WO2010095809A3 - 엘이디 칩 테스트장치 - Google Patents

엘이디 칩 테스트장치 Download PDF

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Publication number
WO2010095809A3
WO2010095809A3 PCT/KR2009/007809 KR2009007809W WO2010095809A3 WO 2010095809 A3 WO2010095809 A3 WO 2010095809A3 KR 2009007809 W KR2009007809 W KR 2009007809W WO 2010095809 A3 WO2010095809 A3 WO 2010095809A3
Authority
WO
WIPO (PCT)
Prior art keywords
led chip
testing device
chip testing
led chips
led
Prior art date
Application number
PCT/KR2009/007809
Other languages
English (en)
French (fr)
Other versions
WO2010095809A2 (ko
Inventor
유병소
Original Assignee
(주)큐엠씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090023030A external-priority patent/KR100931322B1/ko
Priority claimed from KR1020090058292A external-priority patent/KR100935706B1/ko
Priority claimed from KR1020090114028A external-priority patent/KR20110057568A/ko
Application filed by (주)큐엠씨 filed Critical (주)큐엠씨
Priority to JP2011550997A priority Critical patent/JP5327489B2/ja
Priority to US13/148,980 priority patent/US8952717B2/en
Priority to CN2009801571661A priority patent/CN102326090B/zh
Publication of WO2010095809A2 publication Critical patent/WO2010095809A2/ko
Publication of WO2010095809A3 publication Critical patent/WO2010095809A3/ko

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2632Circuits therefor for testing diodes
    • G01R31/2635Testing light-emitting diodes, laser diodes or photodiodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Led Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

본 발명의 목적은 엘이디 칩이 가지는 성능을 정확하게 측정할 수 있는 엘이디 칩 테스트장치를 제공하는 것이다. 이를 위해 본 발명은, 엘이디 칩의 특성을 측정하는 엘이디 칩 테스트장치에 있어서, 상기 엘이디 칩을 지지하며, 상기 엘이디 칩의 특성을 측정하는 테스트위치로 상기 엘이디 칩을 회전시키는 회전부재; 및 상기 회전부재의 옆에 설치되며, 상기 테스트위치에서 상기 엘이디 칩의 특성을 측정하는 테스트부를 포함하는 것을 특징으로 하는 엘이디 칩 테스트장치를 제공한다.
PCT/KR2009/007809 2009-02-20 2009-12-24 엘이디 칩 테스트장치 WO2010095809A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011550997A JP5327489B2 (ja) 2009-02-20 2009-12-24 エルイーディーチップテスト装置
US13/148,980 US8952717B2 (en) 2009-02-20 2009-12-24 LED chip testing device
CN2009801571661A CN102326090B (zh) 2009-02-20 2009-12-24 Led芯片测试装置

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
KR10-2009-0014471 2009-02-20
KR20090014471 2009-02-20
KR10-2009-0023030 2009-03-18
KR1020090023030A KR100931322B1 (ko) 2009-02-20 2009-03-18 엘이디 칩 테스트장치 및 이를 이용한 테스트방법
KR10-2009-0058292 2009-06-29
KR1020090058292A KR100935706B1 (ko) 2009-06-29 2009-06-29 엘이디 칩 테스트장치 및 그 전달부재
KR1020090114028A KR20110057568A (ko) 2009-11-24 2009-11-24 엘이디 칩 테스트장치 및 엘이디 칩 분류장치
KR10-2009-0114028 2009-11-24

Publications (2)

Publication Number Publication Date
WO2010095809A2 WO2010095809A2 (ko) 2010-08-26
WO2010095809A3 true WO2010095809A3 (ko) 2010-10-14

Family

ID=42634289

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007809 WO2010095809A2 (ko) 2009-02-20 2009-12-24 엘이디 칩 테스트장치

Country Status (5)

Country Link
US (1) US8952717B2 (ko)
JP (1) JP5327489B2 (ko)
CN (1) CN102326090B (ko)
TW (1) TWI449901B (ko)
WO (1) WO2010095809A2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104089758A (zh) * 2014-07-03 2014-10-08 常州光电技术研究所 Led产品质量检测分类系统及其检测分类方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101724711B1 (ko) * 2010-10-28 2017-04-10 엘지이노텍 주식회사 발광 칩 측정 장치
KR101083346B1 (ko) * 2010-12-09 2011-11-15 주식회사 이노비즈 엘이디 칩 검사장치
TWI442603B (zh) * 2011-05-09 2014-06-21 Youngtek Electronics Corp 發光二極體封裝晶片分類系統
TWI431291B (zh) * 2011-07-14 2014-03-21 Chroma Ate Inc 發光二極體量測裝置
TWM430614U (en) * 2011-12-21 2012-06-01 Youngtek Electronics Corp Fiber optic light guiding top cover structure
US8749773B2 (en) * 2012-02-03 2014-06-10 Epistar Corporation Method and apparatus for testing light-emitting device
CN103424186A (zh) * 2012-05-18 2013-12-04 全亿大科技(佛山)有限公司 发光二极管检测量具
WO2014020768A1 (ja) * 2012-08-03 2014-02-06 パイオニア株式会社 光量測定装置及び光量測定方法
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TW201423122A (zh) * 2012-12-06 2014-06-16 Jtron Technology Corp Led晶圓多晶粒檢測方法及裝置
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US9347824B2 (en) 2013-11-01 2016-05-24 Kla-Tencor Corporation Light collection optics for measuring flux and spectrum from light-emitting devices
TW201537151A (zh) * 2014-03-20 2015-10-01 Ismeca Semiconductor Holding 帶有遮光器的光學積分球
CN104985365B (zh) * 2015-07-20 2016-10-12 马邵辉 Led双排线自动焊接机
CN105548855B (zh) * 2015-12-23 2018-05-04 陕西华经微电子股份有限公司 一种led厚膜陶瓷支架的测试装置及测试方法
KR102426709B1 (ko) * 2016-02-23 2022-07-29 삼성디스플레이 주식회사 발광 다이오드를 트랜스퍼하는 장치 및 방법
CN106443505A (zh) * 2016-08-31 2017-02-22 苏州康贝尔电子设备有限公司 一种自动点亮测试机
CN107694838B (zh) * 2017-10-26 2023-02-17 福建省苍乐电子企业有限公司 一种led自动测试涂胶装置及其工作方法
CN109724779A (zh) * 2017-10-31 2019-05-07 深圳市炫硕智造技术有限公司 Cob-led灯检测系统及检测方法
CN108627762B (zh) * 2018-06-08 2024-03-26 深圳瑞波光电子有限公司 一种测试系统
KR102558296B1 (ko) 2018-07-10 2023-07-24 삼성전자주식회사 전자 장치, 마이크로 led 모듈 제조 방법 및 컴퓨터 판독가능 기록 매체
TWI693413B (zh) * 2018-07-27 2020-05-11 鴻勁精密股份有限公司 電子元件測試裝置及其應用之測試分類設備
CN109541439B (zh) * 2018-12-10 2020-11-13 通富微电子股份有限公司 一种芯片测试进料方向的调整方法、检测装置、调整系统
CN112059958B (zh) * 2018-12-29 2021-10-22 苏州市东挺河智能科技发展有限公司 一种二极管性能检测设备上的定位导轨结构
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CN114355166B (zh) * 2022-01-10 2024-06-04 深圳市斯迈得半导体有限公司 一种led封装芯片检测装置
CN114932089A (zh) * 2022-04-27 2022-08-23 泉州兰姆达仪器设备有限公司 一种激光芯片测试分选机的上料机构及其工作方法
CN116124406B (zh) * 2023-04-13 2023-08-08 山东泰芯电子科技有限公司 一种芯片封装耐用性测试装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019237A (ja) * 2005-07-07 2007-01-25 Tokyo Seimitsu Co Ltd 両面発光素子用プロービング装置
KR20070039994A (ko) * 2005-10-11 2007-04-16 블루코드테크놀로지 주식회사 웨이퍼 콜렉터
JP2008070308A (ja) * 2006-09-15 2008-03-27 Tokyo Seimitsu Co Ltd マルチチッププローバ

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2967642A (en) * 1957-06-10 1961-01-10 Pacific Semiconductors Inc Orienting apparatus
US2999587A (en) * 1957-08-12 1961-09-12 Pacific Semiconductors Inc Automatic diode sorter
US3238455A (en) * 1962-04-18 1966-03-01 Sylvania Electric Prod Magazine for supporting a plurality of electrical devices and apparatus for making electrical contact to devices supported therein
US3252571A (en) * 1962-09-10 1966-05-24 Western Electric Co Diode orientation machine
US3115235A (en) * 1962-10-29 1963-12-24 Pacific Semiconductors Inc Diode orienting apparatus
US3702438A (en) * 1969-12-23 1972-11-07 Cons Design Inc Diode tester
US3742356A (en) * 1971-09-07 1973-06-26 Kerant Electronics Ltd Testing apparatus for light emitting diodes and method therefor
JPS537743Y2 (ko) * 1973-12-06 1978-02-27
JPS5394774A (en) 1977-01-29 1978-08-19 Toshiba Corp Automatic sorter for semiconductor device
US4179032A (en) * 1978-09-11 1979-12-18 Western Electric Co., Inc. Methods of and apparatus for conveying, orienting, testing and sorting articles
US4433898A (en) * 1980-12-22 1984-02-28 National Semiconductor Corporation Fiber optic assembly for coupling an optical fiber and a light source
US4500003A (en) * 1982-05-20 1985-02-19 Cedrone Nicholas J Axial lead tester/sorter
DE3235727A1 (de) * 1982-09-27 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zum hervorheben eines objektbereichs in einem rastermikroskop
US4611116A (en) * 1984-02-21 1986-09-09 Batt James E Light emitting diode intensity tester
JPS6252941A (ja) 1985-09-02 1987-03-07 Hitachi Ltd 半導体測定装置
US4775640A (en) * 1987-05-01 1988-10-04 American Telephone And Telegraph Company Electronic device test method and apparatus
JPH0664180A (ja) 1992-06-19 1994-03-08 Fuji Electric Co Ltd インクジェット・プリンタ
US5381103A (en) * 1992-10-13 1995-01-10 Cree Research, Inc. System and method for accelerated degradation testing of semiconductor devices
JPH0664180U (ja) * 1993-02-17 1994-09-09 株式会社アドバンテスト Icハンドラにおける搬送装置
JP2570585B2 (ja) 1993-07-22 1997-01-08 日本電気株式会社 プローブ装置
JPH0992882A (ja) * 1995-09-25 1997-04-04 Mitsubishi Electric Corp 半導体発光素子,及びその製造方法
US5793220A (en) * 1996-08-12 1998-08-11 Micron Electronics, Inc. Fixture for testing and prepping light-emitting diodes
US6028441A (en) * 1997-08-14 2000-02-22 Alvord; Robert J. Self-test routine and circuit for LED display
US6043668A (en) * 1997-12-12 2000-03-28 Sony Corporation Planarity verification system for integrated circuit test probes
US6384612B2 (en) * 1998-10-07 2002-05-07 Agere Systems Guardian Corporation Method and apparatus for testing the light output of light emitting devices
US6597195B1 (en) * 2000-07-28 2003-07-22 Labsphere, Inc. Method of and cassette structure for burn-in and life testing of multiple LEDs and the like
US6564161B1 (en) * 2000-12-01 2003-05-13 Advanced Micro Devices, Inc. Arrangement for testing light emitting diode interface of an integrated network device
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
JP2003090847A (ja) * 2001-09-20 2003-03-28 Seiwa Electric Mfg Co Ltd 半導体素子測定用電極及びそれを用いた半導体素子の測定機
US6797936B1 (en) * 2002-01-03 2004-09-28 Opto Electronic Systems, Inc. Automated laser diode testing
JP4217217B2 (ja) * 2002-12-11 2009-01-28 オリンパス株式会社 光学素子の支持装置およびその製造方法、製造装置
JP2004301807A (ja) 2003-04-01 2004-10-28 Nec Kansai Ltd 検査用プローブカード
JP4293840B2 (ja) * 2003-06-06 2009-07-08 株式会社アドバンテスト 試験装置
US7030642B2 (en) * 2004-02-06 2006-04-18 Honeywell International Inc. Quick attachment fixture and power card for diode-based light devices
CA2558483C (en) * 2004-03-08 2015-01-06 Sioptical, Inc. Wafer-level opto-electronic testing apparatus and method
EP1738107A4 (en) * 2004-04-23 2008-12-31 Light Prescriptions Innovators OPTICAL DISTRIBUTOR FOR LIGHT-EMITTING DIODES
US20080284329A1 (en) * 2004-06-18 2008-11-20 Koninklijke Philips Electronics, N.V. Led with Improve Light Emittance Profile
KR20050121376A (ko) * 2004-06-22 2005-12-27 삼성전자주식회사 반도체 장치의 테스트 장치 및 이를 이용한 반도체 장치테스트 방법
KR20050122972A (ko) * 2004-06-26 2005-12-29 삼성전자주식회사 유기 발광소자 분석방법
US7374293B2 (en) * 2005-03-25 2008-05-20 Vishay General Semiconductor Inc. Apparatus, system and method for testing electronic elements
CN100573168C (zh) * 2005-04-21 2009-12-23 鸿富锦精密工业(深圳)有限公司 测试计算机面板发光二极管灯及其连接线的系统及方法
WO2007002297A2 (en) * 2005-06-24 2007-01-04 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
KR100997946B1 (ko) * 2005-12-22 2010-12-02 파나소닉 전공 주식회사 Led를 가진 조명 장치
KR100816617B1 (ko) * 2006-08-09 2008-03-24 팸텍주식회사 부품트레이 잔류 부품 검출보드
US8573836B2 (en) * 2006-10-26 2013-11-05 Tokyo Electron Limited Apparatus and method for evaluating a substrate mounting device
US7652480B2 (en) * 2007-04-26 2010-01-26 General Electric Company Methods and systems for testing a functional status of a light unit
US7538359B2 (en) * 2007-08-16 2009-05-26 Philips Lumiled Lighting Company, Llc Backlight including side-emitting semiconductor light emitting devices
US7868637B2 (en) * 2007-10-15 2011-01-11 Hamilton Sundstrand Corporation System and method for automated detection of singular faults in diode or'd power bus circuits
CN101237017B (zh) * 2008-02-29 2012-02-08 晶能光电(江西)有限公司 Led裸芯测试用的led支架处理方法、led支架单元以及支架
US7804589B2 (en) * 2008-06-13 2010-09-28 Chroma Ate Inc. System and method for testing light-emitting devices
CN101339092B (zh) * 2008-08-13 2010-11-10 重庆大学 Led芯片/晶圆/外延片的非接触式检测方法及检测装置
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ledパッケージ及びその製造方法
TWM436227U (en) * 2012-03-23 2012-08-21 Mpi Corp Heating point testing appliances

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019237A (ja) * 2005-07-07 2007-01-25 Tokyo Seimitsu Co Ltd 両面発光素子用プロービング装置
KR20070039994A (ko) * 2005-10-11 2007-04-16 블루코드테크놀로지 주식회사 웨이퍼 콜렉터
JP2008070308A (ja) * 2006-09-15 2008-03-27 Tokyo Seimitsu Co Ltd マルチチッププローバ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104089758A (zh) * 2014-07-03 2014-10-08 常州光电技术研究所 Led产品质量检测分类系统及其检测分类方法

Also Published As

Publication number Publication date
WO2010095809A2 (ko) 2010-08-26
US8952717B2 (en) 2015-02-10
CN102326090B (zh) 2013-12-11
TWI449901B (zh) 2014-08-21
JP5327489B2 (ja) 2013-10-30
US20110316579A1 (en) 2011-12-29
CN102326090A (zh) 2012-01-18
TW201037296A (en) 2010-10-16
JP2012518182A (ja) 2012-08-09

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