WO2012053431A1 - Séparateur de pile à combustible et son procédé de production - Google Patents

Séparateur de pile à combustible et son procédé de production Download PDF

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Publication number
WO2012053431A1
WO2012053431A1 PCT/JP2011/073620 JP2011073620W WO2012053431A1 WO 2012053431 A1 WO2012053431 A1 WO 2012053431A1 JP 2011073620 W JP2011073620 W JP 2011073620W WO 2012053431 A1 WO2012053431 A1 WO 2012053431A1
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Prior art keywords
stainless steel
gold plating
layer
fuel cell
plating layer
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PCT/JP2011/073620
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English (en)
Japanese (ja)
Inventor
将幸 横田
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株式会社Ｎｅｏｍａｘマテリアル
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Application filed by 株式会社Ｎｅｏｍａｘマテリアル filed Critical 株式会社Ｎｅｏｍａｘマテリアル
Priority to CN201180040114.3A priority Critical patent/CN103069629B/zh
Priority to JP2012513374A priority patent/JP5133466B2/ja
Priority to KR1020137004717A priority patent/KR101266096B1/ko
Publication of WO2012053431A1 publication Critical patent/WO2012053431A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0223—Composites
    • H01M8/0228—Composites in the form of layered or coated products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0206—Metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/10—Fuel cells with solid electrolytes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/10—Fuel cells with solid electrolytes
    • H01M2008/1095—Fuel cells with polymeric electrolytes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a separator for a fuel cell, and more particularly to a separator suitable for a polymer electrolyte fuel cell used for a power source for automobiles, a power source for portable devices, a distributed power source and the like.
  • a fuel cell is a power generation device that extracts electric energy by electrochemically reacting hydrogen, which is a fuel, and oxygen.
  • the fuel cell can be a solid oxide fuel cell (SOFC), a molten carbonate fuel cell (MCFC), a phosphoric acid fuel cell (PAFC), or a solid polymer fuel cell (PEFC).
  • SOFC solid oxide fuel cell
  • MCFC molten carbonate fuel cell
  • PAFC phosphoric acid fuel cell
  • PEFC solid polymer fuel cell
  • DMFC direct methanol fuel cell
  • PEFC and DMFC have an operating temperature as low as about 70 to 90 ° C compared to other types of fuel cells, and PEFC and DMFC can generate high-efficiency power even with PEFC of about 1 kW and DMFC of about several hundred watts.
  • application to automobiles and portable devices is expected.
  • the DMFC is small, and its application to portable devices has been energetically studied.
  • the separator is required to have low gas permeability, excellent conductivity, low contact resistance, and excellent corrosion resistance.
  • the demand for corrosion resistance and electrical conductivity has recently become stronger, and as an evaluation standard for corrosion resistance, “the rust (or corrosion) does not occur even if the separator is immersed in a sulfuric acid solution having a pH of about 1 for 1000 hours. Is listed.
  • DMFC is small, it is required to have excellent surface conductivity.
  • Carbon materials are widely used as separator materials having such characteristics. However, since carbon materials have poor toughness and are brittle, there is a problem that processing is difficult and processing costs are high. Therefore, in recent years, it has been studied to use stainless steel, which is easy to process and low in processing cost, as the separator material instead of the carbon material.
  • Patent Documents 1 and 2 disclose separators in which a noble metal layer is directly formed on a passive layer formed on a stainless steel surface without removing the passive layer.
  • Patent Document 1 when the coverage of the gold layer formed directly on the passive layer is 2.3% to 94%, the corrosion resistance of the separator can be improved and the contact resistance can be sufficiently reduced.
  • the fuel cell separator described in Patent Document 1 does not have sufficient corrosion resistance.
  • the separator described in Patent Document 2 requires heat treatment for improving the adhesion of the noble metal layer to the stainless steel, there is a problem that the throughput is low and the cost is high.
  • An object of the present invention is to provide a fuel cell separator that is excellent in corrosion resistance and can be manufactured at low cost, and a method for manufacturing the same.
  • the separator for a fuel cell of the present invention includes a stainless steel substrate, a gold plating layer having a pinhole formed on the stainless steel substrate, and a passive layer of stainless steel formed in the pinhole. And the gold plating layer and the stainless steel base material are in contact with each other without a stainless steel passivation layer. Preferably, there is no stainless steel passivation layer between the gold plating layer and the stainless steel substrate.
  • the thickness of the gold plating layer is preferably at least more than 0.01 ⁇ m, and more preferably 0.05 ⁇ m or more.
  • the gold plating layer and the stainless steel base material have a region in contact with each other via an iron oxide layer substantially not containing chromium.
  • An iron oxide layer substantially free from chromium exists between the gold plating layer and the stainless steel substrate.
  • the passive layer has a thickness of 4 nm or more.
  • the gold plating layer has a thickness of 0.3 ⁇ m or less.
  • the contact resistance of the gold plating layer is 10 m ⁇ ⁇ cm 2 or less.
  • the method for producing a separator for a fuel cell according to the present invention includes a step a in which a stainless steel substrate is prepared, and a strike gold plating using an acidic gold strike plating solution on the surface of the stainless steel substrate after the step a.
  • Step b for forming a layer
  • Step c for forming the gold plating layer on the strike gold plating layer after the step b
  • the gold plating layer having a pinhole after the step c
  • the passivation treatment preferably uses nitric acid having a concentration of 30% or more.
  • the method further includes a step of etching the surface of the stainless steel substrate after the step a and before the step b.
  • the gold plating layer formed in step c has a pinhole, and in step d, a stainless steel passivation layer is formed in the pinhole.
  • the fuel cell separator of the present invention may have substantially the same structure as the fuel cell separator manufactured by any one of the above-described fuel cell separator manufacturing methods. That is, at least a part of the passive layer between the gold plating layer and the stainless steel substrate is removed, so that the adhesion between the gold plating layer and the stainless steel substrate is improved, and the pin of the gold plating layer is further improved. It is only necessary to have a structure in which corrosion resistance is improved by forming a passive layer of stainless steel in the hole.
  • a fuel cell separator having excellent corrosion resistance and high adhesion of a gold plating layer and a method for producing the same are provided.
  • (A)-(e) is typical sectional drawing for demonstrating the manufacturing method of the separator 20 for fuel cells of embodiment by this invention. It is a graph which shows the density
  • FIGS. 1A to 1E are schematic cross-sectional views for explaining a method for manufacturing a fuel cell separator 20 according to an embodiment of the present invention.
  • a stainless steel substrate 12 is prepared as shown in FIG.
  • the stainless steel base 12 has a main body 12a made of stainless steel and a passive layer (passive film) 14 formed on the surface of the main body 12a.
  • the passive layer 14 is naturally formed when the stainless steel is left in the atmosphere, and contains a chromium oxide and chromium and iron hydroxides, and has excellent corrosion resistance. It is considered that a chromium oxide layer is formed on the main body 12a side, and a chromium and iron hydroxide layer is formed on the surface side.
  • the thickness of the passive layer 14 is about several nm although it varies depending on conditions.
  • austenitic stainless steel for example, SUS304, SUS316
  • austenitic-ferritic stainless steel for example, SUS329J1
  • the surface of the passive layer 14 may be cleaned and / or degreased, if necessary.
  • the surface of the stainless steel substrate 12 is etched. If, for example, hydrochloric acid or a mixed acid of hydrochloric acid and nitric acid is used as the etching solution, the passive layer 14 can be removed. Further, the passive layer 14 can be removed by cathodic electrolysis using an aqueous sulfuric acid solution as the electrolytic solution instead of etching. Thus, prior to the step of forming the strike gold plating layer 22s using the next acidic gold strike plating solution, the passivation layer 14 is removed once, thereby achieving the final gold plating uniformity. Can be increased. The uniformity of the gold plating finish can be easily confirmed visually.
  • the passive layer 14 after removing the passive layer 14, before forming a strike gold plating layer, it is preferable to remove the etching liquid adhering to the surface of the stainless steel base material 12 (main body part 12a), for example by washing with water. . At this time, the passive layer may be formed again. Moreover, depending on the storage environment after removing the passive layer 14, the passive layer may be formed again.
  • the passive layer 14 on the surface of the stainless steel substrate 12 is at least partially removed, so that prior to the strike gold plating step. Even if the passive layer 14 is not removed in advance, a gold plating layer having excellent corrosion resistance and adhesion can be obtained.
  • the final uniformity of the gold plating can be improved.
  • a naturally formed oxide layer has a non-uniform degree of oxidation, oxide layer thickness and oxide layer composition due to history (rolling conditions, storage environment, processing conditions before processing, etc.), and non-uniformity in the etching process. It is considered that the uniformity of the surface can be improved by removing the oxide layer.
  • an acidic gold strike plating solution (for example, K-manufactured by Kojima Chemical Co., Ltd.) is formed on the surface of the main body 12a exposed as a result of removing the passive layer. 770) is used to form the strike gold plating layer 22s.
  • the acidic gold strike plating solution known ones can be widely used. For example, one having a pH of 0.4 or more and 1.0 or less (liquid temperature of 20 ° C. or more and 40 ° C. or less) is preferable.
  • the current density is, for example, 0.5 A / dm 2 or more and 8.0 A / dm 2 or less, and the plating time is, for example, 30 seconds or more and 90 seconds or less.
  • the thickness of the strike gold plating layer 22s is preferably, for example, 0.005 ⁇ m or more and 0.05 ⁇ m or less. Since the strike gold plating layer 22s is very thin, it has a pinhole 22sa. As described above, even if the step of removing the passivation layer 14 described with reference to FIG. 1B is omitted, the removal of the passivation layer 14 also occurs in the gold strike plating step. The structure shown in (c) can be obtained.
  • the gold plating layer 22m is formed on the strike gold plating layer 22s.
  • the gold plating layer 22m is formed using, for example, a gold cyanide plating solution.
  • a well-known thing can be widely used as a gold plating solution containing a cyanide compound (for example, Nippon High Purity Chemical Co., Ltd. Tempe resist BL).
  • a gold plating solution containing a cyanide compound for example, Nippon High Purity Chemical Co., Ltd. Tempe resist BL.
  • those having a pH of 6.0 or more and 6.5 or less liquid temperature of 60 ° C. or more and 70 ° C. or less
  • the current density is, for example, 0.02 A / dm 2 or more and 0.3 A / dm 2 or less
  • the plating time is, for example, 100 seconds or more and 300 seconds or less.
  • the gold plating layer 22m does not need to be thick, and the gold plating layer 22 including the strike gold plating layer 22s and the gold plating layer 22m may have a pinhole 22a.
  • the total thickness of the gold plating layer 22 is required to be approximately 1.2 ⁇ m or more.
  • the total thickness of the gold plating layer 22 is sufficient if the contact resistance can be sufficiently lowered, is preferably at least over 0.01 ⁇ m, and more preferably at least 0.05 ⁇ m.
  • the thickness of the gold plating layer 22 does not need to be more than 0.3 ⁇ m, and the contact resistance can be sufficiently reduced with a thickness of 0.3 ⁇ m or less.
  • the contact resistance of the gold plating layer 22 is preferably 10 m ⁇ ⁇ cm 2 or less.
  • the fuel cell separator 20 is obtained by performing a passivation treatment on the main body 12a of the stainless steel base material on which the gold plating layer 22 is formed.
  • the passivation treatment is performed under conditions that allow a stainless steel passivation layer to be formed in the pinhole when the gold plating layer has a pinhole.
  • it can be performed by immersing in a 30% by mass nitric acid aqueous solution at 30 ° C. for 5 minutes.
  • it is not restricted to this condition, For example, you may immerse for about 10 second in 30 mass% nitric acid aqueous solution of 50 degreeC.
  • the concentration of the nitric acid aqueous solution is preferably 30% by mass or more.
  • the strike gold plating layer 22s is formed using the acidic strike gold plating solution, so that the gold plating layer 22 and the stainless steel substrate 12a are formed. Between them, the stainless steel passive layer 14 is hardly present, and the adhesion between the gold plating layer 22 and the stainless steel substrate 12a can be improved. Further, since the passivation treatment is performed after the gold plating layer 22 is formed, the stainless steel substrate 12a exposed in the pin hole 22a is passivated even if the pin hole 22a exists in the gold plating layer 22. As a result of the formation of the passive layer 16 made of stainless steel in the pinhole 22a, the corrosion resistance is improved.
  • the gold plating layer 22 may have pinholes, the gold plating layer 22 does not need to be formed thick, and the gold plating process has high throughput and low material costs. Moreover, if the passivation layer is removed by etching or cathodic electrolysis of the surface of the stainless steel substrate prior to the strike gold plating step, the final gold plating finish can be improved. .
  • FIG. 2A shows an example of a concentration profile obtained as a result of analyzing the surface of this substrate by glow discharge emission spectrometry.
  • the horizontal axis represents the depth from the substrate surface, and the vertical axis represents the concentration of each atom in atomic% (at%).
  • results for carbon, nickel, copper, silicon, and manganese are omitted. The same applies to the following glow discharge emission spectroscopic analysis results.
  • Fe iron
  • Cr chromium
  • O oxygen
  • This oxide layer is a passivation layer 14 as is well known.
  • the thickness of the passive layer 14 was about 4.4 nm when evaluated at a depth at which the oxygen atom concentration was half the peak value.
  • FIG. 2B shows an example of the result of analyzing the surface of this substrate by glow discharge emission spectrometry.
  • the oxygen atom concentration in the vicinity of the outermost surface was a little lower than that in FIG. 2A and was the same as the concentration profile in FIG. 2A except that the change in the depth direction was gentle.
  • the thickness of the passive layer 14 obtained in the same manner as described above from the concentration profile in FIG. 2B was about 6.1 nm.
  • FIGS. 3 (a) and 3 (b) show the results of analyzing the surface of the obtained substrate by glow discharge emission spectrometry.
  • FIG. 3A shows the results when a 10% nitric acid aqueous solution is used
  • FIG. 3B shows the results when a 30% nitric acid aqueous solution is used.
  • the concentration profiles in FIGS. 3 (a) and 3 (b) are almost the same as the concentration profile in FIG. 2 (a), and the composition and thickness of the surface passivation layer are changed by the passivation treatment with nitric acid. It is thought that it is not.
  • concentration profile of Fig.3 (a) and (b) was about 4.5 nm and about 4.3 nm, respectively. From the results of FIGS. 2 to 3, the thickness of the passive layer 14 formed on the surface of the substrate used in this experiment is considered to be in the range of about 4 nm to about 6 nm.
  • Gold plating was performed by strike gold plating using an acidic strike gold plating solution and main gold plating using a gold cyanide plating solution. Strike gold plating uses a gold-based strike plating solution (K-770 500 ml / L (2 times dilution) manufactured by Kojima Chemical Co., Ltd.), which is cyan, has a pH of 0.8, and a temperature of 35 ° C. Electroplating was performed at dm 2 for 40 seconds. The thickness of the strike gold plating layer obtained under these conditions was about 0.01 ⁇ m. The thickness of the plating layer is a thickness measured using a fluorescent X-ray film thickness meter unless otherwise specified.
  • the gold plating was performed following the strike gold plating.
  • a gold cyanide plating solution having a pH of 6.3 and a temperature of 65 ° C. (Tempresist BL 200 g / L, potassium gold cyanide 8.0 g / L, manufactured by Japan High Purity Chemical Co., Ltd.)
  • the thickness of the gold plating layer was adjusted by adjusting the energization time at a current density of 0.1 A / dm 2 .
  • the energized time was 4 minutes, and a gold plating layer having a thickness of about 0.1 ⁇ m could be obtained.
  • Corrosion resistance was evaluated by visually observing the surface after being immersed in a sulfuric acid aqueous solution (80 ° C.) having a pH of 1 for 1000 hours.
  • the case where the corrosion of the gold plating layer was confirmed was rated as “X”, the case where corrosion was not reached but a discoloration was observed was indicated as “ ⁇ ”, and the case where no discoloration was observed was indicated as “ ⁇ ”.
  • (circle) has the corrosion resistance which can be used practically.
  • the contact resistance is 1A using a milliohm meter in a state where each sample (separator) is sandwiched between a carbon plate and a copper plate (current collector plate) plated with gold at a surface pressure of 10 kgf / cm 2. It was evaluated by the resistance value when a current of.
  • the contact resistance of the gold plating layer is 10 m [Omega ⁇ cm 2 or less, and more preferably 5 m [Omega ⁇ cm 2 or less.
  • the contact resistance of all the samples was 5 m ⁇ ⁇ cm 2 or less, which was good. That is, it can be seen that the contact resistance can be sufficiently reduced if the thickness of the gold plating layer is at least 0.01 ⁇ m.
  • the corrosion resistance of Sample 2 plated with gold after etching is inferior to that of Sample 1 plated with gold without etching.
  • the reason why the corrosion resistance of Sample 1 is not sufficient is that the adhesion between the passive layer and the gold plating layer is low.
  • the corrosion resistance of the sample 2 is lower than that of the sample 1 because the passive layer (FIG. 2 (b)) regenerated after removing the passive layer by etching is a passive layer that has been previously formed on the surface of the substrate. This is probably because the corrosion resistance is lower than that of the layer (FIG. 2A). That is, as described with reference to FIGS. 2A and 2B, even if the passive layer is removed by etching, the passive layer is formed again during washing and storage.
  • the manufacturing process of sample 4 includes a passivation treatment with 10% nitric acid after the etching process in the manufacturing process of sample 2 and before the strike gold plating. That is, the passivation process is performed on the surface to which gold plating is applied. As a result, although the corrosion resistance of the sample 4 is superior to that of the sample 2, it is equivalent to the sample 1 and is not at a sufficient level.
  • the manufacturing process of the sample 4 is a simulation of the manufacturing process described in Patent Document 2.
  • Samples 7 to 9 have sufficient corrosion resistance, and as can be seen from the results of Sample 7, it is sufficient that the thickness of the gold plating layer is 0.05 ⁇ m. It can be seen that the contact resistance of these samples hardly increased even after the corrosion resistance test, and has very excellent corrosion resistance.
  • the thickness of the gold plating layer is 0.01 ⁇ m or less, the corrosion resistance is low, and the thickness of the gold plating layer is preferably more than 0.01 ⁇ m.
  • a 10% by mass nitric acid aqueous solution cannot form a passive layer of stainless steel in the pinhole, and the nitric acid aqueous solution is used to form a passive layer in the pinhole. It is understood that it is preferable to use a 30% by mass or more nitric acid aqueous solution.
  • FIGS. 4 (a) and 4 (b) show the results of analyzing the surfaces of Sample 4 and Sample 8 by glow discharge optical emission spectrometry, respectively.
  • the Fe and Cr concentration profiles show that after the Fe concentration starts to increase, Cr begins to increase. That is, it can be seen that an iron oxide layer substantially free of chromium is formed near the surface. This is in contrast to the presence of an oxide layer containing iron and chromium on the outermost surface in the passive layer formed on the surface of the substrate shown in FIGS. . That is, in Sample 4 and Sample 8, there is a region where the gold plating layer and the stainless steel base material are in contact with each other without passing through the stainless steel passive layer.
  • adhesion it is considered preferable that there is no stainless steel passive layer between the gold plating layer and the stainless steel base material, but at least partially without passing through the passive layer, If the gold plating layer and the stainless steel substrate are in contact, the adhesion is considered to be improved.
  • the sample 8 plated with gold without performing the passivation treatment performed the etching shown in FIG. 4A.
  • the thickness of the iron oxide layer which does not contain chromium substantially is thicker than the sample 4 which performed the passivation process and performed gold plating after that.
  • the passive layer formed by washing with water and storing in the air after removing the passive layer is removed in the acidic strike gold plating process rather than the passive layer formed by the passivation treatment. It is thought that it is easy to be done.
  • the acidic strike gold plating step it is considered that not all of the passive layer is removed but a portion rich in chromium oxide in the passive layer is removed.
  • the chromium oxide rich portion of the passive layer on the surface of the stainless steel substrate is at least partially removed. Since chromium oxide reduces the adhesion with the gold plating layer, the adhesion between the gold plating layer and the stainless steel substrate is improved by removing the portion rich in chromium oxide. In particular, the chromium oxide can be more effectively removed by performing strike gold plating after removing the previously formed passive layer by etching. As a result of various experiments, it has also been found that by performing etching, the uniformity of the surface of the substrate can be increased, and the uniformity of the final gold plating finish can be improved.
  • the gold plating layer is as thin as 0.3 ⁇ m or less and has a pinhole, it is exposed in the pinhole by performing passivation treatment under predetermined conditions after gold plating. Since a passive layer can be formed on the surface of the stainless steel substrate, corrosion resistance can be improved. In order to obtain high corrosion resistance, it is preferable to use a 30% by mass or more nitric acid aqueous solution.
  • the strike gold plating and the gold plating may be electroless plating, but as exemplified here, electrolytic plating is more preferable.
  • acidic strike gold plating not only forms a strike gold plating layer, but also has an action and effect of removing a chromium-rich portion of the underlying passive layer, and for this purpose, electrolytic plating is preferred.
  • the present invention is widely used in fuel cell separators and manufacturing methods thereof.

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Abstract

La présente invention concerne un séparateur de pile à combustible (20) qui possède une région comprenant un substrat en acier inoxydable (12a), une couche plaquée or (22) formée sur le substrat en acier inoxydable (12a) et qui possède des piqûres (22a), ainsi qu'une couche de passivation en acier inoxydable (16) constituée dans les piqûres (22a) ; la couche plaquée or (22) et le substrat en acier inoxydable (12a) entrent en contact sans impliquer la couche de passivation en acier inoxydable. Le présent séparateur pour pile à combustible (20) peut être produit par la formation d'une couche plaquée or, sur la surface du substrat en acier inoxydable (12) à l'aide d'une solution de placage à l'or acide, puis par la formation de la couche plaquée or (22) et la réalisation consécutive du traitement de passivation. L'invention concerne un séparateur de pile à combustible qui présente une excellente résistance à la corrosion et qui peut être fabriqué à peu de frais, ainsi qu'un procédé de production du séparateur de pile à combustible.
PCT/JP2011/073620 2010-10-20 2011-10-14 Séparateur de pile à combustible et son procédé de production WO2012053431A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201180040114.3A CN103069629B (zh) 2010-10-20 2011-10-14 燃料电池用隔板及其制造方法
JP2012513374A JP5133466B2 (ja) 2010-10-20 2011-10-14 燃料電池用セパレータおよびその製造方法
KR1020137004717A KR101266096B1 (ko) 2010-10-20 2011-10-14 연료 전지용 세퍼레이터 및 그 제조 방법

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JP2010-235262 2010-10-20
JP2010235262 2010-10-20

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WO2012053431A1 true WO2012053431A1 (fr) 2012-04-26

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KR (1) KR101266096B1 (fr)
CN (1) CN103069629B (fr)
TW (1) TWI489679B (fr)
WO (1) WO2012053431A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
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JP2016113697A (ja) * 2014-12-12 2016-06-23 東洋鋼鈑株式会社 金属めっき被覆ステンレス材の製造方法
JP2016113647A (ja) * 2014-12-12 2016-06-23 東洋鋼鈑株式会社 金属めっき被覆ステンレス材の製造方法
WO2016166935A1 (fr) * 2015-04-14 2016-10-20 Ｊｆｅスチール株式会社 Plaque métallique destinée à être utilisée comme séparateur de pile à combustible à polymère solide
WO2017006741A1 (fr) * 2015-07-09 2017-01-12 東洋鋼鈑株式会社 Élément porteur de courant pour piles à combustible, pile à combustible, empilement de piles à combustible et procédé de production d'élément porteur de courant pour piles à combustible
JP2018119211A (ja) * 2017-01-23 2018-08-02 日東電工株式会社 配線回路基板の製造方法
EP3231893A4 (fr) * 2014-12-12 2018-09-05 Toyo Kohan Co., Ltd. Procédé pour la production de matériau en acier inoxydable métallisé
JP2022122337A (ja) * 2021-02-10 2022-08-23 トヨタ自動車株式会社 セパレータの製造方法

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EP3231893A4 (fr) * 2014-12-12 2018-09-05 Toyo Kohan Co., Ltd. Procédé pour la production de matériau en acier inoxydable métallisé
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JP7144937B2 (ja) 2017-01-23 2022-09-30 日東電工株式会社 配線回路基板の製造方法
JP2022122337A (ja) * 2021-02-10 2022-08-23 トヨタ自動車株式会社 セパレータの製造方法
JP7484760B2 (ja) 2021-02-10 2024-05-16 トヨタ自動車株式会社 セパレータの製造方法

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