JP2012067281A - 回路接続材料、これを用いた回路部材の接続方法、回路接続構造体、及び、回路接続構造体の製造方法 - Google Patents
回路接続材料、これを用いた回路部材の接続方法、回路接続構造体、及び、回路接続構造体の製造方法 Download PDFInfo
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Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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Abstract
【解決手段】第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、第二の基板の主面上に第二の回路電極が形成された第二の回路部材との間に介在させ、加熱及び加圧により第一の回路電極及び第二の回路電極を対向配置された状態で電気的に接続するための回路接続材料であって、加圧は1.5MPa以下で行われ、フィルム性付与ポリマー、ラジカル重合性物質、ラジカル重合開始剤及び導電粒子を含有し、フィルム性付与ポリマーは、ガラス転移温度70℃未満のポリマーを含み、その配合量がフィルム性付与ポリマー及びラジカル重合性物質の総量を基準として30〜70質量%である、回路接続材料。
【選択図】図1
Description
本発明の回路接続材料は、接着剤成分と、導電粒子とを含有するものである。本発明において接着剤成分とは、回路接続材料の構成材料のうち、導電粒子以外の全ての材料を含むものを意味する。本発明の回路接続材料は、接着剤成分として、フィルム性付与ポリマー、ラジカル重合性物質及びラジカル重合開始剤を含む。また、接着剤成分は、必要に応じて、ハイドロキノン、メチルエーテルハイドロキノン類等の重合禁止剤を含んでもよい。
図2は、本発明に係る回路部材の接続構造(回路接続構造体)の一実施形態を示す概略断面図である。図2に示す回路部材の接続構造(回路接続構造体)1は、相互に対向する第一の回路部材20及び第二の回路部材30を備えており、第一の回路部材20と第二の回路部材30との間には、これらを接続する回路接続材料10が設けられている。
TCP、COF等のフレキシブルプリント配線板とガラス基板との接続、
TCP、COF等のフレキシブルプリント配線板とプラスチック基板との接続、
TCP、COF等のフレキシブルプリント配線板とプリント配線板との接続、及び、
TCP、COF等のフレキシブルプリント配線板とセラミック配線板との接続が挙げられる。
図3(a)〜(c)は、本発明に係る回路部材の接続方法の一実施形態を概略断面図により示す工程図である。
目標圧力=1.0MPa(10kgf/cm2)
接続部の総面積=0.2cm×3.0cm=0.6cm2
加圧力=(接続部の総面積)×(目標圧力)=0.6cm2×10kgf/cm2=6kgf
目標圧力=1.0MPa(10kgf/cm2)
接続部の総面積=0.2cm×3.0cm×10=6cm2
加圧力=(接続部の総面積)×(目標圧力)=6cm2×10kgf/cm2=60kgf
平均分子量800のポリカプロラクトンジオール400質量部と、2−ヒドロキシプロピルアクリレート131質量部と、触媒としてのジブチル錫ジラウレート0.5質量部と、重合禁止剤としてのハイドロキノンモノメチルエーテル1.0質量部とを攪拌しながら50℃に加熱して混合した。次いで、イソホロンジイソシアネート222質量部を滴下し、更に攪拌しながら80℃に昇温してウレタン化反応を行った。イソシアネート基の反応率が99%以上になったことを確認後、反応温度を下げてウレタンアクリレートを得た。
ジカルボン酸としてテレフタル酸を、ジオールとしてプロピレングリコールを、イソシアネートとして4,4’−ジフェニルメタンジイソシアネートを用い、テレフタル酸/プロピレングリコール/4,4’−ジフェニルメタンジイソシアネートのモル比が1.0/2.0/0.25となるポリエステルウレタン樹脂Aを合成した。上記ポリエステルウレタン樹脂Aをメチルエチルケトン(以下、「MEK」と略記する。)に20質量%となるように溶解した。このポリエステルウレタン樹脂Aの20質量%MEK溶液を、厚み80μmの片面を表面処理したPETフィルムに塗工装置を用いて塗布し、70℃、10分間の熱風乾燥により、厚みが35μmのフィルムを作製した。このフィルムの弾性率の温度依存性を、広域動的粘弾性測定装置(測定条件:引っ張り荷重5g、周波数10Hz)を用いて測定した。弾性率の温度依存性から算出されるポリエステルウレタン樹脂Aのガラス転移温度は65℃であった。なお、ポリエステルウレタン樹脂Aの重量平均分子量は、24000であった。
テレフタル酸/プロピレングリコール/4,4’−ジフェニルメタンジイソシアネートのモル比を1.0/1.3/0.25に変更した以外は、ポリエステルウレタン樹脂Aの合成と同様に操作して、ポリエステルウレタン樹脂Bの20質量%MEK溶液を調製した。このポリエステルウレタン樹脂Bの20質量%MEK溶液を、厚み80μmの片面を表面処理したPETフィルムに塗工装置を用いて塗布し、70℃、10分間の熱風乾燥により、厚みが35μmのフィルムを作製した。このフィルムの弾性率の温度依存性を、広域動的粘弾性測定装置(測定条件:引っ張り荷重5g、周波数10Hz)を用いて測定した。弾性率の温度依存性から算出されるポリエステルウレタン樹脂Bのガラス転移温度は105℃であった。なお、ポリエステルウレタン樹脂Bの重量平均分子量は、26000であった。
(接着シートの作製)
ラジカル重合性物質として、上記ウレタンアクリレート25質量部、イソシアヌレート型アクリレート(製品名:M−325、東亞合成社製)20質量部、及び、2−メタクリロイロキシエチルアッシドフォスヘート(製品名:P−2M、共栄社化学社製)1質量部、並びに、ラジカル重合開始剤としてベンゾイルパーオキサイド(製品名:ナイパーBMT−K40、日本油脂製)4質量部を、フィルム性付与ポリマーであるポリエステルウレタン樹脂Aの20質量%MEK溶液275質量部(ポリエステルウレタン樹脂A:55質量部)と混合し、攪拌してバインダ樹脂を調製した。次いで、導電粒子として、ポリスチレンを核とし、最外層がAuで覆われた導電粒子を上記バインダ樹脂に対して2.0体積%を分散させ、接着剤ワニスを調製した。このワニスを、厚み50μmの片面を表面処理したPETフィルム(支持基材)に塗工装置を用いて塗布し、70℃、10分の熱風乾燥により、接着シート(幅15cm、長さ70m)を得た。支持基材上に形成されたフィルム状回路接続材料の厚みは16μmであった。
上記接着シートを幅1.5mmのサイズに切り出し、フィルム状回路接続材料面をITO電極及びAl電極が形成されたガラス基板に、70℃、1MPa、2秒間の条件で仮接着した。次いで、支持基材を剥離した後、COF(電極間ピッチ:50μm、電極幅25μm、スペース25μm)を積層し、170℃、1MPa、5秒間の条件で本接続を行い、回路接続構造体を得た。また、比較のため、本接続の条件を170℃、3MPa、5秒間に変更した以外は同様に操作して、回路接続構造体を得た。
ラジカル重合性物質としてウレタンアクリレートを35質量部、M−325を25質量部及びP−2Mを1質量部配合し、フィルム性付与ポリマーとしてポリエステルウレタン樹脂Aを30質量部及びポリエステルウレタン樹脂C(製品名:UR8300、東洋紡社製、ガラス転移温度20℃、重量平均分子量30000)を10質量部配合したこと以外は実施例1と同様にして、回路接続構造体を得た。
ラジカル重合性物質としてウレタンアクリレートを45質量部及びP−2Mを1質量部を配合し、フィルム性付与ポリマーとしてポリエステルウレタン樹脂Aを55質量部に配合したこと以外は実施例1と同様にして、回路接続構造体を得た。
ラジカル重合性物質としてウレタンアクリレートを20質量部、M−325を15質量部及びP−2Mを1質量部配合し、フィルム性付与ポリマーとしてポリエステルウレタン樹脂Aを65質量部配合したこと以外は実施例1と同様にして、回路接続構造体を得た。
ポリエステルウレタン樹脂Aをポリエステルウレタン樹脂Bに変更したこと以外は実施例1と同様にして、回路接続構造体を得た。
ポリエステルウレタン樹脂Aをポリエステルウレタン樹脂D(製品名:UR1400、東洋紡社製、ガラス転移温度83℃、重量平均分子量50000)に変更したこと以外は実施例1と同様にして、回路接続構造体を得た。
ラジカル重合性物質としてウレタンアクリレートを25質量部、M−325を25質量部及びP−2Mを1質量部配合し、フィルム性付与ポリマーとしてポリエステルウレタン樹脂Aを10質量部、ポリエステルウレタン樹脂Bを30質量部及びポリエステルウレタン樹脂Cを10質量部配合したこと以外は実施例1と同様にして、回路接続構造体を得た。
ラジカル重合性物質としてウレタンアクリレートを10質量部、M−325を15質量部及びP−2Mを1質量部配合し、フィルム性付与ポリマーとしてポリエステルウレタン樹脂Aを75質量部配合したこと以外は実施例1と同様にして、回路接続構造体を得た。
得られた回路接続構造体について、デジタルマルチメータ(アドバンテスト社製、商品名:TR−6845)を用い、測定電流1mAの定電流下での隣接電極間の抵抗を37点測定した。測定の平均値が3Ω未満の場合「A」、3Ω以上場合「B」とした。
回路接続部の圧痕の形状を、オリンパス者製BH3−MJL液晶パネル検査用顕微鏡を用い、ガラス基板側からノマルスキー微分干渉観察により評価した。図4に、観察した圧痕の写真の一例を示す。図4(a)は、圧痕の強度が十分に強くむらがない状態を示す写真である。図4(b)は圧痕の強度が弱い場合やむらがある状態を示す写真である。図4(a)に示すように圧痕の強度が十分に強くむらがなく場合には「A」、図4(b)に示すように圧痕の強度が弱い場合やむらがある場合には「B」とした。
Claims (6)
- 第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、第二の基板の主面上に第二の回路電極が形成された第二の回路部材との間に介在させ、加熱及び加圧により前記第一の回路電極及び前記第二の回路電極を対向配置された状態で電気的に接続するための回路接続材料であって、
前記加圧は1.5MPa以下で行われ、
フィルム性付与ポリマー、ラジカル重合性物質、ラジカル重合開始剤及び導電粒子を含有し、
前記フィルム性付与ポリマーが、ガラス転移温度70℃未満のポリマーを含み、該ガラス転移温度70℃未満のポリマーの配合量が、前記フィルム性付与ポリマー及び前記ラジカル重合性物質の総量を基準として30〜70質量%である、回路接続材料。 - 前記フィルム性付与ポリマーが、ガラス転移温度50℃以上70℃未満のポリマーを、前記フィルム性付与ポリマーの全量を基準として50質量%以上含む、請求項1記載の回路接続材料。
- 前記ラジカル重合性物質が、2官能以下のラジカル重合性物質を含み、該2官能以下のラジカル重合性物質の配合量が、前記ラジカル重合性物質の全量を基準として50質量%以上である、請求項1又は2記載の回路接続材料。
- 第一の基板の主面上に第一の回路電極が形成された第一の回路部材と、
第二の基板の主面上に第二の回路電極が形成された第二の回路部材と、
前記第一の回路部材及び前記第二の回路部材の間に配置された請求項1〜3のいずれか一項に記載の回路接続材料と、を前記第一の回路電極と前記第二の回路電極とが対向配置された状態で加熱及び加圧して、前記第一の回路電極と前記第二の回路電極とを電気的に接続する回路部材の接続方法であって、
前記加圧が1.5MPa以下で行われる、回路部材の接続方法。 - 第一の基板の主面上に第一の回路電極が形成された第一の回路部材、及び、第二の基板の主面上に第二の回路電極が形成された第二の回路部材の間に、請求項1〜3のいずれか一項に記載の回路接続材料を配置する工程と、
前記第一の回路電極と前記第二の回路電極とが対向配置された状態で加熱及び加圧して、前記第一の回路電極と前記第二の回路電極とを電気的に接続する工程と、を備え、
前記加圧が1.5MPa以下で行われる、回路接続構造体の製造方法。 - 請求項5に記載の製造方法で製造された、回路接続構造体。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013231097A (ja) * | 2012-04-27 | 2013-11-14 | Hitachi Chemical Co Ltd | 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法 |
JP2014145028A (ja) * | 2013-01-29 | 2014-08-14 | Hitachi Chemical Co Ltd | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
JP2015130426A (ja) * | 2014-01-08 | 2015-07-16 | デクセリアルズ株式会社 | 接続方法、及び接合体 |
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Publication number | Priority date | Publication date | Assignee | Title |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001082363A1 (en) * | 2000-04-25 | 2001-11-01 | Hitachi Chemical Co., Ltd. | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
JP2001323224A (ja) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
JP2006173100A (ja) * | 2005-11-18 | 2006-06-29 | Hitachi Chem Co Ltd | 電極の接続方法 |
JP2007009201A (ja) * | 2006-06-16 | 2007-01-18 | Hitachi Chem Co Ltd | 電極接続用接着剤及びこれを用いた微細電極の接続構造 |
JP2009001765A (ja) * | 2007-05-23 | 2009-01-08 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続構造体及び半導体装置 |
WO2009038190A1 (ja) * | 2007-09-19 | 2009-03-26 | Hitachi Chemical Company, Ltd. | 接着剤組成物及び接合体 |
JP2009277682A (ja) * | 2008-05-12 | 2009-11-26 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた回路部材の接続構造 |
JP2010157746A (ja) * | 2010-01-27 | 2010-07-15 | Hitachi Chem Co Ltd | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
JP2011204898A (ja) * | 2010-03-25 | 2011-10-13 | Hitachi Chem Co Ltd | 接着剤組成物及び回路部材の接続構造体 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
JP2006199825A (ja) * | 2005-01-20 | 2006-08-03 | Soken Chem & Eng Co Ltd | 異方導電性接着テープおよび配線基板異方導電接着体 |
KR100747336B1 (ko) * | 2006-01-20 | 2007-08-07 | 엘에스전선 주식회사 | 이방성 도전 필름을 이용한 회로기판의 접속 구조체, 이를위한 제조 방법 및 이를 이용한 접속 상태 평가방법 |
CN101794638B (zh) * | 2006-07-21 | 2012-06-06 | 日立化成工业株式会社 | 电路连接材料、电路部件的连接结构及电路部件的连接方法 |
JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
JP5029372B2 (ja) * | 2007-09-14 | 2012-09-19 | 日立化成工業株式会社 | 異方導電性接着剤、異方導電性フィルムおよび回路接続構造体の製造方法 |
KR20110019392A (ko) * | 2008-07-01 | 2011-02-25 | 히다치 가세고교 가부시끼가이샤 | 회로 접속 재료 및 회로 접속 구조체 |
US8373283B2 (en) * | 2008-08-04 | 2013-02-12 | Hitachi Chemical Company, Ltd. | Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
JP2010100840A (ja) * | 2008-09-24 | 2010-05-06 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
-
2011
- 2011-08-08 JP JP2011173136A patent/JP5668636B2/ja active Active
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- 2011-08-23 KR KR1020110083861A patent/KR101227358B1/ko active IP Right Grant
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Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001082363A1 (en) * | 2000-04-25 | 2001-11-01 | Hitachi Chemical Co., Ltd. | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
JP2001323224A (ja) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
JP2006173100A (ja) * | 2005-11-18 | 2006-06-29 | Hitachi Chem Co Ltd | 電極の接続方法 |
JP2007009201A (ja) * | 2006-06-16 | 2007-01-18 | Hitachi Chem Co Ltd | 電極接続用接着剤及びこれを用いた微細電極の接続構造 |
JP2009001765A (ja) * | 2007-05-23 | 2009-01-08 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続構造体及び半導体装置 |
WO2009038190A1 (ja) * | 2007-09-19 | 2009-03-26 | Hitachi Chemical Company, Ltd. | 接着剤組成物及び接合体 |
JP2009277682A (ja) * | 2008-05-12 | 2009-11-26 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた回路部材の接続構造 |
JP2010157746A (ja) * | 2010-01-27 | 2010-07-15 | Hitachi Chem Co Ltd | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
JP2011204898A (ja) * | 2010-03-25 | 2011-10-13 | Hitachi Chem Co Ltd | 接着剤組成物及び回路部材の接続構造体 |
Non-Patent Citations (1)
Title |
---|
JPN6013030011; ポリエステルウレタン樹脂「バイロン」URシリーズ * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013231097A (ja) * | 2012-04-27 | 2013-11-14 | Hitachi Chemical Co Ltd | 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法 |
JP2014145028A (ja) * | 2013-01-29 | 2014-08-14 | Hitachi Chemical Co Ltd | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
JP2015130426A (ja) * | 2014-01-08 | 2015-07-16 | デクセリアルズ株式会社 | 接続方法、及び接合体 |
WO2015105098A1 (ja) * | 2014-01-08 | 2015-07-16 | デクセリアルズ株式会社 | 接続方法、及び接合体 |
JP2015185399A (ja) * | 2014-03-25 | 2015-10-22 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
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KR101227358B1 (ko) | 2013-01-28 |
TWI436709B (zh) | 2014-05-01 |
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KR20120022655A (ko) | 2012-03-12 |
CN102417794A (zh) | 2012-04-18 |
WO2012026470A1 (ja) | 2012-03-01 |
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TW201220995A (en) | 2012-05-16 |
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