WO2010113486A1 - 保持装置、搬送装置及び回転伝達装置 - Google Patents
保持装置、搬送装置及び回転伝達装置 Download PDFInfo
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- WO2010113486A1 WO2010113486A1 PCT/JP2010/002332 JP2010002332W WO2010113486A1 WO 2010113486 A1 WO2010113486 A1 WO 2010113486A1 JP 2010002332 W JP2010002332 W JP 2010002332W WO 2010113486 A1 WO2010113486 A1 WO 2010113486A1
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- holding
- substrate
- recess
- pad
- hand
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D3/00—Yielding couplings, i.e. with means permitting movement between the connected parts during the drive
- F16D3/16—Universal joints in which flexibility is produced by means of pivots or sliding or rolling connecting parts
- F16D3/48—Universal joints in which flexibility is produced by means of pivots or sliding or rolling connecting parts one coupling part having pins arranged parallel to the axis and entering holes in the other coupling part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Definitions
- the present invention relates to a holding device, a conveying device, and a rotation transmitting device that hold an object in a tiltable manner.
- One type of transport device that transports semiconductor substrates for LSI (Large Scale Integration), glass substrates for displays, etc. (hereinafter referred to as substrates) is a transport device that holds a substrate by a hand attached to the tip of a robot arm. .
- Such a transport device requires reliable holding of the substrate and high positional accuracy, and there are various types of holding mechanisms for holding the substrate on the hand.
- Patent Document 1 discloses a substrate transport hand in which a metal film having a low emissivity is formed on a surface on which a substrate is placed.
- the substrate transport hand suppresses the temperature rise of the hand when entering the heating chamber, the film forming chamber, and the like, and reduces heat transfer to the substrate placed on the hand. Accordingly, it is possible to prevent the substrate from being warped due to thermal deformation and to carry it stably and satisfactorily.
- JP 2006-237256 A (paragraph [0024], FIG. 2)
- the substrate transport hand described in Patent Document 1 is said to be able to stably transport a substrate that has not been deformed by preventing thermal deformation of the substrate. There is no mention of transport.
- the substrate is held by being placed on the substrate placing portion of the hand formed in a flat shape, but when the substrate is deformed, the contact area between the substrate and the substrate placing portion is reduced. Therefore, it is considered that the holding property of the substrate is remarkably lowered.
- an object of the present invention is to provide a holding device, a conveyance device, and a rotation transmission device that can stably hold an object while suppressing an influence due to a shape change of the object. is there.
- the holding unit includes a first surface that holds the object to be held and a second surface that faces the base.
- the support portion is disposed between the base portion and the second surface, and makes the holding portion tiltable with respect to the base portion.
- the conveyance apparatus which concerns on one form of this invention is a conveyance apparatus which conveys a conveyance target object, Comprising: A hand, a holding
- the hand has a placement surface on which the transport object is placed.
- the holding unit includes a first surface that holds the conveyance object and a second surface that faces the placement surface.
- the support portion is disposed between the placement surface and the second surface, and is made of an inelastic body that allows the holding portion to tilt with respect to the placement surface.
- a rotation transmission device includes a first rotation disk, a transmission part, a recess, a support part, an engagement part, and a second rotation disk.
- the transmission unit has a first surface and a second surface facing the first rotating disk.
- the concave portion is formed on one of the first rotating disk and the second surface.
- the support portion is disposed between the first rotating disk and the second surface, and engages with the recess to make the transmission portion tiltable with respect to the first rotating disk.
- the engaging portion is disposed around the support portion and engages the first rotating disk and the transmission portion in the rotation direction.
- the second rotating disk is in contact with the first surface.
- the holding unit includes a first surface that holds the object to be held and a second surface that faces the base.
- the support portion is disposed between the base portion and the second surface, and makes the holding portion tiltable with respect to the base portion.
- the holding device holds the holding object on the first surface of the holding unit. Since the holding unit is supported by a support unit that supports the holding unit in a tiltable manner with respect to the substrate, the holding unit easily follows the deformation of the substrate. Therefore, according to the holding device, it is possible to stably hold the object corresponding to the shape of the object to be held.
- the holding device may have a recess formed in one of the base and the second surface, and the support portion may be made of an inelastic body and engage with the recess.
- the support part can hold
- the support portion is made of an inelastic material, the holding portion can be stably held without vibrating with respect to the base due to inertial force generated by the movement of the base.
- the support part may be made of an elastic body. According to this configuration, the support portion can hold the holding portion so as to be tiltable with respect to the substrate by being elastically deformed.
- the concave portion may be formed on the second surface, and the support portion may be a convex portion that is fixed to the base portion, protrudes toward the holding portion, and contacts a bottom portion of the concave portion.
- the support portion can support the holding portion so as to be tiltable with respect to the substrate when the tip of the convex portion makes point contact with the bottom portion of the concave portion.
- the concave portion may be formed on the base portion, and the support portion may be a convex portion that is fixed to the second surface, protrudes toward the base portion, and contacts the bottom portion of the concave portion.
- the support portion can support the holding portion so as to be tiltable with respect to the substrate when the tip of the convex portion makes point contact with the bottom portion of the concave portion.
- the concave portion may be formed on the second surface, and the support portion may be a convex portion that is fixed to the base portion, protrudes toward the holding portion, and contacts a peripheral edge of the concave portion.
- the support portion can support the holding portion so as to be tiltable with respect to the substrate by sliding the convex portion in line contact with the periphery of the concave portion.
- the concave portion may be formed in the base portion, and the support portion may be a convex portion that is fixed to the second surface, protrudes toward the base portion, and contacts a peripheral edge of the concave portion.
- the support portion can support the holding portion so as to be tiltable with respect to the substrate by sliding the convex portion in line contact with the periphery of the concave portion.
- the recess is formed in a cylindrical shape at the base, and the support is fixed to the second surface, protrudes toward the base, and has a bottom shape corresponding to the shape of the bottom of the recess.
- the convex part of a shape may be sufficient.
- the support portion can support the holding portion so as to be tiltable with respect to the substrate by inclining the bottom surface of the convex portion with respect to the bottom surface of the concave portion.
- the shape of the bottom surface of the convex portion corresponds to the shape of the bottom surface of the concave portion, it is possible to prevent displacement of the support portion with respect to the base portion.
- the holding device may further include a restricting portion that is provided between the base portion and the holding portion and prevents a displacement of the holding portion with respect to the base portion. According to this configuration, the position of the holding portion with respect to the base portion can be maintained.
- the first surface may be made of a friction material. According to this configuration, the object to be held can be held by the frictional force of the friction material.
- the friction material may be composed of an electroadhesive element that can electrically control the adhesive force. According to this configuration, the adhesive force is increased when holding the object to be held, and the adhesive force is weakened when opening the object to be held. It is possible to get a function.
- the electroadhesive element includes an insulating adhesive medium, an electric adhesive material composed of dielectric fine particles or semiconductor fine particles dispersed in the adhesive medium, and an electrode for applying a voltage to the electric adhesive material. Also good. According to this configuration, by controlling the voltage applied to the electrodes, it is possible to move the dielectric fine particles or the semiconductor fine particles in the adhesive medium and change the adhesiveness of the electric adhesive material.
- the conveyance apparatus which concerns on one Embodiment of this invention is a conveyance apparatus which conveys a conveyance target object, Comprising: A hand, a holding
- the hand has a placement surface on which the transport object is placed.
- the holding unit includes a first surface that holds the conveyance object and a second surface that faces the ground.
- the support portion is disposed between the placement surface and the second surface, and is made of an inelastic body that allows the holding portion to tilt with respect to the placement surface.
- the holding unit Since the holding unit is supported by a support unit that instructs the holding unit to be tiltable with respect to the mounting surface, the holding unit easily follows the deformation of the substrate. Therefore, according to the said conveying apparatus, it is possible to hold
- a rotation transmission device includes a first rotation disk, a transmission part, a recess, a support part, an engagement part, and a second rotation disk.
- the transmission unit has a first surface and a second surface facing the first rotating disk.
- the concave portion is formed on one of the first rotating disk and the second surface.
- the support portion is disposed between the first rotating disk and the second surface, and engages with the recess to make the transmission portion tiltable with respect to the first rotating disk.
- the engaging portion is disposed around the support portion and engages the first rotating disk and the transmission portion in the rotation direction.
- the second rotating disk is in contact with the first surface.
- the first surface may be made of a friction material. According to this configuration, rotation can be transmitted to the second rotating disk by the frictional force of the friction material.
- the friction material may include an electroadhesive element capable of electrically controlling an adhesive force. According to this configuration, it is possible to vary the rotational transmission force between the transmission unit and the second rotating disk to a desired magnitude.
- FIG. 1 is a perspective view showing the transport device 1.
- the transfer apparatus 1 of this embodiment is configured as a substrate transfer apparatus that transfers a substrate in a vacuum or in the atmosphere.
- the transport device 1 includes a drive unit 2, an arm 3, and a hand 4.
- the drive unit 2 is connected to one end of the arm 3, and the hand 4 is connected to the other end of the arm 3.
- a substrate W that is an object to be transported is placed on the hand 4.
- the drive unit 2 drives the arm 3.
- the drive unit 2 includes a power source such as an electric motor and a power transmission mechanism, and is configured to be able to drive the arm 3.
- the configuration of the drive unit 2 is not limited to this.
- the arm 3 supports the hand 4.
- the arm 3 is configured to be able to move and move the hand 4 by turning, expanding and contracting with the power transmitted from the drive unit 2.
- the arm 3 has a multi-joint structure, but is not limited to this configuration.
- the hand 4 has a support surface 4a (mounting surface) on which a holding mechanism 5 for holding the substrate W is arranged.
- the holding force of the hand 4 with respect to the substrate W is variable. When the substrate W is received from a substrate processing unit (not shown) and transported, the substrate W is held with a predetermined holding force and the substrate is transferred to the substrate processing unit (not shown). When you release the holding force.
- FIG. 2 is a perspective view showing the hand 4.
- the hand 4 is made of a metal material such as stainless steel or a ceramic material such as alumina, and is formed in a U-shaped plate shape.
- the shape of the hand 4 is not limited to this.
- the hand 4 is attached to the arm 3 so that the surface thereof is horizontal.
- Three holding mechanisms 5 are provided on the support surface 4 a of the hand 4. The number and location of the holding mechanisms 5 can be appropriately changed according to the size, shape, etc. of the object to be conveyed.
- FIG. 3 is a cross-sectional view showing the holding mechanism 5.
- the holding mechanism 5 includes a pad 6 (holding portion) and a support member 7 (support portion).
- the pad 6 is supported on the hand 4 (base) by a support member 7.
- the pad 6 is formed by laminating a substrate layer 8, an electrode layer 9, and an adhesive material layer 10 (friction material).
- the pad 6 is formed in a disc shape, but is not limited to a disc shape.
- the substrate layer 8 is formed of an insulating material such as ceramics, but may be formed of other inorganic or organic insulating materials.
- the substrate layer 8 has a recess 8 a formed at the center of the surface facing the hand 4.
- the recess 8a is formed in a shape that converges from the opening toward the back.
- the electrode layer 9 is laminated on the surface of the substrate layer 8 opposite to the surface facing the hand 4.
- the electrode layer 9 is formed so that an electric field can be applied to the adhesive material layer 10, and has, for example, a comb-like electrode.
- the electrode layer 9 is connected to a wiring (not shown) connected to an external power source.
- the adhesive material layer 10 is laminated on the electrode layer 9.
- the adhesive layer 10 is composed of an adhesive medium 11 and electrorheological particles 12 dispersed in the adhesive medium 11.
- the adhesive medium 11 is a gel-like insulating material such as a fluorine-based resin or a silicone resin, and has an adhesive force.
- the electrorheological particle 12 is a general term for a particulate dielectric material, a particulate semiconductor material, and a particulate material obtained by combining them. Adhesive medium 11 and electrorheological particles 12 are combined to exhibit an electroadhesive effect.
- FIG. 4A shows the pressure-sensitive adhesive layer 10 in a state where no voltage is applied
- FIG. 4B shows the pressure-sensitive adhesive layer 10 in a state where a voltage is applied.
- the electrorheological particles 12 are dispersed in the adhesive layer 10 because they are separated from each other by the viscoelasticity of the adhesive medium 11, and protrude from the surface of the adhesive layer 10. This prevents the substrate W from coming into direct contact with the adhesive medium 11, and the adhesive force between the substrate W and the adhesive material layer 10 is small (or absent).
- a voltage is applied to the electrode layer 9
- the state shifts to a voltage application state shown in FIG.
- the electrorheological particles 12 are caused to undergo dielectric polarization by the voltage applied to the electrode layer 9 and aggregate on the lines of electric force.
- the electrorheological particles 12 protruding on the surface of the adhesive layer 10 settle in the adhesive medium 11. Thereby, the board
- the support member 7 is an inelastic body and is made of a metal material such as stainless steel.
- the support member 7 is formed in a column shape having two ends. One end is fixed to the hand 4, and the other end (top) is in point contact with the bottom of the recess 8 a of the substrate layer 8.
- the support member 7 supports the pad 6 by this point contact.
- the end of the support member 7 on the side in contact with the recess 8a is formed in a conical shape that is sharper than the angle at which the recess 8a converges, for example, and only the tip of the end is in point contact with the recess 8a.
- a gap is generated between the portion and the recess 8a.
- the substrate layer 8 (pad 6) can tilt in all directions around the contact point.
- the point contact means that the contact area is a minute one that does not prevent the inclination of the pad 6 (substantially regarded as a point) and does not mean a strict point.
- the angle at which the pad 6 can tilt with respect to the surface of the hand 4 is the smaller one of the angle at which the concave portion 8a and the support member 7 are in contact with each other, or the angle at which the pad 6 and the hand 4 are in contact.
- the contact point with the support member 7 is always the deepest part of the recess, and the horizontal position of the pad 6 with respect to the hand 4 can always be maintained.
- the contact point (fulcrum) of the support member 7 is positioned vertically above the center of gravity of the pad 6, the pad 6 is moved against the surface of the hand 4 by the moment of force even when the substrate W is not held. Maintained level.
- the pad 6 is engaged with the support member 7 by contact, the substrate W is held by the adhesive material layer 10 that can arbitrarily lose the adhesive force, so the pad 6 sticks to the substrate W and is pulled out. It will never be.
- a mechanism for preventing the pad 6 from coming off may be provided as necessary.
- the arm 3 is driven by the driving unit 2 and the hand 4 acquires the substrate W. This is done, for example, when the hand 4 scoops up the substrate W supported by lifter pins.
- a voltage is applied to the electrode layer 9 of the holding mechanism 5 so that the adhesive force of the adhesive material layer 10 is kept high.
- FIG. 5 is a schematic diagram showing how the holding mechanism 5 holds the substrate W.
- FIG. 5A when the substrate W comes into contact with the pad 6, the adhesive material layer 10 of the pad 6 comes into contact with the substrate W, and the substrate W is held. Even if the pad 6 of the holding mechanism 5 is inclined with respect to the hand 4 in a state where the substrate W is not held, the pad 6 is corrected horizontally by the surface of the substrate W coming into contact with the pad 6.
- FIG. 5B even when the substrate W is warped with respect to the surface of the hand 4, the pad 6 is inclined with respect to the hand 4 in accordance with the surface of the substrate W. The entire surface of 10 contacts the substrate W, and the substrate W is held.
- the drive unit 2 is driven while the substrate W is held, and the substrate W moves. At a predetermined position, the application of voltage to the electrode layer 9 is released. Thereby, the adhesive force of the adhesive material layer 10 becomes low, the holding force of the substrate W is released, and the substrate W can be transferred. Note that some processing (cooling or the like) may be performed on the substrate W during the transfer.
- the substrate W is transported as described above. Even when the substrate W is deformed such as warping, the entire surface of the adhesive layer 10 contacts the substrate W by tilting the pad 6 in accordance with the surface of the substrate W, and the substrate W is stably held. Is possible. Further, since the support member 7 is made of an inelastic material, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 4.
- FIG. 6 is a cross-sectional view showing the holding mechanism 21 of the transport apparatus.
- the holding mechanism 21 includes a pad 22 (holding portion) and a support member 23 (support portion).
- the pad 22 is supported on the hand 24 (base) by a support member 23.
- the pad 22 is formed by laminating a substrate layer 25, an electrode layer 26, and an adhesive material layer 27 (friction material).
- the substrate layer 25, the electrode layer 26, and the adhesive material layer 27 have the same configurations as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the substrate layer 25 of the present embodiment has a recess 25 a formed in the center of the surface facing the hand 24.
- the recess 25a is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the support member 23 is an inelastic body and is made of metal or the like.
- the support member 23 is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the flat surface is fixed to the hand 24, and the curved surface is in contact with the recess 25a.
- the support member 23 is formed in a hemispherical or semi-ellipsoidal shape having a smaller radius than the concave portion 25a, or is formed to have a larger curvature than the concave portion 25a.
- the top of the curved surface of the support member 23 makes point contact with the bottom of the recess 25a, and a gap exists between the other part and the recess 25a. For this reason, the pad 22 can tilt in all directions around the contact point.
- the angle at which the pad 22 can be tilted with respect to the hand 24 is the smaller of the angle at which the recess 25a and the support member 23 are in contact with each other, or the angle at which the pad 22 and the hand 24 are in contact.
- the substrate W is held and transported as described above. Even when the substrate W is deformed such as warping, the entire surface of the adhesive layer 27 comes into contact with the substrate W by tilting the pad 22 in accordance with the surface of the substrate W, and the substrate W is stably held. Is possible. Further, since the support member 23 is made of an inelastic material, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 24.
- FIG. 7 is a cross-sectional view showing the holding mechanism 31 of the transport apparatus.
- the holding mechanism 31 includes a pad 32 (holding portion) and a support member 33 (support portion).
- the pad 32 is supported on the hand 34 (base) by a support member 33.
- the hand 34 has a recess 34 a formed on the surface facing the pad 32.
- the pad 32 is formed by laminating a substrate layer 35, an electrode layer 36, and an adhesive material layer 37 (friction material).
- the substrate layer 35, the electrode layer 36, and the adhesive material layer 37 have the same configuration as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the substrate layer 35 of this embodiment does not have a recess on the surface facing the hand 34.
- the support member 33 is an inelastic body and is made of metal or the like.
- the support member 33 is formed in a column shape having two ends. One end is fixed to the substrate layer 35, and the other end (top) is in point contact with the bottom of the recess 34a.
- the support member 33 is formed to be narrower than the opening diameter of the recess 34a, and a gap between the support member 33 and the recess 34a is filled with a viscoelastic body 38.
- the support member 33 fixed to the pad 32 can tilt in all directions around the contact point with the hand 34 due to the viscoelasticity of the viscoelastic body 38. By changing the filling amount and material of the viscoelastic body 38, it is possible to adjust the degree of tilting.
- the angle at which the pad 32 can tilt with respect to the hand 34 is smaller, either the angle at which the recess 34a and the support member 33 contact, the angle at which the pad 32 and the hand 34 contact, or the angle allowed by the viscoelastic body 38. Is an angle.
- the support member 33 Since the support member 33 is sealed to the hand 34 by the viscoelastic body 38, the horizontal position of the pad 32 with respect to the hand 34 can always be maintained. Further, the pad 32 (support member 33) is prevented from being detached from the hand 34.
- the substrate W is held and transported as described above. Even when the substrate W is deformed such as warping, the entire surface of the adhesive layer 37 contacts the substrate W by tilting the pad 32 in accordance with the surface of the substrate W, and the substrate W is stably held. Is possible. Further, since the support member 33 is made of an inelastic material, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 34.
- FIG. 8 is a cross-sectional view showing the holding mechanism 41 of the transport apparatus.
- the holding mechanism 41 has a pad 42 (holding portion) and a support member 43 (support portion).
- the pad 42 is supported on the hand 44 (base) by a support member 43.
- the hand 44 has a recess 44 a formed on the surface facing the pad 42.
- the recess 44a is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the pad 42 is formed by laminating a substrate layer 45, an electrode layer 46, and an adhesive material layer 47 (friction material).
- the substrate layer 45, the electrode layer 46, and the adhesive material layer 47 have the same configuration as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the substrate layer 45 of this embodiment does not have a recess on the surface facing the hand 44.
- the support member 43 is an inelastic body and is made of metal or the like.
- the support member 43 is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the flat surface is fixed to the substrate layer 45, and the curved surface is in contact with the recess 44a.
- the support member 43 is formed in a hemispherical or semi-ellipsoidal shape having a smaller radius than the concave portion 44a, or formed to have a larger curvature than the concave portion 44a.
- the top of the curved surface of the support member 43 makes point contact with the bottom of the recess 44a, and a gap exists between the other part and the recess 44a. For this reason, the pad 42 tilts in all directions around the contact point.
- the angle at which the pad 42 can be tilted with respect to the hand 44 is the smaller one of the angle at which the recess 44a and the support member 43 are in contact, or the angle at which the pad 42 and the hand 44 are in contact.
- the substrate W is held and transported as described above. Even when the substrate W is warped or deformed, the pad 42 tilts in accordance with the surface of the substrate W, so that the entire surface of the adhesive layer 47 contacts the substrate W, and the substrate W is stably held. Is possible.
- the support member 43 is made of an inelastic material, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 44.
- FIG. 9 is a cross-sectional view showing the holding mechanism 51 of the transport apparatus.
- the holding mechanism 51 includes a pad 52 (holding portion) and a support member 53 (support portion).
- the pad 52 is supported on the hand 54 (base) by a support member 53.
- the pad 52 is formed by laminating a substrate layer 55, an electrode layer 56, and an adhesive material layer 57 (friction material).
- the substrate layer 55, the electrode layer 56, and the adhesive material layer 57 have the same configurations as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the substrate layer 55 of the present embodiment has a recess 55 a formed at the center of the surface facing the hand 54.
- the recess 55a is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the support member 53 is an inelastic body and is made of metal or the like.
- the support member 53 is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the flat surface is fixed to the hand 54, and the curved surface is in contact with the recess 55a.
- the support member 53 is formed in a hemispherical or semi-ellipsoidal shape having a larger radius than the concave portion 55a, or is formed to have a smaller curvature than the concave portion 55a.
- the top of the curved surface of the support member 53 does not contact the bottom of the recess 55a, and the inclined portion of the curved surface makes a line contact with the opening edge (periphery) of the recess 55a.
- the pad 52 can be tilted with respect to the hand 54 as the recess 55 a slides on the support member 53.
- the angle at which the pad 52 can tilt with respect to the hand 54 is up to the angle at which the pad 52 contacts the hand 54.
- the substrate W is held and transported as described above. Even when the substrate W is warped or deformed, the pad 52 tilts in accordance with the surface of the substrate W, so that the entire surface of the adhesive layer 57 contacts the substrate W, and the substrate W is stably held. Is possible. Further, since the support member 53 is made of an inelastic material, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 54.
- FIG. 10 is a cross-sectional view showing the holding mechanism 61 of the transport device.
- the holding mechanism 61 includes a pad 62 (holding portion) and a support member 63 (support portion).
- the pad 62 is supported on the hand 64 (base) by a support member 63.
- the hand 64 has a recess 64 a formed on the surface facing the pad 62.
- the recess 64a is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the pad 62 is formed by laminating a substrate layer 65, an electrode layer 66, and an adhesive material layer 67 (friction material).
- the substrate layer 65, the electrode layer 66, and the adhesive material layer 67 have the same configuration as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the substrate layer 65 of this embodiment does not have a recess on the surface facing the hand 64.
- the support member 63 is an inelastic body and is made of metal or the like.
- the support member 63 is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the flat surface is fixed to the substrate layer 65, and the curved surface is in contact with the recess 64a.
- the support member 63 is formed in a hemispherical or semi-ellipsoidal shape having a larger radius than the concave portion 64a, or formed to have a larger curvature than the concave portion 64a. Thereby, the top of the curved surface of the support member 63 does not contact the bottom of the concave portion 64a, and the inclined portion of the curved surface linearly contacts the opening edge (periphery) of the concave portion 64a.
- the pad 62 can tilt with respect to the hand 64 by the support member 63 sliding on the opening edge of the recess 64 a.
- the angle at which the pad 62 can tilt with respect to the hand 64 is up to the angle at which the pad 62 contacts the hand 64.
- the substrate W is held and transported as described above. Even when the substrate W is deformed such as warping, the entire surface of the adhesive layer 67 contacts the substrate W by tilting the pad 62 in accordance with the surface of the substrate W, so that the substrate W can be stably held. Is possible. Further, since the support member 63 is made of an inelastic material, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 64.
- FIG. 11 is a cross-sectional view showing the holding mechanism 71 of the transport apparatus.
- the holding mechanism 71 includes a pad 72 (holding portion), a supporting member 73 (supporting portion), and a regulating member 78 (regulating portion).
- the pad 72 is supported on the hand 74 (base) by a support member 73.
- the pad 72 is formed by laminating a substrate layer 75, an electrode layer 76, and an adhesive material layer 77 (friction material).
- the substrate layer 75, the electrode layer 76, and the adhesive material layer 77 have the same configuration as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the substrate layer 75 of the present embodiment has a recess 75a formed at the center of the surface facing the hand 74 and two recesses 75b formed on the outer peripheral side of the same surface.
- the recess 75a is formed in a hemispherical shape or a semi-ellipsoidal shape, and the recess 75b is formed in a cylindrical shape.
- the number of the recesses 75b is not limited to two.
- the support member 73 is an inelastic body and is made of metal or the like.
- the support member 73 is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the flat surface is fixed to the hand 74, and the curved surface is in contact with the recess 75a.
- the support member 73 is formed in a hemispherical or semi-ellipsoidal shape having a smaller radius than the recess 75a, or is formed to have a larger curvature than the recess 75a.
- the top of the curved surface of the support member 73 makes point contact with the bottom of the recess 75a, and a gap exists between the other portion and the recess 75a. Therefore, the pad 72 can tilt in all directions around the contact point.
- the angle at which the pad 72 can tilt with respect to the hand 74 is the smaller one of the angle at which the recess 75a and the support member 73 are in contact, or the angle at which the pad 72 and the hand 74 are in contact.
- the regulating member 78 is formed in a cylindrical shape, one end is fixed to the hand 74, and the other end is inserted into the recess 75b.
- the restricting member 78 is formed to have a smaller diameter than the recess 75b, and the tip of the restricting member 78 is opposed to the bottom of the recess 75b with a gap. Thereby, the pad 72 is not prevented from tilting with respect to the hand 74 by the regulating member 78.
- the restriction member 78 engages with the recess 75b to prevent the release. That is, the position of the pad 72 with respect to the hand 74 can be maintained.
- the substrate W is held and transported as described above. Even when the substrate W is deformed such as warping, the entire surface of the adhesive layer 77 contacts the substrate W by tilting the pad 72 in accordance with the surface of the substrate W, and the substrate W is stably held. Is possible.
- the support member 73 is made of an inelastic material, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 74.
- the mechanism for preventing the pad 72 from being separated by the regulating member 78 and the recess 75b according to the present embodiment is a transport device according to other embodiments, in particular, the fourth, fifth and sixth embodiments in which the support member is curved. It is also effective when applied to.
- FIG. 12 is a cross-sectional view showing the holding mechanism 81 of the transport apparatus.
- the holding mechanism 81 has a pad 82 (holding portion) and a support member 83 (support portion).
- the pad 82 is supported on the hand 84 (base) by a support member 83.
- the hand 84 has a concave portion 84 a formed in a cylindrical shape on the surface facing the pad 82.
- the pad 82 is formed by laminating a substrate layer 85, an electrode layer 86, and an adhesive material layer 87 (friction material).
- the substrate layer 85, the electrode layer 86, and the adhesive material layer 87 have the same configuration as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the substrate layer 85 of the present embodiment has no recess on the surface facing the hand 84.
- the support member 83 is an inelastic body and is made of metal or the like.
- the support member 83 is formed in a truncated cone shape.
- the support member 83 has two bottom surfaces.
- the bottom surface having the smaller area is defined as a bottom surface 83c
- the bottom surface having the larger area is defined as a bottom surface 83d.
- the bottom surface 83c is fixed to the substrate layer 85, and the bottom surface 83d is in contact with the recess 84a.
- the support member 83 is formed such that the bottom surface 83d matches the bottom surface shape of the recess 84a.
- the bottom surface 83d can be separated from the bottom surface of the recess 84a with one point of the periphery of the bottom surface 83d as a fulcrum, that is, the pad 82 can be tilted from the hand 84.
- the angle at which the pad 82 can tilt with respect to the hand 84 is the angle at which the pad 82 or the support member 83 contacts the hand 84.
- the substrate W is held and transported as described above. Even when the substrate W is deformed such as warping, the entire surface of the adhesive layer 87 is in contact with the substrate W by the pad 82 tilting in accordance with the surface of the substrate W, and the substrate W is stably held. Is possible. Further, since the support member 83 is made of an inelastic body, the substrate W can be stably held without being vibrated by the inertial force generated by the movement of the hand 84.
- FIG. 13 is a cross-sectional view showing the holding mechanism 201 of the transport apparatus.
- the holding mechanism 201 includes a pad 202 (holding unit) and a support member 203.
- the pad 202 is supported on the hand 204 (base) by a support member 203.
- the pad 202 is formed by laminating a substrate layer 205, an electrode layer 206, and an adhesive material layer 207 (friction material).
- the substrate layer 205, the electrode layer 206, and the adhesive material layer 207 have the same configurations as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the support member 203 is a coil spring, and both ends thereof are fixed to the hand 204 and the substrate layer 205.
- the pad 202 can be tilted with respect to the hand 204 by elastically deforming the support member 203.
- the angle at which the pad 202 can tilt with respect to the hand 204 is up to the angle at which the pad 202 contacts the hand 204.
- the substrate W is held and transported as described above. Even when the substrate W is deformed such as warping, the entire surface of the adhesive layer 207 comes into contact with the substrate W by tilting the pad 202 in accordance with the surface of the substrate W, so that the substrate W can be stably held. Is possible.
- FIG. 14 is a cross-sectional view showing the holding mechanism 211 of the transport apparatus.
- the holding mechanism 211 includes a pad 212 (holding unit) and a support member 213.
- the pad 212 is supported on the hand 214 (base) by a support member 213.
- the pad 212 is formed by laminating a substrate layer 215, an electrode layer 216, and an adhesive layer 217 (friction material).
- the substrate layer 215, the electrode layer 216, and the adhesive material layer 217 have the same configuration as the substrate layer 8, the electrode layer 9, and the adhesive material layer 10 in the first embodiment, respectively.
- the support member 213 includes a support shaft 213a and a leaf spring 213b.
- the support shaft 213a is made of an inelastic material, and one end is fixed to the substrate layer 215 and the other end is fixed to the leaf spring 213b.
- the leaf spring 213b is fixed to the hand 214 and configured to be elastically deformed when a force is applied from the support shaft 213a.
- the plate spring 213 b can be a plate-like elastic member that is stretched over a concave portion 214 a formed in the hand 214.
- the leaf spring 213b can be elastically deformed by deforming the gap formed between it and the concave portion 214a as a deformation allowance.
- the leaf spring 213b can be elastically deformed in all directions by being spanned radially around a portion where the support shaft 213a is fixed.
- the leaf spring 213b is not limited to such a configuration, and may be a curved plate shape to ensure a gap with the hand 214.
- the pad 212 can be tilted with respect to the hand 214 by the elastic deformation of the leaf spring 213b.
- the angle at which the pad 212 can tilt with respect to the hand 214 is up to the angle at which the pad 212 contacts the hand 214.
- the substrate W is held and transported as described above. Even when the substrate W is deformed such as warping, the pad 212 tilts in accordance with the surface of the substrate W, so that the entire surface of the adhesive layer 217 comes into contact with the substrate W, and the substrate W is stably held. Is possible.
- the rotational centers of the driving shaft and the driven shaft need to be coaxial.
- the rotation center of the drive shaft and the rotation center of the driven shaft are tilted due to vibration or the like, the load on the contact surface between the drive panel and the driven disk becomes non-uniform, and there is a risk of causing problems such as uneven wear.
- an alignment mechanism or the like is required.
- a rotation transmission device that allows tilting of the rotation shaft will be described.
- FIG. 15 is a cross-sectional view showing the rotation transmission device 90.
- the rotation transmission device 90 includes a drive shaft 91, a drive plate 92 (first rotary plate), a transmission mechanism 93, a driven plate 94 (second rotary plate), and a driven shaft 95.
- a drive panel 92 is connected to the drive shaft 91
- a driven panel 94 is connected to the driven shaft 95.
- the driving board 92 and the driven board 94 are opposed to each other via the transmission mechanism 93.
- the drive shaft 91 can be a driven shaft and the driven shaft 95 can be a drive shaft.
- the drive shaft 91 is connected to an external drive source and rotates around the shaft.
- the drive panel 92 rotates with the drive shaft 91.
- the drive board 92 is formed in a disk shape.
- the transmission mechanism 93 transmits or does not transmit the rotation of the drive panel 92 to the driven board 94. Details will be described later.
- the driven board 94 is rotated by the rotation transmitted from the transmission mechanism 93.
- the driven board 94 is formed in a disk shape.
- the driven shaft 95 rotates with the rotation of the driven disk 94 and transmits the rotation to an external mechanism.
- the transmission mechanism 93 includes a plate 96 (transmission portion), a support member 97 (support portion), and a rotation transmission pin 98 (engagement portion).
- the plate 96 is supported by the driving plate 92 (first rotating plate) by the support member 97.
- the plate 96 is formed in a disk shape by laminating a substrate layer 99, an electrode layer 100, and an adhesive material layer 101 (friction material).
- the substrate layer 99 is made of an insulating material and has a recess 99a formed at the center of the surface facing the drive panel 92 and two recesses 99b formed on the outer periphery of the same surface.
- the recess 99a is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the recess 99b is formed in a cylindrical shape.
- the electrode layer 100 is laminated on the surface of the substrate layer 99 opposite to the surface facing the drive panel 92.
- the electrode layer 100 is formed so that an electric field can be applied to the adhesive layer 101 made of an electroadhesive material, as in the first embodiment, and has, for example, a comb-like electrode.
- the electrode layer 100 is connected to a wiring (not shown) connected to an external power source.
- the adhesive material layer 101 is laminated on the electrode layer 100 and is in contact with the driven board 94 (adhered to the driven board 94).
- the support member 97 is formed in a hemispherical shape or a semi-ellipsoidal shape.
- the flat surface is fixed to the drive panel 92, and the curved surface is in contact with the recess 99a.
- the support member 97 is formed in a hemispherical or semi-ellipsoidal shape having a smaller radius than the concave portion 99a, or is formed to have a larger curvature than the concave portion 99a.
- the top of the curved surface of the support member 97 makes point contact with the bottom of the recess 99a, and a gap exists between the other portion and the recess 99a. For this reason, the plate 96 can tilt in all directions around the contact point.
- the rotation transmission pin 98 transmits the rotation of the drive panel 92 to the plate 96.
- the rotation transmission pin is formed in a columnar shape, one end is fixed to the drive panel 92, and the other end is inserted into the recess 99b.
- the rotation transmitting pin is formed with a smaller diameter than the recess 99b, and does not prevent the plate 96 from tilting with respect to the drive panel 92.
- the operation of the rotation transmission device 90 configured as described above will be described.
- the drive shaft 91 and the drive panel 92 are rotated by an external drive source.
- the rotation of the drive panel 92 is transmitted to the plate 96 by the rotation transmission pin 98.
- the adhesive force (friction force) between the adhesive material layer 101 and the driven board 94 is small, and the driven board 94 does not rotate.
- a predetermined voltage is applied to the electrode layer 100 of the plate 96, the adhesive force (frictional force) between the adhesive material layer 101 and the driven board 94 increases, and the driven board 94 is rotated.
- the rotation is transmitted to a driven shaft 95 connected to the driven board 94.
- whether or not the rotation of the drive shaft 91 is transmitted to the driven shaft 95 can be switched only by applying a voltage to the electrode layer 100.
- the fluidity of the adhesive layer 101 differs depending on the magnitude of the voltage applied to the electrode layer 100, and the transmission torque of the drive panel 92 can be made variable. Thereby, setting of a torque limit is easy.
- FIG. 15B is a diagram showing the state of tilting of the plate 96.
- the plate 96 according to the present embodiment is configured to be tiltable with respect to the drive board 92. It is possible to adhere to the driven board 94 and transmit the rotation. Therefore, even when the rotation shafts of the drive shaft 91 and the driven shaft 95 are tilted and the drive plate 92 and the driven plate 94 are not parallel to each other, the rotational driving force can be properly transmitted to the driven shaft 95. .
- the rotation transmission device 90 has an adhesive layer 101 made of an electroadhesive material, and controls the voltage to the electrode layer 100 to vary the rotation transmission force.
- an adhesive layer 101 made of an electroadhesive material
- a viscoelastic material that is not an electric adhesive material as the adhesive material layer 101.
- a layer is formed using a non-adhesive material such as metal, and this layer and the follower board 94 are formed in a shape (for example, an uneven shape or a saw blade shape) that meshes with each other. They may be mechanically engaged by bringing them into contact with each other. In this case, as in the above example, even if the rotation centers of the drive shaft 91 and the driven shaft 95 are tilted, the rotation can be stably transmitted.
- the configuration in which the object is held using the friction material is shown, but the object may be held in another configuration.
- an electrostatic chuck or the like may be used as the holding unit or the transmission unit.
- the friction material is not limited to an electroadhesive element. It is also possible to use an elastomer or the like.
- Electrode layer 37 adhesive layer 41 ... holding mechanism 42 ... pad (holding part) 43 ... support member 44 ... hand (base) 44a ... recess 45 ... Substrate layer 46 ... Electrode layer 47 ... Adhesive layer 47a ... Recess 51 ... Holding mechanism 52 ... Pad (holding part) 53 ... Support member 54 ... Hand (base) 55 ... Substrate layer 55a ... Recess 56 ... Electrode layer 57 ... Adhesive layer 61 ... Holding mechanism 62 ... Pad (holding part) 63 ... Support member 64 ... Hand (base) 64a ... Recess 65 ... Substrate layer 66 ... Electrode layer 67 ... Adhesive layer 71 ...
- Holding mechanism 72 ... Pad (holding part) 73 ... Support member 74 ... Hand (base part) 75 ... Substrate layer 75a ... Recessed part 75b ... Recessed part 76 ... Electrode layer 77 ... Adhesive layer 78 ... Restricting member 81 ... Holding Mechanism 82 ... Pad (holding part) 83 ... Support member 83 c ... Bottom face 83 d ... Bottom face 84 ... Hand (base part) 84 a ... Recessed part 85 ... Substrate layer 86 ... Electrode layer 87 ... Adhesive layer 90 ... Rotation transmission device 91 ... Drive shaft 92 ... drive board (first rotary board) 93 ... transmission mechanism 94 ...
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Abstract
Description
上記保持部は、保持対象物を保持する第1の面と、上記基部と対向する第2の面とを有する。
上記支持部は、上記基部と上記第2の面との間に配置され、上記保持部を上記基部に対して傾動自在にする。
上記ハンドは、上記搬送対象物が載置される載置面を有する。
上記保持部は、上記搬送対象物を保持する第1の面と、上記載置面と対向する第2の面とを有する。
上記支持部は、上記載置面と上記第2の面との間に配置され、上記保持部を上記載置面に対して傾動自在にする非弾性体からなる。
上記伝達部は、第1の面と上記第1の回転盤と対向する第2の面を有する。
上記凹部は、上記第1の回転盤と上記第2の面のいずれか一方に形成される。
上記支持部は、上記第1の回転盤と上記第2の面との間に配置され、上記凹部と係合することで、上記伝達部を上記第1の回転盤に対して傾動自在にし、非弾性体からなる。
上記係合部は、上記支持部の周囲に配置され、上記第1の回転盤と上記伝達部を回転方向に係合する。
上記第2の回転盤は、上記第1の面と接触する。
上記保持部は、保持対象物を保持する第1の面と、上記基部と対向する第2の面とを有する。
上記支持部は、上記基部と上記第2の面との間に配置され、上記保持部を上記基部に対して傾動自在にする。
上記保持装置は、保持対象物を保持部の第1の面で保持する。保持部は保持部を基板に対して傾動自在に支持する支持部に支持されているため、基板の変形に対して容易に追従する。従って、上記保持装置によれば、保持対象物の形状に対応して安定に保持することが可能である。
この構成によれば、支持部は、凹部と係合することにより保持部を基板に対して傾動自在に保持することが可能である。また、支持部は非弾性体からなるため、基部の移動により発生する慣性力によって保持部が基部に対して振動することなく安定して保持することが可能である。
この構成によれば、支持部は、弾性変形することにより保持部を基板に対して傾動自在に保持することが可能である。
この構成によれば、支持部は、凸部の先端が凹部の底部に点接触することにより、保持部を基板に対して傾動可能に支持することが可能である。
この構成によれば、支持部は、凸部の先端が凹部の底部に点接触することにより、保持部を基板に対して傾動可能に支持することが可能である。
この構成によれば、支持部は、凸部が凹部の周縁に線接触して摺動することにより、保持部を基板に対して傾動可能に支持することが可能である。
この構成によれば、支持部は、凸部が凹部の周縁に線接触して摺動することにより、保持部を基板に対して傾動可能に支持することが可能である。
この構成によれば、支持部は、凸部の底面が凹部の底面に対して傾斜することにより、保持部を基板に対して傾動可能に支持することが可能である。また、凸部の底面の形状が凹部の底面の形状と対応しているため、支持部の基部に対する位置ずれを防止することが可能である。
この構成によれば、保持部の基部に対する位置を維持することが可能となる。
この構成によれば、摩擦材の摩擦力により保持対象物を保持することが可能である。
この構成によれば、保持対象物を保持する際には粘着力を強くし、保持対象物を開放する際には粘着力を弱くすることで、保持対象物に対する所定のチャック機能と適正なデチャック機能を得ることが可能である。
この構成によれば、電極に印加する電圧を制御することにより、粘着性媒体中で誘電体微粒子もしくは半導体微粒子を移動させ、電気粘着材料の粘着性を変化させることが可能である。
上記ハンドは、上記搬送対象物が載置される載置面を有する。
上記保持部は、上記搬送対象物を保持する第1の面と、上記し地面と対向する第2の面とを有する。
上記支持部は、上記載置面と上記第2の面との間に配置され、上記保持部を上記載置面に対して傾動自在にする非弾性体からなる。
上記搬送装置は、保持対象物を保持部の第1の面で保持し搬送する。保持部は保持部を載置面に対して傾動自在に指示する支持部に支持されているため、基板の変形に対して容易に追従する。従って、上記搬送装置によれば、搬送対象物の形状に対応して安定に保持し搬送することが可能である。
上記伝達部は、第1の面と上記第1の回転盤と対向する第2の面を有する。
上記凹部は、上記第1の回転盤と上記第2の面のいずれか一方に形成される。
上記支持部は、上記第1の回転盤と上記第2の面との間に配置され、上記凹部と係合することで、上記伝達部を上記第1の回転盤に対して傾動自在にし、非弾性体からなる。
上記係合部は、上記支持部の周囲に配置され、上記第1の回転盤と上記伝達部を回転方向に係合する。
上記第2の回転盤は、上記第1の面と接触する。
この構成によれば、第1の回転盤の回転を第2の回転盤に、あるいは第2の回転盤の回転を第1の回転盤に伝達する際、にそれぞれの回転盤の回転軸が傾動したとしても、安定に回転を伝達することが可能となる。
この構成によれば、摩擦材の摩擦力により第2の回転盤に回転を伝達することが可能である。
この構成によれば、伝達部と第2の回転盤との間の回転の伝達力を所望の大きさに変動させることが可能である。
第1の実施形態に係る搬送装置1について説明する。
図1は搬送装置1を示す斜視図である。本実施形態の搬送装置1は、真空中又は大気中で基板を搬送する基板搬送装置として構成されている。
駆動部2はアーム3を駆動する。駆動部2は、電動モーター等の動力源と動力伝達機構を内蔵し、アーム3を駆動可能に構成される。駆動部2の構成はこれに限られない。
ハンド4は基板Wを保持する保持機構5が配置された支持面4a(載置面)を有する。ハンド4の基板Wに対する保持力は可変であり、図示しない基板処理ユニットから基板Wを受け取り及びそれを搬送するときは所定の保持力で基板Wを保持し、図示しない基板処理ユニットへ基板を渡すときは、上記保持力を解放する。
図2はハンド4を示す斜視図である。
同図に示すように、ハンド4は、例えばステンレス鋼などの金属材料やアルミナなどのセラミックス材料からなり、U字型の板状に形成されている。ハンド4の形状はこれに限られない。ハンド4はその面が水平になるようにアーム3に取り付けられる。
ハンド4の支持面4aには3つの保持機構5が設けられている。保持機構5の配置数、配置場所は、搬送対象物の大きさ、形状等に合わせて適宜変更され得る。
図3は保持機構5を示す断面図である。
同図に示すように保持機構5は、パッド6(保持部)と、支持部材7(支持部)を有する。パッド6は支持部材7によりハンド4(基部)に支持されている。
同図に示すように、粘着材層10は、粘着性媒体11と、粘着性媒体11中に分散された電気レオロジー粒子12からなる。
粘着性媒体11は、フッ素系樹脂やシリコーン樹脂等のゲル状絶縁性材料であり、粘着力を有する。
電気レオロジー粒子12は、粒子状誘電体材料と粒子状半導体材料、またそれらを複合した粒子状材料の総称である。
粘着性媒体11及び電気レオロジー粒子12は、電気粘着効果を示すように組み合わされる。
図4(A)は電圧非印加状態の粘着材層10を示し、図4(B)は電圧印加状態の粘着材層10を示す。
図4(A)に示す電圧非印加状態では、電気レオロジー粒子12は粘着性媒体11の粘弾性により互いに離間するため粘着材層10中に分散し、粘着材層10の表面に突出している。これにより、基板Wが粘着性媒体11と直接接触することは妨げられ、基板Wと粘着材層10との間の粘着力は小さい(もしくは無い)。電極層9に電圧を印加すると図4(B)に示す電圧印加状態に移行する。
以上のように、電極層9への電圧印加の有無により、基板Wと粘着材層10との間の粘着力を調節することが可能である。
図5は保持機構5が基板Wを保持する様子を示す模式図である。
図5(A)に示すように、基板Wがパッド6に接触すると、パッド6の粘着材層10が基板Wに接触し、基板Wは保持される。なお、基板Wが保持されていない状態において、保持機構5のパッド6がハンド4に対して傾いていても、基板Wの面がパッド6に当接することによりパッド6は水平に矯正される。
図5(B)に示すように、基板Wがハンド4の面に対して反っている場合でも、パッド6は基板Wの面に合わせてハンド4に対して傾くため、パッド6の粘着材層10の全面が基板Wに接触し、基板Wは保持される。
第2の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
同図に示すように保持機構21は、パッド22(保持部)と、支持部材23(支持部)を有する。パッド22は支持部材23によりハンド24(基部)に支持されている。
ただし、本実施形態の基板層25は、ハンド24と対向する面の中央に形成された凹部25aを有する。凹部25aは、半球状あるいは半楕円体状に形成されている。
第3の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
図7に示すように保持機構31は、パッド32(保持部)と、支持部材33(支持部)を有する。パッド32は支持部材33によりハンド34(基部)に支持されている。ハンド34は、パッド32と対向する面に形成された凹部34aを有する。
ただし、本実施形態の基板層35は、ハンド34と対向する面に凹部を有しない。
第4の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
図8に示すように保持機構41は、パッド42(保持部)と、支持部材43(支持部)を有する。パッド42は支持部材43によりハンド44(基部)に支持されている。ハンド44は、パッド42と対向する面に形成された凹部44aを有する。凹部44aは、半球状あるいは半楕円体状に形成されている。
ただし、本実施形態の基板層45は、ハンド44と対向する面に凹部を有しない。
このため、パッド42は、接触点を中心として全方位的に傾動する。
第5の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
同図に示すように保持機構51は、パッド52(保持部)と、支持部材53(支持部)を有する。パッド52は支持部材53によりハンド54(基部)に支持されている。
ただし、本実施形態の基板層55は、ハンド54と対向する面の中央に形成された凹部55aを有する。凹部55aは、半球状あるいは半楕円体状に形成されている。
パッド52がハンド54対して傾動可能な角度は、パッド52がハンド54と接触する角度までである。
第6の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
図10に示すように保持機構61は、パッド62(保持部)と、支持部材63(支持部)を有する。パッド62は支持部材63によりハンド64(基部)に支持されている。
ただし、本実施形態の基板層65は、ハンド64と対向する面に凹部を有しない。
パッド62がハンド64対して傾動可能な角度は、パッド62がハンド64と接触する角度までである。
第7の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
同図に示すように保持機構71は、パッド72(保持部)と、支持部材73(支持部)と、規制部材78(規制部)とを有する。パッド72は支持部材73によりハンド74(基部)に支持されている。
ただし、本実施形態の基板層75は、ハンド74と対向する面の中央に形成された凹部75aと、同面の外周側に形成された2つの凹部75bとを有する。凹部75aは半球状あるいは半楕円体状に、凹部75bは円筒状に形成されている。凹部75bの数は2つに限られない。
第8の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
図12に示すように保持機構81は、パッド82(保持部)と、支持部材83(支持部)を有する。パッド82は支持部材83によりハンド84(基部)に支持されている。ハンド84は、パッド82と対向する面に円筒状に形成された凹部84aを有する。
特に、本実施形態の基板層85は、ハンド84と対向する面に凹部を有しない。
第9の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
図13に示すように保持機構201は、パッド202(保持部)と、支持部材203を有する。パッド202は支持部材203によりハンド204(基部)に支持されている。
第10の実施形態に係る搬送装置について説明する。
以下の説明では、上述の実施形態の構成と同様な構成を有する部分に関しては説明を簡略化する。
図14に示すように保持機構211は、パッド212(保持部)と、支持部材213を有する。パッド212は支持部材213によりハンド214(基部)に支持されている。
第11の実施形態に係る回転伝達装置について説明する。
駆動盤92は駆動軸91に伴って回転する。駆動盤92は円盤状に形成されている。
従動盤94は、伝達機構93から回転を伝達されて回転する。従動盤94は円盤状に形成されている。
従動軸95は、従動盤94の回転に伴って回転し、外部の機構に回転を伝達する。
図15(A)に示すように、伝達機構93は、プレート96(伝達部)と、支持部材97(支持部)と、回転伝達ピン98(係合部)を有する。プレート96は、支持部材97により駆動盤92(第1の回転盤)に支持されている。
外部の駆動源によって、駆動軸91及び駆動盤92が回転される。
駆動盤92の回転は、回転伝達ピン98によりプレート96に伝達される。
プレート96の電極層100に電圧が印加されない場合には、粘着材層101と従動盤94との粘着力(摩擦力)が小さく、従動盤94は回転しない。
プレート96の電極層100に所定の電圧が印加されると、粘着材層101と従動盤94との粘着力(摩擦力)が増加し、従動盤94が回転される。
従動盤94に接続された従動軸95に回転が伝達される。
これにより、駆動軸91の回転を従動軸95に伝達するか否かを、電極層100への電圧印加のみによって切り替えることが可能である。
同図に示すように、従動盤94が駆動盤92に対して傾く場合、本実施形態に係るプレート96は駆動盤92に対して傾動可能に構成されているため、粘着材層101の全面が従動盤94に粘着し、回転を伝達することが可能である。したがって、駆動軸91と従動軸95の回転軸が傾動し、駆動盤92と従動盤94とが平行でない状態であっても、従動軸95へ回転駆動力を適正に伝達することが可能となる。
Claims (16)
- 基部と、
保持対象物を保持する第1の面と、前記基部と対向する第2の面とを有する保持部と、
前記基部と前記第2の面との間に配置され、前記保持部を前記基部に対して傾動自在にする支持部と
を具備する保持装置。 - 請求項1に記載の保持装置であって、
前記基部と前記第2の面のいずれか一方に形成された凹部を有し、
前記支持部は非弾性体からなり、前記凹部と係合する
保持装置。 - 請求項1に記載の保持装置であって、
前記支持部は、弾性体からなる
保持装置。 - 請求項2に記載の保持装置であって、
前記凹部は、前記第2の面に形成され、
前記支持部は、前記基部に固定され、前記保持部に向かって突出し、前記凹部の底部に接触する凸部である
保持装置。 - 請求項2に記載の保持装置であって、
前記凹部は、前記基部に形成され、
前記支持部は、前記第2の面に固定され、前記基部に向かって突出し、前記凹部の底部に接触する凸部である
保持装置。 - 請求項2に記載の保持装置であって、
前記凹部は、前記第2の面に形成され、
前記支持部は、前記基部に固定され、前記保持部に向かって突出し、前記凹部の周縁に接触する凸部である
保持装置。 - 請求項2に記載の保持装置であって、
前記凹部は、前記基部に形成され、
前記支持部は、前記第2の面に固定され、前記基部に向かって突出し、前記凹部の周縁に接触する凸部である
保持装置。 - 請求項2に記載の保持装置であって、
前記凹部は、前記基部に円筒形状に形成され、
前記支持部は、前記第2の面に固定され、前記基部に向かって突出し、前記凹部の底面の形状と対応する底面の形状を有する錐体形状の凸部である
保持装置。 - 請求項1乃至8の何れか一項に記載の保持装置であって、
前記基部と前記保持部との間に設けられ、前記基部に対する前記保持部の位置ずれを防止する規制部をさらに具備する
保持装置。 - 請求項1乃至9の何れか一項に記載の保持装置であって、
前記第1の面は、摩擦材からなる
保持装置。 - 請求項10に記載の保持装置であって、
前記摩擦材は、電気的に粘着力を制御することができる電気粘着素子からなる
保持装置。 - 請求項11に記載の保持装置であって、
前記電気粘着素子は、絶縁性の粘着性媒体と前記粘着性媒体中に分散された誘電体微粒子もしくは半導体微粒子からなる電気粘着材料と、前記電気粘着材料に電圧を印加する電極とを有する
保持装置。 - 搬送対象物を搬送する搬送装置であって、
前記搬送対象物が載置される載置面を有するハンドと、
前記搬送対象物を保持する第1の面と、前記載置面と対向する第2の面とを有する保持部と、
前記載置面と前記第2の面との間に配置され、前記保持部を前記載置面に対して傾動自在にする支持部と
を具備する搬送装置。 - 第1の回転盤と、
第1の面と、前記第1の回転盤と対向する第2の面を有する伝達部と、
前記第1の回転盤と前記第2の面のいずれか一方に形成された凹部と、
前記第1の回転盤と前記第2の面との間に配置され、前記凹部と係合することで、前記伝達部を前記第1の回転盤に対して傾動自在にする非弾性体からなる支持部と、
前記支持部の周囲に配置され、前記第1の回転盤と前記伝達部を回転方向に係合する係合部と、
前記第1の面と接触する第2の回転盤と
を具備する回転伝達装置。 - 請求項14に記載の回転伝達装置であって、
前記第1の面は、摩擦材からなる
回転伝達装置。 - 請求項15に記載の回転伝達装置であって、
前記摩擦材は、電気的に粘着力を制御することができる電気粘着素子からなる
回転伝達装置。
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WO2011158444A1 (ja) * | 2010-06-18 | 2011-12-22 | 株式会社アルバック | 搬送処理装置及び処理装置 |
JP2013131759A (ja) * | 2011-12-20 | 2013-07-04 | Ap Systems Inc | 基板移送装置 |
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JP6486140B2 (ja) * | 2015-02-25 | 2019-03-20 | キヤノン株式会社 | 搬送ハンド、リソグラフィ装置及び被搬送物を搬送する方法 |
CN107017192B (zh) * | 2017-03-24 | 2020-01-17 | 武汉华星光电技术有限公司 | 一种机械运送装置 |
JP2021070132A (ja) * | 2019-11-01 | 2021-05-06 | ファナック株式会社 | ワーク搬送用ツール |
CN113618775A (zh) * | 2021-08-05 | 2021-11-09 | 西安交通大学 | 一种连续体机器人关节及连续体机器人 |
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CN102362341A (zh) | 2012-02-22 |
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