WO2011083756A1 - 冷凍装置 - Google Patents
冷凍装置 Download PDFInfo
- Publication number
- WO2011083756A1 WO2011083756A1 PCT/JP2011/000010 JP2011000010W WO2011083756A1 WO 2011083756 A1 WO2011083756 A1 WO 2011083756A1 JP 2011000010 W JP2011000010 W JP 2011000010W WO 2011083756 A1 WO2011083756 A1 WO 2011083756A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- refrigerant
- power module
- cooling member
- cooling
- contact surface
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B31/00—Compressor arrangements
- F25B31/006—Cooling of compressor or motor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20354—Refrigerating circuit comprising a compressor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/20—Casings or covers
- F24F2013/207—Casings or covers with control knobs; Mounting controlling members or control units therein
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B13/00—Compression machines, plants or systems, with reversible cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/02—Compressor control
- F25B2600/021—Inverters therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Definitions
- the present invention relates to a refrigeration apparatus that performs a refrigeration cycle, and particularly relates to a refrigeration apparatus that cools a power module with a cooling member.
- Patent Document 1 discloses a cooling member including a copper refrigerant pipe through which a refrigerant flows and a flat plate-like main body portion made of a metal having high thermal conductivity such as aluminum and having a refrigerant pipe embedded therein. Yes.
- the power module can be cooled by bringing the main body portion into thermal contact with the power module and applying heat from the power module to the refrigerant flowing through the refrigerant pipe via the main body portion.
- the present invention has been made in view of the above point, and an object of the present invention is to prevent generation of condensed water and prevent condensed water from adhering to an electronic component in a refrigeration apparatus including a cooling member for cooling a power module or the like. There is in doing so.
- the present invention includes a refrigerant circuit (20) connected to a compressor (30) to perform a refrigeration cycle, an electronic component (56, 57, 59) including a power module (56), and the refrigerant circuit (20) inside. And a cooling member (60) in contact with the power module (56) so that the refrigerant cools and the power module (56) is cooled by the refrigerant. A solution was taken.
- the cooling member (60) transmits the cold heat of the refrigerant flowing inside from at least the non-contact surface (60b) other than the contact surface (60a) with the power module (56). There is a blocking means to prevent this.
- the refrigerant compressed by the compressor (30) circulates through the refrigerant circuit (20), so that a refrigeration cycle is performed.
- the cooling member (60) cools the power module (56) using the refrigerant of the refrigerant circuit (20). Specifically, in the cooling member (60), the refrigerant flows inside the main body (61). The heat of the power module (56) is transferred to the refrigerant flowing through the main body (61) through the main body (61). Thereby, the power module (56) is cooled.
- the cooling member (60) prevents the cold heat of the refrigerant flowing inside from being transmitted outside from the non-contact surface (60b) other than the contact surface (60a) with the power module (56). Means. Therefore, when the refrigerant flows into the cooling member (60) and the power module (56) is cooled, non-contact other than the contact surface (60a) of the cooling member (60) with the power module (56) Since the cooling heat of the refrigerant is not transmitted from the surface (60b), the cooling of the air around the cooling member (60) is suppressed. Thereby, dew condensation water is not generated around the cooling member (60), and the dew condensation water is prevented from flowing toward the electronic components (56, 57, 59).
- the cooling member (60) has a main body (61) in contact with the power module (56) while a cooling refrigerant for cooling the power module (56) flows therein.
- the blocking means includes a heat insulating layer (65) that covers a non-contact surface other than a contact surface (61s) of the main body (61) with the power module (56).
- the heat of the cooling refrigerant is cooled by the heat insulating layer (65). External transmission from the non-contact surface other than the contact surface (61s) with the power module (56) of the part (61) is prevented.
- the heat insulation layer (65) prevents the cold heat of the cooling refrigerant from being transmitted externally from at least a non-contact surface other than the contact surface (60a) with the power module (56) of the cooling member (60).
- the blocking means is formed on the non-contact surface (60b) side of the cooling refrigerant flow path (61a) through which the cooling refrigerant flows of the cooling member (60).
- the high-temperature refrigerant flow path (61b) through which the high-temperature refrigerant flows is provided.
- the portion on the non-contact surface (60b) side of the cooling refrigerant flow path (61a) of the cooling member (60) is heated by the high temperature refrigerant flowing through the high temperature refrigerant flow path (61b). Therefore, the cooling heat of the cooling refrigerant flowing through the cooling refrigerant channel (61a) is the high temperature refrigerant flowing through the high temperature refrigerant channel (61b) on the non-contact surface (60b) side of the cooling refrigerant channel (61a) or the high temperature It is absorbed by the hot part heated by the refrigerant.
- the cooling heat of the cooling refrigerant is prevented from being transmitted externally from the non-contact surface (60b) other than the contact surface (60a) with the power module (56) of the cooling member (60).
- (60b) is heated by the heat of the high-temperature refrigerant flowing through the high-temperature refrigerant flow path (61b) and becomes high temperature. Thereby, generation
- the blocking means includes a heat insulating layer (68) formed between the cooling refrigerant flow path (61a) and the high temperature refrigerant flow path (61b). Yes.
- the cooling member (60) from the non-contact surface (60b) Transmission is more reliably prevented. Further, since the cold heat of the cooling refrigerant is not transmitted to the high-temperature refrigerant flow path (61b), all the heat of the high-temperature refrigerant in the high-temperature refrigerant flow path (61b) is used for heating near the non-contact surface (60b). (60b) High temperature near. Therefore, generation
- the heat insulating layer (68) is constituted by a vacuum layer or an air layer.
- the heat insulating layer (68) is easily formed by the vacuum layer or the air layer.
- the cooling refrigerant is generated in the cooling member (60) by depressurizing the refrigerant in the refrigerant circuit (20).
- a pressure reducing mechanism (81) is provided.
- the pressure reducing mechanism (81) that generates the low-temperature cooling refrigerant is provided inside the cooling member (60). Therefore, the high-temperature refrigerant supplied to the refrigerant inlet of the cooling member (60) is decompressed by the decompression mechanism (81) inside the cooling member (60) to become a low-temperature cooling refrigerant. As a result, the high-temperature refrigerant flows through the refrigerant inlet of the cooling member (60), so that the generation of condensed water around the refrigerant inlet of the cooling member (60) is suppressed.
- the cooling member (60) includes a cooling refrigerant on the upstream side of the decompression mechanism (81) after the cooling of the power module (56). It is configured to exchange heat with the refrigerant.
- the cooling refrigerant after cooling the power module (56) is heated by exchanging heat with the high-temperature refrigerant on the upstream side of the decompression mechanism (81) inside the cooling member (60). The Therefore, the temperature of the refrigerant flowing out from the cooling member (60) increases. Thereby, the refrigerant heated by the high-temperature refrigerant flows through the refrigerant outlet of the cooling member (60), so that the generation of condensed water around the refrigerant outlet of the cooling member (60) is suppressed.
- an insulating pipe (85) is connected to the refrigerant outlet of the cooling member (60).
- the cooling refrigerant after cooling the power module (56) inside the cooling member (60) flows into the heat insulation pipe (85) from the refrigerant outlet of the cooling member (60).
- the heat insulation pipe (85) since the cold heat of the cooling refrigerant is not transmitted to the outside, the generation of condensed water near the refrigerant outlet of the cooling member (60) is suppressed.
- the blocking means is configured such that the cold heat of the refrigerant flowing inside the cooling member (60) is generated by the power module (60) of the cooling member (60). 56) is configured to prevent external transmission from the outer edge of the contact surface (60a).
- the outer edge portion of the power module (56) is usually away from the portion that generates heat when energized, so cooling does not contribute to cooling the heating portion, and when cooled, the temperature is lower than the ambient air temperature. May decrease and condensation may occur in the surrounding area.
- the blocking means and the power module (56) of the cooling member (60) are cooled.
- the cold heat of the refrigerant is not transmitted to the outside from the outer edge portion of the contact surface (60a).
- the temperature drop is suppressed by the heat generated in the heat generating portion of the power module (56).
- dew condensation water does not generate
- This dew condensation water is prevented from flowing toward the electronic components (56, 57, 59).
- a tenth aspect of the invention is the ninth aspect of the invention, wherein the blocking means has an area of a heat transfer surface that transmits the cold heat of the refrigerant flowing inside the cooling member (60) to the power module (56).
- the module (56) is configured to be smaller than the area of the surface corresponding to the cooling member (60).
- the portion to which the cold heat of the refrigerant circulating in the cooling member (60) is transmitted is smaller than the power module (56).
- the heat generating portions that require cooling of the power module (56) are intensively cooled, and the portions away from the heat generating portions that do not require cooling are not cooled.
- the surface of the power module (56) and the non-contact surface other than the contact surface with the cooling member (60) is a heat insulating layer ( 66).
- the non-contact surface of the power module (56) Covering with 66) suppresses cooling of the air around the power module (56). Thereby, generation
- the heat insulating layer (65, 68) is made of an insert-molded resin material having heat insulating properties.
- the heat insulating layer (65, 68) is made of an insert-molded resin material having heat insulating properties. With such a configuration, the heat insulating layer (65, 68) excellent in heat insulating performance can be easily formed by insert molding.
- the heat insulating layer (65, 66, 68) is configured by spraying urethane.
- the heat insulating layer (65, 66, 68) is formed by spraying urethane.
- the heat insulating layer (65, 66, 68) excellent in heat insulating performance can be easily formed simply by spraying urethane.
- the non-contact surface (60b) By preventing external transmission from the non-contact surface (60b), it is possible to prevent the air around the cooling member (60) from being cooled by the cold heat of the refrigerant flowing inside. Thereby, dew condensation water is not generated around the cooling member (60), and the dew condensation water is prevented from flowing toward the electronic components (56, 57, 59). Therefore, failure of the electronic components (56, 57, 59) can be avoided.
- the heat insulation layer (65) causes the cooling heat of the refrigerant flowing inside the cooling member (60) to be in a non-contact surface (60b) other than the contact surface (60a) with the power module (56). Therefore, it is possible to easily configure blocking means for blocking external transmission.
- the cold heat of the refrigerant flowing inside the cooling member (60) is transmitted externally from the non-contact surface (60b) other than the contact surface (60a) with the power module (56). It is possible to easily configure blocking means for blocking this.
- the non-contact surface of the cooling member (60) External transmission from (60b) can be more reliably prevented. Further, since the cold heat of the cooling refrigerant is not transmitted to the high-temperature refrigerant flow path (61b), all the heat of the high-temperature refrigerant in the high-temperature refrigerant flow path (61b) is used for heating near the non-contact surface (60b). (60b) The vicinity can be kept at a relatively high temperature. Therefore, generation
- the decompression mechanism (81) that generates the low-temperature cooling refrigerant is provided inside the cooling member (60), and the high-temperature refrigerant flows in the vicinity of the refrigerant inlet of the cooling member (60).
- heat exchange is performed between the cooling refrigerant after cooling the power module (56) and the high-temperature refrigerant upstream of the decompression mechanism (81) inside the cooling member (60).
- the eighth invention it is possible to suppress the generation of condensed water near the refrigerant outlet of the cooling member (60) with an easy configuration.
- the blocking means by configuring the blocking means so that the cold heat of the refrigerant is not transmitted to the outside from the outer edge portion of the contact surface (60a) with the power module (56) of the cooling member (60).
- the air around the outer edge of the contact surface of the power module (56) with the cooling member (60) can be prevented from being cooled.
- the heat generated in the heat generating portion of the power module (56) is suppressed from lowering the temperature of the outer edge portion of the contact surface with the cooling member (60) of the power module (56), the cooling member The generation of condensed water can be suppressed around (60). Therefore, failure of the power module (56) can be avoided.
- the portion to which the cold heat of the refrigerant flowing inside the cooling member (60) is transmitted is formed smaller than the power module (56), thereby cooling the power module (56). While necessary heat generating portions can be intensively cooled, it is possible to avoid the formation of condensed water due to cooling of the portions away from the heat generating portions that do not require cooling.
- the non-contact surface of the power module (56) other than the contact surface with the cooling member (60) is covered with the heat insulating layer (66). Therefore, even when the power module (56) is strongly cooled by the refrigerant flowing inside the cooling member (60), the air around the power module (56) is suppressed from being cooled. . Thereby, generation
- the heat insulating layer (65, 66, 68) having excellent heat insulating performance can be easily formed by insert molding.
- the heat insulating layer (65, 66, 68) excellent in heat insulating performance can be easily formed only by spraying urethane.
- FIG. 1 is a refrigerant circuit diagram illustrating a schematic configuration of an air conditioner according to Embodiment 1 of the present invention.
- FIG. 2 is a longitudinal sectional view showing the internal structure of the inverter control panel.
- FIG. 3 is a perspective view showing a schematic configuration of the cooling member.
- FIG. 4 is a longitudinal sectional view showing the internal structure of the inverter control panel of the air conditioner according to the second embodiment.
- FIG. 5 is a longitudinal sectional view showing the internal structure of the inverter control panel of the air conditioner according to the third embodiment.
- FIG. 6 is a longitudinal sectional view showing a schematic configuration inside the partition plate of FIG.
- FIG. 7 is an enlarged cross-sectional view of the cooling member shown in FIG. FIGS.
- FIG. 8A and 8B are diagrams each showing a temperature distribution during cooling of the power module by the cooling member of the third embodiment, and FIG. 8A shows that the contact surface of the main body is larger than that of the power module.
- FIG. 8B shows a case where the contact surface of the main body is smaller than the power module.
- FIG. 9 is an enlarged cross-sectional view of the cooling member according to the first modification of the third embodiment.
- FIG. 10 is an enlarged plan view showing the contact surface of the main body of the cooling member according to the second modification of the third embodiment and the power module.
- FIG. 11 is an enlarged cross-sectional view of the cooling member according to the fourth embodiment.
- FIG. 12 is an enlarged cross-sectional view of the cooling member according to the fifth embodiment.
- FIG. 13 is an enlarged cross-sectional view of the cooling member according to the sixth embodiment.
- FIG. 14 is an enlarged cross-sectional view of a cooling member according to a modification of the sixth embodiment.
- FIG. 1 is a refrigerant circuit diagram illustrating a schematic configuration of an air conditioner according to Embodiment 1 of the present invention.
- this air conditioner (10) is composed of a refrigeration apparatus that performs a vapor compression refrigeration cycle, and includes an outdoor unit (11) installed outdoors and an indoor unit installed indoors. (12) is provided one by one.
- An outdoor circuit (21) is accommodated in the outdoor unit (11).
- An indoor circuit (22) is accommodated in the indoor unit (12).
- the refrigerant circuit (20) is formed by connecting the outdoor circuit (21) and the indoor circuit (22) with a pair of connecting pipes (23, 24).
- the outdoor circuit (21) is provided with a compressor (30), a four-way switching valve (41), an outdoor heat exchanger (42), a cooling member (60), and an expansion valve (43). ing.
- the cooling member (60) will be described later.
- the discharge side of the compressor (30) is connected to the first port of the four-way switching valve (41), and the suction side is connected to the second port of the four-way switching valve (41) via the accumulator (34).
- the four-way switching valve (41) has a third port connected to one end of the outdoor heat exchanger (42), and a fourth port connected to the gas-side closing valve (44).
- the other end of the outdoor heat exchanger (42) is connected to one end of the expansion valve (43) via a cooling member (60).
- the other end of the expansion valve (43) is connected to the liquid side closing valve (45).
- the indoor circuit (22) is provided with an indoor heat exchanger (46).
- the indoor circuit (22) has its gas side end connected to the gas side shutoff valve (44) via the gas side connection pipe (23), and its liquid side end connected to the liquid side connection pipe (24). And is connected to the liquid side closing valve (45).
- the compressor (30) is a so-called hermetic compressor. That is, in the compressor (30), the compression mechanism (32) for compressing the refrigerant and the electric motor (33) for rotationally driving the compression mechanism (32) are accommodated in one casing (31). .
- the four-way switching valve (41) includes a first state (state indicated by a solid line in FIG. 1) in which the first port and the third port communicate with each other and the second port and the fourth port communicate with each other. The state is switched to a second state (state indicated by a broken line in FIG. 1) in which the port communicates with the fourth port and the second port communicates with the third port.
- the expansion valve (43) is a variable opening electric expansion valve whose valve body is driven by a pulse motor.
- the outdoor heat exchanger (42) and the indoor heat exchanger (46) are both fin-and-tube heat exchangers for exchanging heat between the refrigerant and air.
- the outdoor heat exchanger (42) exchanges heat between the outdoor air and the refrigerant.
- the outdoor unit (11) is provided with an outdoor fan (13) for sending outdoor air to the outdoor heat exchanger (42).
- the indoor heat exchanger (46) exchanges heat between the indoor air and the refrigerant.
- the indoor unit (12) is provided with an indoor fan (14) for sending room air to the indoor heat exchanger (46).
- the air conditioner (10) has a box-shaped inverter control panel (50) and an inverter device (55) accommodated in the inverter control panel (50).
- the inverter device (55) constitutes a power circuit of the compressor (30). Specifically, the inverter device (55) converts the AC frequency supplied from the commercial power source into a command value from a controller (not shown), and converts the AC frequency converted from the frequency to the electric motor (33) of the compressor (30).
- the power supply circuit for supplying to is comprised.
- the inverter control panel (50) is formed of a vertically long rectangular parallelepiped box.
- the inverter control panel (50) has a door (51) that can be opened and closed on the front side (left side in FIG. 2), and a mounting plate (52) on the rear side (right side in FIG. 2).
- the inverter control panel (50) accommodates the inverter device (55) and the cooling member (60) described above.
- the inverter device (55) is composed of a plurality of electronic components. Specifically, in the first embodiment, a power module (56), a capacitor (57), and a reactor (59) are provided as these electronic components.
- the power module (56) includes an IGBT module including an IGBT (Insulated Gate Bipolar Transistor) chip that generates heat during operation.
- the power module (56) is mounted on the wiring board (58).
- the capacitor (57) is disposed on the upper side in the first space (S1) described later.
- the reactor (59) is installed at the bottom of the inverter control panel (50).
- the cooling member (60) includes a main body (61) and a refrigerant pipe (62).
- the main body (61) is made of a metal material having high thermal conductivity such as aluminum.
- the main body (61) has a rectangular parallelepiped base that is flat in the front-rear direction and a raised portion that slightly protrudes from the base.
- the main body (61) is provided so that the end surface of the raised portion contacts the power module (56) so as to exchange heat with the power module (56) via the raised portion.
- the end surface of the raised portion constitutes a contact surface (61s) with the power module (56) in the surface of the main body (61) according to the present invention.
- the end surface of a protruding part comprises the contact surface (60a) with the power module (56) of the member for cooling (60).
- the refrigerant pipe (62) is embedded in the main body (61), and forms a refrigerant flow path through which the refrigerant flows.
- the refrigerant pipe (62) is made of a metal material having a high thermal conductivity such as copper.
- the refrigerant pipe (62) has four straight pipe parts (63) and three U-shaped pipe parts (64) for connecting the straight pipe parts (63) in series. ing.
- the number of the straight pipe parts (63) and the U-shaped pipe parts (64) is merely an example, and may be smaller or larger.
- the straight pipe portion (63) penetrates the main body portion (61) so as to be parallel to the front and rear surfaces of the main body portion (61).
- the U-shaped pipe part (64) is located on both ends in the longitudinal direction of the main body part (61), and connects two straight pipe parts (63) adjacent to each other in the vertical direction.
- the end (63a) of the uppermost straight pipe portion (63) or the end (63b) of the lowermost straight pipe portion (63) is either One of them constitutes the refrigerant inflow part, and the other constitutes the refrigerant outflow part.
- the cooling member (60) includes a heat insulating layer (65) formed on the surface of the main body (61).
- the heat insulation layer (65) is formed by, for example, insert molding a resin material having heat insulation around the main body (61), and the contact surface (61s) between the power module (56) and the main body (61).
- the surface of the main body (61) except for) is covered. That is, the heat insulation layer (65) covers the non-contact surface other than the contact surface (61s) with the power module (56), which is the surface of the main body (61).
- the heat insulating layer (65) constitutes a blocking means according to the present invention, and can prevent the air around the cooling member (60) from being cooled. Thereby, dew condensation water is not generated around the cooling member (60), and the dew condensation water is prevented from flowing toward the electronic components (56, 57, 59). Therefore, failure of the electronic components (56, 57, 59) can be avoided.
- the internal space of the inverter control panel (50) is roughly divided into two spaces (first space (S1) and second space (S2)) by a partition plate (71).
- the partition plate (71) is formed of a synthetic resin material that is formed in a flat plate shape extending vertically and has low thermal conductivity and heat insulation.
- a rectangular opening (71a) penetrating in the thickness direction is formed substantially at the center of the partition plate (71).
- the opening (71a) of the partition plate (71) is closed by the cooling member (60). Specifically, the opening (71a) is formed so that both the vertical and horizontal lengths are shorter than the cooling member (60).
- the cooling member (60) is supported by the outer peripheral edge portion (71b) of the opening (71a) in the surface on the mounting plate (52) side of both end surfaces in the thickness direction of the partition plate (71). Thereby, the cooling member (60) completely covers the opening (71a) from the second space (S2) side.
- the power module (56) is fixed to the cooling member (60) so as to be in contact with the front surface (end surface of the raised portion) of the main body (61) in the first space (S1).
- the capacitor (57) is disposed on the upper side in the first space (S1).
- the power module (56) and the main body (61) of the cooling member (60) are the refrigerant and the power module flowing through the refrigerant pipe (62) embedded in the main body (61). (56) so that heat exchange is possible.
- the main body (61) is in contact with the power module (56) so that the power module (56) is cooled by the refrigerant flowing inside.
- the cooling member (60) is configured to cool the power module (56) with the refrigerant.
- the air conditioner (10) of the first embodiment selectively performs a cooling operation and a heating operation.
- the refrigerant discharged from the compressor (30) flows into the outdoor heat exchanger (42) through the four-way switching valve (41), and dissipates heat to the outdoor air to condense. To do.
- the refrigerant condensed in the outdoor heat exchanger (42) flows into the refrigerant pipe (62) of the cooling member (60).
- the power module (56) heat is generated with energization.
- the refrigerant condensed in the outdoor heat exchanger (42) flows through the refrigerant pipe (62) of the cooling member (60).
- the heat generated in the power module (56) is sequentially transmitted through the main body (61) and the refrigerant pipe (62), and is given to the refrigerant flowing through the refrigerant pipe (62).
- the temperature rise of the power module (56) is suppressed.
- the refrigerant that has flowed out of the refrigerant pipe (62) of the cooling member (60) is reduced in pressure when passing through the expansion valve (43), and then flows into the indoor heat exchanger (46).
- the refrigerant absorbs heat from the indoor air and evaporates. Thereby, indoor air is cooled.
- the refrigerant evaporated in the indoor heat exchanger (46) sequentially passes through the four-way switching valve (41) and the accumulator (34), and then is sucked into the compressor (30) and compressed.
- the heating operation will be described.
- the four-way selector valve (41) is set to the second state (the state indicated by the broken line in FIG. 1), and the outdoor fan (13) and the indoor fan (14) are operated.
- the refrigerant circuit (20) during the heating operation a refrigeration cycle is performed in which the indoor heat exchanger (46) serves as a condenser and the outdoor heat exchanger (42) serves as an evaporator.
- the cooling member (60) is located between the expansion valve (43) and the outdoor heat exchanger (42) that is an evaporator.
- the refrigerant discharged from the compressor (30) flows into the indoor heat exchanger (46) through the four-way switching valve (41).
- the indoor heat exchanger (46) the refrigerant dissipates heat to the indoor air and condenses. As a result, room air is heated.
- the refrigerant condensed in the indoor heat exchanger (46) is decompressed when passing through the expansion valve (43) and then flows into the refrigerant pipe (62) of the cooling member (60).
- the power module (56) heat is generated with energization.
- the refrigerant after being decompressed by the expansion valve (43) flows through the refrigerant pipe (62) of the cooling member (60).
- the heat generated in the power module (56) is sequentially transmitted through the main body (61) and the refrigerant pipe (62), and is given to the refrigerant flowing through the refrigerant pipe (62).
- the temperature rise of the power module (56) is suppressed.
- the heat insulation layer (65) cools the refrigerant. Prevents the air around the cooling member (60) from being transmitted from the non-contact surface (60b) other than the contact surface (60a) with the power module (56) of the cooling member (60). It is possible to prevent cooling by the cold heat of the refrigerant circulating inside. Thereby, dew condensation water is not generated around the cooling member (60), and the dew condensation water is prevented from flowing toward the electronic components (56, 57, 59). Therefore, failure of the electronic components (56, 57, 59) can be avoided, and the reliability of the air conditioner (10) can be ensured.
- the cooling member (60) does not have the heat insulating layer (65)
- the refrigerant pipe (62) of the cooling member (60) When the refrigerant begins to flow, the air around the cooling member (60) is rapidly cooled. For this reason, the water
- the power module (56) is cooled by this refrigerant, while the cooling member (60) is cooled by the heat insulating layer (65).
- the cooling member (60) is cooled by the heat insulating layer (65).
- dew condensation water is generated in the second space (S2) and sent to the electronic components (56, 57) side of the first space (S1) side, or along the surface of the cooling member (60). Dropping downward is suppressed. Therefore, it can be avoided that water adheres to the electronic components (56, 57, 59) and breaks down.
- the heat insulating layer (65) that covers the non-contact surface other than the contact surface (61s) with the power module (56) on the surface of the main body (61) is used for cooling.
- the present invention prevents the cold heat of the refrigerant flowing inside the member (60) from being transmitted externally from the non-contact surface (60b) other than the contact surface (60a) with the power module (56) of the cooling member (60).
- Such blocking means can be easily configured. That is, with an easy configuration, it is possible to prevent the air around the cooling member (60) from being cooled by the cold heat of the refrigerant circulating inside.
- Embodiment 2 of the Invention is a partial modification of the internal structure of the inverter control panel (50) of the first embodiment.
- the heat insulating layer (66) is also formed on the surface of the power module (56). More specifically, the heat insulating layer (66) is formed on the surface of the power module (56) and on a non-contact surface other than the contact surface with the cooling member (60). The heat insulating layer (66) is formed by insert molding a resin material having heat insulating properties, similarly to the heat insulating layer (65) covering the non-contact surface of the main body (61).
- the temperature of the refrigerant flowing inside the main body (61) of the cooling member (60) is low, and the power module (56) is powerful due to the refrigerant. Even in such a case, the air around the power module (56) is suppressed from being cooled by the heat insulating layer (66). Thereby, generation
- the entire main body (61) and power module (56) are covered with a heat insulating material. That is, in the state where the main body (61) and the power module (56) are assembled, the whole is covered with the heat insulating layer (65, 66), and there is no exposed portion. Thereby, generation
- the heat insulating layer (66) may be formed by spraying urethane or the like on the surface of the case of the power module (56).
- Embodiment 3 of the Invention targets a large air conditioner used in a large-scale facility such as a factory.
- the internal structure of the inverter control panel (50) is partially different from that of the first embodiment.
- the inverter control panel (50) is formed in a rectangular parallelepiped shape with a depth of 30 inches and a height of about 90 inches.
- the inverter control panel (50) has a door (51) that can be opened and closed on the rear side (right side in FIG. 5), and a mounting plate (52) on the front side (left side in FIG. 5).
- the inverter control panel (50) is provided with an outside air intake port, an exhaust port, and a fan that ventilates by forming an air flow from the intake port to the exhaust port in the internal space. Yes.
- the partition plate (71) is formed in a box shape with one surface open, and is attached to the mounting plate (52) so that the opening surface is closed by the mounting plate (52).
- a partition plate (71) the internal space of the inverter control panel (50) is partitioned into two spaces (a first space (S1) and a second space (S2)), which are attached to the partition plate (71).
- the second space (S2) formed between the plate (52) is a closed space.
- the inverter device (55) is disposed in the second space (S2).
- the reactor (59) is installed in the bottom part of 1st space (S1).
- the partition plate (71) has a rectangular opening (71a) formed at the bottom of the back surface (the right end surface in FIG. 5).
- the cooling member (60) is attached to the back surface of the partition plate (71) so as to shield the opening (71a).
- the inverter device (55) is configured by connecting a plurality of electronic components by a rod-like or plate-like bus bar (72) made of a conductive metal.
- the inverter device (55) includes a rectifier circuit connected to a commercial power source, a capacitor circuit, and an inverter circuit.
- Each of the rectifier circuit and the inverter circuit is configured by connecting a plurality of power modules (56) by a bus bar (72).
- Each power module (56) includes a power semiconductor chip (56a) that generates heat during operation, and a case (56b) that houses the power semiconductor chip (56a).
- the power module (56) provided in the rectifier circuit is a diode module having a diode chip
- the power module (56) provided in the inverter circuit is an IGBT (Insulated Gate Bipolar Transistor) chip. This is an IGBT module provided.
- a capacitor (57) is connected to the capacitor circuit.
- the capacitor (57) is fixed to a plate-like mounting member (77) fixed to the partition plate (71).
- the other electronic components of the capacitor (57) and the power module (56) are fixed to the partition plate (71) or the mounting member (77).
- each of the plurality of power modules (56) is fixed to a cooling member (60) attached to the back surface of the partition plate (71). Specifically, each power module (56) is arranged so that the cooling member is in contact with the front surface of the cooling member (60) that shields the opening (71a) at the opening (71a) of the partition plate (71). It is fixed to (60).
- the cooling member (60) has the refrigerant pipe (62) embedded in the main body (61) as in the first or second embodiment.
- a coolant channel (61a) through which a coolant flows is formed by machining a hole in the main body (61).
- the member for cooling (60) is provided with the heat insulation layer (65) formed in the surface of the said main-body part (61).
- the heat insulation layer (65) covers the non-contact surface other than the contact surface (61s) between the power module (56) and the main body portion (61), which is the surface of the main body portion (61).
- the main body portion (61) of the cooling member (60) has a number of raised portions corresponding to the number of power modules (56), and each power module ( 56). That is, the end surface of each raised portion is a contact surface (61s) with each power module (56) of the main body (61).
- the main body part (61) of the cooling member (60) has a contact surface (61s) on the back surface of the case (56b) of each power module (56) (on the cooling member (60) side).
- the power semiconductor chip (56a), which is part of the surface) and generates heat when energized, is configured to come into contact with the central portion attached to the inner surface.
- the contact surface (61s) between the power module (56) and the main body (61) corresponds to the back surface (cooling member (60) of the case (56b) of the power module (56). It is formed so that the area is smaller than the surface.
- the outer edge part in a contact surface with the main-body part (61) of a power module (56) will contact with a heat insulation layer (65) instead of a main-body part (61). That is, a part of the heat insulating layer (65) is sandwiched between the main body (61) and the power module (56), and the contact surface (60a) of the cooling member (60) with the power module (56) ).
- the heat of the power semiconductor chip (56a) of each power module (56) is transmitted to the main body (61) of the cooling member (60) via each contact surface (61s), and the refrigerant flow The heat is radiated to the refrigerant circulating in the passage (61a).
- the cold heat of the refrigerant is transmitted to the power module (56) via the contact surface (61s) which is a heat transfer surface.
- the power semiconductor chip (56a) portion where the temperature rises in each power module (56) is cooled by the refrigerant flowing inside the cooling member (60).
- the cold heat of the refrigerant flowing in the cooling member (60) (refrigerant of the refrigerant flow path (61a)) is transmitted outside from the contact surface (61s) with the power module (56) by the heat insulating layer (65). That is blocked.
- the air around the cooling member (60) is prevented from being cooled by the cold heat of the refrigerant flowing inside.
- condensed water is not generated around the cooling member (60), and the condensed water is prevented from flowing toward the electronic components (56, 57, 59). Therefore, failure of the electronic components (56, 57, 59) can be avoided, and the reliability of the air conditioner (10) can be ensured.
- the outer edge of the power module (56) is separated from the power semiconductor chip (56a), which is a part that generates heat when energized, so that the power semiconductor chip (56a), which is a heat generating part even when cooled, is cooled. Not only does it contribute, but when cooled, the temperature may be lower than the ambient air temperature and condensation may occur in the surroundings.
- the contact surface (61s) heat transfer surface with the power module (56) is the back surface of the case (56b) of the power module (56).
- the area is smaller than (the surface corresponding to the cooling member (60)).
- a part of the heat insulating layer (65) comes into contact with the outer edge of the power module (56) that does not need to be cooled, and the cold heat of the refrigerant flowing through the refrigerant flow path (61a) becomes the outer edge of the power module (56). It is not transmitted to the part. That is, the outer edge portion of the power module (56) is not cooled. Thereby, the dew condensation of the outer edge part of the power module (56) which is separated from the power semiconductor chip (56a) which is a heat generating part can be suppressed. Therefore, failure of the power module (56) can be avoided.
- the contact surface (61s) of the main body (61) is smaller than the surface corresponding to the main body (61) of the power module (56)
- the heat generating portion of the power module (56) is cooled and the power is reduced. It is possible to avoid generation of condensed water by avoiding a temperature drop due to cooling of the outer edge portion that does not require cooling of the module (56). The result of verifying this point by simulation is shown below.
- FIG. 8A and 8B show the temperature distribution during cooling of the power module (56) by the cooling member (60) obtained by simulation.
- FIG. 8A shows a case where the area of the contact surface (61s) of the main body (61) is larger than the area of the surface corresponding to the main body (61) of the power module (56), and
- FIG. The case where the area of the contact surface (61s) of a main-body part (61) is smaller than the area of the surface corresponding to the main-body part (61) of a power module (56) is shown.
- the thin line in the figure is an isotherm.
- illustration is abbreviate
- the area of the contact surface (61s) is the power module.
- the area of the surface corresponding to the main body (61) of (56) is larger (hereinafter referred to as a large contact surface)
- the temperature of the outer edge of the power module (56) is reduced to 30 ° C. It became.
- the area of the contact surface (61s) is smaller than the area of the surface corresponding to the main body portion (61) of the power module (56) (hereinafter referred to as the small contact surface).
- the temperature of the outer edge of the power module (56) is reduced only to 40 ° C.
- the temperature of the power semiconductor chip (56a) where the power module (56) generates heat is 116 ° C. in the case of the large contact portion of FIG. 8A and 117.degree.
- the temperature was 5 ° C, which was almost the same. That is, by configuring the contact surface (61s) of the main body (61) to be smaller than the surface corresponding to the main body (61) of the power module (56), the outer edge of the power module (56) that does not need to be cooled. It can be seen that the temperature drop due to the cooling is suppressed.
- the area of the contact surface (61s) of the main body (61) is configured to be smaller than the area of the surface corresponding to the main body (61) of the power module (56).
- each power module (56) includes a plurality of power semiconductor chips (56a)
- the main body (61) of the cooling member (60) Each power module is configured to have a number of raised portions corresponding to the number of power semiconductor chips (56a), and each semiconductor chip (56a) corresponds to the end surface of the raised portions with the case (56b) interposed therebetween.
- (56) may be attached to the main body (61) of the cooling member (60). That is, the main body (61) may have a plurality of contact surfaces (61s) for one power module (56).
- Embodiment 4 of the Invention changes the internal structure of the cooling member (60) of Embodiment 1.
- FIG. 11 shows that Embodiment 4 changes the internal structure of the cooling member (60) of Embodiment 1.
- the cooling member (60) includes only a main body (61) made of a metal material having high thermal conductivity such as aluminum.
- the main body (61) is formed with a coolant channel (61a) through which a cooling coolant flows by machining a plurality of holes.
- the plurality of refrigerant channels (61a) are arranged near the contact surface (60a) of the cooling member (60) with the power module (56).
- the main body (61) has a high-temperature refrigerant on the non-contact surface (60b) side of the cooling member (60) with the power module (56) on the basis of the refrigerant flow path (61a).
- a plurality of high-temperature refrigerant channels (61b) that circulate are formed.
- the plurality of high-temperature refrigerant channels (61b) are arranged so as to surround the refrigerant channel (61a).
- Embodiment 4 when a low-temperature refrigerant flows into the refrigerant flow path (61a), the cold heat of the refrigerant is transmitted to the power module (56) via the contact surface (60a). As a result, the temperature rise of the power module (56) that generates heat when energized is suppressed.
- the non-contact surface (60b) side portion of the refrigerant flow path (61a) of the cooling member (60) is heated by the high-temperature refrigerant flowing through the high-temperature refrigerant flow path (61b). Therefore, the cold heat of the low-temperature refrigerant flowing through the refrigerant flow path (61a) is caused by the high-temperature refrigerant flowing through the high-temperature refrigerant flow path (61b) on the non-contact surface (60b) side of the refrigerant flow path (61a) or the high-temperature refrigerant. It is absorbed by the high-temperature part surrounding the heated refrigerant flow path (61a).
- the non-contact surface (60b) is heated to a high temperature by the heat of the high-temperature refrigerant flowing through the high-temperature refrigerant flow path (61b).
- the high temperature refrigerant flow path (61b) through which the high temperature refrigerant flows causes the cold heat of the refrigerant in the refrigerant flow path (61a) to be other than the contact surface (60a) with the power module (56) of the cooling member (60).
- External transmission from the non-contact surface (60b) is prevented. That is, in the fourth embodiment, the plurality of high-temperature refrigerant channels (61b) constitute blocking means according to the present invention.
- Embodiment 5 of the Invention is obtained by partially changing the structure inside the main body (61) of the cooling member (60) of the fourth embodiment.
- a vacuum layer (68) is formed between the refrigerant channel (61a) and the high-temperature refrigerant channel (61b).
- the vacuum layer (68) is formed so as to surround the outer edge of the power module (56).
- the non-contact surface (60b) of the cooling member (60) for cooling the cold of the refrigerant. External transmission from is more reliably prevented.
- the cold heat of the refrigerant in the refrigerant flow path (61a) is not transmitted to the high temperature refrigerant flow path (61b)
- all the high temperature refrigerant in the high temperature refrigerant flow path (61b) is used for heating near the non-contact surface (60b).
- the vicinity of the non-contact surface (60b) can be kept at a relatively high temperature.
- the blocking means according to the present invention is configured by the vacuum layer (68) and the plurality of high-temperature refrigerant flow paths (61b). Thereby, generation
- the heat insulation layer comprised by the said vacuum layer (68) may be comprised by the air layer. Moreover, it is good also as filling the resin material, urethane, etc. in the space in which the said vacuum layer (68) was formed, and forming a heat insulation layer. Further, the arrangement of the vacuum layer (68) is not limited to the above-described form. For example, one of the high-temperature refrigerant flow paths (61b) may be replaced with the vacuum layer (68).
- Embodiment 6 of the Invention As shown in FIG. 13, the sixth embodiment is obtained by changing the structure of the cooling member (60) of the first embodiment.
- the cooling member (60) is composed of a main body (61) similar to that of the third embodiment, which is made of a metal material having a high thermal conductivity such as aluminum, and the power module (56) of the main body (61). And a heat insulating layer (65) covering a non-contact surface other than the contact surface.
- the heat insulation layer (65) is formed, for example, by insert molding a resin material having heat insulation around the main body (61).
- a fixed throttle (81) as a decompression mechanism that depressurizes the high-temperature refrigerant in the refrigerant circuit (20) to generate a low-temperature refrigerant for cooling.
- the fixed throttle (81) is provided inside the heat insulating layer (65).
- the inlet side pipe (82) and the outlet side are arranged so that heat is exchanged between the refrigerant after cooling the power module (56) and the refrigerant upstream of the fixed throttle (81).
- the pipe (83) is in contact with the heat exchanger.
- the fixed throttle (81) is formed in the inlet side pipe (82) of the main body (61), and the part upstream of the fixed throttle (81) of the inlet side pipe (82) and the main body In a state where the outlet side pipe (83) of the section (61) is in contact with the heat exchangeable part, the fixed throttle (81), the heat exchange part (84) (the inlet side pipe (82) and the outlet side pipe (83) And a non-contact surface other than the contact surface between the main body portion (61) and the power module (56).
- the resin material is formed by insert molding.
- a fixed throttle (81) as a pressure reducing mechanism for generating a low-temperature refrigerant is provided inside the cooling member (60) so that the high-temperature refrigerant flows in the vicinity of the refrigerant inlet of the cooling member (60).
- heat exchange is performed between the low-temperature refrigerant after cooling the power module (56) and the high-temperature refrigerant upstream of the fixed throttle (81) in the cooling member (60).
- the fixed throttle (81) and the main body portion (81) are formed in a state where the fixed throttle (81) is formed in the inlet side pipe (82) of the main body portion (61).
- the resin material is formed by insert molding so that the non-contact surface other than the contact surface with the power module (56) of 61) is covered. That is, as in the sixth embodiment, the upstream portion of the inlet side pipe (82) with respect to the fixed throttle (81) and the outlet side pipe of the main body (61) are not in contact with each other so as to allow heat exchange.
- a heat insulation pipe (85) is connected to the refrigerant outlet of the main body (61).
- the cooling refrigerant after cooling the power module (56) inside the cooling member (60) flows into the heat insulating pipe (85) from the refrigerant outlet of the cooling member (60).
- the heat insulating pipe since the cold heat of the cooling refrigerant is not transmitted to the outside, the generation of condensed water near the refrigerant outlet of the cooling member (60) is suppressed.
- the air conditioner (10) is used as a refrigeration apparatus that performs a refrigeration cycle.
- a refrigeration apparatus that performs a refrigeration cycle for example, a heat pump chiller unit, a water heater, a refrigerator that cools the inside of a refrigerator or a freezer, and the like may be used.
- the configuration in which only the power module (56, 56) according to the present invention can be cooled by the cooling member (60) has been described.
- the condenser (57) may be replaced by the cooling member (60). You may enable it to cool a capacitor
- the application of the cooling member according to the present invention is not limited to cooling the power module (56) of the compressor (30).
- a power module of a CPU central processing unit
- the present invention is useful for a refrigeration apparatus that cools a power module with a cooling member.
- Air conditioner (refrigeration equipment) 20 Refrigerant circuit 30 Compressor 50 Inverter control panel 56 Power module (electronic components, power module) 57 Capacitor (electronic component) 59 Reactor (electronic parts) 60 Cooling member 61 Body 62 Refrigerant pipe 65 Heat insulation layer 66 Heat insulation layer
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Abstract
Description
〈空調機の全体構成〉
図1は、本発明の実施形態1に係る空調機の概略構成を示す冷媒回路図である。図1に示すように、この空調機(10)は、蒸気圧縮式の冷凍サイクルを行う冷凍装置によって構成されており、屋外に設置される室外ユニット(11)と、屋内に設置される室内ユニット(12)とを1つずつ備えている。室外ユニット(11)には、室外回路(21)が収容されている。室内ユニット(12)には、室内回路(22)が収容されている。この空調機(10)では、室外回路(21)と室内回路(22)を一対の連絡配管(23,24)で接続することによって冷媒回路(20)が形成されている。
次に、前記インバータ制御盤(50)の内部の構造について、図2を参照しながら詳細に説明する。インバータ制御盤(50)は、縦長の直方体状の箱体で構成されている。インバータ制御盤(50)には、前側(図2における左側)に開閉自在な扉(51)が形成され、後側(図2における右側)に取付板(52)が形成されている。
次に、本実施形態1の空調機(10)の運転動作について説明する。本実施形態1の空調機(10)は、冷房動作と暖房動作とを選択的に行う。
まず、冷房動作について説明する。冷房動作中の空調機(10)では、四方切換弁(41)が第1状態(図1に実線で示す状態)に設定され、室外ファン(13)と室内ファン(14)とが運転される。そして、冷房動作中の冷媒回路(20)では、室外熱交換器(42)が凝縮器となって室内熱交換器(46)が蒸発器となる冷凍サイクルが行われる。
次に、暖房動作について説明する。暖房動作中の空調機(10)では、四方切換弁(41)が第2状態(図1に破線で示す状態)に設定され、室外ファン(13)と室内ファン(14)とが運転される。そして、暖房動作中の冷媒回路(20)では、室内熱交換器(46)が凝縮器となって室外熱交換器(42)が蒸発器となる冷凍サイクルが行われる。暖房動作中の冷媒回路(20)において、冷却用部材(60)は、膨張弁(43)と蒸発器である室外熱交換器(42)との間に位置している。
以上のように、本実施形態1に係る空調機(10)では、冷却用部材(60)の内部を流れる冷媒によってパワーモジュール(56)を冷却する際に、断熱層(65)によって冷媒の冷熱が冷却用部材(60)のパワーモジュール(56)との接触面(60a)以外の非接触面(60b)から外部伝達することを阻止することにより、冷却用部材(60)の周囲の空気が内部を流通する冷媒の冷熱によって冷却されることを阻止することができる。これにより、冷却用部材(60)の周囲において結露水が発生しなくなり、この結露水が電子部品(56,57,59)の方へ流れてしまうことが抑制される。従って、電子部品(56,57,59)の故障を回避でき、空調機(10)の信頼性を確保できる。
図4に示すように、実施形態2は、実施形態1のインバータ制御盤(50)の内部の構造を一部変更したものである。
図5、図6に示すように、実施形態3では、工場等の大規模な施設において用いられる大型の空調機を対象としている。実施形態3では、インバータ制御盤(50)の内部の構造が実施形態1と一部異なる。
図9に示すように、変形例1は、冷却用部材(60)の本体部(61)の冷媒流路(61a)の形状を変更したものである。変形例1では、熱伝導率の高い銅で構成された本体部(61)に丸穴を加工することによって、内部に冷媒が流れる冷媒流路(61a)が形成されている。
図10に示すように、変形例2は、各パワーモジュール(56)が複数のパワー半導体チップ(56a)を内蔵している場合には、冷却用部材(60)の本体部(61)を、パワー半導体チップ(56a)の個数に対応する数の隆起部を有するように構成し、各半導体チップ(56a)がケース(56b)を挟んで隆起部の端面にそれぞれ対応するように、各パワーモジュール(56)を冷却用部材(60)の本体部(61)に取り付けてもよい。つまり、本体部(61)が1つのパワーモジュール(56)に対して複数の接触面(61s)を有していてもよい。このように本体部(61)を形成することにより、発熱して冷却が必要な部分のみを冷却することができるため、冷却不要である部分の周囲における結露水の発生をより抑制することができる。
図11に示すように、実施形態4は、実施形態1の冷却用部材(60)の内部の構造を変更したものである。
図12に示すように、実施形態5は、実施形態4の冷却用部材(60)の本体部(61)の内部の構造を一部変更したものである。
なお、上記真空層(68)によって構成されていた断熱層は、空気層によって構成されていてもよい。また、上記真空層(68)が形成されていたスペースに、樹脂材料やウレタン等を充填して断熱層を形成することとしてもよい。また、上記真空層(68)の配置は、上述の形態に限定されず、例えば、高温冷媒流路(61b)の1つを真空層(68)に置き換えてもよい。
図13に示すように、実施形態6は、実施形態1の冷却用部材(60)の構造を変更したものである。
図14に示すように、実施形態6の変形例では、本体部(61)の入口側配管(82)に固定絞り(81)が形成された状態で、固定絞り(81)と、本体部(61)のパワーモジュール(56)との接触面以外の非接触面とが覆われるように樹脂材料をインサート成形することによって形成されている。つまり、実施形態6のように、入口側配管(82)の固定絞り(81)よりも上流側の部分と本体部(61)の出口側の配管とが熱交換可能に接触していない。一方、本体部(61)の冷媒出口には断熱パイプ(85)が接続されている。
前記各実施形態では、冷凍サイクルを行う冷凍装置として空調機(10)を用いている。しかしながら、冷凍サイクルを行う冷凍装置として、例えば、ヒートポンプ式のチラーユニットや、給湯器、冷蔵庫や冷凍庫の庫内を冷却する冷却装置等を用いるようにしてもよい。
20 冷媒回路
30 圧縮機
50 インバータ制御盤
56 パワーモジュール(電子部品、パワーモジュール)
57 コンデンサ(電子部品)
59 リアクトル(電子部品)
60 冷却用部材
61 本体部
62 冷媒管
65 断熱層
66 断熱層
Claims (13)
- 圧縮機(30)が接続されて冷凍サイクルを行う冷媒回路(20)と、パワーモジュール(56)を含む電子部品(56,57,59)と、内部に前記冷媒回路(20)の冷媒が流通すると共に該冷媒によって前記パワーモジュール(56)が冷却されるように前記パワーモジュール(56)に接触する冷却用部材(60)とを備えた冷凍装置であって、
前記冷却用部材(60)は、内部を流れる冷媒の冷熱が少なくとも前記パワーモジュール(56)との接触面(60a)以外の非接触面(60b)から外部伝達することを阻止する阻止手段を備えている
ことを特徴とする冷凍装置。 - 請求項1において、
前記冷却用部材(60)は、内部に前記パワーモジュール(56)を冷却するための冷却用冷媒が流通すると共に前記パワーモジュール(56)に接触する本体部(61)を備え、
前記阻止手段は、前記本体部(61)の前記パワーモジュール(56)との接触面(61s)以外の非接触面を覆う断熱層(65)によって構成されている
ことを特徴とする冷凍装置。 - 請求項1において、
前記阻止手段は、前記冷却用部材(60)の前記冷却用冷媒が流れる冷却冷媒流路(61a)の前記非接触面(60b)側に形成された高温冷媒が流通する高温冷媒流路(61b)を備えている
ことを特徴とする冷凍装置。 - 請求項3において、
前記阻止手段は、前記冷却冷媒流路(61a)と前記高温冷媒流路(61b)との間に形成された断熱層(68)を有している
ことを特徴とする冷凍装置。 - 請求項4において、
前記断熱層(68)は、真空層又は空気層によって構成されている
ことを特徴とする冷凍装置。 - 請求項1乃至5のいずれか1つにおいて、
前記冷却用部材(60)の内部には、前記冷媒回路(20)の冷媒を減圧して前記冷却用冷媒を生成する減圧機構(81)が設けられている
ことを特徴とする冷凍装置。 - 請求項6において、
前記冷却用部材(60)は、内部において前記パワーモジュール(56)を冷却した後の前記冷却用冷媒が前記減圧機構(81)よりも上流側の冷媒と熱交換するように構成されている
ことを特徴とする冷凍装置。 - 請求項6において、
前記冷却用部材(60)の冷媒出口には、断熱パイプ(85)が接続されている
ことを特徴とする冷凍装置。 - 請求項1乃至8のいずれか1つにおいて、
前記阻止手段は、冷却用部材(60)の内部を流れる冷媒の冷熱が該冷却用部材(60)の前記パワーモジュール(56)との接触面(60a)の外縁部から外部伝達することを阻止するように構成されている
ことを特徴とする冷凍装置。 - 請求項9において、
前記阻止手段は、前記冷却用部材(60)の内部を流れる冷媒の冷熱を前記パワーモジュール(56)に伝達する熱伝達面の面積が、前記パワーモジュール(56)の前記冷却用部材(60)に対応する面の面積よりも小さくなるように構成されている
ことを特徴とする冷凍装置。 - 請求項1乃至10のいずれか1つにおいて、
前記パワーモジュール(56)の表面であって前記冷却用部材(60)との接触面以外の非接触面は、断熱層(66)によって覆われている
ことを特徴とする冷凍装置。 - 請求項2又は4において、
前記断熱層(65,68)は、インサート成形された断熱性を有する樹脂材料で構成されている
ことを特徴とする冷凍装置。 - 請求項2、4及び11のいずれか1つにおいて、
前記断熱層(65,66,68)は、ウレタンを吹き付けることによって構成されている
ことを特徴とする冷凍装置。
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JP2011548983A JPWO2011083756A1 (ja) | 2010-01-05 | 2011-01-05 | 冷凍装置 |
US13/520,475 US20120279251A1 (en) | 2010-01-05 | 2011-01-05 | Refrigeration apparatus |
EP11731754A EP2522931A1 (en) | 2010-01-05 | 2011-01-05 | Refrigeration device |
CN2011800054684A CN102713462A (zh) | 2010-01-05 | 2011-01-05 | 制冷装置 |
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EP (1) | EP2522931A1 (ja) |
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CN102713462A (zh) | 2012-10-03 |
EP2522931A1 (en) | 2012-11-14 |
US20120279251A1 (en) | 2012-11-08 |
JPWO2011083756A1 (ja) | 2013-05-13 |
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