WO2012070546A1 - 転写装置及び樹脂パターン製造方法 - Google Patents

転写装置及び樹脂パターン製造方法 Download PDF

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Publication number
WO2012070546A1
WO2012070546A1 PCT/JP2011/076833 JP2011076833W WO2012070546A1 WO 2012070546 A1 WO2012070546 A1 WO 2012070546A1 JP 2011076833 W JP2011076833 W JP 2011076833W WO 2012070546 A1 WO2012070546 A1 WO 2012070546A1
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WIPO (PCT)
Prior art keywords
transfer
transferred
flexible
resin
pressure roller
Prior art date
Application number
PCT/JP2011/076833
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English (en)
French (fr)
Japanese (ja)
Inventor
寛 坂本
聡 白鳥
海田　由里子
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to KR1020137012067A priority Critical patent/KR20130133184A/ko
Priority to CN2011800550330A priority patent/CN103210474A/zh
Priority to JP2012545751A priority patent/JPWO2012070546A1/ja
Publication of WO2012070546A1 publication Critical patent/WO2012070546A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/006—Degassing moulding material or draining off gas during moulding

Definitions

  • the present invention relates to a transfer device and a resin pattern manufacturing method, and more particularly, to a transfer device and a resin pattern manufacturing method capable of stably and continuously forming a flexible mold made of resin.
  • a nanoimprint method in which a fine concavo-convex structure on the surface of a nanometer is used to transfer the fine concavo-convex structure to a resist or a resin using a mold.
  • This nanoimprint method has recently been attracting attention because it has a shorter processing time than conventional methods using photolithography and etching, requires less equipment costs and material costs to form a fine relief structure, and is excellent in productivity. Collecting.
  • manufacturing methods using photolithography and etching are generally good at single-wafer processes based on rigid (ie, rigid) substrates such as silicon wafers and quartz substrates, whereas nanoimprints are rigid substrates. It is characterized by good compatibility with a roll-to-roll process using a flexible substrate such as a resin film as well as a single-wafer process using as a base material.
  • the roll-to-roll process requires a roll-shaped mold, but it is very difficult to form a nano-order pattern into a roll shape.
  • a method of wrapping the material around a transfer roll and substituting it is proposed.
  • the nickel mold used here can be produced by forming a resist pattern on a rigid substrate such as a silicon wafer using photolithography and then replicating the resist pattern by nickel electroforming.
  • a replica may be obtained from the etched fine pattern by nickel electroforming.
  • defects such as scratches and dirt on the mold become defects in the transferred product, and therefore it is necessary to replace the mold as soon as it occurs. Therefore, a mold that can be obtained at a lower cost than a nickel mold is required.
  • the nanoimprint mold used in the roll-to-roll process can be wound around the transfer roll, has excellent durability, and is inexpensive. For this reason, a resin-made flexible mold in which a pattern is once nanoimprinted on a film from an expensive flat master made of a material such as quartz or silicon is used (Patent Document 1).
  • a resin film coated with a photocurable resin and a mold are fixed between stages that are parallel plates and spaced apart, with the pattern surface and the photocurable resin coated surface facing each other, and one stage on the other side
  • UV light is applied to form a pattern on the resin film, or a resin film coated with a photo-curable resin and the master of the mold
  • the method is such that the photo-curing resin application surface is placed so as to face each other, a pressure roll is pressed against the resin film, scanned, and then irradiated with UV light to form a pattern on the resin film.
  • in-plane pressing unevenness can be suppressed by lowering the roughness of the stage surface, but as the mold area increases, it is necessary to increase the pressing pressure, which increases the size of the device, etc. There's a problem. Further, when transferring by the mold, air existing between the convex portions of the mold tends to remain on the surface of the resin pattern as bubbles, which may cause a pattern defect. As a method of preventing bubbles from remaining, a method of transferring under reduced pressure has been proposed. Similarly, as the mold size increases, the size of the chamber in which the mold is accommodated increases, and a large-capacity vacuum pump is required. There is a problem such as becoming overhanging. In the case of the latter method, pressing unevenness of the pressure roll becomes a cause of transfer failure.
  • the unevenness from the mold (not shown) is transferred to the resin 3 applied on the film 1 which becomes the base material after the transfer.
  • the height of the film was indicated by H), and the height was not uniform depending on the location, and there was a risk of uneven film thickness.
  • the present invention has been made in view of such conventional problems, and an object of the present invention is to provide a transfer apparatus and a resin pattern manufacturing method capable of stably and continuously forming a resin-made flexible mold. To do.
  • the present invention provides a transfer member having rigidity or flexibility, a transfer member having rigidity or flexibility, and at least one of the transfer member and the transfer member.
  • Application means for applying a curable resin to a predetermined area transfer means for transferring the transfer member and the transferred member to each other with the curable resin interposed therebetween; and a curing means for curing the curable resin;
  • the transfer apparatus includes a peeling unit that peels the transferred transfer member and the transferred member from each other, and at least one of the transfer member and the transferred member has flexibility.
  • the transfer means is a member that is pressed against one of the transfer member or one of the members to be transferred while having flexibility against the other member of the transfer member or the member to be transferred.
  • a pressure roller that feeds and scans in parallel, and a tension generating means that pulls the one flexible member with a predetermined tension from the pressure roller toward a diagonal direction forward from the scanning direction. It is characterized by.
  • the transfer member is a member provided with a mold having a concavo-convex pattern on the surface.
  • the pressure roller then feeds and scans in parallel with the other member of the transfer member or the member to be transferred while pressing against one of the members having flexibility among the transfer member or the member to be transferred. At this time, one member having flexibility is pulled with a predetermined tension from the pressure roller toward the diagonally forward direction from the scanning direction.
  • the resin is not yet transferred. Air leaks out of the gap. For this reason, even if it does not process in a pressure-reduced environment, a bubble does not remain on the resin side.
  • the concavo-convex pattern is transferred to the curable resin by pressing the concavo-convex pattern of the transfer member against the curable resin. Thereafter, the pattern shape can be maintained by curing the curable resin and releasing the mold.
  • the present invention includes a transfer member having rigidity or flexibility, a transfer member having rigidity or flexibility, and at least one of the transfer member and the transfer member.
  • the transfer apparatus includes a peeling unit that peels the transferred transfer member and the transferred member from each other, and at least one of the transfer member and the transferred member has flexibility. And the peeling means is against the other member of the transfer member or the member to be transferred while pressing against the flexible member of the transfer member or the member to be transferred.
  • a pressure roller that scans back in parallel; and tension generating means for pulling the one flexible member with a predetermined tension from the pressure roller toward the front oblique direction with the pressure roller as a fulcrum.
  • the transfer member is a member provided with a mold having a concavo-convex pattern on the surface. Then, while pressing against the flexible member of the transfer member or the member to be transferred with the pressure roller, the scanning is performed in parallel with the other member of the transfer member or the member to be transferred. At this time, one member having flexibility is pulled with a predetermined tension from the pressure roller toward the diagonally forward direction from the scanning direction. By comprising in this way, the flexible member in a transfer member or a to-be-transferred member can be smoothly peeled from a fixed position little by little from the other member in a transfer member or a to-be-transferred member.
  • the present invention is an invention of a transfer device, and comprises a reversing means for reversing either the transfer member or the transfer target member.
  • the present invention is an invention of a transfer device, and has the flexibility so that one of the flexible members is bent at a corner of one end of the other member.
  • a first elevating roll that holds one end of one member at a position higher than the height of the corner portion is provided.
  • the present invention (Claim 5) is an invention of a transfer device, and includes a second lifting roll for holding the one flexible member in the oblique direction.
  • the present invention is an invention of a transfer device, wherein a feeding side guide roll having a first tension sensor that guides a feeding side of the one flexible member, and the flexibility A winding-side guide roll that guides a winding side of one member having a second tension sensor, a feeding roll that feeds out the one flexible member, and one flexible member A take-up roll that winds up the member, drives the feeding roll based on the tension detected by the first tension sensor, and moves the take-up roll based on the tension detected by the second tension sensor. It is characterized by being driven.
  • the present invention is an invention of a transfer device, wherein the curing means is configured to include a light irradiation mechanism in which ultraviolet light emitting elements are arranged in a straight line.
  • the ultraviolet light emitting elements are arranged in a straight line, it is cheaper than arranging the ultraviolet light emitting elements on one side. Further, if the scanning is performed at a constant speed, unevenness in the amount of irradiation light does not occur in the scanning direction.
  • the curing means can be based on heat or the like.
  • the present invention is an invention of a transfer apparatus, wherein a length measuring means for measuring the unwinding dimension of the one flexible member, and an unwinding dimension measured by the length measuring means. And a cutting means for cutting the one flexible member.
  • the present invention cures a predetermined area of a predetermined area of a transfer member having rigidity or flexibility or a predetermined area of a transfer target member having rigidity or flexibility.
  • the transfer member and the transferred member are transferred after the transfer resin and the transferred member are transferred to each other with the curable resin interposed therebetween, and the curable resin is cured.
  • the pressure roller is fed and scanned in parallel to the transfer member or the other member of the transferred member while pressing, and the flexible roller is used as a fulcrum for the one member having flexibility. Run Toward the front oblique direction than the direction wherein the traction with a predetermined tension.
  • the present invention cures a predetermined area of a predetermined area of a transfer member having rigidity or flexibility or a predetermined area of a transfer target member having rigidity or flexibility.
  • the transfer member and the transferred member are transferred after the transfer resin and the transferred member are transferred to each other with the curable resin interposed therebetween, and the curable resin is cured.
  • a resin pattern manufacturing method in which a resin pattern is created by peeling each other from each other, and in the peeling step, a pressure roller is applied to one of the transfer member or one of the members to be transferred that has flexibility.
  • the pressure roller is scanned back in parallel with the transfer member or the other member of the member to be transferred while pressing, and the flexible roller is used as a fulcrum for the one member having flexibility. From ⁇ direction toward a diagonally forward direction, characterized in that pulling a predetermined tension.
  • the transfer member or the other member of the transferred member is pressed against the flexible member of the transfer member or the transferred member with the pressure roller. Since one of the flexible members is pulled with a predetermined tension from the scanning direction toward the front oblique direction with the pressure roller as a fulcrum, the transfer member or the covered member is scanned. One of the members of the transfer member or the member to be transferred that is flexible can be pressed little by little against the other member of the transfer member, and air can be discharged from a slight gap where the resin has not yet been transferred. Push it out. For this reason, even if it does not process in a pressure-reduced environment, a bubble does not remain on the resin side.
  • the front view of the transfer apparatus which is embodiment of this invention AA arrow cross-sectional view in FIG.
  • the top view of the transfer device which is an embodiment of the present invention
  • Conceptual diagram of transcription of the present invention The figure which shows each processing process of a transfer device Diagram showing each processing step of transfer device (details of transfer) Diagram showing each processing step of transfer device (details of peeling)
  • the figure explaining the diversity of embodiment of this invention Example of application to roll-to-roll nanoimprint transfer system Example of flexible substrate having multiple application areas
  • FIG. 1 is a front view of a transfer apparatus according to an embodiment of the present invention
  • FIG. 2 is a sectional view taken along the line AA in FIG. 1, and FIG.
  • a mode in which a transfer member is a rigid mold and a transfer target member is a flexible substrate 9 will be described.
  • a feeding roll 11 wound with a flexible base 9 and a feeding-side guide roll 13 for guiding the flexible base 9 to the upper right are provided at the left end of the transfer device 10.
  • a winding roll 15 for winding the flexible base material 9 and a winding side guide roll 17 for guiding the flexible base material 9 are attached to the upper left of the transfer apparatus 10 at the right end.
  • the feeding-side guide roll 13 and the winding-side guide roll 17 are attached so that the height in the Z-axis direction is the same. Therefore, when the flexible base material 9 is passed, the flexible base material 9 is stretched horizontally in the Y-axis direction between the feeding side guide roll 13 and the winding side guide roll 17. It has become.
  • the feeding side guide roll 13 and the winding side guide roll 17 are provided with tension sensors 19 and 21, respectively, and torque control is performed on a motor (not shown) for driving the feeding roll 11 based on the tension detected by the tension sensor 19. Is supposed to do. On the other hand, torque control is performed on a motor (not shown) for driving the take-up roll 15 based on the tension detected by the tension sensor 21. Thereby, the tension of the flexible base material 9 can be adjusted.
  • a vacuum suction stage 20 that can be evacuated from a vacuum pump (not shown) is disposed at the center of the transfer device 10.
  • a plurality of small holes are formed on one surface of the vacuum suction stage 20, and outside air is sucked to the vacuum pump side through the small holes.
  • the vacuum suction stage 20 is rotatable about the horizontal axis 25, and the rigid mold member 23 can be placed from above while being opened around the horizontal axis 25.
  • the mounted rigid mold member 23 is fixed to the vacuum suction stage 20 by suction in a small hole of the vacuum suction stage 20.
  • a flexible base material 9 is sandwiched between the upper and lower sides of the Z-axis direction on the left and right sides of the vacuum suction stage 20 and the rigid mold member 23 when tilted horizontally, and is movable up and down in the Z-axis direction.
  • One lifting rolls 27a and 27b and second lifting rolls 29a and 29b are provided, respectively.
  • a pressure roller 31 is disposed horizontally below the rigid mold member 23 with the flexible base material 9 interposed therebetween so as to be movable horizontally at a constant speed in the Y-axis direction.
  • a UV irradiation lamp 33 in which ultraviolet light emitting elements such as LEDs (not shown) are linearly arranged in the X-axis direction as shown in FIG.
  • the UV irradiation lamp 33 is provided as an irradiation mechanism, and is movable horizontally at a constant speed in the Y-axis direction.
  • a resin application area 35 is formed on the left side of the vacuum suction stage 20 and the first elevating rolls 27a and 27b of the rigid mold member 23 when it is tilted horizontally.
  • the nozzle 37 is positioned and controlled by an XYZ axis robot 39.
  • the winding guide roll 17 is provided with a length meter (not shown) so that the moving distance of the flexible base material 9 can be measured.
  • the flexible base material 9 is sent to the cutting stage 40 shown in FIG. 3 so that the flexible base material 9 can be cut by a film cutter (not shown).
  • FIG. 4 is a conceptual diagram of transfer according to the present invention.
  • a rigid mold member 23 having a pattern portion 43 with an uneven pattern is placed on a vacuum suction stage 20 (not shown).
  • the rigid mold member 23 is sucked by the vacuum suction stage 20. It is in the state.
  • the material of the rigid mold member 23 is quartz, silicon, nickel or the like.
  • a photocurable resin 47 is applied to the resin application area 35 of the flexible substrate 9 by a resin application nozzle 37.
  • a thermoplastic resin or a thermosetting resin film can be used as a material of the flexible substrate 9.
  • a photocurable composition that can be photocured by photoradical polymerization can be used as a material of the photocurable resin 47.
  • a method for applying the photocurable resin 47 die coating, bar coating, blade coating, knife coating, roll coating, spray coating, ink jet, or the like can be used.
  • a thermosetting resin that can be thermoset by thermal radical polymerization can also be used.
  • a linear infrared heater or the like in the X-axis direction is provided as a heating device, and the infrared heater may be scanned horizontally at a constant speed in the Y-axis direction. .
  • the surface of the rigid mold member 23 may be subjected to a surface treatment in advance in order to improve releasability.
  • This surface treatment preferably includes a compound having a fluoroalkyl group (which may have an etheric oxygen atom), a silicone chain, or a long-chain alkyl group having 4 to 24 carbon atoms. It is particularly preferable to include a compound having
  • the resin application area 35 of the flexible base material 9 is wider than the entire pattern portion 43 of the rigid mold member 23 and is narrower than the outer shape of the rigid mold member 23. That is, as shown in FIG. 4A, the resin application area 35 is formed inside the flexible substrate 9, and the rigid mold member 23 is formed outside the surface of the resin application area 35. .
  • FIG. 4C shows the transfer process.
  • the pressure roller 31 is moved in the positive direction along the Y axis while pressing the pressure roller 31 with a predetermined pressure in the Z axis direction from below.
  • the right end side of the flexible base material 9 is pulled obliquely downward to the right with a constant tension.
  • the photo-curable resin 47 is cured by UV irradiation, but any side of the rigid mold member 23 side and the flexible substrate 9 side can be used as long as ultraviolet rays can be transmitted. May be irradiated.
  • the photocurable resin 47 of the flexible substrate 9 is peeled from the rigid mold member 43.
  • the pressure roller 31 is pressed from below at a predetermined pressure in the Z-axis direction, and is moved in the Y-axis negative direction as opposed to the transfer step of FIG.
  • the right end side of the flexible base material 9 is pulled obliquely downward to the right with a constant tension.
  • the position of the peeling portion is kept constant and the peeling speed is kept constant.
  • the peeling is gradually performed, so that smooth peeling is possible.
  • FIG. 5A shows a resin base material passing process.
  • the first elevating rolls 27a and 27b and the second elevating rolls 29a and 29b are opened, and the flexible base 9 is horizontally disposed in the Y-axis direction between the feeding side guide roll 13 and the take-up side guide roll 17. Are in a balanced state with a predetermined tension.
  • the resin application nozzle 37 applies resin to the resin application area 35 while being moved by the XYZ axis robot 39.
  • one end of the flexible base material 9 is fixed by the first elevating rolls 27a and 27b, while the tension is kept constant by the tension sensor 19 on the other end side, so that the coating film thickness is uniform. Kept.
  • the surface of the photocurable resin 47 of the flexible base 9 is opened with the first lifting rolls 27a and 27b and the second lifting rolls 29a and 29b opened.
  • the flexible base material 9 is moved in the positive direction of the Y-axis to a position where it meets the surface of the rigid mold member 23.
  • the first elevating rolls 27a and 27b and the second elevating rolls 29a and 29b are closed again.
  • the flexible base material 9 is not pressed against the rigid mold member 23 at once, but is pressed gradually by scanning the pressure roller 31.
  • the first elevating rolls 27a and 27b are raised in FIG. 6A, while the second elevating rolls 29a and 29b are lowered.
  • the flexible base material 9 is bent into a “ ⁇ ” shape (“L” shape) at the bottom corner of the rigid mold member 23.
  • the pressure roller 31 is moved at a constant speed in the positive direction of the Y axis while pressing the pressure roller 31 from below with a predetermined pressure. At this time, the right end side of the flexible base material 9 is pulled obliquely downward to the right with a constant tension by the tension sensor 21 of the rewinding guide roller 17.
  • the UV irradiation lamp 33 that is linear in the X-axis direction is scanned horizontally at a constant speed in the Y-axis direction, thereby causing ultraviolet rays. Is irradiated to cure the photocurable resin 47. Unlike the arrangement of the UV irradiation lamp 33 on one surface, the UV irradiation lamp 33 is inexpensive because it is configured in a straight line in the X-axis direction. Further, by scanning at a constant speed, there is no unevenness in the amount of irradiation light in the Y-axis direction.
  • the cured photocurable resin 47 is peeled from the rigid mold member 23.
  • the flexible substrate 9 is not peeled off from the rigid mold member 23 at once, but is peeled off while scanning the pressure roller 31.
  • the pressure roller 31 is moved in the Y-axis negative direction so that the pressure roller 31 is a fulcrum in order to gradually peel the flexible substrate 9.
  • the right end side of the flexible base material 9 is pulled obliquely downward to the right with a constant tension by the tension sensor 21 of the rewinding guide roller 17.
  • the second elevating rolls 29a and 29b are raised, and the first elevating rolls 27a and 27b are lowered.
  • the flexible substrate 9 is sent to the cutting stage 40 in FIG.
  • the resin pattern 100 composed of the flexible substrate 9 and the photocurable resin 47 thus completed can make the film thickness of the photocurable resin 47 uniform.
  • the photocurable resin may be applied to either the mold side or the substrate side as shown in FIG.
  • the photocurable resin 47 is applied on the flexible base material 9 that is a base material.
  • the photocurable resin 147 may be applied to the base material 109 side as in the present embodiment, or may be applied to the mold 123 side.
  • the member to be transferred is the flexible base material 9 and the transfer member is the rigid mold member 23 has been described.
  • the member to which the pressure roller 31 is applied may be a transfer member having flexibility, that is, a flexible mold.
  • the member to be transferred may be flexible or rigid.
  • the member to which the pressure roller 31 is applied is a flexible transfer member, that is, a flexible member, as in the transfer process. It may be a mold. In this case, the member to be transferred may be flexible or rigid.
  • the transfer member may be a flexible member, that is, a flexible mold.
  • the transferred member may be flexible or rigid (second embodiment).
  • the pressure roller 31 is applied to the flexible mold.
  • the photocurable resin 147 may be applied to the base material 109 side or may be applied to the mold 123 side.
  • the rigid transfer member may be a glass plate.
  • thermoplastic resin or a thermosetting resin film or a metal sheet having flexibility as a base material, and a resin pattern formed by nanoimprinting on one side thereof can be used as a flexible mold.
  • the base material is preferably a thermoplastic resin or thermosetting resin film that transmits ultraviolet rays.
  • the UV irradiation lamp 33 irradiates from the lower side of the flexible substrate 9, but if ultraviolet rays can pass, as shown in FIG. Irradiation may be performed from below the base material 109 or from above the mold 123.
  • the first embodiment is suitable when a flexible thermoplastic resin or a thermosetting resin film is used as a substrate and quartz, silicon, metal, or the like having high rigidity is used as a mold.
  • the second embodiment is suitable when a resin mold is used as a flexible mold and a glass plate, a thermoplastic resin, or a thermosetting resin film is used as a base material.
  • the transfer portion is conventionally configured in a drum type as shown in FIG.
  • a single-wafer mold 100 (for example, three sheets) is used by being attached to a cylindrical transfer drum 50.
  • a plurality of resin application areas 35 can be formed on the flexible substrate 9.
  • the resin mold 200 having three resin application areas 35 ⁇ / b> A, 35 ⁇ / b> B, and 35 ⁇ / b> C is generated, and the resin mold 200 is wound around the transfer drum 50, so that the mounting operation can be easily completed.
  • the transfer apparatus and the resin pattern manufacturing method of the present invention are useful for manufacturing a resin pattern using a mold for nanoimprinting (particularly, a mold having a maximum dimension of any one of the width, height, and pitch of the protrusions of 950 nm or less). is there.
  • a mold for nanoimprinting particularly, a mold having a maximum dimension of any one of the width, height, and pitch of the protrusions of 950 nm or less.

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JP2014054735A (ja) * 2012-09-11 2014-03-27 Toshiba Mach Co Ltd 転写装置および被成形体
JP2014203897A (ja) * 2013-04-02 2014-10-27 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP2014213552A (ja) * 2013-04-26 2014-11-17 株式会社日立産機システム ナノインプリント方法及びそのための装置
JP2014213551A (ja) * 2013-04-26 2014-11-17 株式会社日立産機システム ナノインプリント方法及びそのための装置
JP2014226877A (ja) * 2013-05-24 2014-12-08 パナソニック株式会社 微細パターン形成方法、及び微細パターン形成装置
WO2015072572A1 (ja) * 2013-11-18 2015-05-21 Ｓｃｉｖａｘ株式会社 離型装置及び離型方法
KR20150127092A (ko) * 2013-03-15 2015-11-16 캐논 나노테크놀로지즈 인코퍼레이티드 금속 또는 산화물 코팅을 가진 재사용가능한 중합체 주형을 사용한 나노 임프린팅
JP2018140577A (ja) * 2017-02-28 2018-09-13 東芝機械株式会社 転写装置および転写方法
JP2019174755A (ja) * 2018-03-29 2019-10-10 株式会社オーク製作所 露光装置
CN110320765A (zh) * 2018-03-29 2019-10-11 株式会社Orc制作所 曝光装置
JP2021028933A (ja) * 2019-08-09 2021-02-25 Ａｉメカテック株式会社 微細構造転写装置及び微細構造転写方法
JP7475646B2 (ja) 2020-04-24 2024-04-30 Ａｉメカテック株式会社 微細構造転写装置及び微細構造転写方法

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WO2016181831A1 (ja) * 2015-05-13 2016-11-17 凸版印刷株式会社 凹凸パターン形成体の製造方法、その製造装置、及びシール
KR101877772B1 (ko) * 2016-12-30 2018-07-13 주식회사 에스에프에이 패턴 복제장치
KR102165656B1 (ko) * 2017-10-25 2020-10-14 시바우라 기카이 가부시키가이샤 전사 장치 및 전사 방법
CN109709766B (zh) 2017-10-25 2023-06-16 东芝机械株式会社 转印装置
JP6397553B1 (ja) * 2017-10-25 2018-09-26 東芝機械株式会社 転写装置
JP7245973B2 (ja) * 2019-02-04 2023-03-27 パナソニックＩｐマネジメント株式会社 パターンの形成方法および装置

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JP2001058352A (ja) * 1999-06-14 2001-03-06 Dainippon Printing Co Ltd 密着転写方法および装置ならびに転写型
JP2004288783A (ja) * 2003-03-20 2004-10-14 Hitachi Ltd ナノプリント装置、及び微細構造転写方法
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WO2014010517A1 (ja) * 2012-07-10 2014-01-16 旭硝子株式会社 インプリント方法、及びインプリント装置
JP2014054735A (ja) * 2012-09-11 2014-03-27 Toshiba Mach Co Ltd 転写装置および被成形体
KR102170524B1 (ko) * 2013-03-15 2020-10-27 캐논 나노테크놀로지즈 인코퍼레이티드 금속 또는 산화물 코팅을 가진 재사용가능한 중합체 주형을 사용한 나노 임프린팅
KR20150127092A (ko) * 2013-03-15 2015-11-16 캐논 나노테크놀로지즈 인코퍼레이티드 금속 또는 산화물 코팅을 가진 재사용가능한 중합체 주형을 사용한 나노 임프린팅
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JP2014203897A (ja) * 2013-04-02 2014-10-27 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP2014213551A (ja) * 2013-04-26 2014-11-17 株式会社日立産機システム ナノインプリント方法及びそのための装置
JP2014213552A (ja) * 2013-04-26 2014-11-17 株式会社日立産機システム ナノインプリント方法及びそのための装置
JP2014226877A (ja) * 2013-05-24 2014-12-08 パナソニック株式会社 微細パターン形成方法、及び微細パターン形成装置
WO2015072572A1 (ja) * 2013-11-18 2015-05-21 Ｓｃｉｖａｘ株式会社 離型装置及び離型方法
JP2018140577A (ja) * 2017-02-28 2018-09-13 東芝機械株式会社 転写装置および転写方法
JP2019174755A (ja) * 2018-03-29 2019-10-10 株式会社オーク製作所 露光装置
CN110320765A (zh) * 2018-03-29 2019-10-11 株式会社Orc制作所 曝光装置
JP7040981B2 (ja) 2018-03-29 2022-03-23 株式会社オーク製作所 露光装置
TWI816763B (zh) * 2018-03-29 2023-10-01 日商鷗爾熙製作所股份有限公司 曝光裝置
JP2021028933A (ja) * 2019-08-09 2021-02-25 Ａｉメカテック株式会社 微細構造転写装置及び微細構造転写方法
JP7475646B2 (ja) 2020-04-24 2024-04-30 Ａｉメカテック株式会社 微細構造転写装置及び微細構造転写方法

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