MY154860A - Adhesive sheet for wafer bonding and method of processing a wafer by using the same - Google Patents

Adhesive sheet for wafer bonding and method of processing a wafer by using the same

Info

Publication number
MY154860A
MY154860A MYPI2012000033A MYPI2012000033A MY154860A MY 154860 A MY154860 A MY 154860A MY PI2012000033 A MYPI2012000033 A MY PI2012000033A MY PI2012000033 A MYPI2012000033 A MY PI2012000033A MY 154860 A MY154860 A MY 154860A
Authority
MY
Malaysia
Prior art keywords
wafer
adhesive sheet
processing
same
wafer bonding
Prior art date
Application number
MYPI2012000033A
Other languages
English (en)
Inventor
Ota Satoshi
Yabuki Akira
Yano Shozo
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY154860A publication Critical patent/MY154860A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C09J2453/006—Presence of block copolymer in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
MYPI2012000033A 2009-07-08 2010-07-06 Adhesive sheet for wafer bonding and method of processing a wafer by using the same MY154860A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009162009 2009-07-08

Publications (1)

Publication Number Publication Date
MY154860A true MY154860A (en) 2015-08-14

Family

ID=43429249

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012000033A MY154860A (en) 2009-07-08 2010-07-06 Adhesive sheet for wafer bonding and method of processing a wafer by using the same

Country Status (6)

Country Link
JP (1) JPWO2011004825A1 (zh)
KR (1) KR101336430B1 (zh)
CN (1) CN102473617B (zh)
MY (1) MY154860A (zh)
TW (1) TWI447202B (zh)
WO (1) WO2011004825A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101883648B1 (ko) * 2011-05-17 2018-07-31 린텍 코포레이션 필름 및 점착 시트
JP5546518B2 (ja) * 2011-09-28 2014-07-09 古河電気工業株式会社 脆性ウェハ裏面研削用粘着テープ及びそれを用いた研削方法
CN104488107B (zh) * 2012-08-03 2016-10-19 Lg化学株式会社 粘合膜以及使用该粘合膜的有机电子装置的封装方法
WO2014129469A1 (ja) * 2013-02-22 2014-08-28 電気化学工業株式会社 粘着シート、及び粘着シートを用いた電子部品の製造方法
KR101659057B1 (ko) * 2013-09-30 2016-09-22 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
JP6264126B2 (ja) * 2014-03-20 2018-01-24 日立化成株式会社 ウエハ加工用テープ
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6280459B2 (ja) * 2014-06-27 2018-02-14 株式会社ディスコ テープ拡張装置
CN107109144A (zh) * 2014-10-20 2017-08-29 积水化成品工业株式会社 具有粘接用途的粘合性凝胶片、其制造方法、一对被粘物的固定方法及复合材料
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6623639B2 (ja) * 2015-09-18 2019-12-25 住友ベークライト株式会社 仮固定用テープ
KR102355077B1 (ko) * 2016-03-31 2022-01-25 후루카와 덴키 고교 가부시키가이샤 반도체 가공용 점착 시트
JP6310492B2 (ja) * 2016-03-31 2018-04-11 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6606191B2 (ja) * 2016-03-31 2019-11-13 古河電気工業株式会社 半導体加工用粘着シート
KR102243345B1 (ko) * 2016-10-27 2021-04-21 미쓰이 가가쿠 토세로 가부시키가이샤 전자 장치의 제조 방법, 전자 장치 제조용 점착성 필름 및 전자 부품 시험 장치
SG11201903703WA (en) * 2016-10-27 2019-05-30 Mitsui Chemicals Tohcello Inc Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus
KR102319730B1 (ko) 2016-12-07 2021-11-02 후루카와 덴키 고교 가부시키가이샤 반도체 가공용 테이프
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
JP6535047B2 (ja) * 2017-05-12 2019-06-26 古河電気工業株式会社 半導体加工用粘着テープ
JP7400263B2 (ja) * 2018-08-23 2023-12-19 東レ株式会社 フィルム、及びフィルムの製造方法
JP7430853B2 (ja) * 2019-05-28 2024-02-14 シーカ テクノロジー アクチェンゲゼルシャフト 接着剤の選定方法および接着複合体並びに接着複合体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780828B2 (ja) * 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP2003092273A (ja) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd 半導体ウエハ用ダイシングフィルム
JP4851246B2 (ja) * 2006-06-12 2012-01-11 古河電気工業株式会社 ポリプロピレンに水素添加したスチレン・ブタジエン共重合体を加えた相分離構造を有する組成物を基材とするレーザーダイシング用ダイシングテープ。
JP2008066688A (ja) * 2006-08-11 2008-03-21 Furukawa Electric Co Ltd:The ウェハ加工用テープ
JP5019580B2 (ja) * 2006-09-20 2012-09-05 古河電気工業株式会社 ウエハ貼着用貼着シートおよびウエハの加工方法
WO2009063793A1 (ja) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. 半導体ウエハ加工用粘着テープ
WO2009078440A1 (ja) * 2007-12-18 2009-06-25 The Furukawa Electric Co., Ltd. ウエハ貼着用粘着シートおよびウエハの加工方法

Also Published As

Publication number Publication date
TW201118146A (en) 2011-06-01
KR20120023811A (ko) 2012-03-13
CN102473617A (zh) 2012-05-23
CN102473617B (zh) 2015-04-29
KR101336430B1 (ko) 2013-12-04
JPWO2011004825A1 (ja) 2012-12-20
WO2011004825A1 (ja) 2011-01-13
TWI447202B (zh) 2014-08-01

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