WO2012011457A1 - 異方性導電フィルム、接続構造体及びそれらの製造方法 - Google Patents
異方性導電フィルム、接続構造体及びそれらの製造方法 Download PDFInfo
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- WO2012011457A1 WO2012011457A1 PCT/JP2011/066309 JP2011066309W WO2012011457A1 WO 2012011457 A1 WO2012011457 A1 WO 2012011457A1 JP 2011066309 W JP2011066309 W JP 2011066309W WO 2012011457 A1 WO2012011457 A1 WO 2012011457A1
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- Prior art keywords
- meth
- acrylate
- anisotropic conductive
- conductive film
- group
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- 0 *C(C(OCC(CCO1)C1=O)=O)=C Chemical compound *C(C(OCC(CCO1)C1=O)=O)=C 0.000 description 4
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Definitions
- the resin for film formation can be appropriately selected from known resin for film formation according to the usage of the anisotropic conductive film.
- phenoxy resin, epoxy resin, unsaturated polyester resin, saturated polyester resin , Urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin resin, and the like can be used in combination.
- a phenoxy resin synthesized from bisphenol A and epichlorohydrin can be preferably used from the viewpoint of film forming property, workability, and connection reliability, and a commercially available product can also be used.
- the conductive particles constituting the anisotropic conductive film of the present invention can be appropriately selected from those conventionally used for anisotropic conductive adhesives.
- examples thereof include metal particles such as nickel, cobalt, silver, copper, gold and palladium, and electroless plated metal-coated resin particles obtained by coating the surfaces of polystyrene particles and guanamine resin particles with an electroless plated metal.
- the size of such resin particles is preferably 1 to 20 ⁇ m, more preferably 2 to 10 ⁇ m.
- a known bonder can be used as the heat and pressure bonder.
- the pressing surface of the bonder may be a metal surface such as stainless steel, but is applied to the mounting method described in claim 1 of JP-A-2005-32952 and 2006-24554.
- An elastic body may be used like a thermocompression bonding head.
- the anisotropic conductive films of Examples 1 to 5 using acrylates having cyclic ester residues as (meth) acrylate monomers have good adhesive strength, conduction resistance and connection reliability. Indicated.
- the anisotropic conductive film of Example 5 using cyclic carbonate acrylate was particularly excellent in adhesive strength as compared to the anisotropic conductive films of Examples 1 to 4 using lactone acrylate.
- the adhesive strength of an anisotropic conductive film using an acrylic monomer that initiates radical polymerization with an organic peroxide as a thermosetting adhesive main component is reduced with a phosphate group-containing acrylate. Can be improved without using. Therefore, it is useful for manufacturing a connection structure such as a semiconductor device.
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Abstract
Description
第1の電子部品の端子上に前述の本発明の異方性導電フィルムを仮貼りし、
仮貼りされた異方性導電フィルム上に第2の電子部品を、第1の電子部品の端子と第2の電子部品の端子とが対向するように仮設置し、
仮設置された第2の電子部品を加熱加圧することにより、第1の電子部品の端子と第2の電子部品の端子とを異方性導電接続する製造方法を提供する。
参考例1(ラクトンアクリレートの合成)
アクリル酸(72.1g、1モル)、α-ヒドロキシ-γ-ブチロラクトン(112.3g、1.1モル)、p-トルエンスルホン酸3g、及びトルエン1Lを反応容器に投入し、水を除去しながら5時間加熱還流させてエステル化した。トルエンを減圧留去し、残渣を減圧蒸留処理することにより、γ-ブチロラクトン-2-イルアクリレートを50%の収率で得た。
α-ヒドロキシ-γ-ブチロラクトンを4-ヒドロキシメチル-1,3-ジオキソラン-2-オンに代えた以外は、参考例1の合成工程を繰り返すことにより1,3-ジオキソラン-2-オン-4-イルメチルアクリレートを得た。
α-ヒドロキシ-γ-ブチロラクトンをα-ヒドロキシ-γ-ブチロラクタムに代えた以外は、参考例1の合成工程を繰り返すことによりγ-ブチロラクタム-2-イルアクリレートを得た。
フェノキシ樹脂(YP50、東都化成(株))60質量部、参考例2で調製した環状カーボネートアクリレート30質量部、ウレタンアクリレート(U-4HA、新中村化学工業(株))20質量部、及び過酸化ベンゾイル(ナイパーBW、日油(株))5質量部とを、酢酸エチルとトルエンとの混合溶媒(1/1(V/V))で固形分50%となるように混合することにより絶縁性接着ペーストを調製した。
フェノキシ樹脂(YP50、東都化成(株))60質量部、鎖状エステルアクリレート(NKエステルA-SA、新中村化学工業(株))30質量部、ウレタンアクリレート(U-4HA、新中村化学工業(株))20質量部、及び過酸化ベンゾイル(ナイパーBW、日油(株))5質量部とを、酢酸エチルとトルエンとの混合溶媒(1/1(V/V))で固形分50%となるように混合することにより絶縁性接着ペーストを調製した。
表1の実施例1~5及び比較例1の配合成分を、酢酸エチルとトルエンとの混合溶媒(1/1(V/V))で固形分50%となるように混合して異方性導電接着剤ペーストを調製した。このペーストを50μm厚の剥離処理済ポリエチレンテレフタレートに、乾燥厚が20μmとなるように塗布し、70℃のオーブン中で5分間乾燥することにより異方性導電フィルムを作成した。
表2に示すように、実施例1~5及び比較例1の異方性導電フィルムに対し、参考例4又は5の絶縁性接着ペーストを、それぞれ実施例1~5及び比較例1の異方性導電フィルムに乾燥厚が20μmとなるように塗布し、70℃のオーブン中で5分間乾燥することにより絶縁性接着層が積層された2層構造の異方性導電フィルムを作成した。
得られた異方性導電フィルムについて、以下に説明するように接着強度、導通抵抗、接続信頼性を試験した。
200nm厚のITO膜が全面に形成された0.7mm厚のガラス基板に、10mm巾の異方性導電フィルムを仮貼りし、その上からフレキシブルプリント配線板(ソニーケミカル&インフォメーションデバイス(株)製、サイズ:20mm×40mm×総厚み46μm(PI/Cu=38μm/8μm、ピッチ50μm))を仮固定した。160℃、4MPa、4秒間という条件で貼り付け、剥離試験器(テンシロン、(株)オリエンテック)を用いて剥離速度50mm/分で90度剥離試験を行った。得られた接着強度[N/cm]を表1に示す。接着強度は実用上6N/cm以上であることが望ましい。
フレキシブルプリント配線板(ソニーケミカル&インフォメーションデバイス(株)製、サイズ:20mm×40mm×総厚み46μm(PI/Cu=38μm/8μm、ピッチ50μm))と、20μm厚のハンダ表面層が形成された電極パッド(Au/NiメッキCuベース)とを有するガラスエポキシ基板(679F、日立化成工業(株):38mm×38mm×0.6mm厚)との間に異方性導電フィルムを挟持させ、加熱加圧ボンダーで、160℃、4MPaの圧力で4秒加熱加圧することにより接続構造体を得た。この接続構造体におけるICチップと配線基板との間の導通抵抗を、4端子法により測定し、測定した抵抗値を表1に示す。導通抵抗は、実用上1Ω以下であることが求められる。
導通抵抗を測定した接続構造体を、高温高湿槽(85℃、85%RH)に500時間放置した後の導通抵抗を4端子法により測定し、測定した抵抗値を以下の基準に従って評価した。
AA: 3Ω未満
A:3Ω以上5Ω未満
B:5Ω以上10Ω未満
C:10Ω以上
γ-ブチロラクトン-2-イルアクリレートに代えてγ-ブチロラクタム-2-イルアクリレートを使用すること以外は、実施例1と同様に異方性導電フィルムを製造し、評価した。その結果、実施例1の異方性導電フィルムと同様の結果であった。
Claims (8)
- 導電粒子が、(メタ)アクリレート系モノマー組成物とラジカル重合開始剤と成膜用樹脂とを含有する絶縁性接着剤組成物に分散してなる異方性導電フィルムにおいて、(メタ)アクリレート系モノマー組成物が環状エステル残基又は環状アミド残基を有する、(メタ)アクリレート系モノマーを含有する異方性導電フィルム。
- 環状エステル残基又は環状アミド残基を有する(メタ)アクリレートが、以下式(1)
(式中、R1は水素原子又はメチル基であり、R2はアルキレン基又はアルキルオキシ基であり、R3はアルキル基、アルキレン基、アリール基又はハロゲン原子であり、nは0~3の整数であり、R4は存在しないか又は酸素原子で置換してもよいアルキレン基であり、R4が存在しない場合、R4の両側の点線はそれらで単結合を表し、X1は存在しないか又は酸素原子もしくは炭素原子であり、X1が存在しない場合、X1の両側の実線はそれらで単結合を表し、X2は酸素原子、窒素原子又は硫黄原子である。)
の構造式で表される請求項1記載の異方性導電フィルム。 - (メタ)アクリレート系モノマー組成物とラジカル重合開始剤と成膜用樹脂とを含有する絶縁性接着剤組成物に導電粒子を均一に分散混合し、得られた混合物を剥離フィルムに塗布し、乾燥することにより異方性導電フィルムを製造する方法において、(メタ)アクリレート系モノマー組成物として、環状エステル残基又は環状アミド残基を有する(メタ)アクリレート系モノマーを使用する製造方法。
- 第1の電子部品の端子と第2の電子部品の端子とが、請求項1~3のいずれかに記載の異方性導電フィルムを介して異方性導電接続されてなる接続構造体。
- 第1の電子部品の端子と第2の電子部品の端子とが、異方性導電フィルムを介して異方性導電接続されてなる接続構造体の製造方法において、
第1の電子部品の端子上に請求項1~3のいずれかに記載の異方性導電フィルムを仮貼りし、
仮貼りされた異方性導電フィルム上に第2の電子部品を、第1の電子部品の端子と第2の電子部品の端子とが対向するように仮設置し、
仮設置された第2の電子部品を加熱加圧することにより、第1の電子部品の端子と第2の電子部品の端子とを異方性導電接続する製造方法。
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US13/512,752 US9515042B2 (en) | 2010-07-21 | 2011-07-19 | Anisotropic conductive film, connection structure and method of producing the same |
CN201180035632.6A CN103081235B (zh) | 2010-07-21 | 2011-07-19 | 各向异性导电膜、连接结构体以及它们的制作方法 |
HK13108692.9A HK1181557A1 (zh) | 2010-07-21 | 2013-07-24 | 各向異性導電膜、連接結構體以及它們的製作方法 |
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KR101583691B1 (ko) * | 2012-10-10 | 2016-01-08 | 제일모직주식회사 | 이방 전도성 접착 조성물 및 이를 이용한 이방 전도성 필름 |
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US20120228026A1 (en) | 2012-09-13 |
US9515042B2 (en) | 2016-12-06 |
HK1181557A1 (zh) | 2013-11-08 |
CN103081235B (zh) | 2016-06-01 |
KR101312748B1 (ko) | 2013-09-27 |
JP2010242101A (ja) | 2010-10-28 |
CN103081235A (zh) | 2013-05-01 |
JP5521848B2 (ja) | 2014-06-18 |
KR20120106985A (ko) | 2012-09-27 |
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