WO2011055203A3 - 具有外移式电极之垂直发光二极体 - Google Patents

具有外移式电极之垂直发光二极体 Download PDF

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Publication number
WO2011055203A3
WO2011055203A3 PCT/IB2010/002775 IB2010002775W WO2011055203A3 WO 2011055203 A3 WO2011055203 A3 WO 2011055203A3 IB 2010002775 W IB2010002775 W IB 2010002775W WO 2011055203 A3 WO2011055203 A3 WO 2011055203A3
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WO
WIPO (PCT)
Prior art keywords
type electrode
epitaxial structure
light emitting
semiconductor epitaxial
equipment
Prior art date
Application number
PCT/IB2010/002775
Other languages
English (en)
French (fr)
Other versions
WO2011055203A2 (zh
Inventor
朱振甫
刘文煌
郑好钧
Original Assignee
旭明光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭明光电股份有限公司 filed Critical 旭明光电股份有限公司
Priority to CN2010800016616A priority Critical patent/CN102282685B/zh
Priority to EP10827985.2A priority patent/EP2498304A4/en
Priority to KR1020127011706A priority patent/KR101296353B1/ko
Priority to JP2012535952A priority patent/JP2013510421A/ja
Publication of WO2011055203A2 publication Critical patent/WO2011055203A2/zh
Publication of WO2011055203A3 publication Critical patent/WO2011055203A3/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

本发明系关于一种具有外移式电极之垂直发光二极体，其包含：一导电性基底；一半导体磊晶结构，形成在该导电性基底上；一钝化层，形成在该半导体磊晶结构的周围；以及一导电性框架，形成在该钝化层上，且与该半导体磊晶结构之上表面的外侧相接触，以使该导电性框架与该半导体磊晶结构产生电性连接。
PCT/IB2010/002775 2009-11-06 2010-10-29 具有外移式电极之垂直发光二极体 WO2011055203A2 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2010800016616A CN102282685B (zh) 2009-11-06 2010-10-29 具有外移式电极的垂直发光二极管
EP10827985.2A EP2498304A4 (en) 2009-11-06 2010-10-29 VERTICAL LIGHT-EMITTING DIODE WITH ELECTRODE WITH OUTER FRAME AND DEVICE THEREFOR
KR1020127011706A KR101296353B1 (ko) 2009-11-06 2010-10-29 외향배치된 전극을 가지는 수직 발광다이오드
JP2012535952A JP2013510421A (ja) 2009-11-06 2010-10-29 外向きに配置された電極を具えた垂直発光ダイオード

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW98137665 2009-11-06
TW098137665A TWI394299B (zh) 2009-11-06 2009-11-06 具有外移式電極之垂直發光二極體

Publications (2)

Publication Number Publication Date
WO2011055203A2 WO2011055203A2 (zh) 2011-05-12
WO2011055203A3 true WO2011055203A3 (zh) 2011-06-30

Family

ID=43970460

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/002775 WO2011055203A2 (zh) 2009-11-06 2010-10-29 具有外移式电极之垂直发光二极体

Country Status (7)

Country Link
US (1) US8384088B2 (zh)
EP (1) EP2498304A4 (zh)
JP (1) JP2013510421A (zh)
KR (1) KR101296353B1 (zh)
CN (1) CN102282685B (zh)
TW (1) TWI394299B (zh)
WO (1) WO2011055203A2 (zh)

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TW201222878A (en) * 2010-11-23 2012-06-01 Siliconware Precision Industries Co Ltd Light-permeating cover board, fabrication method thereof, and package structure having LED
WO2012144126A1 (ja) 2011-04-20 2012-10-26 パナソニック株式会社 発光装置、バックライトユニット、液晶表示装置及び照明装置
JP6006525B2 (ja) * 2012-05-15 2016-10-12 スタンレー電気株式会社 半導体発光装置及びそれを用いた灯具
CN108140688B (zh) * 2015-09-28 2021-01-29 曜晟光电有限公司 半导体结构
JP6732586B2 (ja) * 2016-07-28 2020-07-29 ローム株式会社 Ｌｅｄパッケージ
CN106407967B (zh) * 2016-12-02 2019-11-08 信利光电股份有限公司 一种指纹模组及其贴合方法和应用
DE102018121338A1 (de) * 2018-08-31 2020-03-05 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung, optoelektronische beleuchtungseinrichtung und herstellungsverfahren
DE102019204358A1 (de) * 2019-03-28 2020-10-01 Robert Bosch Gmbh Lichtemittierendes Halbleiterbauelement

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Also Published As

Publication number Publication date
TW201117423A (en) 2011-05-16
KR20120068036A (ko) 2012-06-26
EP2498304A4 (en) 2014-03-05
US8384088B2 (en) 2013-02-26
KR101296353B1 (ko) 2013-08-14
WO2011055203A2 (zh) 2011-05-12
EP2498304A2 (en) 2012-09-12
JP2013510421A (ja) 2013-03-21
US20110108851A1 (en) 2011-05-12
CN102282685A (zh) 2011-12-14
CN102282685B (zh) 2013-05-29
TWI394299B (zh) 2013-04-21

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