WO2011043119A1 - Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board - Google Patents

Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board Download PDF

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Publication number
WO2011043119A1
WO2011043119A1 PCT/JP2010/062492 JP2010062492W WO2011043119A1 WO 2011043119 A1 WO2011043119 A1 WO 2011043119A1 JP 2010062492 W JP2010062492 W JP 2010062492W WO 2011043119 A1 WO2011043119 A1 WO 2011043119A1
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Prior art keywords
thermosetting adhesive
epoxy resin
adhesive composition
mass
acrylic copolymer
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Application number
PCT/JP2010/062492
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French (fr)
Japanese (ja)
Inventor
稔城 名取
Original Assignee
ソニーケミカル＆インフォメーションデバイス株式会社
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Application filed by ソニーケミカル＆インフォメーションデバイス株式会社 filed Critical ソニーケミカル＆インフォメーションデバイス株式会社
Priority to KR1020127009008A priority Critical patent/KR101702694B1/en
Priority to CN201080045247.5A priority patent/CN102549097B/en
Publication of WO2011043119A1 publication Critical patent/WO2011043119A1/en
Priority to HK12109993.4A priority patent/HK1169135A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/24—Derivatives of hydrazine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof

Definitions

  • the present invention relates to a thermosetting adhesive composition containing an acrylic copolymer, an epoxy resin, and a curing agent for epoxy resin.
  • thermosetting adhesive layer an epoxy resin adhesive mainly composed of a liquid epoxy resin, a solid epoxy resin, and a curing agent thereof is widely used in the field of flexible printed wiring boards (Patent Document 1). ).
  • the storage stability at room temperature is improved compared to the conventional epoxy resin adhesive as in Patent Document 1, but it is stored for a long period of several months at room temperature.
  • the adhesiveness (peeling strength) and reflow soldering heat resistance may be lowered, and the improvement has been demanded.
  • the object of the present invention is to solve the above-mentioned problems of the prior art, and is an acrylic thermosetting adhesive composition used for bonding in the field of flexible printed circuit boards, which is a resin such as a polyimide film.
  • an acrylic thermosetting adhesive composition that can satisfactorily bond between a substrate and a polyimide film, a metal reinforcing plate, or a glass epoxy substrate and can exhibit good room temperature storage characteristics over a long period of several months. That is.
  • the present inventor is an epoxy resin curing agent for improving the storage stability of an epoxy resin adhesive at room temperature and does not react with the epoxy resin because it is difficult to dissolve in an organic solvent and is solid at room temperature. Focusing on organic acid dihydrazide, which starts reaction after being melt-mixed, we studied the blending of organic acid dihydrazide as an epoxy resin and a curing agent for epoxy resin in acrylic copolymers. In general, as a method for producing a film-like adhesive sheet, a method in which the above-mentioned compound is dissolved and dispersed in an organic solvent such as methyl ethyl ketone and applied is used. However, the curing agent particles of organic acid dihydrazide are used in an organic solvent.
  • the present invention is a thermosetting adhesive composition containing an acrylic copolymer (A), an epoxy resin (B), and a curing agent for epoxy resin (C),
  • the acrylic copolymer (A) is an epoxy group-free (meth) acrylic acid ester monomer (a) 65 to 75% by mass, an acrylonitrile monomer (b) 20 to 35% by mass and an epoxy group-containing (meth) acrylic acid.
  • Ester monomer (c) is copolymerized 1 to 10% by mass
  • the epoxy resin curing agent is organic acid dihydrazide particles having an average particle size of 0.5 to 15 ⁇ m.
  • the term “(meth) acryl” is used to mean “methacryl or acryl”.
  • the present invention also provides a thermosetting adhesive sheet in which a thermosetting adhesive layer made of this thermosetting adhesive composition is formed on a base film.
  • thermosetting adhesive sheet Comprising: The thermosetting adhesive composition of the above-mentioned this invention is thrown into an organic solvent, The hardening
  • thermosetting adhesive composition of the present invention adheres well between a resin substrate such as a polyimide film and a metal plate such as a polyimide film, glass epoxy, and stainless steel (preferably 15 N / cm or more), and for several months.
  • the film shows good room temperature storage characteristics over a long period of time.
  • thermosetting adhesive composition of the present invention contains an acrylic copolymer (A), an epoxy resin (B), and a curing agent for epoxy resin (C).
  • the acrylic copolymer (A) is for imparting film-forming properties at the time of film molding, and for imparting flexibility and toughness to the cured product, and is an epoxy group-free (meth) acrylic ester.
  • a monomer (a), an acrylonitrile monomer (b), and an epoxy group-containing (meth) acrylic acid ester monomer (c) are copolymerized.
  • the epoxy group-free (meth) acrylic acid ester monomer (a) can be appropriately selected from those used in conventional acrylic thermosetting adhesives applied in the field of electronic components.
  • the content is preferably 65 to 75% by mass, more preferably 65 to 70% by mass.
  • Acrylonitrile monomer (b) is used to improve heat resistance.
  • the content is preferably 20 to 35% by mass, more preferably 25 to 30% by mass.
  • the epoxy group-containing (meth) acrylic acid ester monomer (c) is used for reacting with a curing agent for epoxy resin to form a three-dimensional cross-linked structure in the cured product of the thermosetting adhesive composition.
  • a three-dimensional cross-linked structure is formed, the moisture resistance and heat resistance of the cured product are improved.
  • a reinforced flexible print made of a reinforced resin sheet bonded and fixed to a flexible printed wiring board with a cured product of a thermosetting adhesive composition. Even when the wiring board is subjected to a soldering process (for example, a solder reflow process) at 260 ° C. or higher, it is possible to prevent the swollen phenomenon caused by moisture absorption from occurring in the adhesive fixing portion.
  • Such an epoxy group-containing (meth) acrylic acid ester monomer (c) is appropriately selected from those used in conventional acrylic thermosetting adhesives applied in the field of electronic components.
  • examples thereof include glycidyl acrylate (GA) and glycidyl methacrylate (GMA).
  • GAA glycidyl methacrylate
  • GMA glycidyl methacrylate
  • the amount of the epoxy group-containing (meth) acrylic acid ester monomer (c) used in the preparation of the acrylic copolymer (A) is too small, the heat resistance is lowered. Therefore, it is preferably 1 to 10% by mass, more preferably 3 to 7% by mass.
  • the acrylic copolymer (A) used in the present invention has a weight-average molecular weight that is too small, the peel strength and heat resistance will decrease, and if it is too large, the solution viscosity will increase, and the applicability will tend to deteriorate.
  • it has a weight average molecular weight of 500,000 to 700,000, more preferably 550000 to 650000.
  • the epoxy resin (B) constituting the thermosetting adhesive composition of the present invention is used for forming a three-dimensional network structure and improving heat resistance and adhesiveness.
  • the epoxy resin (B) can be appropriately selected from liquid or solid epoxy resins used in conventional epoxy resin-based thermosetting adhesives applied in the field of electronic components.
  • Examples include drophtalate, diglycidyl tetrahydrophthalate, vinylcyclohexene dioxide, 3,4-epoxycyclohexylmethyl (3,4-epoxy
  • the acrylic copolymer (A) The amount is preferably 5 to 30 parts by mass, more preferably 10 to 20 parts by mass with respect to 100 parts by mass.
  • thermosetting adhesive composition of the present invention reacts with an epoxy group derived from an epoxy group-containing (meth) acrylic acid ester monomer used in preparing the epoxy resin (B) and the acrylic copolymer (A).
  • epoxy resin curing agent (C) organic acid dihydrazide particles having an average particle diameter of 0.5 to 15 ⁇ m, preferably 1 to 5 ⁇ m are used.
  • the reason for using the organic acid dihydrazide is that it is solid at room temperature, so that the room temperature storage characteristics of the thermosetting adhesive composition can be improved.
  • the average particle size of the organic acid dihydrazide particles is 0.5 to 15 ⁇ m because the organic acid dihydrazide is less than 0.5 ⁇ m when an organic solvent is used for coating the thermosetting adhesive composition. This is because the possibility of dissolution of the particles is increased, and there is a concern that the storage property at room temperature may be lowered. This is because there is a concern that the polymer and the epoxy resin cannot be sufficiently mixed when melted.
  • Such an organic acid dihydrazide can be appropriately selected from organic acid dihydrazides conventionally used as curing agents for epoxy resins.
  • organic acid dihydrazides conventionally used as curing agents for epoxy resins.
  • adipic acid dihydrazide or 7,11-octadecadien-1,18-dicarbohydrazide is used because it has a relatively low melting point, excellent balance of curability, and is easily available. preferable.
  • thermosetting adhesive composition of the present invention If the amount of the curing agent for epoxy resin (C) used in the thermosetting adhesive composition of the present invention is too small, unreacted epoxy groups remain and crosslinking is not sufficient, resulting in a decrease in heat resistance and adhesiveness. Too much curing agent remains unreacted, and heat resistance and adhesiveness tend to decrease. Therefore, it is preferable for a total of 100 parts by mass of the acrylic copolymer (A) and the epoxy resin (B). Is 4 to 20 parts by mass, more preferably 6 to 15 parts by mass.
  • thermosetting adhesive composition of the present invention includes, in addition to the components described above, a metal deactivator and an antifoaming agent that do not promote the dissolution of the organic acid dihydrazide as necessary within the range not impairing the effects of the present invention.
  • a metal deactivator and an antifoaming agent that do not promote the dissolution of the organic acid dihydrazide as necessary within the range not impairing the effects of the present invention.
  • Well-known additives such as a rust inhibitor and a dispersant can be blended.
  • thermosetting adhesive composition of the present invention is obtained by uniformly mixing an acrylic copolymer (A), an epoxy resin (B), a curing agent for epoxy resin (C), and other additives by a conventional method.
  • the form can be a paste, a film, a dispersed liquid, or the like.
  • a thermosetting adhesive layer made of the thermosetting adhesive composition of the present invention is formed on a base film (peeling base material) such as a polyethylene terephthalate film or a polyimide film. It is preferably used as an embodiment of a thermosetting adhesive sheet formed with a thickness of 10 to 50 ⁇ m. In addition, you may perform the peeling process to this base film with silicone etc. as needed.
  • thermosetting adhesive sheet includes the following thermosetting adhesive layer forming coating preparation step and thermosetting adhesive layer forming step.
  • thermosetting adhesive composition of the present invention is charged into an organic solvent such as methyl ethyl ketone and toluene so as to have a viscosity corresponding to the coating method, and the epoxy resin curing agent (C) is dispersed in the organic solvent.
  • a thermosetting adhesive layer-forming coating material is prepared by dissolving the acrylic copolymer (A) and the epoxy resin (B) in an organic solvent.
  • thermosetting adhesive layer forming step Next, the thermosetting adhesive layer-forming coating material is applied onto the base film with a bar coater or roll coater so that the dry thickness is 10 to 50 ⁇ m, and dried by a conventional method to form a thermosetting adhesive layer. Form. Thereby, a thermosetting adhesive sheet can be obtained.
  • thermosetting adhesive composition and the thermosetting adhesive sheet described above can be preferably applied to the electronic component field.
  • the above-mentioned thermosetting adhesive sheet is a resin sheet for reinforcement having a thickness of 50 ⁇ m to 2 mm made of polyethylene terephthalate, polyimide, glass epoxy, stainless steel, aluminum or the like for backing the terminal portion of a flexible printed wiring board and the like.
  • the terminal portion of the flexible printed wiring board and the reinforcing resin sheet can be applied to fix and bond the thermosetting adhesive layer excluding the base film of the thermosetting adhesive sheet of the present invention.
  • a reinforced flexible printed wiring board is obtained which is bonded and fixed with a thermosetting material.
  • thermosetting adhesive layer-forming coating material As a thermosetting adhesive composition.
  • the viscosities of the obtained paints were measured with a B-type viscometer and are shown in Tables 1 and 2.
  • thermosetting adhesive sheet The obtained thermosetting adhesive layer-forming coating material was applied to a polyethylene terephthalate film that had been subjected to release treatment, dried in a drying oven at 50 to 130 ° C., and 35 ⁇ m thick A thermosetting adhesive sheet was prepared by forming a thermosetting adhesive layer.
  • thermosetting adhesive layer-forming coating material (4) Evaluation of applicability of the thermosetting adhesive layer-forming coating material
  • the applicability of the thermosetting adhesive layer-forming coating material was evaluated according to the following criteria. The obtained evaluation results are shown in Tables 1 and 2.
  • thermosetting adhesive sheet immediately after being obtained is cut into a strip (5 cm ⁇ 10 cm) having a predetermined size, and the thermosetting adhesive layer is formed into a 175 ⁇ m-thick polyimide film (175AH, ( After temporarily attaching to Kaneka Corporation with a laminator set at 80 ° C., the base film was removed to expose the thermosetting adhesive layer.
  • a 50 ⁇ m thick polyimide film (200H, DuPont) of the same size is superimposed on the exposed thermosetting adhesive layer from above, heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, and then 140 ° C. In an oven for 60 minutes.
  • thermosetting adhesive layer of the thermosetting adhesive sheet cut into a strip (5 cm ⁇ 10 cm) is pressed against a 0.5 mm SUS304 plate or a 1 mm thick glass epoxy plate, the substrate film is temporarily attached. Was removed to expose the thermosetting adhesive layer.
  • a strip-shaped polyimide film (5 cm ⁇ 10 cm) having a thickness of 50 ⁇ m is superimposed on the exposed thermosetting adhesive layer, heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, and then heated at 140 ° C. Hold in oven for 60 minutes.
  • Peel strength is desired to be 10 N / cm practically. Further, it is desired that the difference between the peel strength after storage at room temperature for 6 months and the initial peel strength is less than -30%. Therefore, when the difference is less than 2 N / cm, the room temperature storage characteristics are good, and when it exceeds, the result is bad.
  • the acrylic copolymer (A) is an epoxy group-free (meth) acrylic acid ester monomer (a) 65 to 75% by mass, an acrylonitrile monomer (b) 20 to An organic acid dihydrazide obtained by copolymerizing 35% by mass and 1-10% by mass of an epoxy group-containing (meth) acrylic acid ester monomer (c) and having an average particle diameter of 0.5-15 ⁇ m. Since it was a particle, the applicability, the initial peel strength, and the room temperature storage characteristics were satisfactory.
  • thermosetting adhesive sheet of Example 8 has an acrylic copolymer (A) having a weight average molecular weight of 300,000, which is lower than the thermosetting adhesive sheets of Examples 1 to 7, the room temperature storage characteristics are as follows. Although good, the overall peel strength and heat resistance were low.
  • the acrylic copolymer (A) has a weight average molecular weight of 900,000, which is higher than those of Examples 1 to 7, so that the surface of the adhesive sheet is Although there were coating stripes and the thickness was not uniform, the room temperature storage characteristics were good.
  • thermosetting adhesive sheet of Example 10 since the average particle size of the organic acid dihydrazide is larger than that of the thermosetting adhesive sheets of Examples 1 to 7, the applicability is slightly lowered, and the room temperature storage characteristics are Although it was good, the peel strength was generally low. Moreover, since the hydrazide particle
  • thermosetting adhesive sheet of Comparative Example 1 since the thermosetting adhesive sheet of Comparative Example 1 has too little component (a) and too much component (b) in the acrylic copolymer, it does not sufficiently dissolve in the organic solvent and gels. It was.
  • thermosetting adhesive sheet of Comparative Example 2 Since the thermosetting adhesive sheet of Comparative Example 2 has too much component (a) and too little component (b) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was The level was not suitable for practical use.
  • thermosetting adhesive sheet of Comparative Example 3 had too little component (c) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was a low level not suitable for practical use. It was.
  • thermosetting adhesive sheet of Comparative Example 4 had too much component (c) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was a low level not suitable for practical use. It was.
  • thermosetting adhesive sheet of Comparative Example 5 the average particle size of the organic acid dihydrazide was too large, so the initial peel strength was at a low level not suitable for practical use.
  • thermosetting adhesive sheets of Comparative Examples 6 to 8 had poor room temperature storage characteristics due to the presence of hydroxyl groups or carboxyl groups in the acrylic copolymer.
  • Example 11 Reinforcing flexible printed wiring boards were produced using the thermosetting adhesive sheets of Examples 1 to 10 and Comparative Examples 2 to 8 as described below.
  • thermosetting adhesive layer of a thermosetting adhesive sheet cut into a strip (2 cm ⁇ 2 cm) was temporarily attached to a 175 ⁇ m-thick polyimide film (Apical 175AH, Kaneka Corporation) with a laminator set at 80 ° C., and then peeled off.
  • the substrate was removed to expose the thermosetting adhesive layer.
  • a 50 ⁇ m thick polyimide film (Kapton 200H, DuPont) of the same size is superimposed on the exposed thermosetting adhesive layer from above, and heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, then 140 In an oven for 60 minutes. Thereafter, the heat-cured test piece was left in a wet heat oven at 40 ° C. and 90% RH for 96 hours.
  • test piece immediately after the wet heat treatment is passed through a reflow furnace set at a top temperature of 260 ° C. ⁇ 30 seconds, and the test piece after passing is visually observed for abnormal appearance such as swelling and peeling, and there is no abnormality in the appearance.
  • the case is evaluated as “A”
  • the case where the swelling is slightly observed in the test piece but there is no practical problem is evaluated as “B”
  • the case where the swelling due to foaming is observed in the test piece is indicated as “C”. evaluated.
  • the reinforced flexible printed wiring board using the thermosetting adhesive sheets of Examples 1 to 10 showed no abnormality in appearance, or slight swelling was observed in the test piece. There was no problem in practical use.
  • the reinforced flexible printed wiring boards using the thermosetting adhesive sheets of Examples 1 to 7 have a good balance of acrylic copolymer-epoxy resin-hydrazide cross-linked structure, and almost no unreacted raw material remains. No abnormality was observed in the appearance.
  • Comparative Examples 2 to 8 except for Comparative Example 4, after 25 months at 6 months, swelling due to foaming was observed on the test piece.
  • Comparative Example 4 although the moisture absorption reflow soldering heat resistance was good due to a good cross-linked structure, as described above, the initial peel strength was at a low level not suitable for practical use.
  • thermosetting adhesive composition and thermosetting adhesive sheet of the present invention can satisfactorily bond between a resin substrate such as a polyimide film and a polyimide film, a stainless steel plate or a glass epoxy substrate, and for a long period of several months. It exhibits good room temperature storage characteristics. Moreover, even if it carries out a 260 degreeC reflow process, it can prevent that a swelling arises for moisture absorption. Therefore, it is useful as an adhesive in the field of electronic components that frequently use polyimide materials.

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Abstract

Disclosed is a thermosetting adhesive composition comprising (A) an acrylic copolymer, (B) an epoxy resin, and (C) an epoxy resin curing agent. The acrylic copolymer (A) is obtained by copolymerizing 65 to 75% by mass of (a) a (meth)acrylic ester monomer containing no epoxy group, 20 to 35% by mass of (b) an acrylonitrile monomer, and 1 to 10% by mass of (c) a (meth)acrylic ester monomer containing an epoxy group. The epoxy resin curing agent comprises particles of an organic acid dihydrazide having an average particle diameter of 0.5 to 15 μm.

Description

熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing the same, and reinforced flexible printed wiring board
　本発明は、アクリル系共重合体、エポキシ樹脂及びエポキシ樹脂用硬化剤を含有する熱硬化性接着組成物に関する。 The present invention relates to a thermosetting adhesive composition containing an acrylic copolymer, an epoxy resin, and a curing agent for epoxy resin.
　ポリイミドフィルムからなるフレキシブルプリント配線板の端子部等をポリイミドフィルムやガラスエポキシ板、金属板で裏打ちし、その強度を高めることが行われている。このような場合、補強板とフレキシブルプリント配線板のポリイミドとの間の接着は、それらで挟持した熱硬化性接着剤層を硬化させて接着することが一般的である。このような熱硬化性接着剤層としては、フレキシブルプリント配線板分野においては主として液状エポキシ樹脂と固形エポキシ樹脂とそれらの硬化剤とからなるエポキシ樹脂系接着剤が広く使用されている（特許文献１）。 The terminal part of a flexible printed wiring board made of a polyimide film is lined with a polyimide film, a glass epoxy board, or a metal plate to increase its strength. In such a case, the adhesion between the reinforcing plate and the polyimide of the flexible printed wiring board is generally performed by curing the thermosetting adhesive layer sandwiched between them and bonding them. As such a thermosetting adhesive layer, an epoxy resin adhesive mainly composed of a liquid epoxy resin, a solid epoxy resin, and a curing agent thereof is widely used in the field of flexible printed wiring boards (Patent Document 1). ).
　しかし、このようなエポキシ樹脂系接着剤は、エポキシ樹脂と硬化剤との配合割合が多いため、常温保管中に徐々に硬化反応が進行してしまうという問題があり、常温保管特性に問題があった。そこで、常温保管特性を向上させるために、エポキシ樹脂の配合量を抑制し、反射的にアクリル系ポリマーを主要成分として使用したアクリル系熱硬化性接着組成物が提案されている（特許文献２、特に実施例２）。 However, since such an epoxy resin adhesive has a large blending ratio of epoxy resin and curing agent, there is a problem that the curing reaction gradually proceeds during normal temperature storage, and there is a problem in normal temperature storage characteristics. It was. Therefore, in order to improve the room temperature storage characteristics, an acrylic thermosetting adhesive composition that suppresses the amount of the epoxy resin and uses an acrylic polymer as a main component in a reflective manner has been proposed (Patent Document 2,). Especially Example 2).
特開平０４－３７０９９６号公報Japanese Patent Laid-Open No. 04-370996 特開平２００７－９０５８号公報Japanese Patent Laid-Open No. 2007-9058
　しかしながら、特許文献２のアクリル系熱硬化性接着組成物の場合、特許文献１のような従来のエポキシ樹脂系接着剤に比べ、常温保存性は向上するものの、常温で数ヶ月という長期に亘り保管し、その後にフレキシブルプリント基板と樹脂シート、金属補強板あるいはガラスエポキシ板との接合に使用すると接着性（剥離強度）及びリフローハンダ耐熱性が低下する場合があり、その改善が求められていた。 However, in the case of the acrylic thermosetting adhesive composition of Patent Document 2, the storage stability at room temperature is improved compared to the conventional epoxy resin adhesive as in Patent Document 1, but it is stored for a long period of several months at room temperature. However, if it is used for joining a flexible printed circuit board and a resin sheet, a metal reinforcing plate or a glass epoxy plate thereafter, the adhesiveness (peeling strength) and reflow soldering heat resistance may be lowered, and the improvement has been demanded.
　本発明の目的は、以上の従来の技術の課題を解決しようとするものであり、フレキシブルプリント基板等の分野における接着に使用するアクリル系熱硬化性接着組成物であって、ポリイミドフィルム等の樹脂基板と、ポリイミドフィルム、金属補強板あるいはガラスエポキシ基板との間を良好に接着し、数ヶ月という長期に亘って良好な常温保管特性を示すことができるアクリル系熱硬化性接着組成物を提供することである。 The object of the present invention is to solve the above-mentioned problems of the prior art, and is an acrylic thermosetting adhesive composition used for bonding in the field of flexible printed circuit boards, which is a resin such as a polyimide film. Provided is an acrylic thermosetting adhesive composition that can satisfactorily bond between a substrate and a polyimide film, a metal reinforcing plate, or a glass epoxy substrate and can exhibit good room temperature storage characteristics over a long period of several months. That is.
　本発明者は、エポキシ樹脂系接着剤の常温保管性を改善するためのエポキシ樹脂用硬化剤として、有機溶剤に溶解し難く常温では固体であるためエポキシ樹脂と反応せず、加熱によりエポキシ樹脂と溶融混合して反応が開始する有機酸ジヒドラジドに着目し、アクリル系共重合体にエポキシ樹脂、エポキシ樹脂用硬化剤として有機酸ジヒドラジドを配合することを研究した。一般に、フィルム状接着シートの製造方法として、上記配合物をメチルエチルケトン等の有機溶剤に溶解・分散し、塗布して製造する方法が採用されているが、有機酸ジヒドラジドの硬化剤粒子は有機溶剤に溶解し難いとはいえ、有機溶剤中では徐々に溶解し、溶解した硬化剤がエポキシ樹脂にも溶解してしまうために反応が進行してしまうという問題があった。このような知見の下、有機酸ジヒドラジドの平均粒径を特定の粒径範囲に制御することにより、常温保管時における有機酸ジヒドラジドの有機溶剤への溶解の抑制と、熱硬化反応の速やかな進行とをバランスよく実現でき、更に、アクリル系共重合体として、特定範囲量のエポキシ基非含有（メタ）アクリル酸エステルモノマーとアクリロニトリルモノマーとエポキシ基含有（メタ）アクリル酸エステルモノマーとの共重合体を採用することにより、上述の目的を達成できることを見出し、本願発明を完成させた。 The present inventor is an epoxy resin curing agent for improving the storage stability of an epoxy resin adhesive at room temperature and does not react with the epoxy resin because it is difficult to dissolve in an organic solvent and is solid at room temperature. Focusing on organic acid dihydrazide, which starts reaction after being melt-mixed, we studied the blending of organic acid dihydrazide as an epoxy resin and a curing agent for epoxy resin in acrylic copolymers. In general, as a method for producing a film-like adhesive sheet, a method in which the above-mentioned compound is dissolved and dispersed in an organic solvent such as methyl ethyl ketone and applied is used. However, the curing agent particles of organic acid dihydrazide are used in an organic solvent. Although it is difficult to dissolve, there is a problem that the reaction progresses because it dissolves gradually in an organic solvent and the dissolved curing agent also dissolves in the epoxy resin. Under such knowledge, by controlling the average particle size of the organic acid dihydrazide to a specific particle size range, the dissolution of the organic acid dihydrazide in the organic solvent during normal temperature storage and the rapid progress of the thermosetting reaction In addition, a copolymer of a specific range amount of an epoxy group-free (meth) acrylate monomer, an acrylonitrile monomer, and an epoxy group-containing (meth) acrylate monomer as an acrylic copolymer. By adopting the above, it was found that the above-mentioned object can be achieved, and the present invention was completed.
　即ち、本発明は、アクリル系共重合体（Ａ）、エポキシ樹脂（Ｂ）及びエポキシ樹脂用硬化剤（Ｃ）を含有する熱硬化性接着組成物であって、
　該アクリル系共重合体（Ａ）が、エポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）６５～７５質量％、アクリロニトリルモノマー（ｂ）２０～３５質量％及びエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）１～１０質量％を共重合させたものであり、
　該エポキシ樹脂用硬化剤が、平均粒子径０．５～１５μｍの有機酸ジヒドラジド粒子である熱硬化性接着組成物を提供する。なお、本明細書において、「（メタ）アクリル」なる用語は、「メタクリル又はアクリル」という意味で用いている。 That is, the present invention is a thermosetting adhesive composition containing an acrylic copolymer (A), an epoxy resin (B), and a curing agent for epoxy resin (C),
The acrylic copolymer (A) is an epoxy group-free (meth) acrylic acid ester monomer (a) 65 to 75% by mass, an acrylonitrile monomer (b) 20 to 35% by mass and an epoxy group-containing (meth) acrylic acid. Ester monomer (c) is copolymerized 1 to 10% by mass,
Provided is a thermosetting adhesive composition in which the epoxy resin curing agent is organic acid dihydrazide particles having an average particle size of 0.5 to 15 μm. In the present specification, the term “(meth) acryl” is used to mean “methacryl or acryl”.
　また、本発明は、基材フィルム上に、この熱硬化性接着組成物からなる熱硬化性接着層が形成されてなる熱硬化性接着シートを提供する。 The present invention also provides a thermosetting adhesive sheet in which a thermosetting adhesive layer made of this thermosetting adhesive composition is formed on a base film.
　更に、本発明は、この熱硬化性接着シートの製造方法であって、上述の本発明の熱硬化性接着組成物を有機溶剤に投入し、エポキシ樹脂用硬化剤（Ｃ）を有機溶媒中に分散させ、他方アクリル系共重合体（Ａ）及びエポキシ樹脂（Ｂ）を有機溶剤中に溶解させることにより熱硬化性接着層形成用塗料を調製する工程、及び
　熱硬化性接着層形成用塗料を、基材フィルム上に塗布し、乾燥することにより熱硬化性接着層を形成する工程
を含んでなる製造方法を提供する。 Furthermore, this invention is a manufacturing method of this thermosetting adhesive sheet, Comprising: The thermosetting adhesive composition of the above-mentioned this invention is thrown into an organic solvent, The hardening | curing agent (C) for epoxy resins is put in an organic solvent. A step of preparing a thermosetting adhesive layer forming coating by dispersing the other acrylic copolymer (A) and epoxy resin (B) in an organic solvent, and a thermosetting adhesive layer forming coating The manufacturing method which comprises the process of forming on a base film and forming a thermosetting contact bonding layer by drying is provided.
　本発明の熱硬化性接着組成物は、ポリイミドフィルム等の樹脂基板と、ポリイミドフィルム、ガラスエポキシ、ステンレス等の金属板との間を良好に接着し（好ましくは１５Ｎ／ｃｍ以上）、しかも数ヶ月という長期に亘って良好なフィルム常温保管特性を示す。また、２６０℃以上のリフロー処理後においても、吸湿のために膨れが生じないという特性も示す。 The thermosetting adhesive composition of the present invention adheres well between a resin substrate such as a polyimide film and a metal plate such as a polyimide film, glass epoxy, and stainless steel (preferably 15 N / cm or more), and for several months. The film shows good room temperature storage characteristics over a long period of time. In addition, even after a reflow treatment at 260 ° C. or higher, there is also a characteristic that swelling does not occur due to moisture absorption.
　本発明の熱硬化性接着組成物は、アクリル系共重合体（Ａ）、エポキシ樹脂（Ｂ）及びエポキシ樹脂用硬化剤（Ｃ）を含有する。 The thermosetting adhesive composition of the present invention contains an acrylic copolymer (A), an epoxy resin (B), and a curing agent for epoxy resin (C).
　本発明において、アクリル系共重合体（Ａ）は、フィルム成形時に成膜性をもたせ、硬化物に可撓性、強靭性をもたせるためのものであり、エポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）、アクリロニトリルモノマー（ｂ）及びエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）を共重合させたものである。 In the present invention, the acrylic copolymer (A) is for imparting film-forming properties at the time of film molding, and for imparting flexibility and toughness to the cured product, and is an epoxy group-free (meth) acrylic ester. A monomer (a), an acrylonitrile monomer (b), and an epoxy group-containing (meth) acrylic acid ester monomer (c) are copolymerized.
　エポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）としては、電子部品分野に適用されている従来のアクリル系熱硬化性接着剤で使用されているものから適宜選択して使用することができ、例えば、メチルアクリレート、エチルアクリレート、ｎ－プロピルアクリレート、ｎ－ブチルアクリレート、ｉ－ブチルアクリレート、ｎ－ヘキシルアクリレート、ｎ－オクチルアクリレート、ｉ－オクチルアクリレート、２－エチルヘキシルアクリレート、ｉ－ノニルアクリレート、ステアリルアクリレート、メチルメタクリレート、エチルメタクリレート、ｎ－ブチルメタクリレート、ｉ－ブチルメタクリレート、ｎ－ヘキシルメタクリレート、ｎ－オクチルメタクリレート、ｉ－オクチルメタクリレート、２－エチルヘキシルメタクリレート、ｉ－ノニルメタクリレート、ｎ－ドデシルメタクリレート、ｉ－ドデシルメタクリレート、ステアリルメタクリレート等が挙げられる。中でもブチルアクリレート、エチルアクリレートを使用することが好ましい。 The epoxy group-free (meth) acrylic acid ester monomer (a) can be appropriately selected from those used in conventional acrylic thermosetting adhesives applied in the field of electronic components. For example, methyl acrylate, ethyl acrylate, n-propyl acrylate, n-butyl acrylate, i-butyl acrylate, n-hexyl acrylate, n-octyl acrylate, i-octyl acrylate, 2-ethylhexyl acrylate, i-nonyl acrylate, stearyl Acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, i-butyl methacrylate, n-hexyl methacrylate, n-octyl methacrylate, i-octyl methacrylate, 2-ethylhexyl methacrylate Rate, i- nonyl methacrylate, n- dodecyl methacrylate, i- dodecyl methacrylate, stearyl methacrylate, and the like. Of these, butyl acrylate and ethyl acrylate are preferably used.
　アクリル系共重合体（Ａ）を調製する際に使用する全モノマーにおけるエポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）の使用量は、少なすぎると基本特性が低下し、多すぎると耐熱性が低下する傾向があるので、好ましくは６５～７５質量％、より好ましくは６５～７０質量％である。 When the amount of the epoxy group-free (meth) acrylic acid ester monomer (a) used in the preparation of the acrylic copolymer (A) is too small, the basic characteristics are lowered. Since the property tends to decrease, the content is preferably 65 to 75% by mass, more preferably 65 to 70% by mass.
　アクリロニトリルモノマー（ｂ）は、耐熱性を向上するために使用されている。 Acrylonitrile monomer (b) is used to improve heat resistance.
　アクリル系共重合体（Ａ）を調製する際に使用する全モノマーにおけるアクリロニトリルモノマー（ｂ）の使用量は、少なすぎると耐熱性が低下し、多すぎると溶剤に溶解し難くなる傾向があるので、好ましくは２０～３５質量％、より好ましくは２５～３０質量％である。 When the amount of the acrylonitrile monomer (b) used in preparing all the acrylic copolymers (A) is too small, the heat resistance is lowered, and when it is too much, it tends to be difficult to dissolve in the solvent. The content is preferably 20 to 35% by mass, more preferably 25 to 30% by mass.
　エポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）は、エポキシ樹脂用硬化剤と反応し、熱硬化性接着組成物の硬化物に３次元架橋構造を形成するために使用されている。３次元架橋構造が形成されると硬化物の耐湿性及び耐熱性が向上し、例えば、熱硬化性接着組成物の硬化物でフレキシブルプリント配線板に接着固定された補強樹脂シートからなる補強フレキシブルプリント配線板を、２６０℃以上でのハンダ処理（例えばハンダリフロー処理）を行った場合でも、その接着固定部に、吸湿を原因とする膨れ現象が発生することを防止することが可能となる。このようなエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）としては、電子部品分野に適用されている従来のアクリル系熱硬化性接着剤で使用されているものから適宜選択して使用することができ、例えば、グリシジルアクリレート（ＧＡ）、グリシジルメタクリレート（ＧＭＡ）等が挙げられる。中でも、安全性、市場入手容易性の点からグリシジルメタクリレート（ＧＭＡ）を使用することが好ましい。 The epoxy group-containing (meth) acrylic acid ester monomer (c) is used for reacting with a curing agent for epoxy resin to form a three-dimensional cross-linked structure in the cured product of the thermosetting adhesive composition. When a three-dimensional cross-linked structure is formed, the moisture resistance and heat resistance of the cured product are improved. For example, a reinforced flexible print made of a reinforced resin sheet bonded and fixed to a flexible printed wiring board with a cured product of a thermosetting adhesive composition. Even when the wiring board is subjected to a soldering process (for example, a solder reflow process) at 260 ° C. or higher, it is possible to prevent the swollen phenomenon caused by moisture absorption from occurring in the adhesive fixing portion. Such an epoxy group-containing (meth) acrylic acid ester monomer (c) is appropriately selected from those used in conventional acrylic thermosetting adhesives applied in the field of electronic components. Examples thereof include glycidyl acrylate (GA) and glycidyl methacrylate (GMA). Among these, glycidyl methacrylate (GMA) is preferably used from the viewpoint of safety and market availability.
　アクリル系共重合体（Ａ）を調製する際に使用する全モノマーにおけるエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）の使用量は、少なすぎると耐熱性が低下し、多すぎると剥離強度が低下する傾向があるので、好ましくは１～１０質量％、より好ましくは３～７質量％である。 When the amount of the epoxy group-containing (meth) acrylic acid ester monomer (c) used in the preparation of the acrylic copolymer (A) is too small, the heat resistance is lowered. Therefore, it is preferably 1 to 10% by mass, more preferably 3 to 7% by mass.
　以上説明したエポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）、アクリロニトリルモノマー（ｂ）及びエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）からのアクリル系共重合体の調製は、公知の共重合方法を適用して行うことができる。 Preparation of an acrylic copolymer from the epoxy group-free (meth) acrylic acid ester monomer (a), acrylonitrile monomer (b) and epoxy group-containing (meth) acrylic acid ester monomer (c) described above is known. A copolymerization method can be applied.
　本発明において使用するアクリル系共重合体（Ａ）は、その重量平均分子量が小さすぎると剥離強度並びに耐熱性が低下し、大きすぎると溶液粘度が上がり、塗布性が悪化する傾向があるので、好ましくは５０００００～７０００００、より好ましくは５５００００～６５００００の重量平均分子量を有することが好ましい。 If the acrylic copolymer (A) used in the present invention has a weight-average molecular weight that is too small, the peel strength and heat resistance will decrease, and if it is too large, the solution viscosity will increase, and the applicability will tend to deteriorate. Preferably it has a weight average molecular weight of 500,000 to 700,000, more preferably 550000 to 650000.
　本発明の熱硬化性接着組成物を構成するエポキシ樹脂（Ｂ）は、３次元網目構造を形成し、耐熱性、接着性を良好にするために使用されるものである。 The epoxy resin (B) constituting the thermosetting adhesive composition of the present invention is used for forming a three-dimensional network structure and improving heat resistance and adhesiveness.
　エポキシ樹脂（Ｂ）としては、電子部品分野に適用されている従来のエポキシ樹脂系熱硬化性接着剤で使用されている液状あるいは固体状のエポキシ樹脂から適宜選択して使用することができ、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂、水添ビスフェノールＡ型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ポリアルキレンポリオール（ネオペンチルグリコールなど）ポリグリシジエーテル、テトラグリシジルジアミノジフェニルメタン、トリグリシジル－ｐ－アミノフェノール、トリグリシジル－ｍ－アミノフェノール、テトラグリシジル－ｍ－キシレンジアミン、ジグリシジルフタレート、ジグリシジルヘキサヒドロフタレート、ジグリシジルテトラヒドロフタレート、ビニルシクロヘキセンジオキシド、３，４－エポキシシクロヘキシルメチル（３，４－エポキシシクロヘキサン）カルボキシレート、ビス（３，４－エポキシ－６－メチルシクロヘキシルメチル）アジペート等が挙げられる。 As the epoxy resin (B), it can be appropriately selected from liquid or solid epoxy resins used in conventional epoxy resin-based thermosetting adhesives applied in the field of electronic components. For example, Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, hydrogenated bisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, polyalkylene polyol (such as neopentyl glycol) polyglycol Sidiether, tetraglycidyldiaminodiphenylmethane, triglycidyl-p-aminophenol, triglycidyl-m-aminophenol, tetraglycidyl-m-xylenediamine, diglycidyl phthalate, diglycidyl hexa Examples include drophtalate, diglycidyl tetrahydrophthalate, vinylcyclohexene dioxide, 3,4-epoxycyclohexylmethyl (3,4-epoxycyclohexane) carboxylate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, and the like. .
　本発明の熱硬化性接着組成物におけるエポキシ樹脂（Ｂ）の使用量は、少なすぎると耐熱性が低下し、多すぎると接着性が低下する傾向があるので、アクリル系共重合体（Ａ）１００質量部に対し、好ましくは５～３０質量部、より好ましくは１０～２０質量部である。 When the amount of the epoxy resin (B) used in the thermosetting adhesive composition of the present invention is too small, the heat resistance is lowered, and when it is too much, the adhesiveness tends to be lowered. Therefore, the acrylic copolymer (A) The amount is preferably 5 to 30 parts by mass, more preferably 10 to 20 parts by mass with respect to 100 parts by mass.
　本発明の熱硬化性接着組成物は、エポキシ樹脂（Ｂ）及びアクリル系共重合体（Ａ）を調製する際に使用されたエポキシ基含有（メタ）アクリル酸エステルモノマーに由来するエポキシ基と反応するエポキシ樹脂用硬化剤（Ｃ）として、平均粒子径０．５～１５μｍ、好ましくは１～５μｍの有機酸ジヒドラジド粒子を使用する。有機酸ジヒドラジドを使用する理由は、それが常温で固体であるため熱硬化性接着組成物の常温保管特性を向上させることができるためである。また、有機酸ジヒドラジド粒子の平均粒子径を０．５～１５μｍとした理由は、０．５μｍ未満であると熱硬化性接着組成物の塗布のために有機溶剤を使用した場合に、有機酸ジヒドラジド粒子が溶解する可能性が高まり、常温保管特性が低下することが危惧されるからであり、逆に１５μｍより大きいと熱硬化性接着組成物の塗布性が低下し、また、粒度が大きい為にアクリルポリマーやエポキシ樹脂との溶融時に十分に混合できなくなることが懸念されるからである。 The thermosetting adhesive composition of the present invention reacts with an epoxy group derived from an epoxy group-containing (meth) acrylic acid ester monomer used in preparing the epoxy resin (B) and the acrylic copolymer (A). As the epoxy resin curing agent (C), organic acid dihydrazide particles having an average particle diameter of 0.5 to 15 μm, preferably 1 to 5 μm are used. The reason for using the organic acid dihydrazide is that it is solid at room temperature, so that the room temperature storage characteristics of the thermosetting adhesive composition can be improved. The average particle size of the organic acid dihydrazide particles is 0.5 to 15 μm because the organic acid dihydrazide is less than 0.5 μm when an organic solvent is used for coating the thermosetting adhesive composition. This is because the possibility of dissolution of the particles is increased, and there is a concern that the storage property at room temperature may be lowered. This is because there is a concern that the polymer and the epoxy resin cannot be sufficiently mixed when melted.
　このような有機酸ジヒドラジドとしては、従来よりエポキシ樹脂の硬化剤として使用されている有機酸ジヒドラジドの中から適宜選択して使用することができ、例えば、シュウ酸ジヒドラジド、マロン酸ジヒドラジド、コハク酸ジヒドラジド、イミノジ酢酸ジヒドラジド、アジピン酸ジヒドラジド、ピメリン酸ジヒドラジド、スベリン酸ジヒドラジド、アゼライン酸ジヒドラジド、セバシン酸ジヒドラジド、ドデカンジオヒドラジド、ヘキサデカンジオヒドラジド、マレイン酸ジヒドラジド、フマル酸ジヒドラジド、ジグリコール酸ジヒドラジド、酒石酸ジヒドラジド、リンゴ酸ジヒドラジド、イソフタル酸ジヒドラジド、テレフタル酸ジヒドラジド、２，６－ナフトエ酸ジヒドラジド、４，４’－ビスベンゼンジヒドラジド、１，４－ナフトエ酸ジヒドラジド、１，３－ビス（ヒドラジノカルボノエチル）－５－イソプロピルヒダントイン（アミキュアＶＤＨ（商品名）、味の素（株））、７，１１－オクタデカジエン－１，１８－ジカルボヒドラジド（アミキュアＵＤＨ（商品名）、味の素（株））、クエン酸トリヒドラジド等が挙げられる。これらは１種単独であるいは２種以上組み合わせて使用することができる。これらの中でも比較的低融点であり、硬化性のバランスに優れ、入手が容易であるという点から、アジピン酸ジヒドラジドまたは７，１１－オクタデカジエン－１，１８－ジカルボヒドラジドを使用することが好ましい。 Such an organic acid dihydrazide can be appropriately selected from organic acid dihydrazides conventionally used as curing agents for epoxy resins. For example, oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide , Iminodiacetic acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, dodecanediohydrazide, hexadecanediohydrazide, maleic acid dihydrazide, diglycolic acid diglycolic acid diglycolic acid diglycolic acid Acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4'-bisbenzenedihydrazide, 1,4-na Toeic acid dihydrazide, 1,3-bis (hydrazinocarbonoethyl) -5-isopropylhydantoin (Amicure VDH (trade name), Ajinomoto Co., Inc.), 7,11-octadecadien-1,18-dicarbohydrazide (Amicure UDH (trade name), Ajinomoto Co., Inc.), trihydrazide citrate and the like. These can be used singly or in combination of two or more. Among these, adipic acid dihydrazide or 7,11-octadecadien-1,18-dicarbohydrazide is used because it has a relatively low melting point, excellent balance of curability, and is easily available. preferable.
　本発明の熱硬化性接着組成物におけるエポキシ樹脂用硬化剤（Ｃ）の使用量は、少なすぎると未反応のエポキシ基が残り、架橋も十分でないため、耐熱性、接着性が低下し、多すぎると過剰の硬化剤が未反応のまま残るため、耐熱性、接着性が低下する傾向があるので、アクリル系共重合体（Ａ）及びエポキシ樹脂（Ｂ）の合計１００質量部に対し、好ましくは４～２０質量部、より好ましくは６～１５質量部である。 If the amount of the curing agent for epoxy resin (C) used in the thermosetting adhesive composition of the present invention is too small, unreacted epoxy groups remain and crosslinking is not sufficient, resulting in a decrease in heat resistance and adhesiveness. Too much curing agent remains unreacted, and heat resistance and adhesiveness tend to decrease. Therefore, it is preferable for a total of 100 parts by mass of the acrylic copolymer (A) and the epoxy resin (B). Is 4 to 20 parts by mass, more preferably 6 to 15 parts by mass.
　本発明の熱硬化性接着組成物は、以上説明した成分に加えて、本発明の効果を損なわない範囲で必要に応じ、有機酸ジヒドラジドの溶解を促進させないような金属不活性剤、消泡剤、防錆剤、分散剤等の公知の添加剤を配合することができる。 The thermosetting adhesive composition of the present invention includes, in addition to the components described above, a metal deactivator and an antifoaming agent that do not promote the dissolution of the organic acid dihydrazide as necessary within the range not impairing the effects of the present invention. Well-known additives such as a rust inhibitor and a dispersant can be blended.
　本発明の熱硬化性接着組成物は、アクリル系共重合体（Ａ）、エポキシ樹脂（Ｂ）、エポキシ樹脂用硬化剤（Ｃ）及びその他の添加剤を、常法により均一に混合することにより調製することができる。その形態としては、ペースト、フィルム、分散液状などとすることができる。中でも、保管性や使用時のハンドリング性などの観点から、ポリエチレンテレフタレートフィルム、ポリイミドフィルム等の基材フィルム（剥離基材）に、本発明の熱硬化性接着組成物からなる熱硬化性接着層が１０～５０μｍの厚さで形成されてなる熱硬化性接着シートの態様として使用することが好ましい。なお、この基材フィルムには、必要に応じてシリコーン等で剥離処理を施しておいてもよい。 The thermosetting adhesive composition of the present invention is obtained by uniformly mixing an acrylic copolymer (A), an epoxy resin (B), a curing agent for epoxy resin (C), and other additives by a conventional method. Can be prepared. The form can be a paste, a film, a dispersed liquid, or the like. Among these, from the viewpoint of storage properties and handling properties during use, a thermosetting adhesive layer made of the thermosetting adhesive composition of the present invention is formed on a base film (peeling base material) such as a polyethylene terephthalate film or a polyimide film. It is preferably used as an embodiment of a thermosetting adhesive sheet formed with a thickness of 10 to 50 μm. In addition, you may perform the peeling process to this base film with silicone etc. as needed.
　このような熱硬化性接着シートの製造方法は、以下の熱硬化性接着層形成用塗料調製工程及び熱硬化性接着層形成工程を含む。 The method for producing such a thermosetting adhesive sheet includes the following thermosetting adhesive layer forming coating preparation step and thermosetting adhesive layer forming step.
　＜熱硬化性接着層形成用塗料調製工程＞
　まず、本発明の熱硬化性接着組成物をメチルエチルケトン、トルエン等の有機溶剤に塗布法に応じた粘度となるように投入し、エポキシ樹脂用硬化剤（Ｃ）を有機溶剤中に分散させ、他方アクリル系共重合体（Ａ）及びエポキシ樹脂（Ｂ）を有機溶剤中に溶解させることにより熱硬化性接着層形成用塗料を調製する。この場合、熱硬化性接着シートの常温保管性を高めるために、室温下で全有機酸ジヒドラジド粒子の７０質量％が熱硬化性接着層形成用塗料中に固体粒子として分散していることが好ましい。 <The coating preparation process for thermosetting adhesive layer formation>
First, the thermosetting adhesive composition of the present invention is charged into an organic solvent such as methyl ethyl ketone and toluene so as to have a viscosity corresponding to the coating method, and the epoxy resin curing agent (C) is dispersed in the organic solvent. A thermosetting adhesive layer-forming coating material is prepared by dissolving the acrylic copolymer (A) and the epoxy resin (B) in an organic solvent. In this case, in order to improve the room temperature storage property of the thermosetting adhesive sheet, it is preferable that 70% by mass of all organic acid dihydrazide particles are dispersed as solid particles in the thermosetting adhesive layer forming coating at room temperature. .
　＜熱硬化性接着層形成工程＞
　次に、熱硬化性接着層形成用塗料を、基材フィルム上にバーコーター、ロールコーターにより乾燥厚が１０～５０μｍとなるように塗布し、常法により乾燥することにより熱硬化性接着層を形成する。これにより熱硬化性接着シートを得ることができる。 <Thermosetting adhesive layer forming step>
Next, the thermosetting adhesive layer-forming coating material is applied onto the base film with a bar coater or roll coater so that the dry thickness is 10 to 50 μm, and dried by a conventional method to form a thermosetting adhesive layer. Form. Thereby, a thermosetting adhesive sheet can be obtained.
　以上説明した熱硬化性接着組成物及び熱硬化性接着シートは、電子部品分野に好ましく適用できる。特に、上述の熱硬化性接着シートは、フレキシブルプリント配線板の端子部等と、その裏打ちをするためのポリエチレンテレフタレート、ポリイミド、ガラスエポキシ、ステンレス、アルミニウム等の厚さ５０μｍ～２ｍｍの補強用樹脂シートとを接着固定するために好ましく適用でき、その適用により、フレキシブルプリント配線板の端子部と補強用樹脂シートとが、本発明の熱硬化性接着シートの基材フィルムを除いた熱硬化性接着層の熱硬化物で接着固定されてなる補強フレキシブルプリント配線板が得られる。 The thermosetting adhesive composition and the thermosetting adhesive sheet described above can be preferably applied to the electronic component field. In particular, the above-mentioned thermosetting adhesive sheet is a resin sheet for reinforcement having a thickness of 50 μm to 2 mm made of polyethylene terephthalate, polyimide, glass epoxy, stainless steel, aluminum or the like for backing the terminal portion of a flexible printed wiring board and the like. The terminal portion of the flexible printed wiring board and the reinforcing resin sheet can be applied to fix and bond the thermosetting adhesive layer excluding the base film of the thermosetting adhesive sheet of the present invention. A reinforced flexible printed wiring board is obtained which is bonded and fixed with a thermosetting material.
　以下、本発明を実施例により具体的に説明する。 Hereinafter, the present invention will be specifically described with reference to examples.
　　実施例１～１０，比較例１～８
（１）アクリル系共重合体の調製
　表１及び表２に示したモノマーからなるアクリル系共重合体を用意した。これらのアクリル系共重合体の重量平均分子量を表１及び表２に示した。 Examples 1 to 10, Comparative Examples 1 to 8
(1) Preparation of acrylic copolymer An acrylic copolymer composed of the monomers shown in Tables 1 and 2 was prepared. The weight average molecular weights of these acrylic copolymers are shown in Tables 1 and 2.
（２）熱硬化接着層形成用塗料の調製
　得られたアクリル系共重合体溶液に、表１及び表２の配合割合でエポキシ樹脂（Ｂ）及びエポキシ樹脂用硬化剤（Ｃ）として有機酸ジヒドラジドを添加し、均一に混合することにより熱硬化性接着組成物として、熱硬化性接着層形成用塗料を調製した。得られた塗料の粘度をＢ型粘度計により測定し、表１及び表２に示した。 (2) Preparation of paint for forming thermosetting adhesive layer In the obtained acrylic copolymer solution, organic acid dihydrazide as epoxy resin (B) and epoxy resin curing agent (C) in the blending ratios of Tables 1 and 2 Was added and mixed uniformly to prepare a thermosetting adhesive layer-forming coating material as a thermosetting adhesive composition. The viscosities of the obtained paints were measured with a B-type viscometer and are shown in Tables 1 and 2.
（３）熱硬化性接着シートの作製
　得られた熱硬化性接着層形成用塗料を、剥離処理が施されたポリエチレンテレフタレートフィルムに塗布し、５０～１３０℃の乾燥炉中で乾燥し、３５μｍ厚の熱硬化性接着層を形成することにより、熱硬化性接着シートを作製した。 (3) Preparation of thermosetting adhesive sheet The obtained thermosetting adhesive layer-forming coating material was applied to a polyethylene terephthalate film that had been subjected to release treatment, dried in a drying oven at 50 to 130 ° C., and 35 μm thick A thermosetting adhesive sheet was prepared by forming a thermosetting adhesive layer.
（４）熱硬化性接着層形成用塗料の塗布性の評価
　上述の熱硬化性接着シートの作製の際、熱硬化性接着層形成用塗料の塗布性について、以下の基準に従って評価した。得られた評価結果を表１及び表２に示す。 (4) Evaluation of applicability of the thermosetting adhesive layer-forming coating material When the thermosetting adhesive sheet was prepared, the applicability of the thermosetting adhesive layer-forming coating material was evaluated according to the following criteria. The obtained evaluation results are shown in Tables 1 and 2.
　AA：接着剤の厚みが均一で塗布中に筋を引かず、外観においても硬化剤粒子が観察されない場合
　Ａ：塗布中に筋は引かないが、乾燥後のフィルムに硬化剤粒子が観察される場合
　Ｂ：塗布筋があり、厚みも不均一である場合
　Ｃ：溶液がゲル状となり、塗布が不可能な場合 AA: When the thickness of the adhesive is uniform, no streaks are drawn during application, and no hardener particles are observed in appearance. A: No streaks are drawn during application, but hardener particles are observed in the dried film. Case B: When there are application stripes and the thickness is non-uniform C: When the solution becomes a gel and application is impossible
（５）剥離強度の評価
　得られた直後の熱硬化性接着シートを所定の大きさの短冊（５ｃｍ×１０ｃｍ）にカットし、その熱硬化性接着層を、１７５μｍ厚のポリイミドフィルム（１７５ＡＨ、（株）カネカ）に８０℃に設定したラミネーターで仮貼りした後、基材フィルムを取り除いて熱硬化性接着層を露出させた。露出した熱硬化性接着層に対し、同じ大きさの５０μｍ厚のポリイミドフィルム（２００Ｈ、デュポン社）を上から重ね合わせ、１７０℃で２．０ＭＰａの圧力で６０秒間加熱加圧した後、１４０℃のオーブン中に６０分間保持した。 (5) Evaluation of peel strength The thermosetting adhesive sheet immediately after being obtained is cut into a strip (5 cm × 10 cm) having a predetermined size, and the thermosetting adhesive layer is formed into a 175 μm-thick polyimide film (175AH, ( After temporarily attaching to Kaneka Corporation with a laminator set at 80 ° C., the base film was removed to expose the thermosetting adhesive layer. A 50 μm thick polyimide film (200H, DuPont) of the same size is superimposed on the exposed thermosetting adhesive layer from above, heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, and then 140 ° C. In an oven for 60 minutes.
　また、短冊（５ｃｍ×１０ｃｍ）にカットした熱硬化性接着シートの熱硬化性接着層を、０．５ｍｍのＳＵＳ３０４板または厚さ１ｍｍのガラスエポキシ板に押し当てて仮貼りした後、基材フィルムを取り除いて熱硬化性接着層を露出させた。露出した熱硬化性接着層に対し、短冊状の厚さ５０μｍのポリイミドフィルム（５ｃｍ×１０ｃｍ）を上から重ね合わせ、１７０℃で２．０ＭＰａの圧力で６０秒間加熱加圧した後、１４０℃のオーブン中に６０分間保持した。 In addition, after the thermosetting adhesive layer of the thermosetting adhesive sheet cut into a strip (5 cm × 10 cm) is pressed against a 0.5 mm SUS304 plate or a 1 mm thick glass epoxy plate, the substrate film is temporarily attached. Was removed to expose the thermosetting adhesive layer. A strip-shaped polyimide film (5 cm × 10 cm) having a thickness of 50 μm is superimposed on the exposed thermosetting adhesive layer, heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, and then heated at 140 ° C. Hold in oven for 60 minutes.
　その後、ポリイミドフィルムに対し、剥離速度５０ｍｍ／ｍｉｎで９０度剥離試験を行い、引き剥がしに要した力を測定した。得られた結果を表１及び表２に示す。剥離強度は実用上１０Ｎ／ｃｍであることが望まれている。また、常温６ヶ月保管後の剥離強度と初期の剥離強度との差が－３０％未満であることが望まれている。従って、差が２Ｎ／ｃｍ未満の場合を常温保管特性が良好とし、超えると不良とした。 Thereafter, a 90 ° peel test was performed on the polyimide film at a peel speed of 50 mm / min, and the force required for peeling was measured. The obtained results are shown in Tables 1 and 2. Peel strength is desired to be 10 N / cm practically. Further, it is desired that the difference between the peel strength after storage at room temperature for 6 months and the initial peel strength is less than -30%. Therefore, when the difference is less than 2 N / cm, the room temperature storage characteristics are good, and when it exceeds, the result is bad.
　また、２５℃で６ヶ月間常温保管した熱硬化性接着シートについても、同様の剥離強度の評価を行った。得られた結果を表１及び表２に示す。 Also, the same peel strength was evaluated for a thermosetting adhesive sheet stored at room temperature for 6 months at 25 ° C. The obtained results are shown in Tables 1 and 2.
Figure JPOXMLDOC01-appb-T000001
 ＊１：ブチルアクリレート、＊２：エチルアクリレート、＊３：アクリロニトリル
＊４：グリシジルメタクリレート、＊５：２－ヒドロキシエチルメタクリレート、＊６：アクリル酸、
＊７：アジピン酸ジヒドラジド、＊８：７，１１－オクタデカジエン－１，１８－ジカルボヒドラジド
＊９：ｊＥＲ８２８、三菱化学（株）、＊１０：ｊＥＲ１５４、三菱化学（株）
Figure JPOXMLDOC01-appb-T000001
 * 1: Butyl acrylate, * 2: Ethyl acrylate, * 3: Acrylonitrile * 4: Glycidyl methacrylate, * 5: 2-hydroxyethyl methacrylate, * 6: Acrylic acid,
* 7: Adipic acid dihydrazide, * 8: 7,11-octadecadien-1,18-dicarbohydrazide * 9: jER828, Mitsubishi Chemical Corporation, * 10: jER154, Mitsubishi Chemical Corporation
Figure JPOXMLDOC01-appb-T000002
 ＊１～＊１０は表１に同じ
Figure JPOXMLDOC01-appb-T000002
 * 1 to * 10 are the same as Table 1.
　＜表１及び表２の結果の考察＞
　実施例１～７の熱硬化性接着シートは、アクリル系共重合体（Ａ）が、エポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）６５～７５質量％、アクリロニトリルモノマー（ｂ）２０～３５質量％及びエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）１～１０質量％を共重合させたものであり、エポキシ樹脂用硬化剤が、平均粒子径０．５～１５μｍの有機酸ジヒドラジド粒子であるので、塗布性も初期剥離強度、常温保管特性も満足のいくものであった。 <Consideration of results in Tables 1 and 2>
In the thermosetting adhesive sheets of Examples 1 to 7, the acrylic copolymer (A) is an epoxy group-free (meth) acrylic acid ester monomer (a) 65 to 75% by mass, an acrylonitrile monomer (b) 20 to An organic acid dihydrazide obtained by copolymerizing 35% by mass and 1-10% by mass of an epoxy group-containing (meth) acrylic acid ester monomer (c) and having an average particle diameter of 0.5-15 μm. Since it was a particle, the applicability, the initial peel strength, and the room temperature storage characteristics were satisfactory.
　なお、実施例８の熱硬化性接着シートは、アクリル系共重合体（Ａ）の重量平均分子量が３０万と実施例１～７の熱硬化性接着シートに比べて低いため、常温保管特性は良好なものの、全体的に剥離強度及び耐熱性が低めであった。 In addition, since the thermosetting adhesive sheet of Example 8 has an acrylic copolymer (A) having a weight average molecular weight of 300,000, which is lower than the thermosetting adhesive sheets of Examples 1 to 7, the room temperature storage characteristics are as follows. Although good, the overall peel strength and heat resistance were low.
　実施例９の熱硬化性接着シートは、アクリル系共重合体（Ａ）の重量平均分子量が９０万と実施例１～７の熱硬化性接着シートに比べて高いため、接着シートの表面には塗布筋があり、厚みも不均一であるが、常温保管特性は良好なものであった。 In the thermosetting adhesive sheet of Example 9, the acrylic copolymer (A) has a weight average molecular weight of 900,000, which is higher than those of Examples 1 to 7, so that the surface of the adhesive sheet is Although there were coating stripes and the thickness was not uniform, the room temperature storage characteristics were good.
　実施例１０の熱硬化性接着シートの場合、有機酸ジヒドラジドの平均粒径が実施例１～７の熱硬化性接着シートに比べて大きいため、塗布性が若干低下し、また、常温保管特性は良好なものであったが、全体的に剥離強度が低めであった。また、ヒドラジド粒子が大きすぎるため反応性が低下し、剥離強度、耐熱性が十分でなかった。 In the case of the thermosetting adhesive sheet of Example 10, since the average particle size of the organic acid dihydrazide is larger than that of the thermosetting adhesive sheets of Examples 1 to 7, the applicability is slightly lowered, and the room temperature storage characteristics are Although it was good, the peel strength was generally low. Moreover, since the hydrazide particle | grains were too large, the reactivity fell, and peeling strength and heat resistance were not enough.
　それに対し、比較例１の熱硬化性接着シートは、アクリル系共重合体における成分（ａ）が少なすぎ、成分（ｂ）が多すぎるので、有機溶剤に十分に溶解せず、ゲル化してしまった。 On the other hand, since the thermosetting adhesive sheet of Comparative Example 1 has too little component (a) and too much component (b) in the acrylic copolymer, it does not sufficiently dissolve in the organic solvent and gels. It was.
　比較例２の熱硬化性接着シートは、アクリル系共重合体における成分（ａ）が多すぎ、成分（ｂ）が少なすぎるので、常温保管特性は良好なものであったが、初期剥離強度が実用に適さない低いレベルであった。 Since the thermosetting adhesive sheet of Comparative Example 2 has too much component (a) and too little component (b) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was The level was not suitable for practical use.
　比較例３の熱硬化性接着シートは、アクリル系共重合体における成分（ｃ）が少なすぎるので、常温保管特性は良好なものであったが、初期剥離強度が実用に適さない低いレベルであった。 Since the thermosetting adhesive sheet of Comparative Example 3 had too little component (c) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was a low level not suitable for practical use. It was.
　比較例４の熱硬化性接着シートは、アクリル系共重合体における成分（ｃ）が多すぎるので、常温保管特性は良好なものであったが、初期剥離強度が実用に適さない低いレベルであった。 Since the thermosetting adhesive sheet of Comparative Example 4 had too much component (c) in the acrylic copolymer, the room temperature storage characteristics were good, but the initial peel strength was a low level not suitable for practical use. It was.
　比較例５の熱硬化性接着シートは、有機酸ジヒドラジドの平均粒径が大きすぎるので、初期剥離強度が実用に適さない低いレベルであった。 In the thermosetting adhesive sheet of Comparative Example 5, the average particle size of the organic acid dihydrazide was too large, so the initial peel strength was at a low level not suitable for practical use.
　比較例６～８の熱硬化性接着シートは、アクリル系共重合体に水酸基またはカルボキシル基が存在するため、常温保管特性が不良であった。 The thermosetting adhesive sheets of Comparative Examples 6 to 8 had poor room temperature storage characteristics due to the presence of hydroxyl groups or carboxyl groups in the acrylic copolymer.
　　実施例１１
　実施例１～１０及び比較例２～８の熱硬化性接着シートを使用して以下に説明するように補強フレキシブルプリント配線板を作製した。 Example 11
Reinforcing flexible printed wiring boards were produced using the thermosetting adhesive sheets of Examples 1 to 10 and Comparative Examples 2 to 8 as described below.
　＜吸湿リフローハンダ耐熱性試験＞　
　短冊（２ｃｍ×２ｃｍ）にカットした熱硬化性接着シートの熱硬化性接着層を、１７５μｍ厚のポリイミドフィルム（アピカル１７５ＡＨ、（株）カネカ）に８０℃に設定したラミネーターで仮貼りした後、剥離基材を取り除いて熱硬化性接着層を露出させた。露出した熱硬化性接着層に対し、同じ大きさの５０μｍ厚のポリイミドフィルム（カプトン２００Ｈ、デュポン社）を上から重ね合わせ、１７０℃で２．０ＭＰａの圧力で６０秒間加熱加圧した後、１４０度のオーブン中で６０分間保持した。その後、加熱硬化した試験片を４０℃、９０％ＲＨの湿熱オーブン中で９６時間放置した。 <Hygroscopic reflow solder heat resistance test>
A thermosetting adhesive layer of a thermosetting adhesive sheet cut into a strip (2 cm × 2 cm) was temporarily attached to a 175 μm-thick polyimide film (Apical 175AH, Kaneka Corporation) with a laminator set at 80 ° C., and then peeled off. The substrate was removed to expose the thermosetting adhesive layer. A 50 μm thick polyimide film (Kapton 200H, DuPont) of the same size is superimposed on the exposed thermosetting adhesive layer from above, and heated and pressurized at 170 ° C. and a pressure of 2.0 MPa for 60 seconds, then 140 In an oven for 60 minutes. Thereafter, the heat-cured test piece was left in a wet heat oven at 40 ° C. and 90% RH for 96 hours.
　湿熱処理直後の試験片をトップ温度２６０℃×３０秒に設定したリフロー炉を通過させ、通過後の試験片に膨れ、剥がれ等の外観異常がないかを目視観察し、外観に全く異常がない場合を“Ａ”と評価し、試験片に膨れがわずかに観察されるが実用上問題がない場合を“Ｂ”と評価し、試験片に発泡による膨れが観察される場合を“Ｃ”と評価した。得られた結果を表３及び表４に示す。 The test piece immediately after the wet heat treatment is passed through a reflow furnace set at a top temperature of 260 ° C. × 30 seconds, and the test piece after passing is visually observed for abnormal appearance such as swelling and peeling, and there is no abnormality in the appearance. The case is evaluated as “A”, the case where the swelling is slightly observed in the test piece but there is no practical problem is evaluated as “B”, and the case where the swelling due to foaming is observed in the test piece is indicated as “C”. evaluated. The obtained results are shown in Tables 3 and 4.
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000004
Figure JPOXMLDOC01-appb-T000004
　吸湿リフローハンダ耐熱性試験の結果、実施例１～１０の熱硬化性接着シートを使用した補強フレキシブルプリント配線板は、外観に異常が全く観察されないか、または試験片に膨れがわずかに観察されたが実用上問題がなかった。特に、実施例１～７の熱硬化性接着シートを使用した補強フレキシブルプリント配線板は、アクリル共重合体－エポキシ樹脂－ヒドラジド架橋構造のバランスがよく、未反応の原料が殆ど残存しないために、外観に異常が全く観察されなかった。 As a result of the moisture absorption reflow soldering heat resistance test, the reinforced flexible printed wiring board using the thermosetting adhesive sheets of Examples 1 to 10 showed no abnormality in appearance, or slight swelling was observed in the test piece. There was no problem in practical use. In particular, the reinforced flexible printed wiring boards using the thermosetting adhesive sheets of Examples 1 to 7 have a good balance of acrylic copolymer-epoxy resin-hydrazide cross-linked structure, and almost no unreacted raw material remains. No abnormality was observed in the appearance.
　他方、比較例２～８の場合、比較例４を除き、２５℃／６ヶ月後には、試験片に発泡による膨れが観察された。なお比較例４の場合、良好な架橋構造のために吸湿リフローハンダ耐熱性は良好ではあったが、前述したように、初期剥離強度が実用に適さない低いレベルであった。 On the other hand, in the case of Comparative Examples 2 to 8, except for Comparative Example 4, after 25 months at 6 months, swelling due to foaming was observed on the test piece. In the case of Comparative Example 4, although the moisture absorption reflow soldering heat resistance was good due to a good cross-linked structure, as described above, the initial peel strength was at a low level not suitable for practical use.
　本発明の熱硬化性接着組成物及び熱硬化性接着シートは、ポリイミドフィルム等の樹脂基板と、ポリイミドフィルム、ステンレス板あるいはガラスエポキシ基板との間を、良好に接着でき、しかも数ヶ月という長期に亘って良好な常温保管特性を示す。また、２６０℃リフロー処理しても、吸湿のために膨れが生じないようにできる。従って、ポリイミド材料を多用する電子部品分野における接着剤として有用である。 The thermosetting adhesive composition and thermosetting adhesive sheet of the present invention can satisfactorily bond between a resin substrate such as a polyimide film and a polyimide film, a stainless steel plate or a glass epoxy substrate, and for a long period of several months. It exhibits good room temperature storage characteristics. Moreover, even if it carries out a 260 degreeC reflow process, it can prevent that a swelling arises for moisture absorption. Therefore, it is useful as an adhesive in the field of electronic components that frequently use polyimide materials.

Claims (9)

  1. 　アクリル系共重合体（Ａ）、エポキシ樹脂（Ｂ）及びエポキシ樹脂用硬化剤（Ｃ）を含有する熱硬化性接着組成物であって、
    　該アクリル系共重合体（Ａ）が、エポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）６５～７５質量％、アクリロニトリルモノマー（ｂ）２０～３５質量％及びエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）１～１０質量％を共重合させたものであり、
    　該エポキシ樹脂用硬化剤が、平均粒子径０．５～１５μｍの有機酸ジヒドラジド粒子である熱硬化性接着組成物。     A thermosetting adhesive composition containing an acrylic copolymer (A), an epoxy resin (B), and a curing agent for epoxy resin (C),
    The acrylic copolymer (A) is an epoxy group-free (meth) acrylic acid ester monomer (a) 65 to 75% by mass, an acrylonitrile monomer (b) 20 to 35% by mass and an epoxy group-containing (meth) acrylic acid. Ester monomer (c) is copolymerized 1 to 10% by mass,
    A thermosetting adhesive composition, wherein the epoxy resin curing agent is organic acid dihydrazide particles having an average particle size of 0.5 to 15 μm.
  2. 　該エポキシ樹脂用硬化剤が、平均粒子径１～５μｍの有機酸ジヒドラジド粒子である請求項１記載の熱硬化性接着組成物。 The thermosetting adhesive composition according to claim 1, wherein the epoxy resin curing agent is organic acid dihydrazide particles having an average particle diameter of 1 to 5 µm.
  3. 　有機酸ジヒドラジドが、アジピン酸ジヒドラジドまたは７，１１－オクタデカジエン－１，１８－ジカルボヒドラジドである請求項１または２記載の熱硬化性接着組成物。 The thermosetting adhesive composition according to claim 1 or 2, wherein the organic acid dihydrazide is adipic acid dihydrazide or 7,11-octadecadien-1,18-dicarbohydrazide.
  4. 　アクリル系共重合体（Ａ）１００質量部に対し、エポキシ樹脂（Ｂ）を５～３０質量部、アクリル系共重合体（Ａ）及びエポキシ樹脂（Ｂ）の合計１００質量部に対し、エポキシ樹脂用硬化剤を４～２０質量部含有する請求項１～３のいずれかに記載の熱硬化性接着組成物。 The epoxy resin (B) is 5 to 30 parts by mass with respect to 100 parts by mass of the acrylic copolymer (A), and the total amount of the acrylic copolymer (A) and the epoxy resin (B) is 100 parts by mass. The thermosetting adhesive composition according to any one of claims 1 to 3, which contains 4 to 20 parts by mass of a curing agent for use.
  5. 　アクリル系共重合体（Ａ）の重量平均分子量が、５０００００～７０００００である請求項１～４のいずれかに記載の熱硬化性接着組成物。 The thermosetting adhesive composition according to any one of claims 1 to 4, wherein the acrylic copolymer (A) has a weight average molecular weight of 500,000 to 700,000.
  6. 　エポキシ基非含有（メタ）アクリル酸エステルモノマー（ａ）及びエポキシ基含有（メタ）アクリル酸エステルモノマー（ｃ）がいずれも水酸基及び遊離カルボキシル基を含有しないモノマーである請求項１～５のいずれかに記載の熱硬化性接着組成物。 The epoxy group-free (meth) acrylic acid ester monomer (a) and the epoxy group-containing (meth) acrylic acid ester monomer (c) are both monomers not containing a hydroxyl group and a free carboxyl group. The thermosetting adhesive composition described in 1.
  7. 　基材フィルム上に、請求項１～６のいずれかに記載の熱硬化性接着組成物からなる熱硬化性接着層が形成されてなる熱硬化性接着シート。 A thermosetting adhesive sheet in which a thermosetting adhesive layer made of the thermosetting adhesive composition according to any one of claims 1 to 6 is formed on a base film.
  8. 　請求項７記載の熱硬化性接着シートの製造方法であって、
    　請求項１～６のいずれかに記載の熱硬化性接着組成物を有機溶剤に投入し、エポキシ樹脂用硬化剤（Ｃ）を有機溶媒中に分散させ、他方アクリル系共重合体（Ａ）及びエポキシ樹脂（Ｂ）を有機溶剤中に溶解させることにより熱硬化性接着層形成用塗料を調製する工程、及び
    　熱硬化性接着層形成用塗料を、基材フィルム上に塗布し、乾燥することにより熱硬化性接着層を形成する工程
    を含んでなる製造方法。     A method for producing a thermosetting adhesive sheet according to claim 7,
    The thermosetting adhesive composition according to any one of claims 1 to 6 is charged into an organic solvent, the epoxy resin curing agent (C) is dispersed in the organic solvent, and the acrylic copolymer (A) and By dissolving the epoxy resin (B) in an organic solvent to prepare a thermosetting adhesive layer forming coating, and applying the thermosetting adhesive layer forming coating on the base film and drying A production method comprising a step of forming a thermosetting adhesive layer.
  9. 　フレキシブルプリント配線板の端子部が補強用樹脂シートで裏打ちされている補強フレキシブルプリント配線板であって、該端子部と該補強用樹脂シートとが、請求項７記載の熱硬化性接着シートの基材フィルムを除いた熱硬化性接着層の熱硬化物で接着固定されてなる補強フレキシブルプリント配線板。
     
          A reinforced flexible printed wiring board in which a terminal portion of the flexible printed wiring board is lined with a reinforcing resin sheet, wherein the terminal portion and the reinforcing resin sheet are based on the thermosetting adhesive sheet according to claim 7. A reinforced flexible printed wiring board, which is bonded and fixed with a thermoset of a thermosetting adhesive layer excluding a material film.

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