KR20120027191A - 에폭시 수지 조성물 - Google Patents

에폭시 수지 조성물 Download PDF

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Publication number
KR20120027191A
KR20120027191A KR1020117025885A KR20117025885A KR20120027191A KR 20120027191 A KR20120027191 A KR 20120027191A KR 1020117025885 A KR1020117025885 A KR 1020117025885A KR 20117025885 A KR20117025885 A KR 20117025885A KR 20120027191 A KR20120027191 A KR 20120027191A
Authority
KR
South Korea
Prior art keywords
component
epoxy resin
penetration
degreec
resin composition
Prior art date
Application number
KR1020117025885A
Other languages
English (en)
Korean (ko)
Inventor
토시후미 쿠보야마
Original Assignee
가부시끼가이샤 쓰리본드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 쓰리본드 filed Critical 가부시끼가이샤 쓰리본드
Publication of KR20120027191A publication Critical patent/KR20120027191A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/06—Copolymers with styrene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR1020117025885A 2009-04-07 2010-04-07 에폭시 수지 조성물 KR20120027191A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-092817 2009-04-07
JP2009092817 2009-04-07

Publications (1)

Publication Number Publication Date
KR20120027191A true KR20120027191A (ko) 2012-03-21

Family

ID=42936364

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117025885A KR20120027191A (ko) 2009-04-07 2010-04-07 에폭시 수지 조성물

Country Status (5)

Country Link
JP (1) JP6115929B2 (ja)
KR (1) KR20120027191A (ja)
CN (1) CN102378790B (ja)
TW (1) TWI466938B (ja)
WO (1) WO2010117081A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60045303D1 (de) 1999-09-29 2011-01-13 Jfe Steel Corp Stahlblech und verfahren zu dessen herstellung
JP5290515B2 (ja) * 2006-12-25 2013-09-18 パナソニック株式会社 電子部品封止用エポキシ樹脂組成物およびそれを用いた樹脂封止電子部品
TWI609917B (zh) * 2011-05-31 2018-01-01 Ajinomoto Co., Inc. 樹脂組成物
CN102801115B (zh) * 2012-08-03 2016-04-27 天津合纵电力设备有限公司 Smc1气体绝缘开关两种不同材质之间静密封结构
JP2019199511A (ja) * 2018-05-15 2019-11-21 旭化成株式会社 エポキシ樹脂組成物の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770406A (ja) * 1993-08-31 1995-03-14 Tonen Corp 低温硬化型プリプレグ用エポキシ樹脂組成物及びそれを用いたプリプレグ
JPH07196769A (ja) * 1993-12-28 1995-08-01 Tonen Corp 低温硬化型プリプレグ用エポキシ樹脂組成物及びそれを用いたプリプレグ
CN1175043C (zh) * 1999-04-01 2004-11-10 三井化学株式会社 液晶密封剂组合物
JP2003055434A (ja) * 2001-08-15 2003-02-26 Toto Kasei Co Ltd 合成樹脂用難燃剤及び該難燃剤を含有する難燃性樹脂組成物
JP3722427B2 (ja) * 2001-12-20 2005-11-30 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物
JP2006241252A (ja) * 2005-03-01 2006-09-14 Sekisui Chem Co Ltd エポキシ樹脂硬化物、エポキシ樹脂硬化物からなるシート及びエポキシ樹脂硬化物の製造方法
JP4826728B2 (ja) * 2005-09-28 2011-11-30 株式会社スリーボンド 熱硬化性樹脂組成物
JP5340558B2 (ja) * 2007-05-17 2013-11-13 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置
JP2010221526A (ja) * 2009-03-24 2010-10-07 Sumitomo Bakelite Co Ltd 金属張積層板、プリント回路板および半導体装置

Also Published As

Publication number Publication date
TWI466938B (zh) 2015-01-01
TW201107405A (en) 2011-03-01
CN102378790A (zh) 2012-03-14
CN102378790B (zh) 2013-05-08
JPWO2010117081A1 (ja) 2012-10-18
JP6115929B2 (ja) 2017-04-19
WO2010117081A1 (ja) 2010-10-14

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A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E601 Decision to refuse application