AU2001252557A1 - Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure - Google Patents
Adhesive for circuit connection, circuit connection method using the same, and circuit connection structureInfo
- Publication number
- AU2001252557A1 AU2001252557A1 AU2001252557A AU5255701A AU2001252557A1 AU 2001252557 A1 AU2001252557 A1 AU 2001252557A1 AU 2001252557 A AU2001252557 A AU 2001252557A AU 5255701 A AU5255701 A AU 5255701A AU 2001252557 A1 AU2001252557 A1 AU 2001252557A1
- Authority
- AU
- Australia
- Prior art keywords
- circuit connection
- adhesive
- same
- connection structure
- connection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31554—Next to second layer of polyamidoester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000128936 | 2000-04-25 | ||
JP2000-128936 | 2000-04-25 | ||
JP2000-128937 | 2000-04-25 | ||
JP2000128937 | 2000-04-25 | ||
PCT/JP2001/003547 WO2001082363A1 (en) | 2000-04-25 | 2001-04-25 | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001252557A1 true AU2001252557A1 (en) | 2001-11-07 |
Family
ID=26591060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001252557A Abandoned AU2001252557A1 (en) | 2000-04-25 | 2001-04-25 | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
Country Status (8)
Country | Link |
---|---|
US (3) | US7208105B2 (en) |
JP (2) | JP3915512B2 (en) |
KR (1) | KR100463558B1 (en) |
CN (1) | CN1214455C (en) |
AU (1) | AU2001252557A1 (en) |
MY (1) | MY143567A (en) |
TW (1) | TWI285216B (en) |
WO (1) | WO2001082363A1 (en) |
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JP2007169632A (en) * | 2000-04-25 | 2007-07-05 | Hitachi Chem Co Ltd | Adhesive for circuit connection, circuit connection method using the same and circuit connection structure |
TWI285216B (en) * | 2000-04-25 | 2007-08-11 | Hitachi Chemical Co Ltd | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure |
JP2005194393A (en) | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | Adhesive film for circuit connection, and circuit connection structure |
JP2005320455A (en) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device |
US7224075B2 (en) * | 2004-08-13 | 2007-05-29 | Intel Corporation | Methods and systems for attaching die in stacked-die packages |
JP4555943B2 (en) * | 2004-10-29 | 2010-10-06 | 日立化成工業株式会社 | Anisotropic conductive film, method for manufacturing anisotropic conductive film, connection body using the same, and semiconductor device |
EP1860170A4 (en) * | 2005-03-16 | 2010-05-05 | Hitachi Chemical Co Ltd | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device |
JP4760070B2 (en) * | 2005-03-16 | 2011-08-31 | 日立化成工業株式会社 | Adhesive, adhesive for circuit connection, connector and semiconductor device |
JP2007091959A (en) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Ind Ltd | Anisotropically conductive adhesive |
WO2007083810A1 (en) * | 2006-01-23 | 2007-07-26 | Hitachi Chemical Co., Ltd. | Adhesive composition, filmy adhesive, adhesive sheet, and semiconductor device made with the same |
KR20110011755A (en) | 2006-04-26 | 2011-02-08 | 히다치 가세고교 가부시끼가이샤 | Adhesive for electrically connecting solar battery cell and metal foil |
CN101794638B (en) * | 2006-07-21 | 2012-06-06 | 日立化成工业株式会社 | Circuit connecting material, connecting structure for circuit parts and connecting method for circuit parts |
EP2223981B1 (en) * | 2006-07-21 | 2012-03-21 | Hitachi Chemical Co., Ltd. | Circuit connection material, circuit member connecting structure and method of connecting circuit member |
CN101501151B (en) * | 2006-08-04 | 2012-02-15 | 日立化成工业株式会社 | Adhesive composition and connection structure for circuit member |
JP2008111091A (en) * | 2006-10-06 | 2008-05-15 | Hitachi Chem Co Ltd | Adhesive film and circuit connection material |
JP5181220B2 (en) * | 2007-04-19 | 2013-04-10 | 日立化成株式会社 | Adhesive film for circuit connection, connection structure and manufacturing method thereof |
JP5192194B2 (en) * | 2007-07-26 | 2013-05-08 | デクセリアルズ株式会社 | Adhesive film |
CN103351829A (en) * | 2007-09-05 | 2013-10-16 | 日立化成株式会社 | Adhesive and connecting structure using the same |
KR101238178B1 (en) * | 2007-10-29 | 2013-02-28 | 히타치가세이가부시끼가이샤 | Circuit connecting material, connection structure and method for producing the same |
TWI456707B (en) * | 2008-01-28 | 2014-10-11 | Renesas Electronics Corp | Semiconductor device and method of manufacturing same |
JP5226562B2 (en) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | Anisotropic conductive film, joined body and method for producing the same |
JP2010100840A (en) * | 2008-09-24 | 2010-05-06 | Hitachi Chem Co Ltd | Adhesive film and circuit connection material |
JP5668636B2 (en) * | 2010-08-24 | 2015-02-12 | 日立化成株式会社 | Method for manufacturing circuit connection structure |
CN102737752B (en) * | 2011-03-30 | 2016-06-29 | 株式会社田村制作所 | Anisotropic conductive is stuck with paste and uses the method for attachment of electronic unit of this electroconductive paste |
JP2012057161A (en) * | 2011-09-21 | 2012-03-22 | Hitachi Chem Co Ltd | Adhesive film for circuit connections, and circuit connection structure |
JP2013093245A (en) * | 2011-10-26 | 2013-05-16 | Sekisui Chem Co Ltd | Anisotropic conductive material and connection structure |
JP2013206765A (en) * | 2012-03-29 | 2013-10-07 | Tanaka Kikinzoku Kogyo Kk | Conductive paste for die-bonding, and die-bonding method using the conductive paste |
JP6302666B2 (en) * | 2013-12-25 | 2018-03-28 | ヘンケルジャパン株式会社 | Laminating adhesive |
TWI667276B (en) * | 2014-05-29 | 2019-08-01 | 美商羅傑斯公司 | Circuit materials with improved fire retardant system and articles formed therefrom |
US10233365B2 (en) | 2015-11-25 | 2019-03-19 | Rogers Corporation | Bond ply materials and circuit assemblies formed therefrom |
US11242472B2 (en) * | 2017-02-17 | 2022-02-08 | Showa Denko Materials Co., Ltd. | Adhesive film |
WO2018225191A1 (en) * | 2017-06-07 | 2018-12-13 | 日立化成株式会社 | Film-like adhesive for semiconductors, semiconductor device production method, and semiconductor device |
EP3728504B1 (en) | 2017-12-21 | 2022-01-26 | 3M Innovative Properties Company | Adhesive articles including a cushion layer and a continuous shell layer |
CN112424308A (en) * | 2018-09-10 | 2021-02-26 | 昭和电工株式会社 | Adhesive sheet |
CN116801484B (en) * | 2023-08-11 | 2024-03-08 | 荣耀终端有限公司 | Veneer, preparation method thereof and electronic equipment |
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JPH0821254B2 (en) | 1991-02-22 | 1996-03-04 | 旭化成工業株式会社 | Copper alloy composition, molded product, paste and adhesive printed using the same |
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JP3907217B2 (en) | 1993-07-29 | 2007-04-18 | 日立化成工業株式会社 | Circuit connection material and circuit connection method using the connection material |
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US5686703A (en) * | 1994-12-16 | 1997-11-11 | Minnesota Mining And Manufacturing Company | Anisotropic, electrically conductive adhesive film |
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JPH09235355A (en) * | 1996-02-28 | 1997-09-09 | Taiyo Ink Mfg Ltd | Photocurable-thermosetting resin composition and production of multilayer printed wiring board using the same |
JP3852488B2 (en) | 1996-04-26 | 2006-11-29 | 日立化成工業株式会社 | Repairable electrode connecting adhesive composition and electrode connecting connecting member comprising the composition |
US6034331A (en) * | 1996-07-23 | 2000-03-07 | Hitachi Chemical Company, Ltd. | Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet |
JPH10178251A (en) | 1996-10-15 | 1998-06-30 | Toray Ind Inc | Board for connecting semiconductor integrated circuit, parts constituting it, and semiconductor device |
JPH10178063A (en) | 1996-10-15 | 1998-06-30 | Toray Ind Inc | Board for connecting semiconductor integrated circuit and parts and semiconductor device constituting the same |
JPH10168412A (en) * | 1996-12-10 | 1998-06-23 | Sumitomo Bakelite Co Ltd | Anisotropically conductive adhesive |
JPH10273626A (en) | 1997-03-31 | 1998-10-13 | Hitachi Chem Co Ltd | Circuit connecting material and production of circuit board |
DE69836078T2 (en) * | 1997-03-31 | 2007-05-10 | Hitachi Chemical Co., Ltd. | MATERIAL FOR CONNECTING PCB AND METHOD FOR CONNECTING SWITCHING CONNECTIONS |
US6022907A (en) * | 1997-06-03 | 2000-02-08 | Kyoeisha Chemical Co., Ltd. | Urethane prepolymer, process for producing the same and pressure-sensitive adhesive comprising the same |
JP3632882B2 (en) * | 1997-06-27 | 2005-03-23 | ソニー株式会社 | Semiconductor device and manufacturing method thereof |
JPH11274372A (en) * | 1998-03-19 | 1999-10-08 | Toshiba Corp | Semiconductor device and its semiconductor package |
DE69830623T2 (en) * | 1998-08-13 | 2006-05-04 | Hitachi Chemical Co., Ltd. | ADHESIVE FOR CONNECTING SWITCH ELEMENTS, PCB AND METHOD FOR MANUFACTURING THE SAME |
JP3195315B2 (en) * | 1999-06-03 | 2001-08-06 | 株式会社日立製作所 | Wiring tape with adhesive layer for semiconductor device and method of manufacturing the same |
TWI285216B (en) | 2000-04-25 | 2007-08-11 | Hitachi Chemical Co Ltd | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure |
-
2001
- 2001-04-25 TW TW90109925A patent/TWI285216B/en not_active IP Right Cessation
- 2001-04-25 WO PCT/JP2001/003547 patent/WO2001082363A1/en active IP Right Grant
- 2001-04-25 AU AU2001252557A patent/AU2001252557A1/en not_active Abandoned
- 2001-04-25 MY MYPI20011930A patent/MY143567A/en unknown
- 2001-04-25 CN CNB018082556A patent/CN1214455C/en not_active Expired - Lifetime
- 2001-04-25 US US10/258,548 patent/US7208105B2/en not_active Expired - Fee Related
- 2001-04-25 KR KR10-2002-7012143A patent/KR100463558B1/en not_active IP Right Cessation
- 2001-04-25 JP JP2001579354A patent/JP3915512B2/en not_active Expired - Fee Related
-
2007
- 2007-03-21 US US11/723,644 patent/US20070166549A1/en not_active Abandoned
-
2009
- 2009-05-21 JP JP2009122824A patent/JP2009182363A/en active Pending
-
2010
- 2010-07-30 US US12/847,819 patent/US8029911B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3915512B2 (en) | 2007-05-16 |
MY143567A (en) | 2011-05-31 |
JP2009182363A (en) | 2009-08-13 |
US20030141014A1 (en) | 2003-07-31 |
KR100463558B1 (en) | 2004-12-29 |
CN1425192A (en) | 2003-06-18 |
US20070166549A1 (en) | 2007-07-19 |
WO2001082363A1 (en) | 2001-11-01 |
TWI285216B (en) | 2007-08-11 |
US7208105B2 (en) | 2007-04-24 |
CN1214455C (en) | 2005-08-10 |
KR20020084198A (en) | 2002-11-04 |
US20100294551A1 (en) | 2010-11-25 |
US8029911B2 (en) | 2011-10-04 |
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