WO2010095809A3 - 엘이디 칩 테스트장치 - Google Patents
엘이디 칩 테스트장치 Download PDFInfo
- Publication number
- WO2010095809A3 WO2010095809A3 PCT/KR2009/007809 KR2009007809W WO2010095809A3 WO 2010095809 A3 WO2010095809 A3 WO 2010095809A3 KR 2009007809 W KR2009007809 W KR 2009007809W WO 2010095809 A3 WO2010095809 A3 WO 2010095809A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led chip
- testing device
- chip testing
- led chips
- led
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Led Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011550997A JP5327489B2 (ja) | 2009-02-20 | 2009-12-24 | エルイーディーチップテスト装置 |
US13/148,980 US8952717B2 (en) | 2009-02-20 | 2009-12-24 | LED chip testing device |
CN2009801571661A CN102326090B (zh) | 2009-02-20 | 2009-12-24 | Led芯片测试装置 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0014471 | 2009-02-20 | ||
KR20090014471 | 2009-02-20 | ||
KR10-2009-0023030 | 2009-03-18 | ||
KR1020090023030A KR100931322B1 (ko) | 2009-02-20 | 2009-03-18 | 엘이디 칩 테스트장치 및 이를 이용한 테스트방법 |
KR10-2009-0058292 | 2009-06-29 | ||
KR1020090058292A KR100935706B1 (ko) | 2009-06-29 | 2009-06-29 | 엘이디 칩 테스트장치 및 그 전달부재 |
KR1020090114028A KR20110057568A (ko) | 2009-11-24 | 2009-11-24 | 엘이디 칩 테스트장치 및 엘이디 칩 분류장치 |
KR10-2009-0114028 | 2009-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010095809A2 WO2010095809A2 (ko) | 2010-08-26 |
WO2010095809A3 true WO2010095809A3 (ko) | 2010-10-14 |
Family
ID=42634289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/007809 WO2010095809A2 (ko) | 2009-02-20 | 2009-12-24 | 엘이디 칩 테스트장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8952717B2 (ko) |
JP (1) | JP5327489B2 (ko) |
CN (1) | CN102326090B (ko) |
TW (1) | TWI449901B (ko) |
WO (1) | WO2010095809A2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104089758A (zh) * | 2014-07-03 | 2014-10-08 | 常州光电技术研究所 | Led产品质量检测分类系统及其检测分类方法 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101724711B1 (ko) * | 2010-10-28 | 2017-04-10 | 엘지이노텍 주식회사 | 발광 칩 측정 장치 |
KR101083346B1 (ko) * | 2010-12-09 | 2011-11-15 | 주식회사 이노비즈 | 엘이디 칩 검사장치 |
TWI442603B (zh) * | 2011-05-09 | 2014-06-21 | Youngtek Electronics Corp | 發光二極體封裝晶片分類系統 |
TWI431291B (zh) * | 2011-07-14 | 2014-03-21 | Chroma Ate Inc | 發光二極體量測裝置 |
TWM430614U (en) * | 2011-12-21 | 2012-06-01 | Youngtek Electronics Corp | Fiber optic light guiding top cover structure |
US8749773B2 (en) * | 2012-02-03 | 2014-06-10 | Epistar Corporation | Method and apparatus for testing light-emitting device |
CN103424186A (zh) * | 2012-05-18 | 2013-12-04 | 全亿大科技(佛山)有限公司 | 发光二极管检测量具 |
WO2014020768A1 (ja) * | 2012-08-03 | 2014-02-06 | パイオニア株式会社 | 光量測定装置及び光量測定方法 |
CN103777127A (zh) * | 2012-10-19 | 2014-05-07 | 晶元光电股份有限公司 | 发光二极管光电特性量测装置 |
TW201423122A (zh) * | 2012-12-06 | 2014-06-16 | Jtron Technology Corp | Led晶圓多晶粒檢測方法及裝置 |
CN103418557B (zh) * | 2013-08-09 | 2015-05-13 | 上海无线电设备研究所 | Led球泡灯成品在线检测及分拣的设备及方法 |
US9347824B2 (en) | 2013-11-01 | 2016-05-24 | Kla-Tencor Corporation | Light collection optics for measuring flux and spectrum from light-emitting devices |
TW201537151A (zh) * | 2014-03-20 | 2015-10-01 | Ismeca Semiconductor Holding | 帶有遮光器的光學積分球 |
CN104985365B (zh) * | 2015-07-20 | 2016-10-12 | 马邵辉 | Led双排线自动焊接机 |
CN105548855B (zh) * | 2015-12-23 | 2018-05-04 | 陕西华经微电子股份有限公司 | 一种led厚膜陶瓷支架的测试装置及测试方法 |
KR102426709B1 (ko) * | 2016-02-23 | 2022-07-29 | 삼성디스플레이 주식회사 | 발광 다이오드를 트랜스퍼하는 장치 및 방법 |
CN106443505A (zh) * | 2016-08-31 | 2017-02-22 | 苏州康贝尔电子设备有限公司 | 一种自动点亮测试机 |
CN107694838B (zh) * | 2017-10-26 | 2023-02-17 | 福建省苍乐电子企业有限公司 | 一种led自动测试涂胶装置及其工作方法 |
CN109724779A (zh) * | 2017-10-31 | 2019-05-07 | 深圳市炫硕智造技术有限公司 | Cob-led灯检测系统及检测方法 |
CN108627762B (zh) * | 2018-06-08 | 2024-03-26 | 深圳瑞波光电子有限公司 | 一种测试系统 |
KR102558296B1 (ko) | 2018-07-10 | 2023-07-24 | 삼성전자주식회사 | 전자 장치, 마이크로 led 모듈 제조 방법 및 컴퓨터 판독가능 기록 매체 |
TWI693413B (zh) * | 2018-07-27 | 2020-05-11 | 鴻勁精密股份有限公司 | 電子元件測試裝置及其應用之測試分類設備 |
CN109541439B (zh) * | 2018-12-10 | 2020-11-13 | 通富微电子股份有限公司 | 一种芯片测试进料方向的调整方法、检测装置、调整系统 |
CN112059958B (zh) * | 2018-12-29 | 2021-10-22 | 苏州市东挺河智能科技发展有限公司 | 一种二极管性能检测设备上的定位导轨结构 |
CN111323878B (zh) * | 2020-04-01 | 2021-10-15 | 联合微电子中心有限责任公司 | 一种激光器芯片与硅基光电子芯片的耦合对准装置及方法 |
CN112345915B (zh) * | 2020-09-30 | 2022-03-22 | 无锡凌通精密工业有限公司 | 一种pcb线路板阳极测试夹具 |
CN115672790A (zh) * | 2021-07-30 | 2023-02-03 | 深圳市华讯方舟装备技术有限公司 | 一种微波芯片筛选装置 |
CN113560203B (zh) * | 2021-08-09 | 2023-04-11 | 武汉锐科光纤激光技术股份有限公司 | 一种芯片分选系统 |
CN114089146B (zh) * | 2021-11-25 | 2022-11-15 | 深圳市众志祥科技有限公司 | 一种二极管生产用测试装置 |
CN113865835B (zh) * | 2021-12-06 | 2022-02-18 | 河北圣昊光电科技有限公司 | 一种基于双积分球的芯片测试设备及测试方法 |
CN114472193B (zh) * | 2022-01-06 | 2022-11-25 | 山东润通齿轮集团有限公司 | 一种锥齿轮输送质检一体化装置及其使用方法 |
CN114355166B (zh) * | 2022-01-10 | 2024-06-04 | 深圳市斯迈得半导体有限公司 | 一种led封装芯片检测装置 |
CN114932089A (zh) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | 一种激光芯片测试分选机的上料机构及其工作方法 |
CN116124406B (zh) * | 2023-04-13 | 2023-08-08 | 山东泰芯电子科技有限公司 | 一种芯片封装耐用性测试装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007019237A (ja) * | 2005-07-07 | 2007-01-25 | Tokyo Seimitsu Co Ltd | 両面発光素子用プロービング装置 |
KR20070039994A (ko) * | 2005-10-11 | 2007-04-16 | 블루코드테크놀로지 주식회사 | 웨이퍼 콜렉터 |
JP2008070308A (ja) * | 2006-09-15 | 2008-03-27 | Tokyo Seimitsu Co Ltd | マルチチッププローバ |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2967642A (en) * | 1957-06-10 | 1961-01-10 | Pacific Semiconductors Inc | Orienting apparatus |
US2999587A (en) * | 1957-08-12 | 1961-09-12 | Pacific Semiconductors Inc | Automatic diode sorter |
US3238455A (en) * | 1962-04-18 | 1966-03-01 | Sylvania Electric Prod | Magazine for supporting a plurality of electrical devices and apparatus for making electrical contact to devices supported therein |
US3252571A (en) * | 1962-09-10 | 1966-05-24 | Western Electric Co | Diode orientation machine |
US3115235A (en) * | 1962-10-29 | 1963-12-24 | Pacific Semiconductors Inc | Diode orienting apparatus |
US3702438A (en) * | 1969-12-23 | 1972-11-07 | Cons Design Inc | Diode tester |
US3742356A (en) * | 1971-09-07 | 1973-06-26 | Kerant Electronics Ltd | Testing apparatus for light emitting diodes and method therefor |
JPS537743Y2 (ko) * | 1973-12-06 | 1978-02-27 | ||
JPS5394774A (en) | 1977-01-29 | 1978-08-19 | Toshiba Corp | Automatic sorter for semiconductor device |
US4179032A (en) * | 1978-09-11 | 1979-12-18 | Western Electric Co., Inc. | Methods of and apparatus for conveying, orienting, testing and sorting articles |
US4433898A (en) * | 1980-12-22 | 1984-02-28 | National Semiconductor Corporation | Fiber optic assembly for coupling an optical fiber and a light source |
US4500003A (en) * | 1982-05-20 | 1985-02-19 | Cedrone Nicholas J | Axial lead tester/sorter |
DE3235727A1 (de) * | 1982-09-27 | 1984-03-29 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum hervorheben eines objektbereichs in einem rastermikroskop |
US4611116A (en) * | 1984-02-21 | 1986-09-09 | Batt James E | Light emitting diode intensity tester |
JPS6252941A (ja) | 1985-09-02 | 1987-03-07 | Hitachi Ltd | 半導体測定装置 |
US4775640A (en) * | 1987-05-01 | 1988-10-04 | American Telephone And Telegraph Company | Electronic device test method and apparatus |
JPH0664180A (ja) | 1992-06-19 | 1994-03-08 | Fuji Electric Co Ltd | インクジェット・プリンタ |
US5381103A (en) * | 1992-10-13 | 1995-01-10 | Cree Research, Inc. | System and method for accelerated degradation testing of semiconductor devices |
JPH0664180U (ja) * | 1993-02-17 | 1994-09-09 | 株式会社アドバンテスト | Icハンドラにおける搬送装置 |
JP2570585B2 (ja) | 1993-07-22 | 1997-01-08 | 日本電気株式会社 | プローブ装置 |
JPH0992882A (ja) * | 1995-09-25 | 1997-04-04 | Mitsubishi Electric Corp | 半導体発光素子,及びその製造方法 |
US5793220A (en) * | 1996-08-12 | 1998-08-11 | Micron Electronics, Inc. | Fixture for testing and prepping light-emitting diodes |
US6028441A (en) * | 1997-08-14 | 2000-02-22 | Alvord; Robert J. | Self-test routine and circuit for LED display |
US6043668A (en) * | 1997-12-12 | 2000-03-28 | Sony Corporation | Planarity verification system for integrated circuit test probes |
US6384612B2 (en) * | 1998-10-07 | 2002-05-07 | Agere Systems Guardian Corporation | Method and apparatus for testing the light output of light emitting devices |
US6597195B1 (en) * | 2000-07-28 | 2003-07-22 | Labsphere, Inc. | Method of and cassette structure for burn-in and life testing of multiple LEDs and the like |
US6564161B1 (en) * | 2000-12-01 | 2003-05-13 | Advanced Micro Devices, Inc. | Arrangement for testing light emitting diode interface of an integrated network device |
AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
JP2003090847A (ja) * | 2001-09-20 | 2003-03-28 | Seiwa Electric Mfg Co Ltd | 半導体素子測定用電極及びそれを用いた半導体素子の測定機 |
US6797936B1 (en) * | 2002-01-03 | 2004-09-28 | Opto Electronic Systems, Inc. | Automated laser diode testing |
JP4217217B2 (ja) * | 2002-12-11 | 2009-01-28 | オリンパス株式会社 | 光学素子の支持装置およびその製造方法、製造装置 |
JP2004301807A (ja) | 2003-04-01 | 2004-10-28 | Nec Kansai Ltd | 検査用プローブカード |
JP4293840B2 (ja) * | 2003-06-06 | 2009-07-08 | 株式会社アドバンテスト | 試験装置 |
US7030642B2 (en) * | 2004-02-06 | 2006-04-18 | Honeywell International Inc. | Quick attachment fixture and power card for diode-based light devices |
CA2558483C (en) * | 2004-03-08 | 2015-01-06 | Sioptical, Inc. | Wafer-level opto-electronic testing apparatus and method |
EP1738107A4 (en) * | 2004-04-23 | 2008-12-31 | Light Prescriptions Innovators | OPTICAL DISTRIBUTOR FOR LIGHT-EMITTING DIODES |
US20080284329A1 (en) * | 2004-06-18 | 2008-11-20 | Koninklijke Philips Electronics, N.V. | Led with Improve Light Emittance Profile |
KR20050121376A (ko) * | 2004-06-22 | 2005-12-27 | 삼성전자주식회사 | 반도체 장치의 테스트 장치 및 이를 이용한 반도체 장치테스트 방법 |
KR20050122972A (ko) * | 2004-06-26 | 2005-12-29 | 삼성전자주식회사 | 유기 발광소자 분석방법 |
US7374293B2 (en) * | 2005-03-25 | 2008-05-20 | Vishay General Semiconductor Inc. | Apparatus, system and method for testing electronic elements |
CN100573168C (zh) * | 2005-04-21 | 2009-12-23 | 鸿富锦精密工业(深圳)有限公司 | 测试计算机面板发光二极管灯及其连接线的系统及方法 |
WO2007002297A2 (en) * | 2005-06-24 | 2007-01-04 | Crafts Douglas E | Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures |
KR100997946B1 (ko) * | 2005-12-22 | 2010-12-02 | 파나소닉 전공 주식회사 | Led를 가진 조명 장치 |
KR100816617B1 (ko) * | 2006-08-09 | 2008-03-24 | 팸텍주식회사 | 부품트레이 잔류 부품 검출보드 |
US8573836B2 (en) * | 2006-10-26 | 2013-11-05 | Tokyo Electron Limited | Apparatus and method for evaluating a substrate mounting device |
US7652480B2 (en) * | 2007-04-26 | 2010-01-26 | General Electric Company | Methods and systems for testing a functional status of a light unit |
US7538359B2 (en) * | 2007-08-16 | 2009-05-26 | Philips Lumiled Lighting Company, Llc | Backlight including side-emitting semiconductor light emitting devices |
US7868637B2 (en) * | 2007-10-15 | 2011-01-11 | Hamilton Sundstrand Corporation | System and method for automated detection of singular faults in diode or'd power bus circuits |
CN101237017B (zh) * | 2008-02-29 | 2012-02-08 | 晶能光电(江西)有限公司 | Led裸芯测试用的led支架处理方法、led支架单元以及支架 |
US7804589B2 (en) * | 2008-06-13 | 2010-09-28 | Chroma Ate Inc. | System and method for testing light-emitting devices |
CN101339092B (zh) * | 2008-08-13 | 2010-11-10 | 重庆大学 | Led芯片/晶圆/外延片的非接触式检测方法及检测装置 |
JP2012124249A (ja) * | 2010-12-07 | 2012-06-28 | Toshiba Corp | Ledパッケージ及びその製造方法 |
TWM436227U (en) * | 2012-03-23 | 2012-08-21 | Mpi Corp | Heating point testing appliances |
-
2009
- 2009-12-24 JP JP2011550997A patent/JP5327489B2/ja not_active Expired - Fee Related
- 2009-12-24 WO PCT/KR2009/007809 patent/WO2010095809A2/ko active Application Filing
- 2009-12-24 US US13/148,980 patent/US8952717B2/en not_active Expired - Fee Related
- 2009-12-24 CN CN2009801571661A patent/CN102326090B/zh not_active Expired - Fee Related
-
2010
- 2010-02-12 TW TW099104694A patent/TWI449901B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007019237A (ja) * | 2005-07-07 | 2007-01-25 | Tokyo Seimitsu Co Ltd | 両面発光素子用プロービング装置 |
KR20070039994A (ko) * | 2005-10-11 | 2007-04-16 | 블루코드테크놀로지 주식회사 | 웨이퍼 콜렉터 |
JP2008070308A (ja) * | 2006-09-15 | 2008-03-27 | Tokyo Seimitsu Co Ltd | マルチチッププローバ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104089758A (zh) * | 2014-07-03 | 2014-10-08 | 常州光电技术研究所 | Led产品质量检测分类系统及其检测分类方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2010095809A2 (ko) | 2010-08-26 |
US8952717B2 (en) | 2015-02-10 |
CN102326090B (zh) | 2013-12-11 |
TWI449901B (zh) | 2014-08-21 |
JP5327489B2 (ja) | 2013-10-30 |
US20110316579A1 (en) | 2011-12-29 |
CN102326090A (zh) | 2012-01-18 |
TW201037296A (en) | 2010-10-16 |
JP2012518182A (ja) | 2012-08-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010095809A3 (ko) | 엘이디 칩 테스트장치 | |
WO2010095810A3 (ko) | 엘이디 칩 분류장치 | |
PL2419706T3 (pl) | Sposób i próbka do testowania przyrządu pomiarowego do wyznaczania wilgotności wagowej | |
EP1958565A4 (en) | APPARATUS FOR MEASURING BLOOD PRESSURE CAPABLE OF MEASURING ARTERIAL PRESSURE WITH HIGH PRECISION | |
WO2011149725A3 (en) | Flexible storage interface tester with variable parallelism and firmware upgradeability | |
HK1157608A1 (en) | Blood vessel characteristics measurement device and method for measuring blood vessel characteristics | |
EP2633950A4 (en) | METHOD FOR MEASURING THE DIMENSIONS OF A TOOL, AND MEASURING DEVICE | |
HK1168419A1 (en) | Test probe as well as family of test probes for the non-destructive testing of a workpiece by means of ultrasonic sound and testing device | |
WO2011071256A3 (en) | Centrifugal micro-fluidic structure for measuring glycated hemoglobin, centrifugal micro-fluidic device for measuring glycated hemoglobin, and method for measuring glycated hemoglobin | |
EP2634526A4 (en) | METHOD FOR MEASURING DIMENSIONS OF A TOOL, MEASURING DEVICE, AND MACHINE TOOL | |
EP2026058A4 (en) | DEVICE FOR MEASURING A BIOLOGICAL COMPONENT CAPABLE OF MEASURING NON-INVASIVE PRECISION ACCURATELY A BIOLOGICAL CONSTITUENT | |
EP2243824A4 (en) | DEVICE AND METHOD FOR MEASURING THE CONCENTRATION OF A BIOMASS AND USE OF A CHIP ELECTRONIC ELEMENT FOR MEASURING THE BIOMASS CONCENTRATION | |
WO2010128280A3 (en) | Ph measurement device | |
GB2488720B (en) | Test and measurement device with a pistol-grip handle | |
FR2906027B1 (fr) | Dispositif de mesure multicapteur pour sonde de jaugeage embarquee | |
EP2422289A4 (en) | FIELD DEVICE WITH MEASUREMENT ACCURACY REPORT | |
GB201014837D0 (en) | Biomarker signatures and uses thereof | |
WO2015007153A3 (en) | An immunoassay reading device and its calibration method | |
TWI340832B (en) | Handler for testing packaged chips | |
IL201475A0 (en) | Probe for testing semiconductor devices | |
WO2010063987A3 (en) | Device | |
WO2011145895A3 (ko) | 반사식 흡광도 측정 장치 및 이를 포함하는 반사식 흡광도 및 측방유동 분석 일체형 장치 | |
EP2120042A4 (en) | TEST FOR MEASURING BIOLOGICAL SAMPLES AND MEASURING DEVICE FOR BIOLOGICAL SAMPLES | |
FI10956U1 (fi) | Mittaväline ajoneuvon mittaukseen | |
EP2418479A4 (en) | SENSOR CHIP AND MEASURING DEVICE AND BLOOD TEST DEVICE WITH THE SENSOR CHIP |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980157166.1 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09840485 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13148980 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011550997 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 18/01/2012) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09840485 Country of ref document: EP Kind code of ref document: A2 |