WO2011043119A1 - 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 - Google Patents
熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 Download PDFInfo
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- WO2011043119A1 WO2011043119A1 PCT/JP2010/062492 JP2010062492W WO2011043119A1 WO 2011043119 A1 WO2011043119 A1 WO 2011043119A1 JP 2010062492 W JP2010062492 W JP 2010062492W WO 2011043119 A1 WO2011043119 A1 WO 2011043119A1
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- thermosetting adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4035—Hydrazines; Hydrazides
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/24—Derivatives of hydrazine
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
Definitions
- the present invention relates to a thermosetting adhesive composition containing an acrylic copolymer, an epoxy resin, and a curing agent for epoxy resin.
- thermosetting adhesive layer an epoxy resin adhesive mainly composed of a liquid epoxy resin, a solid epoxy resin, and a curing agent thereof is widely used in the field of flexible printed wiring boards (Patent Document 1). ).
- the storage stability at room temperature is improved compared to the conventional epoxy resin adhesive as in Patent Document 1, but it is stored for a long period of several months at room temperature.
- the adhesiveness (peeling strength) and reflow soldering heat resistance may be lowered, and the improvement has been demanded.
- the object of the present invention is to solve the above-mentioned problems of the prior art, and is an acrylic thermosetting adhesive composition used for bonding in the field of flexible printed circuit boards, which is a resin such as a polyimide film.
- an acrylic thermosetting adhesive composition that can satisfactorily bond between a substrate and a polyimide film, a metal reinforcing plate, or a glass epoxy substrate and can exhibit good room temperature storage characteristics over a long period of several months. That is.
- the present inventor is an epoxy resin curing agent for improving the storage stability of an epoxy resin adhesive at room temperature and does not react with the epoxy resin because it is difficult to dissolve in an organic solvent and is solid at room temperature. Focusing on organic acid dihydrazide, which starts reaction after being melt-mixed, we studied the blending of organic acid dihydrazide as an epoxy resin and a curing agent for epoxy resin in acrylic copolymers. In general, as a method for producing a film-like adhesive sheet, a method in which the above-mentioned compound is dissolved and dispersed in an organic solvent such as methyl ethyl ketone and applied is used. However, the curing agent particles of organic acid dihydrazide are used in an organic solvent.
- the present invention is a thermosetting adhesive composition containing an acrylic copolymer (A), an epoxy resin (B), and a curing agent for epoxy resin (C),
- the acrylic copolymer (A) is an epoxy group-free (meth) acrylic acid ester monomer (a) 65 to 75% by mass, an acrylonitrile monomer (b) 20 to 35% by mass and an epoxy group-containing (meth) acrylic acid.
- Ester monomer (c) is copolymerized 1 to 10% by mass
- the epoxy resin curing agent is organic acid dihydrazide particles having an average particle size of 0.5 to 15 ⁇ m.
- the term “(meth) acryl” is used to mean “methacryl or acryl”.
- the present invention also provides a thermosetting adhesive sheet in which a thermosetting adhesive layer made of this thermosetting adhesive composition is formed on a base film.
- thermosetting adhesive sheet Comprising: The thermosetting adhesive composition of the above-mentioned this invention is thrown into an organic solvent, The hardening
- thermosetting adhesive composition of the present invention adheres well between a resin substrate such as a polyimide film and a metal plate such as a polyimide film, glass epoxy, and stainless steel (preferably 15 N / cm or more), and for several months.
- the film shows good room temperature storage characteristics over a long period of time.
- thermosetting adhesive composition of the present invention contains an acrylic copolymer (A), an epoxy resin (B), and a curing agent for epoxy resin (C).
- the acrylic copolymer (A) is for imparting film-forming properties at the time of film molding, and for imparting flexibility and toughness to the cured product, and is an epoxy group-free (meth) acrylic ester.
- a monomer (a), an acrylonitrile monomer (b), and an epoxy group-containing (meth) acrylic acid ester monomer (c) are copolymerized.
- the epoxy group-free (meth) acrylic acid ester monomer (a) can be appropriately selected from those used in conventional acrylic thermosetting adhesives applied in the field of electronic components.
- the content is preferably 65 to 75% by mass, more preferably 65 to 70% by mass.
- Acrylonitrile monomer (b) is used to improve heat resistance.
- the content is preferably 20 to 35% by mass, more preferably 25 to 30% by mass.
- the epoxy group-containing (meth) acrylic acid ester monomer (c) is used for reacting with a curing agent for epoxy resin to form a three-dimensional cross-linked structure in the cured product of the thermosetting adhesive composition.
- a three-dimensional cross-linked structure is formed, the moisture resistance and heat resistance of the cured product are improved.
- a reinforced flexible print made of a reinforced resin sheet bonded and fixed to a flexible printed wiring board with a cured product of a thermosetting adhesive composition. Even when the wiring board is subjected to a soldering process (for example, a solder reflow process) at 260 ° C. or higher, it is possible to prevent the swollen phenomenon caused by moisture absorption from occurring in the adhesive fixing portion.
- Such an epoxy group-containing (meth) acrylic acid ester monomer (c) is appropriately selected from those used in conventional acrylic thermosetting adhesives applied in the field of electronic components.
- examples thereof include glycidyl acrylate (GA) and glycidyl methacrylate (GMA).
- GAA glycidyl methacrylate
- GMA glycidyl methacrylate
- the amount of the epoxy group-containing (meth) acrylic acid ester monomer (c) used in the preparation of the acrylic copolymer (A) is too small, the heat resistance is lowered. Therefore, it is preferably 1 to 10% by mass, more preferably 3 to 7% by mass.
- the acrylic copolymer (A) used in the present invention has a weight-average molecular weight that is too small, the peel strength and heat resistance will decrease, and if it is too large, the solution viscosity will increase, and the applicability will tend to deteriorate.
- it has a weight average molecular weight of 500,000 to 700,000, more preferably 550000 to 650000.
- the epoxy resin (B) constituting the thermosetting adhesive composition of the present invention is used for forming a three-dimensional network structure and improving heat resistance and adhesiveness.
- the epoxy resin (B) can be appropriately selected from liquid or solid epoxy resins used in conventional epoxy resin-based thermosetting adhesives applied in the field of electronic components.
- Examples include drophtalate, diglycidyl tetrahydrophthalate, vinylcyclohexene dioxide, 3,4-epoxycyclohexylmethyl (3,4-epoxy
- the acrylic copolymer (A) The amount is preferably 5 to 30 parts by mass, more preferably 10 to 20 parts by mass with respect to 100 parts by mass.
- thermosetting adhesive composition of the present invention reacts with an epoxy group derived from an epoxy group-containing (meth) acrylic acid ester monomer used in preparing the epoxy resin (B) and the acrylic copolymer (A).
- epoxy resin curing agent (C) organic acid dihydrazide particles having an average particle diameter of 0.5 to 15 ⁇ m, preferably 1 to 5 ⁇ m are used.
- the reason for using the organic acid dihydrazide is that it is solid at room temperature, so that the room temperature storage characteristics of the thermosetting adhesive composition can be improved.
- the average particle size of the organic acid dihydrazide particles is 0.5 to 15 ⁇ m because the organic acid dihydrazide is less than 0.5 ⁇ m when an organic solvent is used for coating the thermosetting adhesive composition. This is because the possibility of dissolution of the particles is increased, and there is a concern that the storage property at room temperature may be lowered. This is because there is a concern that the polymer and the epoxy resin cannot be sufficiently mixed when melted.
- Such an organic acid dihydrazide can be appropriately selected from organic acid dihydrazides conventionally used as curing agents for epoxy resins.
- organic acid dihydrazides conventionally used as curing agents for epoxy resins.
- adipic acid dihydrazide or 7,11-octadecadien-1,18-dicarbohydrazide is used because it has a relatively low melting point, excellent balance of curability, and is easily available. preferable.
- thermosetting adhesive composition of the present invention If the amount of the curing agent for epoxy resin (C) used in the thermosetting adhesive composition of the present invention is too small, unreacted epoxy groups remain and crosslinking is not sufficient, resulting in a decrease in heat resistance and adhesiveness. Too much curing agent remains unreacted, and heat resistance and adhesiveness tend to decrease. Therefore, it is preferable for a total of 100 parts by mass of the acrylic copolymer (A) and the epoxy resin (B). Is 4 to 20 parts by mass, more preferably 6 to 15 parts by mass.
- thermosetting adhesive composition of the present invention includes, in addition to the components described above, a metal deactivator and an antifoaming agent that do not promote the dissolution of the organic acid dihydrazide as necessary within the range not impairing the effects of the present invention.
- a metal deactivator and an antifoaming agent that do not promote the dissolution of the organic acid dihydrazide as necessary within the range not impairing the effects of the present invention.
- Well-known additives such as a rust inhibitor and a dispersant can be blended.
- thermosetting adhesive composition of the present invention is obtained by uniformly mixing an acrylic copolymer (A), an epoxy resin (B), a curing agent for epoxy resin (C), and other additives by a conventional method.
- the form can be a paste, a film, a dispersed liquid, or the like.
- a thermosetting adhesive layer made of the thermosetting adhesive composition of the present invention is formed on a base film (peeling base material) such as a polyethylene terephthalate film or a polyimide film. It is preferably used as an embodiment of a thermosetting adhesive sheet formed with a thickness of 10 to 50 ⁇ m. In addition, you may perform the peeling process to this base film with silicone etc. as needed.
- thermosetting adhesive sheet includes the following thermosetting adhesive layer forming coating preparation step and thermosetting adhesive layer forming step.
- thermosetting adhesive composition of the present invention is charged into an organic solvent such as methyl ethyl ketone and toluene so as to have a viscosity corresponding to the coating method, and the epoxy resin curing agent (C) is dispersed in the organic solvent.
- a thermosetting adhesive layer-forming coating material is prepared by dissolving the acrylic copolymer (A) and the epoxy resin (B) in an organic solvent.
- thermosetting adhesive layer forming step Next, the thermosetting adhesive layer-forming coating material is applied onto the base film with a bar coater or roll coater so that the dry thickness is 10 to 50 ⁇ m, and dried by a conventional method to form a thermosetting adhesive layer. Form. Thereby, a thermosetting adhesive sheet can be obtained.
- thermosetting adhesive composition and the thermosetting adhesive sheet described above can be preferably applied to the electronic component field.
- the above-mentioned thermosetting adhesive sheet is a resin sheet for reinforcement having a thickness of 50 ⁇ m to 2 mm made of polyethylene terephthalate, polyimide, glass epoxy, stainless steel, aluminum or the like for backing the terminal portion of a flexible printed wiring board and the like.
- the terminal portion of the flexible printed wiring board and the reinforcing resin sheet can be applied to fix and bond the thermosetting adhesive layer excluding the base film of the thermosetting adhesive sheet of the present invention.
- a reinforced flexible printed wiring board is obtained which is bonded and fixed with a thermosetting material.
- thermosetting adhesive layer-forming coating material As a thermosetting adhesive composition.
- the viscosities of the obtained paints were measured with a B-type viscometer and are shown in Tables 1 and 2.
- thermosetting adhesive sheet The obtained thermosetting adhesive layer-forming coating material was applied to a polyethylene terephthalate film that had been subjected to release treatment, dried in a drying oven at 50 to 130 ° C., and 35 ⁇ m thick A thermosetting adhesive sheet was prepared by forming a thermosetting adhesive layer.
- thermosetting adhesive layer-forming coating material (4) Evaluation of applicability of the thermosetting adhesive layer-forming coating material
- the applicability of the thermosetting adhesive layer-forming coating material was evaluated according to the following criteria. The obtained evaluation results are shown in Tables 1 and 2.
- thermosetting adhesive sheet immediately after being obtained is cut into a strip (5 cm ⁇ 10 cm) having a predetermined size, and the thermosetting adhesive layer is formed into a 175 ⁇ m-thick polyimide film (175AH, ( After temporarily attaching to Kaneka Corporation with a laminator set at 80 ° C., the base film was removed to expose the thermosetting adhesive layer.
- a 50 ⁇ m thick polyimide film (200H, DuPont) of the same size is superimposed on the exposed thermosetting adhesive layer from above, heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, and then 140 ° C. In an oven for 60 minutes.
- thermosetting adhesive layer of the thermosetting adhesive sheet cut into a strip (5 cm ⁇ 10 cm) is pressed against a 0.5 mm SUS304 plate or a 1 mm thick glass epoxy plate, the substrate film is temporarily attached. Was removed to expose the thermosetting adhesive layer.
- a strip-shaped polyimide film (5 cm ⁇ 10 cm) having a thickness of 50 ⁇ m is superimposed on the exposed thermosetting adhesive layer, heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, and then heated at 140 ° C. Hold in oven for 60 minutes.
- Peel strength is desired to be 10 N / cm practically. Further, it is desired that the difference between the peel strength after storage at room temperature for 6 months and the initial peel strength is less than -30%. Therefore, when the difference is less than 2 N / cm, the room temperature storage characteristics are good, and when it exceeds, the result is bad.
- the acrylic copolymer (A) is an epoxy group-free (meth) acrylic acid ester monomer (a) 65 to 75% by mass, an acrylonitrile monomer (b) 20 to An organic acid dihydrazide obtained by copolymerizing 35% by mass and 1-10% by mass of an epoxy group-containing (meth) acrylic acid ester monomer (c) and having an average particle diameter of 0.5-15 ⁇ m. Since it was a particle, the applicability, the initial peel strength, and the room temperature storage characteristics were satisfactory.
- thermosetting adhesive sheet of Example 8 has an acrylic copolymer (A) having a weight average molecular weight of 300,000, which is lower than the thermosetting adhesive sheets of Examples 1 to 7, the room temperature storage characteristics are as follows. Although good, the overall peel strength and heat resistance were low.
- the acrylic copolymer (A) has a weight average molecular weight of 900,000, which is higher than those of Examples 1 to 7, so that the surface of the adhesive sheet is Although there were coating stripes and the thickness was not uniform, the room temperature storage characteristics were good.
- thermosetting adhesive sheet of Example 10 since the average particle size of the organic acid dihydrazide is larger than that of the thermosetting adhesive sheets of Examples 1 to 7, the applicability is slightly lowered, and the room temperature storage characteristics are Although it was good, the peel strength was generally low. Moreover, since the hydrazide particle
- thermosetting adhesive sheet of Comparative Example 1 since the thermosetting adhesive sheet of Comparative Example 1 has too little component (a) and too much component (b) in the acrylic copolymer, it does not sufficiently dissolve in the organic solvent and gels. It was.
- thermosetting adhesive sheet of Comparative Example 2 Since the thermosetting adhesive sheet of Comparative Example 2 has too much component (a) and too little component (b) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was The level was not suitable for practical use.
- thermosetting adhesive sheet of Comparative Example 3 had too little component (c) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was a low level not suitable for practical use. It was.
- thermosetting adhesive sheet of Comparative Example 4 had too much component (c) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was a low level not suitable for practical use. It was.
- thermosetting adhesive sheet of Comparative Example 5 the average particle size of the organic acid dihydrazide was too large, so the initial peel strength was at a low level not suitable for practical use.
- thermosetting adhesive sheets of Comparative Examples 6 to 8 had poor room temperature storage characteristics due to the presence of hydroxyl groups or carboxyl groups in the acrylic copolymer.
- Example 11 Reinforcing flexible printed wiring boards were produced using the thermosetting adhesive sheets of Examples 1 to 10 and Comparative Examples 2 to 8 as described below.
- thermosetting adhesive layer of a thermosetting adhesive sheet cut into a strip (2 cm ⁇ 2 cm) was temporarily attached to a 175 ⁇ m-thick polyimide film (Apical 175AH, Kaneka Corporation) with a laminator set at 80 ° C., and then peeled off.
- the substrate was removed to expose the thermosetting adhesive layer.
- a 50 ⁇ m thick polyimide film (Kapton 200H, DuPont) of the same size is superimposed on the exposed thermosetting adhesive layer from above, and heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, then 140 In an oven for 60 minutes. Thereafter, the heat-cured test piece was left in a wet heat oven at 40 ° C. and 90% RH for 96 hours.
- test piece immediately after the wet heat treatment is passed through a reflow furnace set at a top temperature of 260 ° C. ⁇ 30 seconds, and the test piece after passing is visually observed for abnormal appearance such as swelling and peeling, and there is no abnormality in the appearance.
- the case is evaluated as “A”
- the case where the swelling is slightly observed in the test piece but there is no practical problem is evaluated as “B”
- the case where the swelling due to foaming is observed in the test piece is indicated as “C”. evaluated.
- the reinforced flexible printed wiring board using the thermosetting adhesive sheets of Examples 1 to 10 showed no abnormality in appearance, or slight swelling was observed in the test piece. There was no problem in practical use.
- the reinforced flexible printed wiring boards using the thermosetting adhesive sheets of Examples 1 to 7 have a good balance of acrylic copolymer-epoxy resin-hydrazide cross-linked structure, and almost no unreacted raw material remains. No abnormality was observed in the appearance.
- Comparative Examples 2 to 8 except for Comparative Example 4, after 25 months at 6 months, swelling due to foaming was observed on the test piece.
- Comparative Example 4 although the moisture absorption reflow soldering heat resistance was good due to a good cross-linked structure, as described above, the initial peel strength was at a low level not suitable for practical use.
- thermosetting adhesive composition and thermosetting adhesive sheet of the present invention can satisfactorily bond between a resin substrate such as a polyimide film and a polyimide film, a stainless steel plate or a glass epoxy substrate, and for a long period of several months. It exhibits good room temperature storage characteristics. Moreover, even if it carries out a 260 degreeC reflow process, it can prevent that a swelling arises for moisture absorption. Therefore, it is useful as an adhesive in the field of electronic components that frequently use polyimide materials.
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Abstract
Description
該アクリル系共重合体(A)が、エポキシ基非含有(メタ)アクリル酸エステルモノマー(a)65~75質量%、アクリロニトリルモノマー(b)20~35質量%及びエポキシ基含有(メタ)アクリル酸エステルモノマー(c)1~10質量%を共重合させたものであり、
該エポキシ樹脂用硬化剤が、平均粒子径0.5~15μmの有機酸ジヒドラジド粒子である熱硬化性接着組成物を提供する。なお、本明細書において、「(メタ)アクリル」なる用語は、「メタクリル又はアクリル」という意味で用いている。
熱硬化性接着層形成用塗料を、基材フィルム上に塗布し、乾燥することにより熱硬化性接着層を形成する工程
を含んでなる製造方法を提供する。
まず、本発明の熱硬化性接着組成物をメチルエチルケトン、トルエン等の有機溶剤に塗布法に応じた粘度となるように投入し、エポキシ樹脂用硬化剤(C)を有機溶剤中に分散させ、他方アクリル系共重合体(A)及びエポキシ樹脂(B)を有機溶剤中に溶解させることにより熱硬化性接着層形成用塗料を調製する。この場合、熱硬化性接着シートの常温保管性を高めるために、室温下で全有機酸ジヒドラジド粒子の70質量%が熱硬化性接着層形成用塗料中に固体粒子として分散していることが好ましい。
次に、熱硬化性接着層形成用塗料を、基材フィルム上にバーコーター、ロールコーターにより乾燥厚が10~50μmとなるように塗布し、常法により乾燥することにより熱硬化性接着層を形成する。これにより熱硬化性接着シートを得ることができる。
(1)アクリル系共重合体の調製
表1及び表2に示したモノマーからなるアクリル系共重合体を用意した。これらのアクリル系共重合体の重量平均分子量を表1及び表2に示した。
得られたアクリル系共重合体溶液に、表1及び表2の配合割合でエポキシ樹脂(B)及びエポキシ樹脂用硬化剤(C)として有機酸ジヒドラジドを添加し、均一に混合することにより熱硬化性接着組成物として、熱硬化性接着層形成用塗料を調製した。得られた塗料の粘度をB型粘度計により測定し、表1及び表2に示した。
得られた熱硬化性接着層形成用塗料を、剥離処理が施されたポリエチレンテレフタレートフィルムに塗布し、50~130℃の乾燥炉中で乾燥し、35μm厚の熱硬化性接着層を形成することにより、熱硬化性接着シートを作製した。
上述の熱硬化性接着シートの作製の際、熱硬化性接着層形成用塗料の塗布性について、以下の基準に従って評価した。得られた評価結果を表1及び表2に示す。
A:塗布中に筋は引かないが、乾燥後のフィルムに硬化剤粒子が観察される場合
B:塗布筋があり、厚みも不均一である場合
C:溶液がゲル状となり、塗布が不可能な場合
得られた直後の熱硬化性接着シートを所定の大きさの短冊(5cm×10cm)にカットし、その熱硬化性接着層を、175μm厚のポリイミドフィルム(175AH、(株)カネカ)に80℃に設定したラミネーターで仮貼りした後、基材フィルムを取り除いて熱硬化性接着層を露出させた。露出した熱硬化性接着層に対し、同じ大きさの50μm厚のポリイミドフィルム(200H、デュポン社)を上から重ね合わせ、170℃で2.0MPaの圧力で60秒間加熱加圧した後、140℃のオーブン中に60分間保持した。
*4:グリシジルメタクリレート、*5:2-ヒドロキシエチルメタクリレート、*6:アクリル酸、
*7:アジピン酸ジヒドラジド、*8:7,11-オクタデカジエン-1,18-ジカルボヒドラジド
*9:jER828、三菱化学(株)、*10:jER154、三菱化学(株)
実施例1~7の熱硬化性接着シートは、アクリル系共重合体(A)が、エポキシ基非含有(メタ)アクリル酸エステルモノマー(a)65~75質量%、アクリロニトリルモノマー(b)20~35質量%及びエポキシ基含有(メタ)アクリル酸エステルモノマー(c)1~10質量%を共重合させたものであり、エポキシ樹脂用硬化剤が、平均粒子径0.5~15μmの有機酸ジヒドラジド粒子であるので、塗布性も初期剥離強度、常温保管特性も満足のいくものであった。
実施例1~10及び比較例2~8の熱硬化性接着シートを使用して以下に説明するように補強フレキシブルプリント配線板を作製した。
短冊(2cm×2cm)にカットした熱硬化性接着シートの熱硬化性接着層を、175μm厚のポリイミドフィルム(アピカル175AH、(株)カネカ)に80℃に設定したラミネーターで仮貼りした後、剥離基材を取り除いて熱硬化性接着層を露出させた。露出した熱硬化性接着層に対し、同じ大きさの50μm厚のポリイミドフィルム(カプトン200H、デュポン社)を上から重ね合わせ、170℃で2.0MPaの圧力で60秒間加熱加圧した後、140度のオーブン中で60分間保持した。その後、加熱硬化した試験片を40℃、90%RHの湿熱オーブン中で96時間放置した。
Claims (9)
- アクリル系共重合体(A)、エポキシ樹脂(B)及びエポキシ樹脂用硬化剤(C)を含有する熱硬化性接着組成物であって、
該アクリル系共重合体(A)が、エポキシ基非含有(メタ)アクリル酸エステルモノマー(a)65~75質量%、アクリロニトリルモノマー(b)20~35質量%及びエポキシ基含有(メタ)アクリル酸エステルモノマー(c)1~10質量%を共重合させたものであり、
該エポキシ樹脂用硬化剤が、平均粒子径0.5~15μmの有機酸ジヒドラジド粒子である熱硬化性接着組成物。 - 該エポキシ樹脂用硬化剤が、平均粒子径1~5μmの有機酸ジヒドラジド粒子である請求項1記載の熱硬化性接着組成物。
- 有機酸ジヒドラジドが、アジピン酸ジヒドラジドまたは7,11-オクタデカジエン-1,18-ジカルボヒドラジドである請求項1または2記載の熱硬化性接着組成物。
- アクリル系共重合体(A)100質量部に対し、エポキシ樹脂(B)を5~30質量部、アクリル系共重合体(A)及びエポキシ樹脂(B)の合計100質量部に対し、エポキシ樹脂用硬化剤を4~20質量部含有する請求項1~3のいずれかに記載の熱硬化性接着組成物。
- アクリル系共重合体(A)の重量平均分子量が、500000~700000である請求項1~4のいずれかに記載の熱硬化性接着組成物。
- エポキシ基非含有(メタ)アクリル酸エステルモノマー(a)及びエポキシ基含有(メタ)アクリル酸エステルモノマー(c)がいずれも水酸基及び遊離カルボキシル基を含有しないモノマーである請求項1~5のいずれかに記載の熱硬化性接着組成物。
- 基材フィルム上に、請求項1~6のいずれかに記載の熱硬化性接着組成物からなる熱硬化性接着層が形成されてなる熱硬化性接着シート。
- 請求項7記載の熱硬化性接着シートの製造方法であって、
請求項1~6のいずれかに記載の熱硬化性接着組成物を有機溶剤に投入し、エポキシ樹脂用硬化剤(C)を有機溶媒中に分散させ、他方アクリル系共重合体(A)及びエポキシ樹脂(B)を有機溶剤中に溶解させることにより熱硬化性接着層形成用塗料を調製する工程、及び
熱硬化性接着層形成用塗料を、基材フィルム上に塗布し、乾燥することにより熱硬化性接着層を形成する工程
を含んでなる製造方法。 - フレキシブルプリント配線板の端子部が補強用樹脂シートで裏打ちされている補強フレキシブルプリント配線板であって、該端子部と該補強用樹脂シートとが、請求項7記載の熱硬化性接着シートの基材フィルムを除いた熱硬化性接着層の熱硬化物で接着固定されてなる補強フレキシブルプリント配線板。
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CN103509509A (zh) * | 2013-01-16 | 2014-01-15 | 上海都为电子有限公司 | 硅块切割用室温快速固化单组份厌氧胶 |
EP3098058A1 (en) * | 2015-05-25 | 2016-11-30 | Grupo Antolin-Ingenieria, S.A. | Process for manufacturing vehicle headliners |
CN106184040A (zh) * | 2015-05-25 | 2016-12-07 | 格鲁坡·安托林-英杰尼瑞亚股份有限公司 | 用于制造车辆顶篷的方法 |
US10118569B2 (en) | 2015-05-25 | 2018-11-06 | Grupo Antolín-Ingeniería, S. A. | Process for manufacturing vehicle headliners |
CN106184040B (zh) * | 2015-05-25 | 2019-03-22 | 格鲁坡·安托林-英杰尼瑞亚股份有限公司 | 用于制造车辆顶篷的方法 |
Also Published As
Publication number | Publication date |
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KR20120092594A (ko) | 2012-08-21 |
CN102549097A (zh) | 2012-07-04 |
CN102549097B (zh) | 2015-12-02 |
TWI565772B (zh) | 2017-01-11 |
KR101702694B1 (ko) | 2017-02-06 |
HK1221481A1 (zh) | 2017-06-02 |
TW201113340A (en) | 2011-04-16 |
JP5728804B2 (ja) | 2015-06-03 |
JP2011079959A (ja) | 2011-04-21 |
HK1169135A1 (zh) | 2013-01-18 |
CN105331308B (zh) | 2017-11-28 |
CN105331308A (zh) | 2016-02-17 |
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