CN102417794B - 电路连接材料、连接方法、连接结构体及制造方法和用途 - Google Patents

电路连接材料、连接方法、连接结构体及制造方法和用途 Download PDF

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CN102417794B
CN102417794B CN2011102511296A CN201110251129A CN102417794B CN 102417794 B CN102417794 B CN 102417794B CN 2011102511296 A CN2011102511296 A CN 2011102511296A CN 201110251129 A CN201110251129 A CN 201110251129A CN 102417794 B CN102417794 B CN 102417794B
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polymkeric substance
circuit
application
methyl
free
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CN102417794A (zh
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立泽贵
小林宏治
久米雅英
关耕太郎
相泽阳介
伊藤彰浩
藤绳贡
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Lishennoco Co ltd
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Hitachi Chemical Co Ltd
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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CN2011102511296A 2010-08-24 2011-08-23 电路连接材料、连接方法、连接结构体及制造方法和用途 Active CN102417794B (zh)

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JP2010187456 2010-08-24
JP2010187451 2010-08-24
JP2010-187456 2010-08-24
JP2010-187451 2010-08-24
JP2011-173136 2011-08-08
JP2011173136A JP5668636B2 (ja) 2010-08-24 2011-08-08 回路接続構造体の製造方法

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CN102417794B true CN102417794B (zh) 2013-12-04

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JP (1) JP5668636B2 (ja)
KR (1) KR101227358B1 (ja)
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TW (1) TWI436709B (ja)
WO (1) WO2012026470A1 (ja)

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JP6065407B2 (ja) * 2012-04-27 2017-01-25 日立化成株式会社 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法
JP6102105B2 (ja) * 2012-07-19 2017-03-29 日立化成株式会社 フィルム状回路接続材料及び回路接続構造体
JP6024261B2 (ja) * 2012-07-26 2016-11-16 日立化成株式会社 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール
JP6107175B2 (ja) * 2013-01-29 2017-04-05 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法
CN103336558B (zh) * 2013-06-13 2016-12-28 业成光电（深圳）有限公司 电子装置
JP6398570B2 (ja) * 2013-10-09 2018-10-03 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法
JP6425382B2 (ja) * 2014-01-08 2018-11-21 デクセリアルズ株式会社 接続方法、及び接合体
JP6330346B2 (ja) * 2014-01-29 2018-05-30 日立化成株式会社 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法
JP6374192B2 (ja) * 2014-03-25 2018-08-15 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
WO2022245957A1 (en) * 2021-05-20 2022-11-24 Illinois Tool Works Inc. Air damper with integrated heater

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