JPWO2011004825A1 - ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 - Google Patents
ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 Download PDFInfo
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- JPWO2011004825A1 JPWO2011004825A1 JP2011521930A JP2011521930A JPWO2011004825A1 JP WO2011004825 A1 JPWO2011004825 A1 JP WO2011004825A1 JP 2011521930 A JP2011521930 A JP 2011521930A JP 2011521930 A JP2011521930 A JP 2011521930A JP WO2011004825 A1 JPWO2011004825 A1 JP WO2011004825A1
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- wafer
- styrene
- adhesive sheet
- pressure
- resin film
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- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical group CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
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- 229920002601 oligoester Polymers 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920001384 propylene homopolymer Polymers 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
- C09J2453/006—Presence of block copolymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009162009 | 2009-07-08 | ||
| JP2009162009 | 2009-07-08 | ||
| PCT/JP2010/061485 WO2011004825A1 (ja) | 2009-07-08 | 2010-07-06 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2011004825A1 true JPWO2011004825A1 (ja) | 2012-12-20 |
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Family Applications (1)
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| JP2011521930A Pending JPWO2011004825A1 (ja) | 2009-07-08 | 2010-07-06 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2011004825A1 (zh) |
| KR (1) | KR101336430B1 (zh) |
| CN (1) | CN102473617B (zh) |
| MY (1) | MY154860A (zh) |
| TW (1) | TWI447202B (zh) |
| WO (1) | WO2011004825A1 (zh) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6058534B2 (ja) * | 2011-05-17 | 2017-01-11 | リンテック株式会社 | フィルムおよび粘着シート |
| JP5546518B2 (ja) * | 2011-09-28 | 2014-07-09 | 古河電気工業株式会社 | 脆性ウェハ裏面研削用粘着テープ及びそれを用いた研削方法 |
| WO2014021698A1 (ko) * | 2012-08-03 | 2014-02-06 | 주식회사 엘지화학 | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
| JP6373251B2 (ja) * | 2013-02-22 | 2018-08-15 | デンカ株式会社 | 粘着シートを用いた電子部品の製造方法 |
| KR101659057B1 (ko) * | 2013-09-30 | 2016-09-22 | 주식회사 엘지화학 | 다이싱 필름 및 다이싱 다이본딩 필름 |
| JP6264126B2 (ja) * | 2014-03-20 | 2018-01-24 | 日立化成株式会社 | ウエハ加工用テープ |
| JP6068386B2 (ja) * | 2014-03-31 | 2017-01-25 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
| JP6280459B2 (ja) * | 2014-06-27 | 2018-02-14 | 株式会社ディスコ | テープ拡張装置 |
| US20180230337A1 (en) * | 2014-10-20 | 2018-08-16 | Sekisui Plastics Co., Ltd. | Tacky gel sheet having adhesive applications, method for producing same, method for fixing a pair of objects, and composite material |
| JP6445315B2 (ja) * | 2014-12-12 | 2018-12-26 | 日東電工株式会社 | ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
| JP6623639B2 (ja) * | 2015-09-18 | 2019-12-25 | 住友ベークライト株式会社 | 仮固定用テープ |
| JP6310492B2 (ja) * | 2016-03-31 | 2018-04-11 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
| SG11201800287UA (en) * | 2016-03-31 | 2018-02-27 | Furukawa Electric Co Ltd | Removable adhesive sheet for semiconductor processing |
| WO2017170436A1 (ja) * | 2016-03-31 | 2017-10-05 | 古河電気工業株式会社 | 半導体加工用粘着シート |
| WO2018079552A1 (ja) | 2016-10-27 | 2018-05-03 | 三井化学東セロ株式会社 | 電子装置の製造方法、電子装置製造用粘着性フィルムおよび電子部品試験装置 |
| SG11201903703WA (en) * | 2016-10-27 | 2019-05-30 | Mitsui Chemicals Tohcello Inc | Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus |
| WO2018105613A1 (ja) * | 2016-12-07 | 2018-06-14 | 古河電気工業株式会社 | 半導体加工用テープ |
| JP6800062B2 (ja) * | 2017-03-28 | 2020-12-16 | 古河電気工業株式会社 | 粘着テープ |
| JP6535047B2 (ja) * | 2017-05-12 | 2019-06-26 | 古河電気工業株式会社 | 半導体加工用粘着テープ |
| JP7400263B2 (ja) * | 2018-08-23 | 2023-12-19 | 東レ株式会社 | フィルム、及びフィルムの製造方法 |
| JP7430853B2 (ja) * | 2019-05-28 | 2024-02-14 | シーカ テクノロジー アクチェンゲゼルシャフト | 接着剤の選定方法および接着複合体並びに接着複合体の製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002155249A (ja) * | 2000-11-22 | 2002-05-28 | Mitsui Chemicals Inc | ウエハ加工用粘着テープ及びその製造方法並びに使用方法 |
| JP2008066688A (ja) * | 2006-08-11 | 2008-03-21 | Furukawa Electric Co Ltd:The | ウェハ加工用テープ |
| WO2009063793A1 (ja) * | 2007-11-15 | 2009-05-22 | The Furukawa Electric Co., Ltd. | 半導体ウエハ加工用粘着テープ |
| WO2009078440A1 (ja) * | 2007-12-18 | 2009-06-25 | The Furukawa Electric Co., Ltd. | ウエハ貼着用粘着シートおよびウエハの加工方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003092273A (ja) * | 2001-09-19 | 2003-03-28 | Mitsubishi Plastics Ind Ltd | 半導体ウエハ用ダイシングフィルム |
| JP4851246B2 (ja) | 2006-06-12 | 2012-01-11 | 古河電気工業株式会社 | ポリプロピレンに水素添加したスチレン・ブタジエン共重合体を加えた相分離構造を有する組成物を基材とするレーザーダイシング用ダイシングテープ。 |
| JP5019580B2 (ja) * | 2006-09-20 | 2012-09-05 | 古河電気工業株式会社 | ウエハ貼着用貼着シートおよびウエハの加工方法 |
-
2010
- 2010-07-06 WO PCT/JP2010/061485 patent/WO2011004825A1/ja active Application Filing
- 2010-07-06 CN CN201080030584.7A patent/CN102473617B/zh active Active
- 2010-07-06 KR KR1020117030393A patent/KR101336430B1/ko active IP Right Grant
- 2010-07-06 MY MYPI2012000033A patent/MY154860A/en unknown
- 2010-07-06 JP JP2011521930A patent/JPWO2011004825A1/ja active Pending
- 2010-07-07 TW TW099122289A patent/TWI447202B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002155249A (ja) * | 2000-11-22 | 2002-05-28 | Mitsui Chemicals Inc | ウエハ加工用粘着テープ及びその製造方法並びに使用方法 |
| JP2008066688A (ja) * | 2006-08-11 | 2008-03-21 | Furukawa Electric Co Ltd:The | ウェハ加工用テープ |
| WO2009063793A1 (ja) * | 2007-11-15 | 2009-05-22 | The Furukawa Electric Co., Ltd. | 半導体ウエハ加工用粘着テープ |
| WO2009078440A1 (ja) * | 2007-12-18 | 2009-06-25 | The Furukawa Electric Co., Ltd. | ウエハ貼着用粘着シートおよびウエハの加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011004825A1 (ja) | 2011-01-13 |
| KR101336430B1 (ko) | 2013-12-04 |
| MY154860A (en) | 2015-08-14 |
| TW201118146A (en) | 2011-06-01 |
| CN102473617A (zh) | 2012-05-23 |
| KR20120023811A (ko) | 2012-03-13 |
| CN102473617B (zh) | 2015-04-29 |
| TWI447202B (zh) | 2014-08-01 |
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