KR101227358B1 - 회로 접속 재료, 이것을 이용한 회로 부재의 접속 방법, 회로 접속 구조체, 및 회로 접속 구조체의 제조 방법, 및 접속 재료의 용도 - Google Patents

회로 접속 재료, 이것을 이용한 회로 부재의 접속 방법, 회로 접속 구조체, 및 회로 접속 구조체의 제조 방법, 및 접속 재료의 용도 Download PDF

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KR101227358B1
KR101227358B1 KR1020110083861A KR20110083861A KR101227358B1 KR 101227358 B1 KR101227358 B1 KR 101227358B1 KR 1020110083861 A KR1020110083861 A KR 1020110083861A KR 20110083861 A KR20110083861 A KR 20110083861A KR 101227358 B1 KR101227358 B1 KR 101227358B1
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South Korea
Prior art keywords
circuit
electrode
connection
film
polymer
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KR1020110083861A
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English (en)
Korean (ko)
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KR20120022655A (ko
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다까시 다쯔자와
고우지 고바야시
마사히데 구메
고따로 세끼
요우스께 아이자와
아끼히로 이또
도루 후지나와
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히다치 가세고교 가부시끼가이샤
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
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  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020110083861A 2010-08-24 2011-08-23 회로 접속 재료, 이것을 이용한 회로 부재의 접속 방법, 회로 접속 구조체, 및 회로 접속 구조체의 제조 방법, 및 접속 재료의 용도 KR101227358B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2010187456 2010-08-24
JP2010187451 2010-08-24
JPJP-P-2010-187456 2010-08-24
JPJP-P-2010-187451 2010-08-24
JPJP-P-2011-173136 2011-08-08
JP2011173136A JP5668636B2 (ja) 2010-08-24 2011-08-08 回路接続構造体の製造方法

Publications (2)

Publication Number Publication Date
KR20120022655A KR20120022655A (ko) 2012-03-12
KR101227358B1 true KR101227358B1 (ko) 2013-01-28

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KR1020110083861A KR101227358B1 (ko) 2010-08-24 2011-08-23 회로 접속 재료, 이것을 이용한 회로 부재의 접속 방법, 회로 접속 구조체, 및 회로 접속 구조체의 제조 방법, 및 접속 재료의 용도

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Country Link
JP (1) JP5668636B2 (ja)
KR (1) KR101227358B1 (ja)
CN (1) CN102417794B (ja)
TW (1) TWI436709B (ja)
WO (1) WO2012026470A1 (ja)

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Publication number Priority date Publication date Assignee Title
JP6065407B2 (ja) * 2012-04-27 2017-01-25 日立化成株式会社 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法
JP6102105B2 (ja) * 2012-07-19 2017-03-29 日立化成株式会社 フィルム状回路接続材料及び回路接続構造体
JP6024261B2 (ja) * 2012-07-26 2016-11-16 日立化成株式会社 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール
JP6107175B2 (ja) * 2013-01-29 2017-04-05 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法
CN103336558B (zh) * 2013-06-13 2016-12-28 业成光电（深圳）有限公司 电子装置
JP6398570B2 (ja) * 2013-10-09 2018-10-03 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法
JP6425382B2 (ja) * 2014-01-08 2018-11-21 デクセリアルズ株式会社 接続方法、及び接合体
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