WO2010117081A1 - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物 Download PDFInfo
- Publication number
- WO2010117081A1 WO2010117081A1 PCT/JP2010/056628 JP2010056628W WO2010117081A1 WO 2010117081 A1 WO2010117081 A1 WO 2010117081A1 JP 2010056628 W JP2010056628 W JP 2010056628W WO 2010117081 A1 WO2010117081 A1 WO 2010117081A1
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- WIPO (PCT)
- Prior art keywords
- component
- epoxy resin
- resin composition
- post
- permeability
- Prior art date
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 56
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 52
- 239000002131 composite material Substances 0.000 title abstract 2
- 230000035699 permeability Effects 0.000 claims abstract description 23
- 230000009477 glass transition Effects 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 48
- 239000000843 powder Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- 125000003700 epoxy group Chemical group 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 229920000800 acrylic rubber Polymers 0.000 claims description 8
- 229920000058 polyacrylate Polymers 0.000 claims description 8
- 239000005062 Polybutadiene Substances 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 2
- 239000003566 sealing material Substances 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 description 15
- 238000005259 measurement Methods 0.000 description 15
- 239000005060 rubber Substances 0.000 description 15
- 239000012298 atmosphere Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 239000011256 inorganic filler Substances 0.000 description 12
- 229910003475 inorganic filler Inorganic materials 0.000 description 12
- 239000002245 particle Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 238000007792 addition Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- 150000007824 aliphatic compounds Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004283 Sodium sorbate Substances 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000001469 hydantoins Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004302 potassium sorbate Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention is a post-osmotic sealing suitable for sealing with a resin composition performed after a solder ball such as a chip size package (CSP), a ball grid array (BGA), or a wafer level (WL-CSP) is connected to a substrate electrode.
- a solder ball such as a chip size package (CSP), a ball grid array (BGA), or a wafer level (WL-CSP) is connected to a substrate electrode.
- CSP chip size package
- BGA ball grid array
- WL-CSP wafer level
- a sealing method In substrate mounting, a sealing method is used in which a solder ball and a substrate electrode are connected by a self-alignment effect of solder, and a curable resin composition is poured into a clearance through a cleaning process and then cured.
- This sealant is generally called an underfill agent, but its composition has been proven with epoxy resins.
- a urethane resin underfill agent as disclosed in JP-T-2003-504893 is also known. In the case of a urethane resin, since it is characterized by repairability, reliability may be low.
- a curable resin having a rubber skeleton or a curable resin added with rubber powder is used.
- JP 2001-270976 discloses a sealing epoxy resin to which rubber powder and an inorganic filler are added, and JP 9-153570 A adds a special butadiene copolymer powder and an inorganic filler.
- An epoxy resin for sealing is disclosed.
- Conventional underfill agents require inorganic fillers such as alumina and silica. Attempts have been made to lower the coefficient of linear expansion by adding an inorganic filler to reduce the expansion during heating, which is a drawback of organic materials. However, since the amount of the inorganic filler added increases, the viscosity increases and the permeability decreases.
- Japanese Patent Application Laid-Open No. 2008-208182 describes that acrylic rubber powder and silicone rubber powder are added simultaneously. It is also described that the characteristics are improved by adding an inorganic filler, and it is described that it is preferable to substantially add the two kinds of rubber powder and the inorganic filler together.
- JP 2007-246713 discloses a sealing epoxy resin for relays (relays) using a polyfunctional glycidylamine type epoxy resin. Although the use is similar to the underfill agent in terms of pouring into the gap, reliability is not required more than the mounting use of holding the connected electrode.
- the present inventor has found that the linear expansion coefficient ( ⁇ 1) of the cured product is 60 ppm / ° C. or less, the glass transition point: 120 ° C. or more, and the storage elastic modulus (25 ° C.): 3.0 GPa. It was as follows and the permeability before hardening (120 degreeC): It discovered that the epoxy resin composition which has a parameter of 30 mm or more was suitable for an underfill agent, and came to complete this invention.
- the first of the present invention is a post-penetration in which the linear expansion coefficient ( ⁇ 1), glass transition point, storage elastic modulus (25 ° C.), and permeability before curing (120 ° C.) of the cured product satisfy all the following requirements.
- An epoxy resin composition for mold sealing Linear expansion coefficient ( ⁇ 1): 60 ppm / ° C. or less Glass transition point: 120 ° C. or more Storage elastic modulus (25 ° C.): 3.0 GPa or less Permeability (120 ° C.): 30 mm or more
- a second aspect of the present invention is an epoxy resin composition for post-osmosis sealing according to the first aspect, comprising the following components (A) to (D).
- component (C) 3 to 10 parts by mass of component (C) is added to 100 parts by mass of component (A) and component (B), and a filler other than component (C) is substantially added.
- It is an epoxy resin composition for post-osmotic sealing as described in the second item above, which is not contained in the above.
- a fourth aspect of the present invention is the epoxy resin composition for post-osmosis sealing according to any one of the first to third aspects, which is substantially free of a liquid curing agent at room temperature.
- a post-penetration type underfill agent having resistance to a reliability test and having high permeability in a normal temperature (25 ° C.) atmosphere and a 120 ° C. atmosphere.
- FIG. 1 is a graph showing a continuity test result when a TEG using the underfill agent of the present invention was subjected to a heat cycle test.
- the main cured product characteristics of the underfill agent for mounting are a thermomechanical analyzer (TMA) for confirming the glass transition point (Tg) and the linear expansion coefficient ( ⁇ 1 on the low temperature side and ⁇ 2 on the high temperature side from the glass transition point)
- TMA thermomechanical analyzer
- the storage elastic modulus (E ′), loss elastic modulus (E ′′), glass transition point, and tan ⁇ are measured by a dynamic viscoelasticity measuring device (DMA).
- DMA dynamic viscoelasticity measuring device
- glass transition point by TMA
- line It has been found that a resin composition having specific cured product characteristics in terms of expansion coefficient ( ⁇ 1) and storage elastic modulus (E ′) at 25 ° C.
- a glass transition point is suitable for a post-penetration type underfill agent (hereinafter referred to as a glass transition point).
- a glass transition point Is a linear expansion coefficient at a lower temperature side than the glass transition point by TMA, and E ′ (25 ° C.) is a storage elastic modulus at 25 ° C. by DMA.)
- T It is preferable that g is 120 ° C. or more, ⁇ 1 is 60 ppm / ° C. or less, and E ′ is 3.0 GPa or less, particularly preferably E ′ (25 ° C.) is 2.5 GPa or less.
- the requirements are Tg of 120 to 200 ° C., ⁇ 1 of 10 to 60 ppm / ° C., and E ′ of 0.1 to 3.0 GPa
- the underfill agent has a high glass transition point and a method of reducing the linear expansion coefficient. This is to prevent the electronic circuit from being broken in the temperature range in the reliability test such as a high temperature storage test, a heat shock test, a high temperature and high humidity test, etc. Also, underfill due to thermal history. It is thought that the linear expansion coefficient is lowered so that the cured product of the agent does not expand, however, the cured product becomes brittle when a high glass transition point and low linear expansion coefficient are used.
- the present invention has one characteristic in that a cured product having low elasticity and following ability is obtained by reducing E ′ (25 ° C.).
- E ′ (25 ° C.) can be set to 1.0 GPa or less with a soft epoxy resin or a urethane resin, but Tg tends to be low and ⁇ 1 tends to be high, so Tg, ⁇ 1, E ′ It is necessary to satisfy the three parameters (25 ° C.)
- a parameter effective for fillet formation when the resin composition penetrates into the clearance of 100 to 300 ⁇ m sandwiched between the CSP and BGA and the substrate examples include permeability in an atmosphere of 120 ° C.
- the particularly preferable permeability is 30 to 60 mm.
- the component (A) that can be used in the present invention is a compound having two or more epoxy groups in one molecule, and is a compound generally called an epoxy resin. Only one type may be used, or two or more types may be mixed and used. Specific examples of the epoxy resin are those obtained by condensation of epichlorohydrin with polyhydric phenols such as bisphenols and polyhydric alcohols.
- bisphenol A type brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol F Type, bisphenol S type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, novolak type, phenol novolak type, orthocresol novolak type, tris (hydroxyphenyl) methane type, tetraphenylolethane type epoxy, etc.
- Resins can be exemplified.
- glycidyl ester type epoxy resins obtained by condensation of epichlorohydrin with carboxylic acids such as phthalic acid derivatives and fatty acids
- glycidyl amine type epoxy resins obtained by reaction of epichlorohydrin with amines, cyanuric acids, hydantoins, and various Examples thereof include, but are not limited to, epoxy resins modified by the method.
- the component (A) is preferably a compound having an average of about 2 epoxy groups in the molecule.
- Examples of commercially available component (A) include 827 and 828EL manufactured by Japan Epoxy Resin Co., Ltd., EPICLON 830 and EXA-835LV manufactured by Dainippon Ink Industries, Ltd., and the like. Examples include Etoto YD-128 and YDF-170 manufactured by Toto Kasei Co., Ltd., but are not limited thereto. Considering the price, an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton having an average of two epoxy groups in the molecule is preferable.
- the component (B) that can be used in the present invention is a compound having 3 or more epoxy groups and an aromatic ring in one molecule.
- the aromatic ring include a benzene ring, a naphthalene ring, and an aniline ring.
- Specific examples of the trifunctional component (B) include N, N-bis (2,3-epoxypropyl) -4- (2,3-epoxypropoxy) aniline and N, N-bis (2,3-epoxy). Propyl) -4- (2,3-epoxypropoxy) -2-methylaniline and the like.
- Specific examples of the tetrafunctional component (B) include diaminodiphenylmethane tetraglycidyl ether.
- the component (B) is preferably liquid at room temperature, but it can also be used by dissolving a solid compound in an epoxy resin as long as the viscosity and permeability are not hindered.
- the component (B) is preferably contained in an amount of 20 to 90% by weight of the entire epoxy resin, and the Tg tends to be increased by adding the component (B).
- a trifunctional or higher functional epoxy resin having no aromatic ring cannot increase Tg and is not suitable for the present invention.
- the component (C) that can be used in the present invention is butadiene rubber powder or acrylic rubber powder.
- monomers other than (meth) acrylic acid ester or butadiene may include styrene, isoprene, and the like.
- Specific examples of (meth) acrylic acid esters include MMA, but are not limited thereto.
- (meth) acrylic acid ester means acrylic acid ester or / and acrylic acid ester.
- the average particle diameter of the powder is preferably 0.05 to 0.5 ⁇ m, and the core-shell type (C) component is preferable in consideration of the viscosity change due to swelling.
- E ′ is lowered.
- the component (C) is most preferably rubber powder polymerized from butadiene.
- the component (C) dispersed in the epoxy resin in advance may be used.
- rubber particles dispersed in an epoxy resin by a mixing and stirring device such as hyper or homogenizer, and rubber particles synthesized by emulsion polymerization in an epoxy resin correspond to this.
- the average particle size of the rubber particles finally formed by the emulsion polymerization method is preferably 0.05 to 0.5 ⁇ m.
- acrylic rubber particles include MX series manufactured by Soken Chemical Co., Ltd., Metabrene W series manufactured by Mitsubishi Rayon Co., Ltd., and Zefiac Series manufactured by Zeon Kasei Co., Ltd.
- Specific examples of the epoxy resin in which rubber particles are dispersed in advance include RKB series manufactured by Resinas Kasei Co., Ltd.
- Specific examples of the epoxy resin using emulsion polymerization include, but are not limited to, Akitare BP series manufactured by Nippon Shokubai Co., Ltd.
- Specific examples of the butadiene rubber particles include METABRENE E series and METABLEN C series manufactured by Mitsubishi Rayon Co., Ltd.
- Kaneace MX136 manufactured by Kaneka Corporation is exemplified as a dispersion of core-shell powder having butadiene rubber as a core, but is not limited thereto.
- the addition amount of the component (C) is preferably 10 parts by mass or less with respect to a total of 100 parts by mass of the component (A) and the component (B). More preferably, the addition amount of the component (C) is 3 to 10 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).
- the amount of component (C) added is more than 10 parts by mass, ⁇ 1 tends to increase, and when it is less than 3 parts by mass, E ′ (25 ° C.) tends to increase.
- inorganic fillers such as alumina, silica, calcium carbonate, etc.
- the inorganic filler when an inorganic filler is added, it is most preferable that the inorganic filler is not substantially contained in order to increase E ′.
- substantially free means that an inorganic filler is intentionally included in the case where impurities remaining in the raw material manufacturing process are included or E ′ (25 ° C.) falls within 3.0 GPa or less. When a very small amount is added, it means that the requirement is not met.
- the component (D) that can be used in the present invention includes a compound that can be used as a curing agent for an epoxy resin and pulverized into a powder.
- a curing agent that can ensure storage stability such as little change in viscosity and physical properties over time is latently cured.
- Specific examples include powdered imidazole derivatives, powdered dicyandiamide, and powders obtained by pulverizing an epoxy adduct compound in which a tertiary amine is added to an epoxy resin to stop the reaction. It is not limited.
- epoxy adduct compound those that are commercially available, such as Amimoto series manufactured by Ajinomoto Fine Techno Co., Fujicure series manufactured by Fuji Kasei Kogyo Co., Ltd., NovaCure series manufactured by Asahi Kasei Chemicals Co., Ltd., etc. Is mentioned. It is preferable to start the reaction at 120 ° C. or lower.
- Curing agents that are liquid at room temperature are also known as curing agents for epoxy resins.
- curing agent is also known as curing agents for epoxy resins.
- curing agent as a hardening accelerator is known.
- the liquid curing agent and the component (D) are combined, the permeability in an atmosphere at 120 ° C. is reduced.
- substantially free of liquid curing agent at room temperature means that it contains impurities remaining in the raw material production process, or even if a very small amount of liquid curing agent is intentionally added. In other words, it is out of the requirement that the reactivity is determined by a powder curing agent.
- the addition amount of the component (D) is preferably 10 to 40 parts by mass with respect to 100 parts by mass as the total of the components (A) and (B).
- the amount is less than 10 parts by mass, the curability is lowered, and when the amount is more than 40 parts by mass, the permeability may be lowered.
- the epoxy resin composition of the present invention includes colorants such as pigments and dyes, plasticizers, antioxidants, antifoaming agents, silane coupling agents, and leveling agents, as long as the intended effects of the present invention are not impaired.
- An appropriate amount of additives such as a rheology control agent may be blended.
- (A) component epoxy resin composition-bisphenol F type epoxy resin (made by jER806 Japan Epoxy Resin Co., Ltd.)
- Component (B) Compound having 3 or more epoxy groups and aromatic rings in one molecule ⁇ Compound having 3 or more epoxy groups and aromatic rings in one molecule (manufactured by jER630 Japan Epoxy Resin Co., Ltd.) ⁇ Compound having 3 or more epoxy groups and aromatic rings in one molecule (ELM-100, manufactured by Sumitomo Chemical Co., Ltd.)
- (C) component butadiene rubber powder or acrylic rubber powder ⁇ Butadiene rubber powder dispersed in an epoxy resin (rubber content: 25 mass%) (manufactured by Kaneace MX136 Kaneka Corporation) ⁇ Acrylic rubber powder (Zefiac F351 manufactured by Nippon Zeon Co., Ltd.) ⁇ Acrylic rubber powder (GENIOPERL P-52 Wacker Chemie)
- Component (D) Latent curing agent Amine adduct type cu
- viscosity measurement After the temperature of each epoxy resin composition reached room temperature, “viscosity (Pa ⁇ s)” was measured with a viscometer. The detailed measurement method is as follows. The results are summarized in Table 2. In the present invention, 4.0 Pa ⁇ s or less is suitable. Manufacturer: Toki Sangyo Co., Ltd. TV-33 type viscometer (EHD type) Measurement conditions Cone rotor: 3 ° ⁇ R14 Rotation speed: 5.0rpm Measurement temperature: 25 ° C (use of temperature controller)
- a permeability of 30 mm or more is suitable.
- Tg 120 ° C. or higher and ⁇ 1 of 60 ppm / ° C. or lower are suitable.
- ⁇ DMA measurement (E ′ (25 ° C.) measurement)>
- a cylindrical cured product having a diameter of 5 mm is prepared by curing for 15 minutes in an atmosphere of 120 ° C., and cut into a length of 30 mm. Measurement is performed in a bending mode, and the temperature is increased at a rate of temperature increase of 3 ° C./min. “Storage elastic modulus (GPa)” at 25 ° C. at a frequency of 1 Hz was confirmed.
- E ′ (25 ° C.) is suitably 3.0 GPa or less.
- E ′ 25 ° C.
- ⁇ 1 tends to increase.
- an aliphatic compound having 3 or more epoxy groups in one molecule is not suitable for the present invention because Tg is lowered.
- TEG test element group
- the performance as an underfill agent can be confirmed by a test element group (hereinafter referred to as TEG) in which a semiconductor and a substrate are electrically connected to each other.
- the bumps of the pseudo semiconductor and the pads of the pseudo substrate are electrically connected, and all the wiring inside the TEG is connected in a daisy chain shape.
- Conductivity is confirmed by applying the electrode of the tester to the external electrode on the pseudo substrate.
- An underfill agent is applied to the end portion of the TEG, and the underfill agent is penetrated into the clearance between the pseudo semiconductor and the pseudo substrate by a predetermined method to be cured.
- the electrical connection is not secured after the TEG sealed with the underfill agent is put into reliability tests such as heat shock test, heat cycle test, high temperature storage test, low temperature storage test, constant temperature and humidity test Resistance value is overloaded.
- reliability tests such as heat shock test, heat cycle test, high temperature storage test, low temperature storage test, constant temperature and humidity test Resistance value is overloaded.
- the TEG specifications, the curing conditions of the underfill agent, and the conditions of the heat cycle test conducted as a reliability test are as follows.
- TEG specification Chip specification Chip size 9.6mm x 9.6mm Chip thickness: 725 ⁇ m
- Bump material Sn / 3.0Ag / 0.5Cu Bump height: 245 ⁇ m
- Bump formation method Ball mounting Pattern specification Metal pad pitch: 500 ⁇ m Metal pad size: 300 ⁇ m ⁇ 300 ⁇ m Number of pads: 324 Underfill agent curing conditions (including penetration process) 120 ° C. ⁇ 15 minutes Heat cycle test 1 cycle: ⁇ 40 ⁇ 30 minutes + 85 ° C. ⁇ 30 minutes Total 2000 cycles Test piece number: 5 (hereinafter, test piece is referred to as TEG)
- the underfill agent used in the TEG continuity test has the characteristics shown in Table 4.
- Example 1 was used as the present invention.
- the products A to C are underfill agents corresponding to the comparative examples in the present invention.
- the result of the heat cycle test conducted under the above conditions is shown in FIG. It was taken out from the heat cycle tester at 25, 100, 200, 500, 750, 1000, 1500, and 2000 cycles, and the conductivity was confirmed by a tester after the test piece returned to room temperature. A test piece for which continuity was not ensured was judged to be “bad”.
- Example 1 the continuity is secured even after the end of 2000 cycles, and in the products A to C, TEGs in which the continuity is not ensured suddenly or gradually are generated. Although a pseudo test is performed using TEG, it can be seen that the underfill agent greatly affects the reliability of TEG.
- the epoxy resin composition of the present invention is an underfill agent that does not need to be left at room temperature after the sealing agent is applied, and can be immediately put into an atmosphere at 120 ° C., and an optimum fillet is formed. As a result, the line tact time is shortened and it is thought that it contributes to the improvement of production efficiency. Furthermore, the tolerance of the reliability test can be improved by setting the properties of the cured product within a certain range. In the future, downsizing of packages will progress and the demand for improved reliability of underfill agents will become even stronger. It is difficult to improve the reliability only by the conventional method of highly filling the inorganic filler, and it is possible to cope with downsizing by controlling the parameters of the epoxy resin.
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Abstract
Description
[発明の要約]
線膨張率(α1):60ppm/℃以下
ガラス転移点:120℃以上
貯蔵弾性率(25℃):3.0GPa以下
浸透性(120℃):30mm以上
(A)成分:エポキシ樹脂
(B)成分:1分子内に3個以上のエポキシ基と芳香環とを有する化合物
(C)成分:ブタジエンゴム粉またはアクリルゴム粉
(D)成分:潜在性硬化剤
本発明の第四は、室温で液状の硬化剤を実質的に含まない上記第一~第三に記載の後浸透封止用のエポキシ樹脂組成物である。
[実施例1~12]
実施例1~12を調製するために下記成分を準備した。
・ビスフェノールF型エポキシ樹脂(jER806 ジャパンエポキシレジン株式会社製)
(B)成分:1分子内に3以上のエポキシ基と芳香環を有する化合物
・1分子内に3以上のエポキシ基と芳香環を有する化合物(jER630 ジャパンエポキシレジン株式会社製)
・1分子内に3以上のエポキシ基と芳香環を有する化合物(ELM−100 住友化学株式会社製)
(C)成分:ブタジエンゴム粉またはアクリルゴム粉
・エポキシ樹脂に分散されたブタジエンゴム粉(ゴム含有率:25質量%)(カネエースMX136 カネカ株式会社製)
・アクリルゴム粉(ゼフィアック F351 日本ゼオン株式会社製)
・アクリルゴム粉(GENIOPERL P−52 WackerChemie製)
(D)成分:潜在性硬化剤
・アミンアダクト型硬化剤(フジキュアFXR−1030 富士化成工業株式会社製)
・アミンアダクト型硬化剤(フジキュアFXR−1081 富士化成工業株式会社製)
・アミンアダクト型硬化剤を分散したエポキシ樹脂(ノバキュアHX−3921HP 旭化成エポキシ株式会社製)
その他の成分
・シラン系カップリング剤(KBM−403 信越化学工業株式会社製)
・分散剤(BYK−352 ビックケミー・ジャパン株式会社製)
比較例1~8を調整するため、実施例1~12で使用する成分に加えて下記成分を準備した。
(B’):芳香環を有せず1分子内に3のエポキシ基を有する化合物
・1分子内に3のエポキシ基を有する脂肪族化合物(デナコールEX−321 ナガセケムテックス株式会社製)
その他の成分
・4−メチルヘキサヒドロ無水フタル酸/ヘキサヒドロ無水フタル酸=70/30(リカシッド MH−700 新日本理化株式会社)
・シリカ粉(QS−6 MRCユニテック株式会社製)
<粘度測定>
各エポキシ樹脂組成物の温度が室温になってから粘度計により「粘度(Pa・s)」を測定した。詳細な測定方法は以下の通り。その結果を表2にまとめた。本発明では4.0Pa・s以下が適している。
メーカー:東機産業株式会社 TV−33型粘度計(EHD型)
測定条件
コーンローター:3°×R14
回転速度:5.0rpm
測定温度:25℃(温調装置使用)
厚さ100μmの短冊状シックネスゲージを100mm×50mmのガラス板の短辺に平行して配置して、もう一枚のガラス板を若干ずらしてシックネスゲージを挟み込み、クリップでシックネスゲージがずれない様に固定する。ガラス板がずれた位置にエポキシ樹脂組成物を塗布した後、120℃雰囲気で15分放置してガラス板の端部から浸透した距離を確認して「浸透性(mm)」とした。その結果を表2にまとめた。浸透性が悪いと、フィレット(浸透後の組成物の形状)の形成が悪く、信頼性試験において応力が偏り封止剤に対する破壊や被着体との界面におけるはく離をもたらす恐れがある。本発明では、浸透性が30mm以上が適している。
120℃雰囲気で15分の硬化により直径5mmの円筒形硬化物を作成し、長さ10mmに切断する。TMAにより昇温速度10℃/minで昇温して測定を行った。「線膨張率(α1)(ppm/℃)」を測定し、α1とα2の接線の交点により「ガラス転移点(℃)」を測定した。本発明では、Tgが120℃以上、α1が60ppm/℃以下が適している。
120℃雰囲気で15分の硬化により直径5mmの円筒形硬化物を作成し、長さ30mmに切断する。曲げモードで測定を行い、昇温速度3℃/minで昇温する。周波数1Hzで25℃に於ける「貯蔵弾性率(GPa)」を確認した。本発明では、E’(25℃)は3.0GPa以下が適している。
ガラス繊維強化エポキシ樹脂製(FR−4)で10mm×25mm×100mmのテストピースを用いて、一枚目のテストピースに樹脂組成物を均一に広げて、二枚目のテストピースと25mm×10mmの「接着面積」で貼り合わせる。テストピースが動かない様に固定した状態で、熱風乾燥炉により120℃にて15分で硬化させる。テストピースの温度が室温に戻った後、引張速度10mm/minにて二枚のテストピースを逆方向に引っ張って「最大荷重」を測定する。「最大荷重」を「接着面積」で割ることで「引張せん断接着力(MPa)」を計算する。試験の詳細はJISK8681に従う。本発明では、目安として接着力が15MPa以上有れば使用することができる。
半導体と基板が電気的接続をされた状態を擬似的に形成しているTest Element Group(以下、TEGと言う。)により、アンダーフィル剤としての性能を確認することができる。疑似半導体のバンプと疑似基板のパットは電気的に接続されており、TEG内部の配線がすべてデイジーチェーン状に連結している。疑似基板に有る外部電極にテスターの電極を当てて導通性確認をする。TEGの端部にアンダーフィル剤を塗布して、所定方法でアンダーフィル剤を疑似半導体と疑似基板のクリアランスに浸透させて硬化させる。アンダーフィル剤により封止されたTEGをヒートショック試験、ヒートサイクル試験、高温放置試験、低温放置試験、恒温恒湿試験などの信頼性試験に投入した後、電気的接続が確保されていない場合は抵抗値がオーバーロードになる。これにより、アンダーフィル剤の信頼性を擬似的に試験することができる。TEGの仕様、アンダーフィル剤の硬化条件、信頼性試験として行ったヒートサイクル試験の条件は以下の通りである。
TEG仕様
チップ仕様
チップサイズ:9.6mm×9.6mm
チップ厚:725μm
バンプ材質:Sn/3.0Ag/0.5Cu
バンプ高さ:245μm
バンプ形成方法:ボール搭載
パターン仕様
メタルパットピッチ:500μm
メタルパットサイズ:300μm×300μm
パット数:324
アンダーフィル剤硬化条件(浸透工程を含む)
120℃×15分
ヒートサイクル試験
1サイクル:−40×30分+85℃×30分として全2000サイクル実施
テストピース数:5(以下、テストピースをTEGと呼ぶ。)
Claims (4)
- 硬化物の線膨張率(α1)、ガラス転移点、貯蔵弾性率(25℃)、硬化前の浸透性(120℃)が以下の全ての要件を満たす後浸透型封止用のエポキシ樹脂組成物。
線膨張率(α1):60ppm/℃以下
ガラス転移点:120℃以上
貯蔵弾性率(25℃):3.0GPa以下
浸透性(120℃):30mm以上 - 以下の(A)~(D)成分からなる請求項1に記載の後浸透封止用のエポキシ樹脂組成物。
(A)成分:エポキシ樹脂
(B)成分:1分子内に3以上のエポキシ基と芳香環を有する化合物
(C)成分:ブタジエンゴム粉またはアクリルゴム粉
(D)成分:潜在性硬化剤 - (A)成分と(B)成分の合計100質量部に対して(C)成分が3~10質量部添加されると共に、(C)成分以外の充填剤を実質的に含まない請求項2に記載の後浸透封止用のエポキシ樹脂組成物。
- 室温で液状の硬化剤を実質的に含まない請求項1~3のいずれか1項に記載の後浸透封止用のエポキシ樹脂組成物。
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JP2011508407A JP6115929B2 (ja) | 2009-04-07 | 2010-04-07 | エポキシ樹脂組成物 |
CN2010800146041A CN102378790B (zh) | 2009-04-07 | 2010-04-07 | 环氧树脂组合物 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008156534A (ja) * | 2006-12-25 | 2008-07-10 | Matsushita Electric Works Ltd | 電子部品封止用エポキシ樹脂組成物およびそれを用いた樹脂封止電子部品 |
CN102801115A (zh) * | 2012-08-03 | 2012-11-28 | 北京合纵科沃尔电力科技有限公司 | Smc1气体绝缘开关两种不同材质之间静密封结构 |
JP2019199511A (ja) * | 2018-05-15 | 2019-11-21 | 旭化成株式会社 | エポキシ樹脂組成物の製造方法 |
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DE60045303D1 (de) | 1999-09-29 | 2011-01-13 | Jfe Steel Corp | Stahlblech und verfahren zu dessen herstellung |
TWI609917B (zh) * | 2011-05-31 | 2018-01-01 | Ajinomoto Co., Inc. | 樹脂組成物 |
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JPH07196769A (ja) * | 1993-12-28 | 1995-08-01 | Tonen Corp | 低温硬化型プリプレグ用エポキシ樹脂組成物及びそれを用いたプリプレグ |
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2010
- 2010-04-07 KR KR1020117025885A patent/KR20120027191A/ko not_active Application Discontinuation
- 2010-04-07 WO PCT/JP2010/056628 patent/WO2010117081A1/ja active Application Filing
- 2010-04-07 JP JP2011508407A patent/JP6115929B2/ja active Active
- 2010-04-07 TW TW99110747A patent/TWI466938B/zh active
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JP2008156534A (ja) * | 2006-12-25 | 2008-07-10 | Matsushita Electric Works Ltd | 電子部品封止用エポキシ樹脂組成物およびそれを用いた樹脂封止電子部品 |
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TW201107405A (en) | 2011-03-01 |
JPWO2010117081A1 (ja) | 2012-10-18 |
JP6115929B2 (ja) | 2017-04-19 |
CN102378790B (zh) | 2013-05-08 |
TWI466938B (zh) | 2015-01-01 |
KR20120027191A (ko) | 2012-03-21 |
CN102378790A (zh) | 2012-03-14 |
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