WO2012026470A1 - Matériau de connexion de circuit, et procédé de connexion d'éléments de circuit au moyen dudit matériau - Google Patents

Matériau de connexion de circuit, et procédé de connexion d'éléments de circuit au moyen dudit matériau Download PDF

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Publication number
WO2012026470A1
WO2012026470A1 PCT/JP2011/068982 JP2011068982W WO2012026470A1 WO 2012026470 A1 WO2012026470 A1 WO 2012026470A1 JP 2011068982 W JP2011068982 W JP 2011068982W WO 2012026470 A1 WO2012026470 A1 WO 2012026470A1
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Prior art keywords
circuit
connection
polymerizable substance
radical polymerizable
substrate
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PCT/JP2011/068982
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English (en)
Japanese (ja)
Inventor
陽介 相澤
藤縄　貢
立澤　貴
雅英 久米
小林　宏治
源太郎 関
伊藤　彰浩
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日立化成工業株式会社
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Publication of WO2012026470A1 publication Critical patent/WO2012026470A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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Definitions

  • the present invention relates to a circuit connecting material and a circuit member connecting method using the same.
  • anisotropic conductive adhesive films are known as circuit connection materials for heating and pressurizing opposing circuits to electrically connect electrodes in the pressurizing direction, for example, epoxy adhesives and acrylic adhesives.
  • An anisotropic conductive adhesive film in which conductive particles are dispersed in an agent is known.
  • Such an anisotropic conductive adhesive film is mainly composed of a TCP (Tape Carrier Package) or COF (Chip On Flex) on which a semiconductor for driving a liquid crystal display (hereinafter referred to as “LCD”) is mounted and an LCD panel. Widely used for electrical connection or electrical connection between a TCP or COF and a printed wiring board.
  • flip-chip mounting which is advantageous for thinning and narrow pitch connection, is adopted instead of the conventional wire bonding method even when a semiconductor is directly mounted face-down on an LCD panel or a printed wiring board.
  • anisotropic conductive adhesive films are used as circuit connection materials (see, for example, Patent Documents 1 to 4).
  • connection of circuit members using an anisotropic conductive adhesive film conductive particles are sandwiched between the electrodes arranged opposite to each other by heating and pressurization, and conduction between the electrodes is ensured.
  • the circuit member connecting step sufficient heat for flowing the adhesive component and sufficient pressure for bringing the conductive particles into close contact with the electrode are required.
  • a thermosetting resin-based circuit connection material a relatively high connection temperature is required to heat the thermosetting resin to a temperature at which the curing agent sufficiently reacts.
  • the connection of the circuit members requires thermal stress necessary for curing the adhesive component and pressure stress for crushing the particles between the electrodes. Therefore, the connection of the circuit connection material is usually performed at a pressure of 3 MPa or more. These stresses are likely to cause damage to the adherend and cause poor display and reduced reliability. In particular, in touch panel applications using a PET film as the adherend, it is required to reduce pressure stress. Yes.
  • the present invention provides a circuit connection material that enables connection with good formation of indentation and connection resistance even when the pressure at the time of circuit connection is lower than conventional pressure, and the circuit connection material. It aims at providing the connection method of the used circuit member.
  • the circuit connection material is sandwiched between the circuit electrodes to be connected, and a crimping rod heated to a high temperature is pressed from the side of the adherend.
  • the circuit connection material heated by the crimping rod exhibits fluidity, and unnecessary adhesive components between the connection circuits are pushed out of the connection portion.
  • the space between the opposing electrodes becomes narrower than the diameter of the conductive particles, the conductive particles are crushed by the opposing electrodes, and conduction between the electrodes is ensured. Therefore, when circuit connection is performed under a lower pressure condition, it is necessary to select a circuit connection material that exhibits sufficiently high fluidity.
  • the present inventors paid attention to radical polymerizable substances that are constituent components of radical polymerization circuit connection materials, and as a result of intensive studies, the formation of indentations and connection resistance were good even when the pressure during circuit connection was low.
  • the circuit connection material which enables a certain connection was discovered.
  • the present invention provides a first circuit member in which a first circuit electrode is formed on a main surface of a first substrate, and a second circuit member in which a second circuit electrode is formed on a main surface of a second substrate.
  • a circuit connecting material for electrically connecting the first circuit electrode and the second circuit electrode in a state of being opposed to each other by heating and pressurizing It is carried out at 1.5 MPa or less, contains a film-imparting polymer, a radical polymerizable substance, a radical polymerization initiator and conductive particles, and the radical polymerizable substance contains a bifunctional or lower radical polymerizable substance and has a bifunctional or lower functional group.
  • a circuit connecting material in which the blending amount of the radical polymerizable substance is 50 to 70% by mass based on the total amount of the film-imparting polymer and the radical polymerizable substance.
  • the blending amount of the bifunctional or lower radical polymerizable substance is preferably 50 to 65% by mass based on the total amount of the film-imparting polymer and the radical polymerizable substance. Thereby, the said connection can be performed still more favorably.
  • a bifunctional or lower radical polymerizable substance is contained in an amount of 50% by mass or more based on the total amount of the radical polymerizable substance.
  • the present invention also provides a first circuit member in which a first circuit electrode is formed on a main surface of a first substrate, and a second circuit electrode in which a second circuit electrode is formed on a main surface of a second substrate. Heating the second circuit member and the circuit connecting material disposed between the first circuit member and the second circuit member in a state where the first circuit electrode and the second circuit electrode are opposed to each other.
  • the connection structure connected by such a method has good indentation and connection resistance.
  • the circuit connection material that enables the formation of indentation and the connection resistance is good, and the circuit member using the circuit connection material A connection method can be provided.
  • the circuit connection material of this embodiment contains an adhesive component and conductive particles.
  • an adhesive component means what contains all materials other than electroconductive particle among the constituent materials of a circuit connection material.
  • the circuit connection material of this embodiment contains a film property-imparting polymer, a radical polymerizable substance, and a radical polymerization initiator as an adhesive component.
  • the adhesive component may contain a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone as necessary.
  • the film property-imparting polymer is used as a resin for forming a film, and any known polymer can be used without particular limitation.
  • a polymer polyimide, polyamide, phenoxy resins, poly (meth) acrylates, polyimides, polyurethanes, polyesters, polyester urethanes, polyvinyl butyrals, and the like can be used. These can be used individually by 1 type or in mixture of 2 or more types.
  • the weight average molecular weight of the film imparting polymer is preferably 5000 to 150,000, and more preferably 10,000 to 80,000. When this value is less than 5000, the film-forming property when the circuit connecting material of the present embodiment is used in a film form tends to be inferior, and when it exceeds 150,000, the compatibility with other components tends to deteriorate.
  • the weight average molecular weight is determined by gel permeation chromatography (GPC) analysis under the following conditions and conversion using a standard polystyrene calibration curve.
  • the GPC conditions are as follows. Equipment used: Hitachi L-6000 type (manufactured by Hitachi, Ltd., trade name) Detector: L-3300RI (trade name, manufactured by Hitachi, Ltd.) Column: Gel pack GL-R420 + Gel pack GL-R430 + Gel pack GL-R440 (3 in total) (trade name, manufactured by Hitachi Chemical Co., Ltd.) Eluent: Tetrahydrofuran Measurement temperature: 40 ° C Flow rate: 1.75 mL / min
  • the glass transition temperature (Tg) of the film property-imparting polymer is preferably 40 to 150 ° C, more preferably 60 to 100 ° C.
  • the glass transition temperature is measured under the following conditions by differential scanning calorimetry (DSC). That is, 0.01 g of each polyester urethane resin was weighed and measured using a DSC7 (trade name) manufactured by Perkin Elmer under a nitrogen atmosphere at a temperature range of 25 to 200 ° C. and a heating rate of 10 ° C./min. The straight line before and after the inflection point of the obtained endothermic curve is extended, and the temperature at which the endothermic curve intersects with the half line between the two extended lines is defined as the glass transition temperature.
  • DSC7 trade name
  • the film property-imparting polymer preferably has a pour point measured by a flow tester method of 60 to 170 ° C., more preferably 80 to 120 ° C.
  • the pour point measured by the flow tester method is a temperature at which the cylinder starts to move when a die having a diameter of 1 mm is used and a pressure of 3 MPa is applied and the temperature is increased at a rate of temperature increase of 2 ° C./min. Measure using a flow tester.
  • the pour point in the flow tester method is less than 40 ° C., film moldability and adhesiveness may be deteriorated, and when it exceeds 140 ° C., fluidity may be deteriorated.
  • the radical polymerizable substance is a substance having a functional group that is polymerized by radicals, and examples thereof include (meth) acrylates and maleimide compounds.
  • the circuit connection material of the present embodiment has a bifunctional or lower (that is, monofunctional or bifunctional) radical polymerizable substance as an essential component as a radical polymerizable substance.
  • a bifunctional or lower radical polymerizable substance as an essential component as a radical polymerizable substance.
  • Specific examples thereof include (meth) acrylates such as urethane (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, and ethylene glycol di (meth).
  • maleimide compound those containing at least two maleimide groups in the molecule are preferable.
  • the radical polymerizable substances having 2 or less functional groups urethane (meth) acrylate is preferable from the viewpoint of adhesiveness.
  • the glass transition temperature (Tg) of the polymer after crosslinking with an organic peroxide (one kind of radical polymerization initiator) described later is 100 ° C. or more alone.
  • a radically polymerizable substance in combination.
  • a substance having a dicyclopentenyl group, a tricyclodecanyl group and / or a triazine ring can be used.
  • a radical polymerizable substance having a tricyclodecanyl group or a triazine ring is preferably used.
  • a radically polymerizable substance having a functionality of 3 or more may be included as long as the effect of the present embodiment is not hindered.
  • radical polymerizable substances include trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, ⁇ -caprolactone modified tris ((meth) acryloxyethyl) isocyanurate, tris ((meth)). Acryloxyethyl) isocyanurate.
  • the radical polymerizable substance may have a phosphate structure.
  • Specific examples include 2-methacryloyloxyethyl acid phosphate and 2-acryloyloxyethyl acid phosphate.
  • the radical polymerizable substance having a phosphate ester structure is obtained as a reaction product of phosphoric anhydride and 2-hydroxyl (meth) acrylate.
  • a radically polymerizable substance having a phosphate ester structure when used in an amount of 0.1 to 10% by mass based on the total solid content of the adhesive component (100% by mass), the adhesive strength on the surface of an inorganic substance such as a metal is reduced. It is preferable because it improves, and more preferably 0.5 to 5% by mass is used.
  • the above radical polymerizable substances can be used singly or in combination of two or more.
  • the radical polymerizable substance contains at least one radical polymerizable substance having a viscosity at 25 ° C. of 100,000 to 1,000,000 mPa ⁇ s from the viewpoint of facilitating temporary fixing of the circuit member before curing the circuit connecting material. It is preferable to contain a radical polymerizable substance having a viscosity (25 ° C.) of 100,000 to 500,000 mPa ⁇ s.
  • the viscosity of the radical polymerizable substance can be measured using a commercially available E-type viscometer.
  • the blending amount of the bifunctional or lower radical polymerizable substance is 50 to 70% by mass based on the total amount of the film-imparting polymer and the radical polymerizable substance, and is 50 to 65% by mass.
  • the bifunctional or lower-functional radical polymerizable substance is preferably contained in an amount of 50 to 100% by mass, more preferably 65 to 100% by mass, and more preferably 80 to 100% by mass based on the total amount of the radical polymerizable substance. preferable.
  • liquidity of resin increases in the crimping
  • the weight-average molecular weight of the bifunctional or lower radical polymerizable substance is preferably 100 to 20000, and more preferably 600 to 13000.
  • radical polymerization initiators include those that decompose free radicals by heating or light of peroxide compounds, azo compounds, and the like.
  • the radical polymerization initiator is appropriately selected according to the intended connection temperature, connection time, pot life, etc. From the viewpoint of high reactivity and pot life, the temperature of the half-life of 10 hours is 40 ° C. or more and half. An organic peroxide having a period of 1 minute at a temperature of 180 ° C. or less is preferred.
  • the blending amount of the radical polymerization initiator is preferably about 0.05 to 10% by mass, more preferably 0.1 to 5% by mass based on the total solid content of the adhesive component.
  • radical polymerization initiator examples include diacyl peroxides, peroxydicarbonates, peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides, and the like.
  • peroxyesters, dialkyl peroxides, and hydroperoxides are preferable from the viewpoint of suppressing corrosion of circuit electrodes of the circuit member, and peroxyesters are more preferable from the viewpoint of obtaining high reactivity. .
  • diacyl peroxides examples include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, and succinic peroxide.
  • diacyl peroxides include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, and succinic peroxide.
  • examples thereof include oxide, benzoylperoxytoluene, and benzoyl peroxide.
  • peroxydicarbonates examples include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, and di-2-ethoxymethoxyperoxydicarbonate.
  • peroxyesters examples include cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxyneodecanoate, t-hexylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2- Ethyl hexanoate, t-butyl peroxyisobutyrate, 1,1-bis (t-butyl peroxy) Rhohexan
  • peroxyketals examples include 1,1-bis (t-hexylperoxy) -3,5,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis. Examples thereof include (t-butylperoxy) -3,5,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane and 2,2-bis (t-butylperoxy) decane.
  • dialkyl peroxides examples include ⁇ , ⁇ '-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, Examples thereof include t-butyl cumyl peroxide.
  • hydroperoxides examples include diisopropylbenzene hydroperoxide and cumene hydroperoxide.
  • radical polymerization initiators can be used singly or in combination of two or more.
  • the radical polymerization initiator may be used by mixing a decomposition accelerator, an inhibitor or the like.
  • the circuit connection material of the present embodiment contains conductive particles.
  • the conductive particles include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
  • the conductive particles may have non-conductive glass, ceramic, plastic, or the like as a core, and the core, the metal, metal particles, or carbon may be coated on the core. If the conductive particles are made of plastic as a core and the core is coated with the above metal, metal particles or carbon, or if it is a hot-melt metal particle such as solder, circuit connection is possible because it has deformability due to heat and pressure. This is preferable because it sometimes improves the reliability by absorbing variations in electrode thickness or increasing the contact area with the electrode.
  • the conductive particles may be particles in which metal particles made of copper are coated with silver, for example. Further, as the conductive particles, a metal powder having a shape in which a large number of fine metal particles are connected in a chain shape described in JP-A-2005-116291 can also be used.
  • fine particles in which the surface of these conductive particles is further coated with a polymer resin or the like, or those in which an insulating layer made of an insulating material is provided on the surface of the conductive particles by a method such as hybridization are mixed with conductive particles. Since short-circuiting due to contact between particles when the amount is increased can be suppressed and insulation between electrode circuits can be improved, this may be used alone or mixed with conductive particles as appropriate.
  • the blending amount of the conductive particles is preferably 0.1 to 30% by volume, and more preferably 0.1 to 10% by volume based on the total volume of solid content in the circuit connecting material.
  • the total volume of the solid content is determined by, for example, the sum of the volume of each component of the circuit connection material before curing at 23 ° C.
  • the volume of each component can be determined, for example, by converting mass to volume using specific gravity.
  • the average particle diameter of the conductive particles is preferably 1 to 18 ⁇ m from the viewpoint of dispersibility and conductivity.
  • the circuit connection material of this embodiment can be used more suitably for connection between circuit members.
  • the first circuit member having the first circuit electrode formed on the main surface of the first substrate and the second circuit electrode formed on the main surface of the second substrate The second circuit member thus made can be electrically connected. More specifically, the two circuit electrodes are electrically connected to each other by heating and pressurizing the circuit connection material of the present embodiment with the two electrodes facing each other.
  • the pressurization at this time is 1.5 MPa or less. According to the circuit connection material of this embodiment, even if the pressure at the time of pressurization is as low as 1.5 MPa or less, the indentation and connection resistance in the connection structure are good.
  • FIG. 1 is a sectional view showing one embodiment of an adhesive sheet provided with circuit connection material and a support substrate.
  • An adhesive sheet 100 shown in FIG. 1 includes a support base 8 and a film-like circuit connection material 10 that is detachably laminated on the support base 8.
  • the circuit connecting material 10 includes an insulating adhesive component 5 and conductive particles 7 dispersed in the adhesive component 5.
  • the support base material 8 can be maintained in the circuit connection material 10 film shape, the shape and the material thereof are arbitrary. Specifically, a fluororesin film, a polyethylene terephthalate film (PET), a biaxially stretched polypropylene film (OPP), a nonwoven fabric, or the like can be used as a supporting substrate.
  • PET polyethylene terephthalate film
  • OPP biaxially stretched polypropylene film
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit member connection structure according to this embodiment.
  • the circuit member connection structure 1 shown in FIG. 2 includes a first circuit member 20 and a second circuit member 30 that face each other, and is provided between the first circuit member 20 and the second circuit member 30. Is provided with a circuit connecting material 10 for connecting them.
  • the first circuit member 20 includes a first substrate 21 and first connection terminals 22 formed on the main surface 21a of the first substrate 21.
  • the second circuit member 30 includes a second substrate 31 and second connection terminals 32 formed on the main surface 31 a of the second substrate 31.
  • An insulating layer (not shown) may be formed on the main surface 21a of the first substrate 21 and / or the main surface 31a of the second substrate 31, as the case may be. That is, the insulating layer formed as necessary is formed between at least one of the first circuit member 20 and the second circuit member 30 and the circuit connection material 10.
  • inorganic materials such as semiconductors, glass and ceramics, polyimide resins typified by flexible printed wiring boards such as TCP and COF, polyester terephthalates such as polycarbonate and polyethylene terephthalate, polyethersulphates Examples thereof include substrates made of organic materials such as phon, epoxy resin, and acrylic resin, and materials obtained by combining these inorganic materials and organic materials.
  • at least one of the first and second substrates is selected from the group consisting of polyester terephthalate, polyethersulfone, epoxy resin, acrylic resin, polyimide resin, and glass.
  • a substrate made of a material containing at least one selected resin is preferable.
  • the insulating layer is at least one selected from the group consisting of silicone resin, acrylic resin, and polyimide resin. A layer containing a resin is preferred. Thereby, compared with the thing in which the said insulating layer is not formed, the adhesive strength of the 1st board
  • At least one of the first connecting terminal 22 and the second connecting terminal 32 has at least one surface selected from the group consisting of gold, silver, tin, platinum group metals, and indium-tin oxide (ITO). It is preferable to consist of a material containing. Thereby, the resistance value between the opposing connection terminals 22 and 32 can be further reduced while maintaining insulation between the connection terminals 22 or 32 adjacent on the same circuit member 20 or 30.
  • ITO indium-tin oxide
  • first and second circuit members 20 and 30 include a glass substrate or a plastic substrate, a printed circuit board, a ceramic circuit board, and a flexible circuit board, which are used in a liquid crystal display and have connection terminals formed of ITO or the like.
  • Examples thereof include a printed wiring board and a semiconductor silicon chip.
  • plastic substrates are represented by, for example, polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN), and are used for touch panels and electronic paper.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • PEN polyethylene naphthalate
  • connection between flexible printed wiring boards such as TCP and COF and glass substrates Connection between flexible printed wiring boards such as TCP and COF and plastic substrates, Connection between flexible printed wiring boards such as TCP and COF and printed wiring boards, and Examples include connection between a flexible printed wiring board such as TCP and COF and a ceramic wiring board.
  • the circuit connection material 10 is formed from a cured product of the circuit connection material of the present embodiment containing the conductive particles 7.
  • the circuit connection material 10 includes an adhesive component 11 and conductive particles 7 dispersed in the adhesive component 11.
  • the conductive particles 7 in the circuit connection material 10 are arranged not only between the first connection terminal 22 and the second connection terminal 32 facing each other but also between the main surfaces 21a and 31a.
  • the conductive particles 7 are in direct contact with both the first and second connection terminals 22, 32 and are flat between the first and second connection terminals 22, 32. It is compressed. Thereby, the first and second connection terminals 22 and 32 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the first connection terminal 22 and the second connection terminal 32 is sufficiently reduced. Therefore, the flow of current between the first and second connection terminals 22 and 32 can be made smooth, and the functions of the circuit can be fully exhibited.
  • Circuit member connection method 3 (a) to 3 (c) are process diagrams showing one embodiment of the circuit member connecting method according to the present embodiment in schematic cross-sectional views.
  • first, the first circuit member 20 and the film-like circuit connecting material 40 described above are prepared.
  • the thickness of the film-like circuit connecting material 40 is preferably 5 to 50 ⁇ m. If the thickness of the circuit connection material 40 is less than 5 ⁇ m, the filling of the circuit connection material 40 between the first and second connection terminals 22 and 32 tends to be insufficient. On the other hand, if it exceeds 50 ⁇ m, it tends to be difficult to ensure conduction between the first and second connection terminals 22 and 32.
  • the film-like circuit connection material 40 is placed on the surface on which the connection terminals 22 of the first circuit member 20 are formed. And the film-form circuit connection material 40 is pressurized to the arrow A and B direction of Fig.3 (a), and the film-form circuit connection material 40 is temporarily bonded to the 1st circuit member 20 (FIG.3 (b)).
  • the pressure at this time is not particularly limited as long as it does not damage the circuit member, but is generally preferably 0.1 to 30 MPa, more preferably 0.5 to 1.5 MPa. .
  • you may pressurize, heating, and let heating temperature be the temperature which the circuit connection material 40 does not harden
  • the heating temperature is preferably 50 to 190 ° C. These heating and pressurization are preferably performed in the range of 0.5 to 120 seconds.
  • the second circuit member 30 is placed on the film-like circuit connection material 40 so that the second connection terminal 32 faces the first circuit member 20 side.
  • the film-like circuit connection material 40 is provided in close contact with a support base (not shown)
  • the second circuit member 30 is removed from the support base after the second base member 30 is peeled off. 40. And the whole is pressurized in the arrow A and B directions of FIG.3 (c), heating the circuit connection material 40.
  • the heating temperature is 90 to 200 ° C., for example, and the connection time is 1 second to 10 minutes, for example.
  • the pressure is 1.5 MPa or less.
  • the heating temperature and the connection time are appropriately selected depending on the intended use, circuit connection material, and circuit member, and post-curing may be performed as necessary.
  • the heating temperature when the circuit connecting material contains a radical polymerizable substance is set to a temperature at which the radical polymerization initiator can generate radicals. As a result, radicals are generated in the radical polymerization initiator, and polymerization of the radical polymerizable substance is started.
  • connection under the low pressure condition of 1.5 MPa or less as described above is possible.
  • the lower limit of this pressure is about 0.5 MPa, preferably about 0.8 MPa, and more preferably about 0.9 MPa.
  • the pressure is preferably 0.8 to 1.5 MPa, more preferably 0.9 to 1.3 MPa, and particularly preferably 0.9 to 1.2 MPa.
  • FIG. 5 is a plan view showing a state before a circuit member (a flexible printed circuit board such as FPC, TCP, COF) is connected using a film-like circuit connecting material.
  • the applied pressure at the time of connection mentioned above means the pressure with respect to the total area of a connection part.
  • the “total area of the connection portion” means the total area of the connection terminal 22 connected by the circuit connection material and the area including the gap between the connection terminals 22, and is shown in FIGS. 5 (a) and 5 (b). Thus, it is obtained by the product of the width x in which the connection terminals 22 are arranged in parallel and the length y of the connection terminal in the direction perpendicular to the width.
  • the applied pressure can be obtained as follows. For example, when the width of the connection portion is 30 mm and the length of the connection terminal in the direction perpendicular to the width is 2 mm, the pressure at the connection portion is 1.0 MPa ( ⁇ 10 kgf / cm 2 ).
  • the pressure applied to the apparatus can be obtained by the following calculation. The following pressure may be applied to the corresponding crimping head.
  • Target pressure 1.0 MPa (10 kgf / cm 2 )
  • the film-like circuit connection material 40 By heating the film-like circuit connection material 40, the film-like circuit connection material 40 is cured in a state where the distance between the first connection terminal 22 and the second connection terminal 32 is sufficiently small, and the first circuit. The member 20 and the second circuit member 30 are firmly connected via the circuit connection material 10.
  • the circuit connection material 10 is formed by curing the film-like circuit connection material 40, and a circuit member connection structure 1 as shown in FIG. 2 is obtained.
  • the conductive particles 7 can be brought into contact with both the first and second connection terminals 22 and 32 facing each other.
  • the connection resistance between the connection terminals 22 and 32 can be sufficiently reduced, and the insulation between the adjacent first or second connection terminals 22 and 32 can be sufficiently ensured.
  • the circuit connection material 10 is comprised by the hardened
  • the circuit connection material of this embodiment can also be suitably used for a solar cell module in which a plurality of solar cells are electrically connected.
  • the solar cell module according to the present embodiment will be described.
  • the solar cell module according to the present embodiment includes a solar cell having electrodes, a wiring member, and a connection member that bonds the solar cell and the wiring member so that the electrode and the wiring member are electrically connected. And comprising. And the said connection member contains the hardened
  • FIG. 6 is a schematic cross-sectional view showing an embodiment of the solar cell module of the present embodiment.
  • the solar cell module 200 includes a solar cell 150 ⁇ / b> A and a wiring member 94, and a connecting member 95 that electrically connects them is between the solar cell 150 ⁇ / b> A and the wiring member 94. Is provided.
  • the solar battery cell 150 ⁇ / b> A has an electrode 96 on the substrate 92 and is electrically connected to the wiring member 94 through the electrode 96.
  • the surface on the side provided with the electrode 96 is a light receiving surface 98.
  • the solar cell 150 ⁇ / b> A is provided with a back electrode 97 on the back surface 99 opposite to the light receiving surface 98.
  • the substrate 92 is made of at least one of, for example, Si single crystal, polycrystal, and amorphous.
  • the wiring member 94 is a member for electrically connecting the solar battery cell 150A and other members.
  • the electrode 96 of the solar battery cell 150 ⁇ / b> A and the back electrode 97 of the solar battery cell 100 ⁇ / b> B are electrically connected by the wiring member 94.
  • the wiring member 94 and the back surface electrode 97 of the solar battery cell 150B are electrically connected by the connecting member 95 containing the cured product of the circuit connecting material. 94 and the solar battery cell 150B are bonded together.
  • the connecting member 95 contains conductive particles
  • the electrode 96 and the wiring member 94 of the solar battery cell 150A can be electrically connected via the conductive particles.
  • the back electrode 97 of the solar battery cell 150B and the wiring member 94 can also be electrically connected via conductive particles.
  • connection member 95 is made of a cured product of the circuit connection material. From this, the adhesive strength of the connection member 95 between the solar battery cell 150A and the wiring member 94 is sufficiently high, and the connection resistance between the solar battery cell 150A and the wiring member 94 is sufficiently low. Moreover, even when it is left for a long time in a high temperature and high humidity environment, it is possible to sufficiently suppress a decrease in adhesive strength and an increase in connection resistance. Further, the connection member 95 can be formed by a heat treatment at a low temperature for a short time. Therefore, the solar battery module 200 shown in FIG. 6 can be manufactured without deteriorating the solar battery cell 150A at the time of connection, and can have higher reliability than before.
  • the solar cell 150A and the wiring member 94 can be used as the first and second circuit members 20 and 30 in the circuit member connection method described above. It can manufacture by implementing the method similar to this connection method.
  • Example 1 (Preparation of adhesive sheet) A polyester urethane resin (trade name: UR4125, manufactured by Toyobo Co., Ltd.) as a film-imparting polymer and a bifunctional radically polymerizable substance (trade name: UA5500T, manufactured by Shin-Nakamura Chemical Co., Ltd.) in a mass ratio of 40:60.
  • nickel plated plastic particles having a diameter of 4 ⁇ m are added as conductive particles to 5% by mass (2.1% by volume), and further 4 masses of peroxide (HTP-65W, manufactured by Kayaku Akzo) as a curing agent.
  • This varnish was cast and dried on a 50 ⁇ m polyethylene terephthalate resin film subjected to a release treatment as a supporting group to prepare an adhesive sheet.
  • the average thickness of the film-like circuit connecting material formed on the supporting substrate was 15 ⁇ m.
  • circuit connection structure (Production of circuit connection structure)
  • the adhesive sheet was cut into a size of 1.5 mm in width, and the film-like circuit connecting material surface was temporarily bonded to a glass substrate on which an ITO electrode and an Al electrode were formed under conditions of 70 ° C., 1 MPa, and 2 seconds.
  • COF internal electrode pitch: 50 ⁇ m, electrode width 25 ⁇ m, space 25 ⁇ m
  • main connection is performed under conditions of 170 ° C., 1 MPa, 10 seconds to obtain a circuit connection structure. It was.
  • a circuit connection structure was obtained in the same manner except that the conditions for this connection were changed to 170 ° C., 3 MPa, and 10 seconds.
  • Example 2 A circuit connection structure was produced in the same manner as in Example 1 except that the mixing ratio of the polyester urethane resin and the bifunctional radical polymerizable substance was changed to a mass ratio of 50:50.
  • Example 3 In addition to the polyester urethane resin and the bifunctional radical polymerizable substance, a 10 functional radical polymerizable substance (manufactured by Negami Kogyo Co., Ltd., trade name: UN-952) was used, and the mixing ratio was 40:55: A circuit connection structure was fabricated in the same manner as in Example 1 except that the number was 5.
  • Example 4 In addition to the polyester urethane resin and the bifunctional radically polymerizable substance, a monofunctional radically polymerizable substance (manufactured by Kojin Co., Ltd., trade name: ACMO) is used, and the mixing ratio thereof is 40:50:10. A circuit connection structure was fabricated in the same manner as in Example 1 except that.
  • a monofunctional radically polymerizable substance manufactured by Kojin Co., Ltd., trade name: ACMO
  • Example 1 A circuit connection structure was produced in the same manner as in Example 1 except that the mixing ratio of the polyester urethane resin and the bifunctional radically polymerizable substance was changed to a mass ratio of 60:40.
  • Example 2 A circuit connection structure was produced in the same manner as in Example 1 except that the mixing ratio of the polyester urethane resin and the bifunctional radically polymerizable substance was changed to a mass ratio of 20:80.
  • connection resistance Using the digital multimeter (trade name: TR-6845, manufactured by Advantest Corporation), the obtained circuit connection structure was measured for 37 points of resistance between adjacent electrodes under a constant current of 1 mA. When the average value of the measurement was less than 3 ⁇ , “A” was set, and when it was 3 ⁇ or more, “B” was set.
  • FIG. 4 shows an example of a photograph of the observed indentation.
  • FIG. 4A is a photograph showing a state where the indentation is sufficiently strong and has no unevenness.
  • FIG. 4B is a photograph showing a case where the indentation is weak or uneven. As shown in FIG. 4A, when the indentation strength is sufficiently strong and uneven, “A”, and when the indentation strength is weak or uneven as shown in FIG. 4B, “B” "
  • Table 1 shows the blending ratio of the film property-imparting polymer and the radical polymerizable substance constituting the circuit connection materials obtained in the above Examples and Comparative Examples, and the evaluation results of the circuit connection structure.
  • the circuit connection material of the present invention can satisfactorily achieve circuit connection under a low pressure condition of 1.5 MPa or less, which has been difficult to achieve in the past, and can reduce the load on the adherend during crimping. is there.

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Abstract

La présente invention concerne un matériau de connexion de circuit interposé entre un premier élément de circuit, comportant une première électrode de circuit formée sur une surface principale d'un premier substrat, et un second élément de circuit, comportant une seconde électrode de circuit formée sur une surface principale d'un second substrat, afin de connecter électriquement la première électrode de circuit et la seconde électrode de circuit par application de chaleur et de pression, tout en ayant la première électrode de circuit et la seconde électrode de circuit en face l'une de l'autre. Dans cette connexion, une pression inférieure ou égale à 1,5 MPa est appliquée. Le matériau de connexion de circuit contient un polymère de communication de propriétés de film, une substance polymérisable par radicaux, un initiateur de polymérisation par radicaux, et des particules conductrices. La substance polymérisable par radicaux contient une substance polymérisable par radicaux bifonctionnelle ou monofonctionnelle, et la quantité de liant de la substance polymérisable par radicaux bifonctionnelle ou monofonctionnelle représente 50 à 70 % en masse en se basant sur la masse totale du polymère de communication de propriétés de film et de la substance polymérisable par radicaux.
PCT/JP2011/068982 2010-08-24 2011-08-23 Matériau de connexion de circuit, et procédé de connexion d'éléments de circuit au moyen dudit matériau WO2012026470A1 (fr)

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JP2011173136A JP5668636B2 (ja) 2010-08-24 2011-08-08 回路接続構造体の製造方法
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Cited By (5)

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JP2014022229A (ja) * 2012-07-19 2014-02-03 Hitachi Chemical Co Ltd フィルム状回路接続材料及び回路接続構造体
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JP2014024949A (ja) * 2012-07-26 2014-02-06 Hitachi Chemical Co Ltd 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール
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JP2012067281A (ja) 2012-04-05
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