WO2011004825A1 - ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 - Google Patents

ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 Download PDF

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Publication number
WO2011004825A1
WO2011004825A1 PCT/JP2010/061485 JP2010061485W WO2011004825A1 WO 2011004825 A1 WO2011004825 A1 WO 2011004825A1 JP 2010061485 W JP2010061485 W JP 2010061485W WO 2011004825 A1 WO2011004825 A1 WO 2011004825A1
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WIPO (PCT)
Prior art keywords
wafer
styrene
adhesive sheet
resin film
pressure
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PCT/JP2010/061485
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English (en)
French (fr)
Japanese (ja)
Inventor
郷史 大田
朗 矢吹
正三 矢野
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古河電気工業株式会社
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Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to KR1020117030393A priority Critical patent/KR101336430B1/ko
Priority to JP2011521930A priority patent/JPWO2011004825A1/ja
Priority to CN201080030584.7A priority patent/CN102473617B/zh
Publication of WO2011004825A1 publication Critical patent/WO2011004825A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C09J2453/006—Presence of block copolymer in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

  • the present invention relates to an adhesive sheet for attaching a wafer and a method for processing a wafer using the same, and more particularly, to reduce chipping or cracking (hereinafter referred to as chipping) that occurs when a semiconductor wafer is cut and separated into small pieces.
  • chipping chipping or cracking
  • a semiconductor wafer such as silicon or gallium arsenide is subjected to a picking process after a process of cutting and separating (dicing) into small pieces.
  • a general semiconductor wafer dicing step and pick-up step will be described with reference to cross-sectional views shown in FIGS.
  • a semiconductor wafer 13 is stuck to a wafer sticking adhesive sheet 12 having both ends fixed to a holder 11 and coated with an adhesive on a base resin film (FIG. 2).
  • Chip 14 (FIG. 3).
  • the expander 16 in order to pick up the chip 14, it is pushed up by the expander 16 in the direction of the solid arrow 15 and expanded in the direction of the dotted arrow 17 to expand the interval between the chips 14 (FIG. 4).
  • 14 picks up (FIG. 5). 2 to 5, the same reference numerals mean the same parts.
  • an adhesive sheet obtained by applying an adhesive to a base resin film has been used.
  • a base material made of a relatively soft resin is used in consideration of expandability, and for example, a polyvinyl chloride film or a polyethylene film may be used.
  • chipping or cracking called chipping occurs, and it is not uncommon for the size to be 100 ⁇ m or more.
  • chipping reaches the circuit surface, the performance of the circuit itself may be hindered.
  • chip fragments generated by chipping during the pick-up process may adhere to the surface of another chip and destroy the circuit itself.
  • the present invention is intended to solve the problems associated with the above-described conventional technology, and provides a wafer sticking pressure-sensitive adhesive sheet that can reduce the occurrence of chipping during dicing and a wafer processing method using the same. Let it be an issue.
  • a dynamic viscoelasticity measuring apparatus using a base resin film and a test piece in which a pressure-sensitive adhesive layer is formed on the base resin film, wherein the pressure-sensitive adhesive sheet is processed into a width of 5 mm.
  • the adhesive sheet for sticking a wafer wherein the minimum value of the loss coefficient measured by the above is 0.20 or more.
  • (3) At least one layer of the base resin film is made of styrene-hydrogenated isoprene-styrene block copolymer, styrene-isoprene-styrene copolymer, styrene-hydrogenated butadiene-styrene copolymer, and styrene-hydrogenated.
  • At least one layer of the base resin film is composed of 100 parts by mass of polypropylene resin as component (A), styrene-hydrogenated isoprene-styrene block copolymer, styrene-isoprene-styrene copolymer as component (B).
  • a resin composition comprising 30 to 100 parts by mass of at least one selected from a polymer, a styrene-hydrogenated butadiene-styrene copolymer, and a styrene-hydrogenated isoprene-butadiene-styrene copolymer.
  • the adhesive sheet for sticking a wafer according to any one of (1) to (3).
  • At least one layer of the base resin film is composed of a resin dispersion in which the component (A) is a continuous phase and the component (B) is a dispersed phase, and the average diameter of the dispersed phase particles is 15 nm or more.
  • FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of an adhesive sheet for sticking a wafer of the present invention, wherein a base resin film 1 and an adhesive layer 2 are formed on the base resin film 1.
  • an adhesive sheet contains an adhesive tape (for example, a dicing tape and a dicing die-bonding tape).
  • the adhesive sheet for sticking a wafer of the present invention is measured by applying a tensile stress having a frequency of 400 to 900 Hz at a temperature of 23 ° C. with a dynamic viscoelasticity measuring device using a film-like test piece processed to a width of 5 mm.
  • the minimum value of the loss coefficient is 0.20 or more
  • the minimum value of the loss coefficient measured by applying a tensile stress having a frequency of 650 Hz at a temperature of 15 to 40 ° C. is 0.20 or more.
  • the pressure-sensitive adhesive sheet for wafer sticking of the present invention applies a tensile stress with a frequency of 400 to 900 Hz at a temperature of 23 ° C.
  • the minimum value of the loss coefficient measured by the above is 0.40 or less, and the minimum value of the loss coefficient measured by applying a tensile stress having a frequency of 650 Hz at a temperature of 15 to 40 ° C. is 0.40 or less.
  • This method is a method in which periodic microstrain is given to a specimen and the response to the microstrain is measured. By using this method, it is possible to know how much both the elastic element and the viscous element in the test body are provided. If the test body is a perfect elastic body, the response to it appears in the same phase, and the loss coefficient determined by the ratio of the storage elastic modulus and the loss elastic modulus becomes zero. However, if there is a viscous element, a delay occurs in the response, and the loss coefficient takes a positive value.
  • the storage elastic modulus appears due to the elastic element, and when the elastic element is deformed by applying stress, it receives a response to it and has the property of conserving mechanical energy, whereas the loss elastic modulus is attributed to the viscous element When it is deformed by stress application, mechanical energy corresponding to the applied stress has a property of being consumed as heat.
  • the stress is applied from the rotation of the blade during dicing, but if the loss coefficient when applying a tensile stress to the wafer sticking adhesive sheet is a specific value or more, the wafer sticking adhesive sheet has its stress. It has been found that chipping can be reduced because the vibration of the chip corresponding to the recovery of deformation can be suppressed. Since the value of dynamic viscoelasticity varies depending on the frequency applied and the measurement temperature, it is possible to collect the frequency characteristics with a constant temperature, or to collect the temperature characteristics by applying a constant frequency.
  • the loss coefficient is the storage tensile elastic modulus (E ′) measured with a dynamic viscoelasticity measuring apparatus (for example, trade name “Rheogel-E4000” manufactured by UBM) and the loss tensile elastic modulus. It can be obtained from the ratio (E ′ / E ′′) of (E ′′).
  • the minimum value of the loss coefficient at a frequency of 400 to 900 Hz at a temperature of 23 ° C. can be obtained from the response by fixing the temperature at 23 ° C. and applying a tensile stress to the test piece within a frequency range of 400 to 900 Hz. it can.
  • the minimum value of the loss coefficient at a temperature of 15 to 40 ° C. and a frequency of 650 Hz can be obtained from the response when a tensile stress with a frequency fixed at 650 Hz is applied to the test piece at a temperature of 15 to 40 ° C.
  • Chipping is caused by a rotating blade called a blade at the time of dicing, and the present inventors have examined the cause of the chipping, and the chip sticking generated at the time of dicing can be attenuated by the adhesive sheet attached to the wafer.
  • the present invention provides an adhesive sheet for sticking a wafer with a loss coefficient under a specific condition measured in a film shape by a dynamic viscoelasticity measuring device that exceeds a specific value. It came to complete. When dicing with a blade, heat is generated by contact between the rotating blade and the wafer.
  • the rotation speed of the blade is usually 25000 to 55000 rpm, and the value is converted to a frequency of 400 to 900 Hz.
  • cooling water of 15 to 25 ° C. is flowed to the contact portion during dicing, and the adhesive sheet for adhering the wafer is kept at a substantially constant temperature (for example, 23 ° C.).
  • a substantially constant temperature for example, 23 ° C.
  • the adhesive sheet for adhering a wafer may be brought into contact with the rotating blade, the wafer, and the adhesive sheet for adhering a wafer, for example, at a temperature of 15 to 40 ° C. due to excessive or insufficient cooling. Therefore, by setting the minimum value of the loss coefficient at a temperature of 15 to 40 ° C. and a frequency of 650 Hz to 0.20 or more, chip vibration generated during dicing can be attenuated and chipping can be prevented.
  • the loss factor of the pressure-sensitive adhesive sheet to be attached to the wafer is 0.20 or more, preferably 0.22 or more. If the loss factor is too small, vibration due to the dicing blade cannot be reduced, and chipping is difficult to prevent. Usually, the loss coefficient of the pressure-sensitive adhesive sheet to be attached to a wafer is 0.40 or less.
  • the 5% modulus of the base resin film is 4.0 to 7.0 MPa and the tear strength is 100 N / mm or more.
  • the 5% modulus of the base resin film can be obtained by measuring the stress at 5% strain according to JIS K 7127/2/300. If the base resin film has a 5% modulus and tear strength within this range, even if sufficient tensile stress is applied in the expanding process, the base resin film will not tear and the chip spacing will be expanded evenly. can do. If the 5% modulus of the base resin film is too large, the adhesive sheet for adhering to a wafer of the present invention cannot sufficiently expand the chip interval in the expanding process for expanding the interval between the chips 14 shown in FIG.
  • the 5% modulus of the base resin film is too small, the pressure-sensitive adhesive sheet for wafer sticking may be stretched with low stress, which may hinder handling.
  • the 5% modulus of the base resin film is preferably 4.5 to 6.5 MPa, more preferably 5.0 to 6.5 MPa.
  • the 5% modulus in the MD direction and the TD direction of the base resin film of the adhesive sheet for wafer sticking of the present invention is 4.0 to 7.0 MPa. It is preferable.
  • the tear strength of the base resin film is 100 N / mm or more.
  • the tear strength of the base resin film can be obtained according to JIS K7128-3.
  • the adhesive sheet for affixing a wafer having a tear strength of the base resin film of less than 100 N / mm may be broken in the expanding step.
  • the tear strength of the base resin film is preferably 110 N / mm or more, more preferably 115 N / mm or more.
  • the tear strength of the base resin film in the MD direction and the TD direction of the base resin film of the adhesive sheet for wafer sticking of the present invention is 100 N / mm or more. It is preferable that
  • the base resin film can be used without particular limitation as long as it has excellent heat resistance against cutting of the wafer with a blade in the dicing process.
  • the resin of the base resin film includes those that can be formed into a sheet shape, such as plastic, thermoplastic elastomer, and rubber.
  • this resin include styrene-hydrogenated isoprene-styrene block copolymer (hereinafter referred to as “SEPS”), styrene-isoprene-styrene copolymer (hereinafter referred to as “SIS”), styrene-hydrogenated butadiene-styrene copolymer.
  • the base resin film 1 may be a single layer or multiple layers. In the case of multiple layers, different materials or the same material may be used, but at least one of the layers constituting the base resin film 1 is the above SEPS, It is preferable to contain at least one selected from SIS, SEBS, and SEEPS.
  • the layers composed of at least one selected from SEPS, SIS, SEBS, and SEEPS can be laminated and used in combination.
  • the layer comprising at least one selected from the above SEPS, SIS, SEBS, and SEEPS includes polypropylene, low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene / propylene copolymer, propylene copolymer Polymer, Ethylene-propylene-diene copolymer vulcanizate, polybutene, polybutadiene, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid methyl copolymer Polymer, ethylene- (meth) acrylate copolymer, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, Styrene isoprene rubber, styrene butad
  • the ionomer refers to a resin in which molecules of an ethylene-methacrylic acid copolymer or ethylene-acrylic acid copolymer are intermolecularly bonded with a metal ion such as sodium or zinc. Zinc is preferred as the metal ion.
  • At least one of the layers constituting the base resin film is a polypropylene resin as the component (A), a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene-styrene copolymer as the component (B),
  • a resin composition containing at least one selected from a styrene-hydrogenated butadiene-styrene copolymer and a styrene-hydrogenated isoprene-butadiene-styrene copolymer is preferable.
  • the polypropylene resin in this case includes a propylene homopolymer, an ethylene-propylene copolymer, an ethylene-propylene-diene copolymer vulcanizate, other propylene copolymers, and the like. Either a polymer or a block copolymer may be used and is appropriately selected.
  • the blending amount of the polypropylene resin of component (A) and at least one selected from SEPS, SIS, SEBS and SEEPS of component (B) takes into consideration the balance between film strength and vibration damping properties. It can be determined as appropriate. It is preferable that at least one selected from SEPS, SIS, SEBS and SEEPS of component (B) is 30 to 100 parts by mass with respect to 100 parts by mass of component (A) polypropylene resin. When the amount of at least one selected from SEPS, SIS, SEBS and SEEPS of the component (B) is too small relative to 100 parts by mass of the component (A), sufficient vibration damping properties cannot be obtained, and the chipping suppressing effect is obtained. It may be small. Moreover, when there are too many at least 1 sort (s) selected from SEPS, SIS, SEBS, and SEEPS of (B) component with respect to 100 mass parts of (A) component, the film itself becomes too soft and troubles arise in handling. .
  • resin (A) is a continuous phase
  • component (B) is a dispersed phase
  • the average diameter of the dispersed phase particles is 15 nm or more. A dispersion is preferred.
  • the upper limit of the particles of the dispersed phase is not particularly limited, but if it is too large, the film strength may locally vary, and is preferably 25 nm or less.
  • energy is applied due to the collision of molecular chains or side chains between the components (B) in the process of pulling or restoring during stress application.
  • causes loss when the average diameter of the dispersed phase of component (B) is too small, there are few adjacent molecular chains, so that sufficient energy loss for suppressing chipping cannot be obtained, and it is difficult to attenuate the chip vibration generated during dicing. There is a case.
  • the surface of the base resin film that contacts the pressure-sensitive adhesive layer may be subjected to corona treatment or may be provided with other layers such as a primer.
  • the thickness of the base resin film 1 is not particularly limited, but is preferably 30 to 200 ⁇ m, particularly preferably 50 to 100 ⁇ m.
  • the thickness of the SEPS, SIS, SEBS or SEEPS-containing layer is preferably 5 to 100 ⁇ m.
  • the pressure-sensitive adhesive layer can be formed of various pressure-sensitive adhesives.
  • the resin component used in such an adhesive is not limited at all.
  • an adhesive having a base polymer such as a rubber polymer such as natural rubber or various synthetic rubbers, an acrylic polymer, a silicone polymer, or a polyvinyl ether polymer is used.
  • acrylic polymers such as poly (meth) acrylic acid alkyl esters, copolymers of (meth) acrylic acid alkyl esters and other unsaturated monomers copolymerizable therewith. .
  • a crosslinking agent can be blended.
  • the cross-linking agent by appropriately selecting a cross-linking agent having a functional group capable of reacting with the functional group corresponding to the functional group in the resin component, the cohesive force is imparted to the pressure-sensitive adhesive and the initial pressure-sensitive adhesive is used.
  • the force can be set to a desired value.
  • the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, metal chelate crosslinking agents, aziridine crosslinking agents, and amine resins. From the viewpoint of versatility, an isocyanate-based crosslinking agent is preferable as the crosslinking agent.
  • polyvalent isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′- Diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, lysine isocyanate, etc. are used. .
  • the pressure-sensitive adhesive can contain various additive components as desired within the range in which the object of the present invention is not impaired.
  • a radiation curable or heat-foamed pressure-sensitive adhesive can be used.
  • the radiation curable adhesive it is possible to use an adhesive that is cured by ultraviolet rays, electron beams, etc., and easily peels off at the time of peeling. An adhesive that easily peels can be used.
  • the radiation curable pressure-sensitive adhesive for example, those described in JP-B-1-56112, JP-A-7-135189 and the like are preferably used, but are not limited thereto.
  • At least two photopolymerizable carbons in the molecule for a normal rubber-based or acrylic pressure-sensitive resin component For example, at least two photopolymerizable carbons in the molecule for a normal rubber-based or acrylic pressure-sensitive resin component.
  • a low molecular weight photopolymerizable compound having a carbon double bond hereinafter referred to as a photopolymerizable compound
  • a photopolymerization initiator can be blended.
  • Examples of the photopolymerizable compound include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene.
  • Examples include glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, organopolysiloxane composition, commercially available oligoester acrylate, and urethane acrylate.
  • one having a photocurable carbon-carbon double bond may be used.
  • an acrylic copolymer and / or a methacrylic copolymer (a1) having a photocurable carbon-carbon double bond with respect to a repeating unit of the main chain and having a functional group, and the functional group The thing obtained by making it react with the compound (a2) which has a functional group which can react can be mentioned.
  • the acrylic copolymer and / or methacrylic copolymer (a1) having a radiation curable carbon-carbon double bond and a functional group with respect to the repeating unit of the main chain is, for example, radiation curing.
  • a monomer (a1-1) such as an alkyl acrylate and / or alkyl methacrylate having a functional carbon-carbon double bond and a monomer (a1-2) having a functional group are copolymerized. Obtainable.
  • a (meth) acrylic acid alkyl ester having 6 to 12 carbon atoms in the alkyl group of the alkyl ester eg, hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2- Ethyl hexyl acrylate, dodecyl acrylate, decyl acrylate.
  • (meth) acrylic acid alkyl ester having 5 or less carbon atoms in the alkyl group of the alkyl ester (for example, pentyl acrylate, n-butyl acrylate, isobutyl acrylate, ethyl acrylate, methyl acrylate, or similar methacrylates) Can be mentioned.
  • Examples of the functional group possessed by the monomer (a1-2) include a carboxyl group, a hydroxyl group, an amino group, a cyclic acid anhydride group, an epoxy group, and an isocyanate group.
  • Specific examples of the monomer (a1-2) include, for example, acrylic acid, methacrylic acid, cinnamic acid, itaconic acid, fumaric acid, phthalic acid, 2-hydroxyalkyl acrylates, 2-hydroxyalkyl methacrylates, Glycol monoacrylates, glycol monomethacrylates, N-methylolacrylamide, N-methylolmethacrylamide, allyl alcohol, N-alkylaminoethyl acrylates, N-alkylaminoethyl methacrylates, acrylamides, methacrylamides, maleic anhydride Itaconic anhydride, fumaric anhydride, phthalic anhydride, glycidyl acrylate, glycidyl methacrylate,
  • examples of the functional group (a1) include a hydroxyl group, an epoxy group, and an isocyanate group.
  • examples of the functional group (a2) include a hydroxyl group, an epoxy group, and an isocyanate group.
  • examples of the functional group (a2) include a hydroxyl group, examples of the functional group (a1) include a cyclic acid anhydride group and an isocyanate group.
  • examples of the functional group (a2) include an epoxy group and an isocyanate group.
  • examples of the functional group of (a2) include a carboxyl group, a cyclic acid anhydride group, and an amino group.
  • an ultraviolet curable pressure-sensitive adhesive by mixing a photopolymerization initiator in the pressure-sensitive adhesive, it is possible to reduce the polymerization curing time and the amount of ultraviolet irradiation by ultraviolet irradiation.
  • a photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone and the like can be mentioned.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 4 to 30 ⁇ m, particularly preferably 5 to 25 ⁇ m.
  • the pressure-sensitive adhesive sheet for sticking a wafer of the present invention can be used as a dicing tape without further providing an adhesive layer on the pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer of the present invention is a pressure-sensitive adhesive that can also be used for dicing die bonding, it can be used as a dicing die-bonding tape.
  • the pressure-sensitive adhesive layer is peeled off from the base resin film, and direct bonding can be performed thereafter using the chip having the pressure-sensitive adhesive layer attached to the chip.
  • the pressure-sensitive adhesive sheet for wafer sticking of the present invention may be one in which an adhesive layer is laminated at least on the part to be stuck to the wafer on the pressure-sensitive adhesive layer.
  • the adhesive layer adheres to the chip and is used as an adhesive when fixing the chip to the substrate or lead frame Is done.
  • a film-like adhesive generally used for dicing die-bonding sheets can be used, such as an acrylic adhesive, an epoxy resin / phenolic resin / acrylic resin blend adhesive, and the like. It can be preferably used.
  • the thickness may be appropriately set, but is preferably about 5 to 100 ⁇ m.
  • the resin composition constituting the adhesive layer has such adhesiveness that it can be bonded to a wafer at normal temperature and can be diced, and can be peeled off from the adhesive layer after the dicing is completed, and then the adhesive property is obtained by heating. Appears and acts as a die bond agent.
  • the heating at this time is not particularly limited, but is preferably performed at 40 to 100 ° C., more preferably at 60 to 80 ° C.
  • the wafer can be bonded to the adhesive sheet for sticking a wafer of the present invention, and the wafer can be diced and picked up as shown in FIGS.
  • not cutting up to the base resin film reduces cutting resistance of the dicing blade, smoothes wafer cutting, and reduces chipping. ,preferable. More preferably, it is preferable to perform the maximum cutting up to about 2/3 of the thickness of the pressure-sensitive adhesive layer.
  • the setting of the cutting depth of the dicing apparatus to be used may be appropriately changed according to the manual.
  • the bare wafer used in the present invention is not particularly limited, and can be appropriately selected from any conventionally used bare wafers.
  • Coronate L 3 parts by weight, 10 parts by weight of tetramethylolmethane tetraacrylate as a photopolymerizable compound, and 1 part by weight of ⁇ -hydroxycyclohexyl phenyl ketone as a photopolymerization initiator are mixed and mixed to form an adhesive composition.
  • Product 1 was obtained
  • Adhesive composition 2 2-hydroxyhexyl acrylate (69 mol%), 2-hydroxyethyl acrylate (29 mol%) and a methacrylic acid (2 mol%) copolymer of 2-hydroxyethyl acrylate side chain terminal hydroxyl group and 2-methacryloyloxyethyl isocyanate By reacting the isocyanate group, an acrylic copolymer having a photocurable carbon-carbon double bond was obtained.
  • Example 1 to 3, 6, 7 and Comparative Examples 1 and 2 In Examples 1 to 3, 7 and Comparative Example 1, styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (trade name “Septon KF-2104” manufactured by Kuraray Co., Ltd.) and homopropylene (PP) (Ube) Manufactured by Kosan Co., Ltd., trade name “J-105G”) at a blending ratio shown in Table 1, and processed by film extrusion at about 200 ° C. with a twin-screw kneader to form a base resin film having a thickness of 100 ⁇ m. Manufactured.
  • SEPS styrene-hydrogenated isoprene-styrene block copolymer
  • PP homopropylene
  • Example 6 a styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (manufactured by Kuraray Co., Ltd., trade name “Septon KF-2104”) of 30 ⁇ m was prepared.
  • This resin film is used as an intermediate layer, and styrene-hydrogenated isoprene-styrene block copolymer (SEPS) is added to 100 parts by mass of homopropylene (PP) (trade name “J-105G”, manufactured by Ube Industries) on both sides of the resin film.
  • PP homopropylene
  • the pressure-sensitive adhesive composition 1 was applied to a thickness of 10 ⁇ m and then cured to form a pressure-sensitive adhesive layer.
  • Examples 1 to 3, 6 , 7 and Comparative Examples 1 and 2 were prepared as pressure-sensitive adhesive sheets for attaching wafers.
  • Example 4 and 5 instead of the styrene-hydrogenated isoprene-styrene block copolymer (SEPS), a pressure-sensitive adhesive sheet for wafer sticking, which was carried out in the same manner as in Example 1, except that the following copolymers were mixed in the mixing ratios shown in Table 1, respectively.
  • SEPS Styrene-hydrogenated butadiene-styrene copolymer
  • SEEPS Styrene-hydrogenated isoprene / butadiene-styrene copolymer
  • SEEPS Styrene-hydrogenated isoprene / butadiene-styrene copolymer
  • Example 8 The pressure-sensitive adhesive composition 2 was applied to one surface of the base resin film produced in Example 1 to a thickness of 10 ⁇ m, and then cured to form a pressure-sensitive adhesive layer. A pressure-sensitive adhesive sheet for wafer sticking was produced.
  • Example 9 ⁇ Production of die bond film> 50 parts by mass of a cresol novolac type epoxy resin (epoxy equivalent 197, molecular weight 1200, softening point 70 ° C.) as an epoxy resin, 1.5 parts by mass of ⁇ -mercaptopropyltrimethoxysilane as a silane coupling agent, ⁇ -ureidopropyltriethoxysilane 3 parts by mass and 30 parts by mass of silica filler having an average particle diameter of 16 nm were blended, cyclohexanone was added and stirred and mixed, and further kneaded for 90 minutes using a bead mill.
  • a cresol novolac type epoxy resin epoxy equivalent 197, molecular weight 1200, softening point 70 ° C.
  • a surface gold-deposited silicon wafer having a diameter of 6 inches and a thickness of 350 ⁇ m was pasted on the pressure-sensitive adhesive layer or adhesive layer of the pressure-sensitive adhesive sheet to be adhered to the wafers of Examples 1 to 9 and Comparative Examples 1 and 2, and a dicing apparatus (DISCO Dicing was performed using a DAD-340) manufactured by the company so that the chip size was 5 mm square.
  • the dicing conditions are: a rotating round blade rotation speed: 40000 rpm, a cutting speed: 100 mm / s, and a cutting water flow rate of 20 mL.
  • the depth which a rotary round blade cuts into an adhesive sheet in the case of dicing was performed so that it might be set to 30 micrometers.
  • Test pieces having a width of 5 mm and a length of 10 mm were cut out from the adhesive sheets for sticking wafers of Examples 1 to 9 and Comparative Examples 1 and 2.
  • the test piece is fixed to a supporting jig of a dynamic viscoelasticity measuring apparatus (Rheogel-E4000, manufactured by UBM), measured at a temperature of 23 ° C. and a frequency of 400 to 900 Hz, and has a minimum loss coefficient within that range. Got the value.
  • Rogel-E4000 dynamic viscoelasticity measuring apparatus
  • test pieces of 5 mm width ⁇ 10 mm length cut out from the adhesive sheets for attaching wafers of Examples 1 to 7 and Comparative Examples 1 and 2 were similarly fixed to the supporting jig of the dynamic viscoelasticity measuring apparatus. Then, measurement was performed at a frequency of 650 Hz and a temperature of 15 to 40 ° C., and the minimum value of the loss coefficient within the range was obtained.
  • Chipability The wafer was mounted on the adhesive sheet for attaching wafers of Examples 1 to 9 and Comparative Examples 1 and 2, and dicing was performed. After that, UV irradiation was performed (500 mJ / m 2 ), 50 chips were randomly taken out from one wafer, and the maximum chipping size on each side of the chip back surface (adhesive surface) was measured with a microscope (100 to 200 times). The average of all values was calculated.
  • the wafer was mounted on the adhesive sheet for attaching wafers of Examples 1 to 9 and Comparative Examples 1 and 2, and dicing was performed. Thereafter, ultraviolet irradiation was performed (500 mJ / m 2 ), and using an expanding apparatus (trade name “TEX-218G” manufactured by Technovision), the adhesive sheet was evaluated for the presence or absence of breakage.
  • the particle diameter of the dispersed phase in the field of view (200 nm ⁇ 200 nm) of the transmission electron microscope was measured, and the average value was obtained.
  • the average diameter of the SEPS in Example 1 was 21 nm.
  • the average diameter of SEPS of Example 2 was 19 nm.
  • the average diameter of Example 3 was 18 nm.
  • the adhesive sheets for attaching wafers of Examples 1 to 9 can greatly reduce the size of chipping to 1 ⁇ 2 or less compared to the adhesive sheets for attaching wafers of Comparative Examples 1 and 2, and are expanded. Also showed good performance.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013072036A (ja) * 2011-09-28 2013-04-22 Furukawa Electric Co Ltd:The 脆性ウェハ加工用粘着テープ及びそれを用いた研削方法
KR20140019355A (ko) * 2011-05-17 2014-02-14 린텍 코포레이션 필름 및 점착 시트
JP2015530702A (ja) * 2012-08-03 2015-10-15 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止方法
JP2015185591A (ja) * 2014-03-20 2015-10-22 日立化成株式会社 ウエハ加工用テープ
WO2016093308A1 (ja) * 2014-12-12 2016-06-16 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
TWI555806B (zh) * 2014-10-20 2016-11-01 積水化成品工業股份有限公司 有接著用途之黏著性凝膠片、其製造方法、一對被接著體之固定方法及複合材料
JPWO2014129469A1 (ja) * 2013-02-22 2017-02-02 デンカ株式会社 粘着シート、及び粘着シートを用いた電子部品の製造方法
JP2017057341A (ja) * 2015-09-18 2017-03-23 住友ベークライト株式会社 仮固定用テープ
WO2017170437A1 (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 半導体加工用粘着シート
WO2017168830A1 (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 電子デバイスパッケージ用テープ
WO2018105613A1 (ja) * 2016-12-07 2018-06-14 古河電気工業株式会社 半導体加工用テープ
CN108207116A (zh) * 2016-03-31 2018-06-26 古河电气工业株式会社 半导体加工用粘合片
JP2018165293A (ja) * 2017-03-28 2018-10-25 古河電気工業株式会社 粘着テープ
JP2018195616A (ja) * 2017-05-12 2018-12-06 古河電気工業株式会社 半導体加工用粘着テープ
KR20190059935A (ko) * 2016-10-27 2019-05-31 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법, 전자 장치 제조용 점착성 필름 및 전자 부품 시험 장치
JP2020036007A (ja) * 2018-08-23 2020-03-05 東レ株式会社 フィルム、及びフィルムの製造方法
EP3533850A4 (en) * 2016-10-27 2020-06-17 Mitsui Chemicals Tohcello, Inc. ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TEST DEVICE

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101659057B1 (ko) * 2013-09-30 2016-09-22 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6280459B2 (ja) * 2014-06-27 2018-02-14 株式会社ディスコ テープ拡張装置
JP7430853B2 (ja) * 2019-05-28 2024-02-14 シーカ テクノロジー アクチェンゲゼルシャフト 接着剤の選定方法および接着複合体並びに接着複合体の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155249A (ja) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP2003092273A (ja) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd 半導体ウエハ用ダイシングフィルム
JP2007335467A (ja) * 2006-06-12 2007-12-27 Furukawa Electric Co Ltd:The レーザーダイシング用ダイシングテープ
JP2008066688A (ja) * 2006-08-11 2008-03-21 Furukawa Electric Co Ltd:The ウェハ加工用テープ
JP2008103655A (ja) * 2006-09-20 2008-05-01 Furukawa Electric Co Ltd:The ウエハ貼着用貼着シートおよびウエハの加工方法
WO2009063793A1 (ja) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ
WO2009078440A1 (ja) * 2007-12-18 2009-06-25 The Furukawa Electric Co., Ltd. ウエハ貼着用粘着シートおよびウエハの加工方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155249A (ja) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP2003092273A (ja) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd 半導体ウエハ用ダイシングフィルム
JP2007335467A (ja) * 2006-06-12 2007-12-27 Furukawa Electric Co Ltd:The レーザーダイシング用ダイシングテープ
JP2008066688A (ja) * 2006-08-11 2008-03-21 Furukawa Electric Co Ltd:The ウェハ加工用テープ
JP2008103655A (ja) * 2006-09-20 2008-05-01 Furukawa Electric Co Ltd:The ウエハ貼着用貼着シートおよびウエハの加工方法
WO2009063793A1 (ja) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ
WO2009078440A1 (ja) * 2007-12-18 2009-06-25 The Furukawa Electric Co., Ltd. ウエハ貼着用粘着シートおよびウエハの加工方法

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KR20140019355A (ko) * 2011-05-17 2014-02-14 린텍 코포레이션 필름 및 점착 시트
JP2013072036A (ja) * 2011-09-28 2013-04-22 Furukawa Electric Co Ltd:The 脆性ウェハ加工用粘着テープ及びそれを用いた研削方法
JP2015530702A (ja) * 2012-08-03 2015-10-15 エルジー・ケム・リミテッド 接着フィルム及びこれを利用した有機電子装置の封止方法
US9343697B2 (en) 2012-08-03 2016-05-17 Lg Chem, Ltd. Adhesive film and sealing method for organic electronic device using same
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