HK1181557A1 - 各向異性導電膜、連接結構體以及它們的製作方法 - Google Patents

各向異性導電膜、連接結構體以及它們的製作方法

Info

Publication number
HK1181557A1
HK1181557A1 HK13108692.9A HK13108692A HK1181557A1 HK 1181557 A1 HK1181557 A1 HK 1181557A1 HK 13108692 A HK13108692 A HK 13108692A HK 1181557 A1 HK1181557 A1 HK 1181557A1
Authority
HK
Hong Kong
Prior art keywords
processes
materials
production
conductive film
connection structure
Prior art date
Application number
HK13108692.9A
Other languages
English (en)
Inventor
阿久津恭志
佐藤宏
吉澤茂行
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1181557A1 publication Critical patent/HK1181557A1/zh

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    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
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    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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    • C09J2433/00—Presence of (meth)acrylic polymer
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
HK13108692.9A 2010-07-21 2013-07-24 各向異性導電膜、連接結構體以及它們的製作方法 HK1181557A1 (zh)

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KR20150100853A (ko) 2012-12-27 2015-09-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 인듐-주석 산화물 층용 코팅
JP6127806B2 (ja) * 2013-07-24 2017-05-17 日立化成株式会社 接続材料、接続構造体及びその製造方法
JP2015025028A (ja) * 2013-07-24 2015-02-05 日立化成株式会社 接続材料、これを用いた接続構造体及びその製造方法
WO2016143640A1 (ja) * 2015-03-11 2016-09-15 セメダイン株式会社 導電性構造体、及び導電性構造体の製造方法
KR20180057681A (ko) * 2015-09-21 2018-05-30 로오드 코포레이션 접착제 조성물 및 접합 방법
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JP5521848B2 (ja) 2014-06-18
US9515042B2 (en) 2016-12-06
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