程において、前記不良品回路が形成された基板に対して、前記配線が接続された前記一の電極用貫通孔には前記貫通電極を形成せず、他の前記電極用貫通孔には前記貫通電極を形成する。 - 請求項2に記載の半導体装置の製造方法であって、
前記貫通電極形成工程と前記選択的接続工程は、並行して行われる。 - 請求項2に記載の半導体装置の製造方法であって、
前記貫通電極形成工程の後、前記選択的接続工程が行われる。 - 請求項1に記載の半導体装置の製造方法であって、
前記貫通電極形成工程において、一対の前記貫通電極を形成し、
前記選択的接続工程では、前記良品回路において、前記一対の貫通電極のうちの一の貫通電極と前記配線とを接続する他の配線を形成して、当該一の貫通電極と前記配線とを電気的に接続する。 - 請求項11に記載の半導体装置の製造方法であって、
前記選択的接続工程において、前記一対の貫通電極に対応する位置に極性を切り替え自在の一対の第1の電極を備え、前記配線に対応する位置に極性を切り替え自在の一対の第2の電極を備えたテンプレートを基板に配置し、前記一対の第1の電極と前記一対の第2の電極により、前記一対の貫通電極のうちの一の貫通電極と前記配線に異なる極性で電圧を印加して、前記他の配線をめっき形成する。 - 請求項12に記載の半導体装置の製造方法であって、
前記選択的接続工程の前に、基板において、少なくとも前記他の配線が形成される場所は、めっきが形成されない他の場所に比べて、相対的に親水化される。 - 半導体装置であって、
回路が形成され、且つ厚み方向に電極用貫通孔が貫通して形成された基板が複数積層され、
前記電極用貫通孔に導電性材料が供給されて、前記積層された複数の基板を貫通する貫通電極が形成され、
前記回路には接続されて、前記貫通電極には接続されておらず、少なくとも一部が前記基板の表面に露出している配線が形成され、
前記回路の電気的試験の結果、不良品と判定された不良品回路においては、前記貫通電極と前記配線とが電気的に接続されず、
前記回路の電気的試験の結果、良品と判定された良品回路においては、導電性材料で接合することにより、前記貫通電極と前記配線とが電気的に接続されている。 - 請求項14に記載の半導体装置であって、
基板の厚み方向に貫通する選択用貫通孔がさらに形成され、
前記不良品回路において、前記選択用貫通孔に絶縁性材料が充填され、前記貫通電極と前記配線とが電気的に接続されず、
前記良品回路において、前記選択用貫通孔の上部に導電性材料が充填され、前記貫通電極と前記配線とが電気的に接続されている。 - 請求項15に記載の半導体装置であって、
前記基板には複数の回路が形成され、
前記複数の回路が形成された基板が複数積層されている。 - 請求項15に記載の半導体装置であって、
前記回路の電気的試験の結果、良品と判定された良品回路が形成された基板に対して、前記選択用貫通孔の下部に絶縁性材料が充填されている。 - 請求項15に記載の半導体装置であって、
前記基板には、前記電極用貫通孔と前記選択用貫通孔がそれぞれ複数形成され、
複数の前記電極用貫通孔のうち、少なくとも1本の前記電極用貫通孔に前記貫通電極が形成されている。 - 請求項18に記載の半導体装置であって、
前記複数の電極用貫通孔にそれぞれ前記貫通電極が形成されている。 - 請求項18に記載の半導体装置であって、
前記良品回路が形成された基板に対して、一の前記選択用貫通孔の上部に導電性材料が充填され、且つ当該一の選択用貫通孔の下部に絶縁性材料が充填され、他の前記選択用貫通孔に絶縁性材料が充填されている。 - 請求項15に記載の半導体装置であって、
前記基板には、前記電極用貫通孔が複数形成され、
一の前記電極用貫通孔と前記回路との間を接続する導電性の配線が形成され、
前記不良品回路が形成された基板に対して、前記配線が接続された前記一の電極用貫通孔には前記貫通電極が形成されず、他の前記電極用貫通孔には前記貫通電極が形成されている。 - 請求項14に記載の半導体装置であって、
前記貫通電極は、一対の貫通電極であり、
前記良品回路において、前記一対の貫通電極のうちの一の貫通電極と前記配線とを接続する他の配線が形成され、当該一の貫通電極と前記配線とが電気的に接続される。 - 請求項22に記載の半導体装置であって、
前記一対の貫通電極に対応する位置に極性を切り替え自在の一対の第1の電極を備え、前記配線に対応する位置に極性を切り替え自在の一対の第2の電極を備えたテンプレートを基板に配置し、前記一対の第1の電極と前記一対の第2の電極により、前記一対の貫通電極のうちの一の貫通電極と前記配線に異なる極性で電圧を印加して、前記他の配線はめっき形成される。 - 請求項23に記載の半導体装置であって、
基板において、少なくとも前記他の配線が形成される場所は、めっきが形成されない他の場所に比べて、相対的に親水化される。 - 半導体装置であって、
積層された複数の基板と、
前記複数の基板を貫通して形成され、選択信号を伝送する選択用貫通電極と、
前記複数の基板を貫通して形成され、データ信号を伝送するデータ用貫通電極と、を有し、
前記基板には、前記選択信号に基づいて、前記データ用貫通電極から前記基板に形成された所定の回路への前記データ信号の出力を制御する選択回路が形成されている。 - 請求項25に記載の半導体装置であって、
前記基板には、前記選択回路から出力される制御信号に基づいて、前記データ用貫通電極から前記所定の回路への前記データ信号の出力を制御するゲート回路が形成されている。 - 請求項26に記載の半導体装置であって、
前記選択回路は、前記選択信号を伝送する第1の信号線と、前記選択信号の反転信号を伝送する第2の信号線とを有し、
前記第1の信号線又は前記第2の信号線と前記ゲート回路とを接続することで、前記選択回路から前記ゲート回路に、前記選択信号又は前記反転信号が変換されて前記制御信号として出力される。 - 請求項27に記載の半導体装置であって、
前記選択回路は、前記第1の信号線又は前記第2の信号線と前記ゲート回路とを接続するための接続用貫通孔を有し、
前記接続用貫通孔の上部には導電性材料が充填され、且つ前記接続用貫通孔の下部には絶縁性材料が充填されている。 - 請求項25に記載の半導体装置であって、
前記選択用貫通電極は、前記選択信号をシリアルに伝送し、
前記基板には、前記シリアルな選択信号をパラレルに変換して前記選択回路に出力するシリアルパラレル変換回路が形成されている。 - 請求項25に記載の半導体装置であって、
前記選択用貫通電極は複数形成され、当該複数の選択用貫通電極は前記選択信号をパラレルに伝送する。 - 請求項25に記載の半導体装置であって、
前記複数の基板には冗長用基板がさらに積層され、
前記冗長用基板には、前記選択用貫通電極、前記データ用貫通電極、前記選択回路、及び前記所定の回路のうちの不良な回路を置換するための冗長回路が形成されている。 - 半導体装置の製造方法であって、
基板の厚み方向に貫通する、選択用貫通孔とデータ用貫通孔とをそれぞれ形成し、
前記選択用貫通孔に導電性材料を充填し、選択信号を伝送する選択用貫通電極を形成すると共に、前記データ用貫通孔に導電性材料を充填し、データ信号を伝送するデータ用貫通電極を形成し、
前記基板に、前記選択信号に基づいて、前記データ用貫通電極から前記基板に形成された所定の回路への前記データ信号の出力を制御する選択回路を形成し、
前記選択用貫通電極、前記データ用貫通電極及び前記選択回路が形成された基板を複数積層する。 - 請求項32に記載の半導体装置の製造方法であって、
前記複数の基板を積層する前に、前記基板に、前記選択回路から出力される制御信号に基づいて、前記データ用貫通電極から前記所定の回路への前記データ信号の出力を制御するゲート回路を形成する。 - 請求項33に記載の半導体装置の製造方法であって、
前記選択回路は、前記選択信号を伝送する第1の信号線と、前記選択信号の反転信号を伝送する第2の信号線とを有し、
前記選択回路から前記ゲート回路に、前記選択信号又は前記反転信号が変換されて前記制御信号として出力されるように、前記第1の信号線又は前記第2の信号線と前記ゲート回路とを接続する。 - 請求項34に記載の半導体装置の製造方法であって、
前記選択回路を形成する際、前記第1の信号線又は前記第2の信号線と前記ゲート回路とを接続するための接続用貫通孔を形成し、前記接続用貫通孔の上部に導電性材料を充填し、且つ当該接続用貫通孔の下部に絶縁性材料を充填する。 - 請求項32に記載の半導体装置の製造方法であって、
前記選択信号をシリアルに伝送するように、前記選択用貫通電極は1本形成され、
前記複数の基板を積層する前に、前記基板に、前記シリアルな選択信号をパラレルに変換して前記選択回路に出力するシリアルパラレル変換回路を形成する。 - 請求項32に記載の半導体装置の製造方法であって、
前記選択信号をパラレルに伝送するように、前記選択用貫通電極を複数形成する。 - 請求項32に記載の半導体装置の製造方法であって、
前記選択用貫通電極、前記データ用貫通電極、前記選択回路、及び前記所定の回路のうちの不良な回路を置換するための冗長回路が形成された冗長用基板を、前記複数の基板にさらに積層し、
前記不良な回路を前記冗長回路に置換する。 - 半導体装置であって、
複数の電子素子を備えた複数の半導体チップと、前記半導体チップの不良電子素子を置換するための冗長電子素子を備えた冗長用チップとが積層され、
前記積層された複数の半導体チップ及び冗長用チップを貫通して、前記電子素子の位置情報信号を伝送する位置情報用貫通電極が形成され、
前記積層された複数の半導体チップ及び冗長用チップを貫通して、前記冗長用チップから出力される判定信号を伝送する判定用貫通電極が形成され、
前記冗長用チップは、前記不良電子素子の位置情報が記録された不良位置情報記録部と、前記位置情報用貫通電極からの位置情報信号と前記不良位置情報記録部からの位置情報との一致又は不一致を判定する判定回路とを有し、
前記半導体チップでは、前記位置情報用貫通電極からの前記位置情報信号と前記判定用貫通電極からの前記判定信号とに基づいて、前記不良電子素子が前記冗長電子素子に置換され、且つ前記不良電子素子以外の前記電子素子が動作可能になる。 - 請求項39に記載の半導体装置であって、
前記冗長用チップは、
前記電子素子又は前記冗長電子素子の動作を制御するための制御信号を生成する制御信号生成回路と、
前記判定回路における判定が一致の場合に、前記不良電子素子を前記冗長電子素子に置換するように前記制御信号を出力し、前記判定回路における判定が不一致の場合に、前記電子素子を動作可能にするように前記制御信号を前記判定信号として出力するゲート回路とを有することを特徴とする、請求項1に記載の半導体装置。 - 請求項39に記載の半導体装置であって、
前記冗長用チップは、
複数の前記冗長電子素子が配置された冗長回路と、
前記判定回路における判定が一致の場合に、置換される前記複数の冗長電子素子が前記冗長回路内で連続して配置されるように、前記位置情報用貫通電極からの位置情報信号を変換する位置情報変換回路とを有する。 - 請求項41に記載の半導体装置であって、
前記位置情報変換回路は、前記位置情報信号を伝送する位置情報信号線と、前記位置情報信号の反転信号を伝送する反転位置情報信号線と、前記位置情報信号線又は前記反転位置情報信号線に形成された接続用貫通孔とを有し、
前記接続用貫通孔の上部には導電性材料が充填され、且つ前記接続用貫通孔の下部には絶縁性材料が充填されている。 - 請求項39に記載の半導体装置であって、
前記冗長用チップは、置換される複数の前記冗長電子素子が連続して配置された冗長回路を有する。 - 請求項39に記載の半導体装置であって、
前記半導体チップは、前記判定用貫通電極からの前記判定信号に基づいて、前記位置情報用貫通電極から前記半導体チップへの前記位置情報信号の出力を制御する選択回路を有する。 - 請求項44に記載の半導体装置であって、
前記半導体チップは、前記選択回路からの出力信号に基づいて、前記位置情報用貫通電極から前記半導体チップへの前記位置情報信号の出力を制御する他のゲート回路を有する。 - 請求項45に記載の半導体装置であって、
前記選択回路は、前記判定信号を伝送する判定信号線と、前記判定信号の反転信号を伝送する反転判定信号線と、前記判定信号線又は前記反転判定信号線と前記他のゲート回路とを接続するための他の接続用貫通孔とを有し、
前記他の接続用貫通孔の上部には導電性材料が充填され、且つ前記他の接続用貫通孔の下部には絶縁性材料が充填され、
前記判定信号線又は前記反転判定信号線を前記他のゲート回路と接続することで、前記選択回路から前記他のゲート回路に、前記判定信号又は前記反転信号が変換されて前記出力信号として出力される。 - 請求項39に記載の半導体装置であって、
前記不良位置情報記録部は、電源線接続用の第1の冗長用貫通孔と接地線接続用の第2の冗長用貫通孔を備えた一対の冗長用貫通孔を複数有し、
前記第1の冗長用貫通孔の上部に導電性材料が充填され、且つ第1の冗長用貫通電極の下部に絶縁性材料が充填されると共に、前記第2の冗長用貫通孔に絶縁性材料が充填されて、電源線と位置情報線が接続されるか、あるいは前記第2の冗長用貫通孔の上部に導電性材料が充填され、且つ第2の冗長用貫通電極の下部に絶縁性材料が充填されると共に、前記第1の冗長用貫通孔に絶縁性材料が充填されて、接地線と位置情報線が接続されることで、前記不良位置情報記録部には前記不良電子素子の位置情報が記録されている。 - 請求項39に記載の半導体装置であって、
前記半導体チップは、前記不良電子素子を置換するための他の冗長電子素子を有する。 - 半導体装置の製造方法であって、
複数の電子素子を備えた半導体チップと、前記半導体チップの不良電子素子を置換するための冗長電子素子を備えた冗長用チップとに対して、厚み方向に貫通する位置情報用貫通孔と判定用貫通孔とをそれぞれ形成し、
前記位置情報用貫通孔に導電性材料を充填し、前記電子素子の位置情報信号を伝送する選択用貫通電極を形成すると共に、前記判定用貫通孔に導電性材料を充填し、前記冗長用チップから出力される判定信号を伝送するデータ用貫通電極を形成し、
前記冗長用チップに、前記不良電子素子の位置情報が記録された不良位置情報記録部と、前記位置情報用貫通電極からの位置情報信号と前記不良位置情報記録部からの位置情報との一致又は不一致を判定する判定回路とを形成し、
複数の前記半導体チップと前記冗長用チップとを積層し、
前記半導体チップでは、前記位置情報用貫通電極からの前記位置情報信号と、前記判定用貫通電極からの前記判定信号とに基づいて、前記不良電子素子を前記冗長電子素子に置換し、且つ前記不良電子素子以外の前記電子素子を動作可能にする。 - 請求項49に記載の半導体装置の製造方法であって、
前記複数の半導体チップと前記冗長用チップとを積層する前に、前記冗長用チップに、前記電子素子又は前記冗長電子素子の動作を制御するための制御信号を生成する制御信号生成回路と、前記判定回路における判定が一致の場合に、前記不良電子素子を前記冗長電子素子に置換するように前記制御信号を出力し、前記判定回路における判定が不一致の場合に、前記電子素子を動作可能にするように前記制御信号を前記判定信号として出力するゲート回路とを形成する。 - 請求項49に記載の半導体装置の製造方法であって、
前記複数の半導体チップと前記冗長用チップとを積層する前に、前記冗長用チップに、複数の前記冗長電子素子が配置された冗長回路と、前記判定回路における判定が一致の場合に、置換される前記複数の冗長電子素子が前記冗長回路内で連続して配置されるように、前記位置情報用貫通電極からの位置情報信号を変換する位置情報変換回路とを形成する。 - 請求項51に記載の半導体装置の製造方法であって、
前記位置情報変換回路を形成する際には、前記位置情報信号を伝送する位置情報信号線と、前記位置情報信号の反転信号を伝送する反転位置情報信号線と、前記位置情報信号線又は前記反転位置情報信号線における接続用貫通孔とを形成し、
前記接続用貫通孔の上部に導電性材料を充填し、且つ前記接続用貫通孔の下部には絶縁性材料を充填する。 - 請求項49に記載の半導体装置の製造方法であって、
前記複数の半導体チップと前記冗長用チップとを積層する前に、前記冗長用チップに、置換される複数の前記冗長電子素子が連続して配置された冗長回路を形成する。 - 請求項49に記載の半導体装置の製造方法であって、
前記複数の半導体チップと前記冗長用チップとを積層する前に、前記半導体チップに、前記判定用貫通電極からの前記判定信号に基づいて、前記位置情報用貫通電極から前記半導体チップへの前記位置情報信号の出力を制御する選択回路を形成する。 - 請求項54に記載の半導体装置の製造方法であって、
前記複数の半導体チップと前記冗長用チップとを積層する前に、前記半導体チップに、前記選択回路からの出力信号に基づいて、前記位置情報用貫通電極から前記半導体チップへの前記位置情報信号の出力を制御する他のゲート回路を形成する。 - 請求項55に記載の半導体装置の製造方法であって、
前記選択回路を形成する際には、前記判定信号を伝送する判定信号線と、前記判定信号の反転信号を伝送する反転判定信号線と、前記判定信号線又は前記反転判定信号線と前記他のゲート回路とを接続する他の接続用貫通孔とを形成し、
前記他の接続用貫通孔の上部に導電性材料を充填し、且つ前記他の接続用貫通孔の下部に絶縁性材料を充填し、
前記判定信号線又は前記反転判定信号線を前記他のゲート回路と接続することで、前記選択回路から前記他のゲート回路に、前記判定信号又は前記反転信号が変換されて前記出力信号として出力される。 - 請求項49に記載の半導体装置の製造方法であって、
前記不良位置情報記録部を形成する際には、電源線接続用の第1の冗長用貫通孔と接地線接続用の第2の冗長用貫通孔を備えた一対の冗長用貫通孔を複数形成し、
前記第1の冗長用貫通孔の上部に導電性材料を充填し、且つ第1の冗長用貫通電極の下部に絶縁性材料を充填すると共に、前記第2の冗長用貫通孔に絶縁性材料を充填して、電源線と位置情報線を接続するか、あるいは前記第2の冗長用貫通孔の上部に導電性材料を充填し、且つ第2の冗長用貫通電極の下部に絶縁性材料を充填すると共に、前記第1の冗長用貫通孔に絶縁性材料を充填して、接地線と位置情報線を接続することで、前記不良位置情報記録部に前記不良電子素子の位置情報を記録する。 - 請求項49に記載の半導体装置の製造方法であって、
前記複数の半導体チップと前記冗長用チップとを積層する前に、前記半導体チップに、前記不良電子素子を置換するための他の冗長電子素子を形成する。
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CN109388578A (zh) * | 2017-08-11 | 2019-02-26 | 爱思开海力士有限公司 | 存储装置及其操作方法 |
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CN109388578A (zh) * | 2017-08-11 | 2019-02-26 | 爱思开海力士有限公司 | 存储装置及其操作方法 |
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US11996335B2 (en) | 2021-03-09 | 2024-05-28 | Kioxia Corporation | Manufacturing method of semiconductor device |
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