WO2011001713A1 - Bande de protection pour placage - Google Patents

Bande de protection pour placage Download PDF

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Publication number
WO2011001713A1
WO2011001713A1 PCT/JP2010/053779 JP2010053779W WO2011001713A1 WO 2011001713 A1 WO2011001713 A1 WO 2011001713A1 JP 2010053779 W JP2010053779 W JP 2010053779W WO 2011001713 A1 WO2011001713 A1 WO 2011001713A1
Authority
WO
WIPO (PCT)
Prior art keywords
plating
sensitive adhesive
pressure
protective tape
photopolymerization initiator
Prior art date
Application number
PCT/JP2010/053779
Other languages
English (en)
Japanese (ja)
Inventor
杉田大平
炭井佑一
村山浩
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to JP2010511002A priority Critical patent/JPWO2011001713A1/ja
Publication of WO2011001713A1 publication Critical patent/WO2011001713A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/31—Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68372—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support a device or wafer when forming electrical connections thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Abstract

L'invention porte sur une bande de protection pour placage, qui permet d'empêcher la survenue d'un défaut de placage et qui peut être facilement enlevée après utilisation. De façon spécifique, l'invention porte sur une bande de protection pour placage, qui est utilisée dans le but de protéger une surface qui ne doit pas être plaquée pendant un placage par un procédé de placage autocatalytique ou un procédé d'électroplacage. La bande de protection pour placage est composée d'une base et d'une couche adhésive qui est formée sur au moins une surface de la base et qui contient un adhésif photodurcissable et un initiateur de photopolymérisation. Si x représente la masse moléculaire de l'initiateur de photopolymérisation et y la quantité mélangée de l'initiateur de photopolymérisation pour 100 parties en poids de l'adhésif photodurcissable dans la couche adhésive (en parties en poids), x et y sont dans les intervalles indiqués par la ligne tiretée dans la fig. 1.
PCT/JP2010/053779 2009-06-29 2010-03-08 Bande de protection pour placage WO2011001713A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010511002A JPWO2011001713A1 (ja) 2009-06-29 2010-03-08 めっき保護テープ

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009-154003 2009-06-29
JP2009154003 2009-06-29
JP2009155972 2009-06-30
JP2009-155972 2009-06-30

Publications (1)

Publication Number Publication Date
WO2011001713A1 true WO2011001713A1 (fr) 2011-01-06

Family

ID=43410797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/053779 WO2011001713A1 (fr) 2009-06-29 2010-03-08 Bande de protection pour placage

Country Status (2)

Country Link
JP (2) JPWO2011001713A1 (fr)
WO (1) WO2011001713A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9447288B2 (en) 2011-09-29 2016-09-20 Lg Chem, Ltd. Anti-reflective coating composition providing improved scratch resistance, anti-reflective film using the same, and manufacturing method thereof
RU2672257C2 (ru) * 2014-09-26 2018-11-13 Чанчжоу Иньшэн Фармасьютикал Ко., Лтд. Аналог бензофурана в качестве ингибитора ns4b
JP2020158656A (ja) * 2019-03-27 2020-10-01 リンテック株式会社 ワーク加工用粘着シート

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110616053A (zh) * 2018-06-19 2019-12-27 无锡市祁达胶粘带有限公司 一种电镀贴膜胶粘剂配方及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06264033A (ja) * 1993-03-13 1994-09-20 Sony Chem Corp 光硬化型接着剤組成物
JPH06264036A (ja) * 1993-03-15 1994-09-20 Sony Chem Corp マスキングテープ及びそれを用いるプリント基板の製造方法
JPH1116863A (ja) * 1997-06-25 1999-01-22 Mitsui Chem Inc 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム
JP2003073629A (ja) * 2001-09-03 2003-03-12 Somar Corp 粘着組成物及び粘着シート
JP2006111651A (ja) * 2004-10-12 2006-04-27 Nippon Synthetic Chem Ind Co Ltd:The 粘着シート
JP2007070558A (ja) * 2005-09-09 2007-03-22 Toyo Ink Mfg Co Ltd 活性エネルギー線粘着力消失型感圧接着剤及びそれを用いた粘着シート
JP2008143924A (ja) * 2006-12-06 2008-06-26 Nitto Denko Corp 再剥離型粘着剤組成物、及び粘着テープ又はシート
JP2009001773A (ja) * 2007-05-21 2009-01-08 Sekisui Chem Co Ltd 半導体加工用テープ
JP2009035618A (ja) * 2007-08-01 2009-02-19 Toyo Ink Mfg Co Ltd 活性エネルギー線粘着力消失型粘着剤組成物および粘着テープ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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JPS61192724A (ja) * 1985-02-21 1986-08-27 Nippon Soda Co Ltd 光硬化性組成物
JP3073094B2 (ja) * 1992-03-28 2000-08-07 サンノプコ株式会社 感光性樹脂組成物
JP2002182387A (ja) * 2001-10-19 2002-06-26 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
WO2006008995A1 (fr) * 2004-07-15 2006-01-26 Taiyo Ink Manufacturing Co., Ltd. Composition de résine photodurcissable/thermoformable et produit polymerisé de ladite composition
JP2006220828A (ja) * 2005-02-09 2006-08-24 Tamura Kaken Co Ltd レジスト膜の露光方法
JP2008102327A (ja) * 2006-10-19 2008-05-01 Hitachi Chem Co Ltd 感光性樹脂組成物、この樹脂組成物を用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06264033A (ja) * 1993-03-13 1994-09-20 Sony Chem Corp 光硬化型接着剤組成物
JPH06264036A (ja) * 1993-03-15 1994-09-20 Sony Chem Corp マスキングテープ及びそれを用いるプリント基板の製造方法
JPH1116863A (ja) * 1997-06-25 1999-01-22 Mitsui Chem Inc 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム
JP2003073629A (ja) * 2001-09-03 2003-03-12 Somar Corp 粘着組成物及び粘着シート
JP2006111651A (ja) * 2004-10-12 2006-04-27 Nippon Synthetic Chem Ind Co Ltd:The 粘着シート
JP2007070558A (ja) * 2005-09-09 2007-03-22 Toyo Ink Mfg Co Ltd 活性エネルギー線粘着力消失型感圧接着剤及びそれを用いた粘着シート
JP2008143924A (ja) * 2006-12-06 2008-06-26 Nitto Denko Corp 再剥離型粘着剤組成物、及び粘着テープ又はシート
JP2009001773A (ja) * 2007-05-21 2009-01-08 Sekisui Chem Co Ltd 半導体加工用テープ
JP2009035618A (ja) * 2007-08-01 2009-02-19 Toyo Ink Mfg Co Ltd 活性エネルギー線粘着力消失型粘着剤組成物および粘着テープ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9447288B2 (en) 2011-09-29 2016-09-20 Lg Chem, Ltd. Anti-reflective coating composition providing improved scratch resistance, anti-reflective film using the same, and manufacturing method thereof
RU2672257C2 (ru) * 2014-09-26 2018-11-13 Чанчжоу Иньшэн Фармасьютикал Ко., Лтд. Аналог бензофурана в качестве ингибитора ns4b
JP2020158656A (ja) * 2019-03-27 2020-10-01 リンテック株式会社 ワーク加工用粘着シート
JP7401975B2 (ja) 2019-03-27 2023-12-20 リンテック株式会社 ワーク加工用粘着シート

Also Published As

Publication number Publication date
JPWO2011001713A1 (ja) 2012-12-13
JP2011026595A (ja) 2011-02-10

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