KR101336430B1 - 웨이퍼 첩착용 점착시트 및 이를 이용한 웨이퍼의 가공방법 - Google Patents
웨이퍼 첩착용 점착시트 및 이를 이용한 웨이퍼의 가공방법 Download PDFInfo
- Publication number
- KR101336430B1 KR101336430B1 KR1020117030393A KR20117030393A KR101336430B1 KR 101336430 B1 KR101336430 B1 KR 101336430B1 KR 1020117030393 A KR1020117030393 A KR 1020117030393A KR 20117030393 A KR20117030393 A KR 20117030393A KR 101336430 B1 KR101336430 B1 KR 101336430B1
- Authority
- KR
- South Korea
- Prior art keywords
- styrene
- wafer
- adhesive sheet
- resin film
- adhesive
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
- C09J2453/006—Presence of block copolymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009162009 | 2009-07-08 | ||
JPJP-P-2009-162009 | 2009-07-08 | ||
PCT/JP2010/061485 WO2011004825A1 (ja) | 2009-07-08 | 2010-07-06 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120023811A KR20120023811A (ko) | 2012-03-13 |
KR101336430B1 true KR101336430B1 (ko) | 2013-12-04 |
Family
ID=43429249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117030393A KR101336430B1 (ko) | 2009-07-08 | 2010-07-06 | 웨이퍼 첩착용 점착시트 및 이를 이용한 웨이퍼의 가공방법 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPWO2011004825A1 (zh) |
KR (1) | KR101336430B1 (zh) |
CN (1) | CN102473617B (zh) |
MY (1) | MY154860A (zh) |
TW (1) | TWI447202B (zh) |
WO (1) | WO2011004825A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101883648B1 (ko) * | 2011-05-17 | 2018-07-31 | 린텍 코포레이션 | 필름 및 점착 시트 |
JP5546518B2 (ja) * | 2011-09-28 | 2014-07-09 | 古河電気工業株式会社 | 脆性ウェハ裏面研削用粘着テープ及びそれを用いた研削方法 |
CN104488107B (zh) * | 2012-08-03 | 2016-10-19 | Lg化学株式会社 | 粘合膜以及使用该粘合膜的有机电子装置的封装方法 |
WO2014129469A1 (ja) * | 2013-02-22 | 2014-08-28 | 電気化学工業株式会社 | 粘着シート、及び粘着シートを用いた電子部品の製造方法 |
KR101659057B1 (ko) * | 2013-09-30 | 2016-09-22 | 주식회사 엘지화학 | 다이싱 필름 및 다이싱 다이본딩 필름 |
JP6264126B2 (ja) * | 2014-03-20 | 2018-01-24 | 日立化成株式会社 | ウエハ加工用テープ |
JP6068386B2 (ja) * | 2014-03-31 | 2017-01-25 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP6280459B2 (ja) * | 2014-06-27 | 2018-02-14 | 株式会社ディスコ | テープ拡張装置 |
CN107109144A (zh) * | 2014-10-20 | 2017-08-29 | 积水化成品工业株式会社 | 具有粘接用途的粘合性凝胶片、其制造方法、一对被粘物的固定方法及复合材料 |
JP6445315B2 (ja) * | 2014-12-12 | 2018-12-26 | 日東電工株式会社 | ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP6623639B2 (ja) * | 2015-09-18 | 2019-12-25 | 住友ベークライト株式会社 | 仮固定用テープ |
KR102355077B1 (ko) * | 2016-03-31 | 2022-01-25 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 가공용 점착 시트 |
JP6310492B2 (ja) * | 2016-03-31 | 2018-04-11 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
JP6606191B2 (ja) * | 2016-03-31 | 2019-11-13 | 古河電気工業株式会社 | 半導体加工用粘着シート |
KR102243345B1 (ko) * | 2016-10-27 | 2021-04-21 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 전자 장치의 제조 방법, 전자 장치 제조용 점착성 필름 및 전자 부품 시험 장치 |
SG11201903703WA (en) * | 2016-10-27 | 2019-05-30 | Mitsui Chemicals Tohcello Inc | Method for manufacturing electronic apparatus, adhesive film for manufacturing electronic apparatus, and electronic component testing apparatus |
KR102319730B1 (ko) | 2016-12-07 | 2021-11-02 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 가공용 테이프 |
JP6800062B2 (ja) * | 2017-03-28 | 2020-12-16 | 古河電気工業株式会社 | 粘着テープ |
JP6535047B2 (ja) * | 2017-05-12 | 2019-06-26 | 古河電気工業株式会社 | 半導体加工用粘着テープ |
JP7400263B2 (ja) * | 2018-08-23 | 2023-12-19 | 東レ株式会社 | フィルム、及びフィルムの製造方法 |
JP7430853B2 (ja) * | 2019-05-28 | 2024-02-14 | シーカ テクノロジー アクチェンゲゼルシャフト | 接着剤の選定方法および接着複合体並びに接着複合体の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002155249A (ja) | 2000-11-22 | 2002-05-28 | Mitsui Chemicals Inc | ウエハ加工用粘着テープ及びその製造方法並びに使用方法 |
JP2007335467A (ja) | 2006-06-12 | 2007-12-27 | Furukawa Electric Co Ltd:The | レーザーダイシング用ダイシングテープ |
JP2008066688A (ja) * | 2006-08-11 | 2008-03-21 | Furukawa Electric Co Ltd:The | ウェハ加工用テープ |
WO2009078440A1 (ja) * | 2007-12-18 | 2009-06-25 | The Furukawa Electric Co., Ltd. | ウエハ貼着用粘着シートおよびウエハの加工方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003092273A (ja) * | 2001-09-19 | 2003-03-28 | Mitsubishi Plastics Ind Ltd | 半導体ウエハ用ダイシングフィルム |
JP5019580B2 (ja) * | 2006-09-20 | 2012-09-05 | 古河電気工業株式会社 | ウエハ貼着用貼着シートおよびウエハの加工方法 |
WO2009063793A1 (ja) * | 2007-11-15 | 2009-05-22 | The Furukawa Electric Co., Ltd. | 半導体ウエハ加工用粘着テープ |
-
2010
- 2010-07-06 MY MYPI2012000033A patent/MY154860A/en unknown
- 2010-07-06 KR KR1020117030393A patent/KR101336430B1/ko active IP Right Grant
- 2010-07-06 WO PCT/JP2010/061485 patent/WO2011004825A1/ja active Application Filing
- 2010-07-06 CN CN201080030584.7A patent/CN102473617B/zh active Active
- 2010-07-06 JP JP2011521930A patent/JPWO2011004825A1/ja active Pending
- 2010-07-07 TW TW099122289A patent/TWI447202B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002155249A (ja) | 2000-11-22 | 2002-05-28 | Mitsui Chemicals Inc | ウエハ加工用粘着テープ及びその製造方法並びに使用方法 |
JP2007335467A (ja) | 2006-06-12 | 2007-12-27 | Furukawa Electric Co Ltd:The | レーザーダイシング用ダイシングテープ |
JP2008066688A (ja) * | 2006-08-11 | 2008-03-21 | Furukawa Electric Co Ltd:The | ウェハ加工用テープ |
WO2009078440A1 (ja) * | 2007-12-18 | 2009-06-25 | The Furukawa Electric Co., Ltd. | ウエハ貼着用粘着シートおよびウエハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
MY154860A (en) | 2015-08-14 |
TW201118146A (en) | 2011-06-01 |
KR20120023811A (ko) | 2012-03-13 |
CN102473617A (zh) | 2012-05-23 |
CN102473617B (zh) | 2015-04-29 |
JPWO2011004825A1 (ja) | 2012-12-20 |
WO2011004825A1 (ja) | 2011-01-13 |
TWI447202B (zh) | 2014-08-01 |
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