WO2010084867A1 - Film de résine fluorée multicouche et carte de circuits imprimés - Google Patents

Film de résine fluorée multicouche et carte de circuits imprimés Download PDF

Info

Publication number
WO2010084867A1
WO2010084867A1 PCT/JP2010/050597 JP2010050597W WO2010084867A1 WO 2010084867 A1 WO2010084867 A1 WO 2010084867A1 JP 2010050597 W JP2010050597 W JP 2010050597W WO 2010084867 A1 WO2010084867 A1 WO 2010084867A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
multilayer
fluororesin film
fluororesin
copper
Prior art date
Application number
PCT/JP2010/050597
Other languages
English (en)
Japanese (ja)
Inventor
淳 岡本
哲雄 奥山
郷司 前田
Original Assignee
東洋紡績株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋紡績株式会社 filed Critical 東洋紡績株式会社
Priority to JP2010512863A priority Critical patent/JP5625906B2/ja
Publication of WO2010084867A1 publication Critical patent/WO2010084867A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Definitions

  • the present invention relates to a multilayer fluororesin film used for an electronic device, a flexible printed circuit board that is reduced in size and weight, a copper-coated multilayer fluororesin film laminated with a copper foil that is a metal foil, and a copper foil.
  • the present invention relates to a printed wiring board formed by removing a part thereof to form a circuit pattern and a multilayer printed wiring board formed by laminating these.
  • a polyimide resin excellent in heat resistance is used as an electrical insulator layer in a flexible printed wiring board composed of a laminate having a conductor layer and an electrical insulator layer.
  • the following three methods are used as a manufacturing method of the laminated body which consists of a polyimide resin layer and a conductor layer.
  • a method of bonding a polyimide film and a copper foil through an adhesive layer (2) A method of forming a metal layer on a polyimide resin film by a method such as vapor deposition and / or metal plating, (3) A method of coating a metal foil with a polyimide resin precursor, then forming a polyimide resin from the precursor by heat treatment or the like, and forming a polyimide resin layer on the metal foil (see Patent Document 1).
  • the adhesiveness between the polyimide resin layer and the conductor layer is not sufficient, which may cause malfunction of the circuit. Further, since a propagation loss when a printed wiring board is large, it is not suitable as a high-frequency member.
  • adhesion between the conductor layer and the electrical insulator layer is improved by forming irregularities of about 3 ⁇ m on the surface of the conductor layer on the side in contact with the electrical insulator layer (see Patent Document 2). ).
  • a polyimide whose dielectric constant is reduced by dispersing inorganic fine particles such as silica in polyimide is disclosed.
  • a laminate in which a fluororesin film having the smallest dielectric constant among plastics and a metal plate is laminated is disclosed (see Patent Document 7).
  • a method has a problem that the fluororesin film is peeled off from the metal plate by rubbing against the blade at the time of punching at a high speed, resulting in a decrease in yield.
  • the tensile strength and elongation, which are mechanical properties of the fluororesin film are equivalent to polyolefin at room temperature, and the linear expansion coefficient is 60 ppm / ° C. to 160 ppm / ° C., for example, the linear expansion coefficient is 16 ppm / ° C.
  • the present invention has a feature of polyimide resin by using a polyimide resin having a core that is less deformed and having excellent heat resistance even when subjected to high temperature treatment, which is suitable as a base material for electronic components, and arranging a fluororesin on the surface.
  • a certain low linear expansion coefficient linear expansion coefficient equivalent to copper foil as a multilayer fluororesin film
  • high mechanical properties low dielectric constant and low water absorption (reducing the high water absorption of polyimide), which are the characteristics of fluororesin
  • An object is to provide a compatible multilayer fluororesin film, a copper-clad multilayer fluororesin film, a printed wiring board, a multilayer printed wiring board, and the like.
  • the present inventors have found that a multilayer fluororesin film in which a fluororesin layer is laminated on both sides of a polyimide film is used for a copper-clad laminate, a printed wiring board, an FPC, a TAB tape, a COF tape film, and the like.
  • the present invention was completed by finding that a product that does not peel off at high temperature and high humidity and has excellent electrical characteristics can be obtained. That is, the first invention of the present application has the following configuration. 1.
  • thermoplastic fluororesin layer made of polymer (PFA), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), or tetrafluoroethylene / hexafluoropropylene / perfluoroalkyl vinyl ether copolymer (EPE).
  • the layer is a layer of a functional group-containing thermoplastic fluororesin. Multilayer fluororesin film.
  • the layer (B) is a polyimide layer having a polyimide benzoxazole component, and has a linear expansion coefficient of ⁇ 10 ppm / ° C. to 10 ppm / ° C. Or 2.
  • Multilayer fluororesin film 4).
  • the thickness of the layer is 1.0 ⁇ m to 50 ⁇ m
  • (B) the thickness of the layer is 1.0 ⁇ m to 38 ⁇ m. ⁇ 3.
  • the second invention of the present application has the following configuration. 9.
  • the linear expansion coefficient of the (A) layer (B) layer laminate in the multilayer fluororesin film is 10 ppm / ° C.
  • a multilayer fluororesin film which is a thermoplastic fluororesin layer made of any one of a polymer (FEP) and a tetrafluoroethylene / hexafluoropropylene / perfluoroalkyl vinyl ether copolymer (EPE). Film. 10.
  • the layer is a layer of a functional group-containing thermoplastic fluororesin. Multilayer fluororesin film. 11.
  • the layer is a polyimide layer having a polyimide benzoxazole component, and has a linear expansion coefficient of ⁇ 10 ppm / ° C. to 10 ppm / ° C. Or 10. Multilayer fluororesin film. 12
  • the thickness of the layer is 1.0 ⁇ m to 50 ⁇ m, and the (B) layer is 1.0 ⁇ m to 38 ⁇ m. ⁇ 11. Any multilayer fluororesin film. 13.
  • A Storage elastic modulus at room temperature of layer: E ′ (A) and storage elastic modulus at room temperature of layer (B): ratio of E ′ (B) ⁇ E ′ (A) / E ′ (B) ⁇ Is 2.0% to 20%.
  • a printed wiring board obtained by removing a part of the multilayer fluororesin film of any one of 15.9 to 14 and the copper layer of the copper pasted multilayer fluororesin film to form a circuit pattern.
  • a multilayer printed wiring board obtained by laminating any one of 16.9 to 15 multilayer fluororesin film, a copper-coated multilayer fluororesin film, and a printed wiring board.
  • the multilayer fluororesin film in which the (A) fluororesin layer / (B) polyimide resin layer / (A) fluororesin layer of the first invention of the present application is laminated in this order has a low linear expansion coefficient ( As a multilayer fluororesin film, it is possible to achieve both the linear expansion coefficient equivalent to copper foil), high mechanical properties, low dielectric constant and low water absorption (reducing the high water absorption of polyimide), which are the characteristics of fluororesin. It is a multilayer film.
  • the (A) fluororesin layer is further laminated on the (B) surface of the copper-clad laminate (CCL) in which the (C) copper layer is formed on the (B) polyimide resin layer of the second invention of the present application without using an adhesive.
  • a multilayer fluororesin film having a linear expansion coefficient of 10 ppm / ° C. to 30 ppm / ° C. of the (A) layer (B) layer laminate in the multilayer fluororesin film is a polyimide resin
  • the multilayer fluororesin film of the present invention is excellent in adhesion to copper foil, and has a small deviation from the linear expansion coefficient of copper foil of 16 ppm / ° C. and low water absorption rate. Even underneath, warping and distortion hardly occur, and as a result, the quality of the obtained printed wiring board and the production yield are improved.
  • the copper-coated multilayer fluororesin film, the printed wiring board, and the multilayer printed wiring board using the multilayer fluororesin film of the present invention are used as electronic parts exposed to high temperatures, and warp or strain of the base material during the production thereof. The production of high-quality electronic components without yielding of the multilayer fluororesin film and the copper foil and the improvement of the yield can be realized, which is extremely meaningful in the industry.
  • the present invention is described in detail below.
  • the (A) fluororesin layer used in the present invention is formed by applying a fluororesin film obtained by casting a fluororesin melt into a film, or applying the fluororesin melt to a polyimide resin layer (film). In view of handling and productivity, the form of a fluororesin film is preferable.
  • the fluororesin can be appropriately selected from conventionally known thermoplastic fluororesins used for general molding. Examples of thermoplastic fluororesins include polymers or copolymers such as unsaturated fluorinated hydrocarbons, unsaturated fluorinated chlorinated hydrocarbons, ether group-containing unsaturated hydrocarbons, or these unsaturated fluorinated hydrocarbons. Examples include ethylene copolymers.
  • thermoplastic fluororesin examples include tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetrafluoroethylene / hexafluoropropylene / per Fluoroalkyl vinyl ether copolymer (EPE), tetrafluoroethylene / ethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), chlorotrifluoroethylene / ethylene copolymer (ECTFE) ) And the like.
  • PFA tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer
  • FEP tetrafluoroethylene / hexafluoropropylene copolymer
  • EPE tetrafluoroethylene / hexafluoro
  • tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene / hexafluoropropylene copolymer (PFA), which is a copolymer of perfluorine ( FEP) and tetrafluoroethylene / hexafluoropropylene / perfluoroalkyl vinyl ether copolymer (EPE) are preferred.
  • the fluororesin is more preferably a functional group-containing thermoplastic fluororesin.
  • a thermoplastic fluororesin containing no functional group it is necessary to subject the polyimide film to surface treatment such as honing treatment, corona treatment, plasma treatment, ion gun treatment, and etching treatment in order to obtain adhesiveness that can withstand practical use. Therefore, the cost may increase.
  • thermoplastic fluororesin containing a functional group includes a carboxylic acid group or a derivative group thereof, a hydroxyl group, a nitrile group, a cyanato group, a carbamoyloxy group, a phosphonooxy group, a halophosphonooxy group, a sulfonic acid group or a derivative group thereof, and a sulfo group.
  • a thermoplastic fluororesin usually used in the general molding is used in which the functional group is contained within a range that does not significantly impair the properties.
  • thermoplastic fluororesin as shown in the above example used for general molding is synthesized and then introduced by adding or substituting these functional groups.
  • it can be obtained by copolymerizing monomers having these functional groups during the synthesis of the thermoplastic fluororesin exemplified above.
  • the functional group examples include —COOH, —CH 2 COOH, —COOCH 3, —CONH 2, —OH, —CH 2 OH, —CN, —CH 2 O (CO) NH 2, —CH 2 OCN, —CH 2 OP (O) (OH) 2, — Groups such as CH2OP (O) Cl2 and -SO2F can be exemplified.
  • These functional groups are preferably introduced into the fluororesin by copolymerizing a fluorine-containing monomer having a functional group during the production of the fluororesin.
  • These monomers containing functional groups are preferably copolymerized in the functional group-containing fluororesin in an amount of 0.5 to 10% by weight, more preferably 1 to 5% by weight. Distribution of the functional group-containing monomer in the functional group-containing fluororesin may be uniform or non-uniform. If the content ratio of the functional group-containing monomer in the functional group-containing fluororesin is too small, the effect as a compatibilizer is small, while if the content ratio increases, the functional group-containing fluororesin is similar to the crosslinking reaction due to strong interaction between the functional group-containing fluororesins. Reactions can occur and the viscosity can suddenly increase, making melt molding difficult.
  • the content rate of a functional group containing monomer increases, there exists a tendency for the heat resistance of a functional group containing fluororesin to worsen.
  • a functional group containing fluororesin There is no particular limitation on the viscosity or molecular weight of the functional group-containing fluororesin, but it is within the range not exceeding the viscosity or molecular weight of the thermoplastic fluororesin for general molding blended with these functional group-containing fluororesins, preferably the same. Good level.
  • the fluororesin preferably contains 0.1 to 2% by mass of an antistatic agent that imparts antistatic properties.
  • an antistatic agent surfactants such as nonionic surfactants, anionic surfactants, cationic surfactants, and zwitterionic surfactants are preferable.
  • the fluororesin preferably contains an inorganic filler that lowers the dielectric constant and dielectric loss tangent.
  • Inorganic fillers include silica, clay, talc, calcium carbonate, mica, diatomaceous earth, alumina, zinc oxide, titanium oxide, calcium oxide, magnesium oxide, iron oxide, tin oxide, antimony oxide, calcium hydroxide, magnesium hydroxide, water Aluminum oxide, basic magnesium carbonate, magnesium carbonate, zinc carbonate, barium carbonate, dosonite, hydrotalcite, calcium sulfate, barium sulfate, calcium silicate, montmorillonite, bentonite, activated clay, sepiolite, imogolite, sericite, glass fiber, glass Examples include beads, silica-based balloons, carbon black, graphite, carbon fibers, carbon balloons, wood powder, and zinc borate.
  • the inorganic filler may be used alone or in combination of two or more.
  • the content of the inorganic filler is preferably 1 to 100% by mass with respect to the fluororesin. Further, it is preferable that these inorganic fillers are porous because the dielectric constant and dielectric loss tangent are further reduced.
  • the thickness of the fluororesin layer is preferably 1.0 ⁇ m to 50 ⁇ m, more preferably 1.0 ⁇ m to 38 ⁇ m, and still more preferably 1.0 ⁇ m to 25 ⁇ m. Thicknesses greater than 50 ⁇ m are not preferred for the purpose of reducing the weight of electronic components. On the other hand, a film thickness of less than 1.0 ⁇ m is not preferable because surface modification effects such as improvement of electrical characteristics, reduction of water absorption, and improvement of adhesiveness due to the fluororesin are reduced.
  • the storage elastic modulus E ′ (A) of the fluororesin layer is not particularly limited, and it is generally known that when the fluororesin having the above composition is used, it takes a value of 0.3 GPa to 1.0 GPa.
  • the linear expansion coefficient of the fluororesin layer is not particularly limited, and it is generally known that when the fluororesin having the above composition is used, a value of 50 ppm / ° C. to 150 ppm / ° C. is taken. Furthermore, it is preferable that the dielectric constant and dielectric loss tangent of the film are small from the viewpoint of high frequency response.
  • the dielectric constant and dielectric loss tangent of the fluororesin layer are not particularly limited, and it is known that generally low values are obtained when the fluororesin having the composition is used. Specifically, the dielectric constant at 1 MHz is 2.0 to 2.2, and the dielectric loss tangent at 1 MHz is 3.0 ⁇ 10 ⁇ 4 to 5.0 ⁇ 10 ⁇ 4 .
  • the surface of the fluororesin layer is subjected to treatment with a coupling agent (aminosilane, epoxysilane, etc.), sand plast treatment, hole treatment, corona treatment, plasma treatment, ion gun treatment, etching treatment, etc., as necessary. Also good.
  • a coupling agent aminosilane, epoxysilane, etc.
  • sand plast treatment hole treatment
  • corona treatment corona treatment
  • plasma treatment ion gun treatment
  • etching treatment etc.
  • the (B) polyimide resin layer used in the present invention is composed of, for example, aromatic tetracarboxylic acids (anhydrides, acids, and amide bond derivatives are collectively referred to as classes below) and aromatic diamines (amines and amide bonds).
  • the polyimide film will be mainly described in detail.
  • the said polyimide is not specifically limited, The combination of the following aromatic diamine and aromatic tetracarboxylic acid (anhydride) is mentioned as a preferable example.
  • A. Combination with aromatic tetracarboxylic acid having pyromellitic acid residue and aromatic diamine having benzoxazole structure.
  • B. A combination of an aromatic diamine having a phenylenediamine skeleton and an aromatic tetracarboxylic acid having a biphenyltetracarboxylic acid skeleton.
  • C A combination of an aromatic diamine having a diphenyl ether skeleton and an aromatic tetracarboxylic acid having a pyromellitic acid residue.
  • A. A polyimide film having an aromatic diamine residue having a benzoxazole structure is preferred.
  • the molecular structure of the aromatic diamine having the benzoxazole structure is not particularly limited, and specific examples include the following. These diamines are preferably 70 mol% or more, more preferably 80 mol% or more of the total diamine.
  • amino (aminophenyl) benzoxazole isomers are preferable from the viewpoint of ease of synthesis, and 5-amino-2- (p-aminophenyl) benzoxazole is more preferable.
  • each isomer refers to each isomer in which the two amino groups of amino (aminophenyl) benzoxazole are determined according to the coordinate position (eg, “Formula 1” to “Formula 4” above). Each compound described in the above. These diamines may be used alone or in combination of two or more.
  • the molecular structure of the aromatic tetracarboxylic acid anhydrides is not particularly limited, and specific examples include the following. These acid anhydrides are preferably 70 mol% or more, more preferably 80 mol% or more of the total acid anhydride.
  • tetracarboxylic dianhydrides may be used alone or in combination of two or more. Furthermore, as long as it is 30 mol% or less of the total tetracarboxylic dianhydrides, one or more of the non-aromatic tetracarboxylic dianhydrides exemplified below may be used in combination. Examples of such tetracarboxylic acid anhydrides include butane-1,2,3,4-tetracarboxylic dianhydride, pentane-1,2,4,5-tetracarboxylic dianhydride, and cyclobutanetetracarboxylic acid.
  • the amount of the solvent used may be an amount sufficient to dissolve the monomer as a raw material.
  • the weight of the monomer in the solution in which the monomer is dissolved is usually 5 to 40% by weight, The amount is preferably 10 to 30% by weight.
  • the conditions for the polymerization reaction (hereinafter also simply referred to as “polymerization reaction”) for obtaining the polyamic acid may be conventionally known conditions.
  • the polymerization reaction is carried out in an organic solvent at a temperature range of 0 to 80 ° C. Stirring and / or mixing continuously for min to 30 hours. If necessary, the polymerization reaction may be divided or the temperature may be increased or decreased.
  • the order of adding both monomers is not particularly limited, but it is preferable to add aromatic tetracarboxylic acid anhydrides to the solution of aromatic diamines.
  • the viscosity of the polyamic acid solution obtained by the polymerization reaction is preferably 10 to 2000 Pa ⁇ s, more preferably 100 to 1000 Pa ⁇ s from the viewpoint of the stability of liquid feeding as measured with a Brookfield viscometer (25 ° C.). It is.
  • Vacuum defoaming during the polymerization reaction is effective for producing a good quality polyamic acid solution.
  • polymerization by adding a small amount of terminal blockers to aromatic diamines before a polymerization reaction.
  • the terminal blocking agent include compounds having a carbon-carbon double bond such as maleic anhydride.
  • the amount of maleic anhydride used is preferably 0.001 to 1.0 mole per mole of aromatic diamine.
  • a green film (a self-supporting precursor film is obtained by applying the polyamic acid solution on a support and drying, then,
  • the method of imidization reaction by subjecting the green film to heat treatment include, but are not limited to, application of the polyamic acid solution to the support, including casting from a slit-attached base and extrusion by an extruder.
  • a conventionally known solution coating means can be appropriately used.
  • the conditions for drying the polyamic acid coated on the support to obtain a green sheet are not particularly limited, and examples include a temperature of 70 to 150 ° C. and a drying time of 5 to 180 minutes.
  • a conventionally known drying apparatus that satisfies such conditions can be applied, and examples thereof include hot air, hot nitrogen, far infrared rays, and high frequency induction heating.
  • an imidization reaction is performed. As a specific method thereof, a conventionally known imidation reaction can be appropriately used.
  • thermal ring closure method in which an imidization reaction proceeds by subjecting it to a heat treatment after performing a stretching treatment as necessary using a polyamic acid solution containing no ring closure catalyst or a dehydrating agent.
  • the heating temperature in this case is exemplified by 100 to 500 ° C.
  • it is a two-stage heat treatment in which the treatment is carried out at 350 to 500 ° C. for 3 to 20 minutes after treatment at 150 to 250 ° C. for 3 to 20 minutes. Is mentioned.
  • the imidization reaction is a chemical ring closure method in which a polyamic acid solution contains a ring closing catalyst and a dehydrating agent, and the imidization reaction is performed by the action of the ring closing catalyst and the dehydrating agent.
  • the imidization reaction is partially advanced to form a film having self-supporting property, and then imidization can be performed completely by heating.
  • the condition for partially proceeding with the imidization reaction is preferably a heat treatment for 3 to 20 minutes at 100 to 200 ° C., and the condition for causing the imidization reaction to be completely performed is preferably 200 to 400 ° C. For 3 to 20 minutes.
  • the thickness of the polyimide film forming the polyimide resin layer is preferably 1.0 ⁇ m to 38 ⁇ m, more preferably 1.0 ⁇ m to 25 ⁇ m, and still more preferably 1.0 ⁇ m to 12.5 ⁇ m.
  • a film thickness greater than 38 ⁇ m is not preferred for the purpose of reducing the weight of electronic components.
  • the ratio of the polyimide with respect to the whole laminated body becomes high and exerts a bad influence on physical properties, such as a water absorption rate and an electrical property, it is unpreferable.
  • the film thickness is less than 1.0 ⁇ m, film formation is very difficult because the film is easily broken during conveyance and easily wrinkled.
  • the storage elastic modulus: E ′ (B) of the polyimide film forming the polyimide resin layer is not particularly limited, but is preferably 6.0 GPa or more, more preferably 7.0 GPa or more, and even more preferably 8.0 GPa or more. . If the tensile strength at break is less than 6 GPa, the effect of reinforcing the fluororesin layer by the polyimide film may not be obtained.
  • the linear expansion coefficient of the polyimide film forming the polyimide resin layer is preferably ⁇ 10 ppm / ° C. to 10 ppm / ° C., more preferably ⁇ 7.5 ppm / ° C.
  • the method for producing a copper-clad laminate (CCL) in which (C) a copper layer is formed on the polyimide resin layer (B) used in the second invention of the present application is not particularly limited, and the following means are exemplified.
  • a means for forming a copper layer on a polyimide film by a wet plating method such as electroless plating or electroplating.
  • the linear expansion coefficient of the multilayer fluororesin film is preferably 10 ppm / ° C. to 30 ppm / ° C., more preferably 10 ppm / ° C. to 28 ppm / ° C., and still more preferably 10 ppm / ° C. to 25 ppm / ° C.
  • the coefficient of linear expansion exceeds this range, when laminated with a copper foil having a coefficient of linear expansion of 16 ppm / ° C, the difference between the coefficients of linear expansion is large, and there is a risk of peeling during use or warping. There is a fear.
  • the thickness ratio of the (A) layer in the multilayer fluororesin film ⁇ total (A) layer / multilayer fluororesin film ⁇ Is 60% to 90%, and the storage elastic modulus of the layer (A) at room temperature: E ′ (A) and the storage elastic modulus of the layer (B) at room temperature: E ′ (B) ratio ⁇ E ′ (A) / E ′ (B) ⁇ is preferably 2.0% to 20%, more preferably a thickness ratio of 65% to 90% and a storage modulus ratio of 2.5% to 15%. More preferably, the thickness ratio is 65% to 85%, and the storage modulus ratio is 3.0% to 10%. When the thickness ratio or the storage elastic modulus ratio exceeds this range, a multilayer fluororesin film having a target linear expansion coefficient cannot be obtained.
  • the thickness of the copper foil used in the present invention is preferably 1.0 ⁇ m to 25 ⁇ m, more preferably 1.0 ⁇ m to 12.5 ⁇ m, and still more preferably 1.0 ⁇ m to 10 ⁇ m.
  • the copper foil lamination method for the copper-clad multilayer fluororesin film used in the present invention is not particularly limited, and the following means are exemplified. -Means for welding by hot pressing after laminating the multilayer fluororesin film and copper foil. -Means for forming a copper layer on a multilayer fluororesin film using vacuum coating techniques such as vapor deposition, sputtering, and ion plating.
  • a means for forming a copper layer on a multilayer fluororesin film by a wet plating method such as electroless plating or electroplating can be laminated on at least one side of the multilayer fluororesin film (on the (A) side of the multilayer fluororesin film in the second invention of the present application) by combining these means alone or in combination.
  • the multilayer fluororesin film or copper-laminated multilayer fluororesin film of the present invention can be obtained by applying a photoresist on the side of a conductive copper foil layer or a post-added thick film metal layer formed on the conductive copper foil layer, if necessary. After applying and drying, a wiring circuit pattern is formed by the steps of exposure, development, etching, and photoresist peeling, and further, solder resist coating, plastic and electroless tin plating are performed as necessary, flexible printed wiring boards, and multilayered A multi-layer printed wiring board or a printed wiring board on which a semiconductor chip is directly mounted is obtained. There are no particular limitations on the method for creating these circuits, making them multi-layered, and mounting a semiconductor chip, and the methods may be appropriately selected from known methods.
  • An inorganic coating such as a single metal or a metal oxide may be formed on the surface of the copper foil layer used in the present invention or, if necessary, the surface of the thick film metal layer attached later.
  • the surface of the copper foil layer or, if necessary, the subsequent thick film metal layer formed thereon is treated with a coupling agent (aminosilane, epoxysilane, etc.), sandplast treatment, rolling treatment, corona treatment, You may use for a plasma process, an ion gun process, an etching process, etc.
  • CTE Linear expansion coefficient
  • the stretch rate in the MD direction and the TD direction is measured under the following conditions, and the stretch rate / temperature at intervals of 90 to 100 ° C., 100 to 110 ° C.,. Was performed up to 400 ° C., and the average value of all measured values from 100 ° C. to 350 ° C. was calculated as CTE (average value).
  • the film to be measured was subjected to differential scanning calorimetry (DSC) under the following conditions, and the melting point (Tm) was determined according to JIS K7121.
  • Bread Aluminum bread (non-airtight type)
  • Sample mass 4mg
  • Temperature rising start temperature 30 ° C
  • Temperature rise end temperature 400 ° C
  • Temperature increase rate 20 ° C / min
  • Atmosphere Argon
  • a fluororesin film to be measured for dielectric constant and dielectric loss tangent was cut into a size of 3 mm (thickness) ⁇ 200 mm ⁇ 120 mm to prepare a test film.
  • Conductive paste was applied to both sides of the test film and wired, and the dielectric constant and dielectric loss tangent at 1 MHz were measured.
  • peel strength The peel strength between the multilayer fluororesin film / copper foil was determined by conducting a 90 ° peel test under the following conditions.
  • Device name Shimadzu Autograph AG-IS Sample length: 100mm Sample width: 10mm Measurement temperature: 25 ° C Peeling speed: 50mm / min Atmosphere: Atmosphere
  • the polyamic acid film was wound up.
  • the polyamic acid film is passed through a pin tenter having three heat treatment zones, the first stage 150 ° C. ⁇ 2 minutes, the second stage 220 ° C. ⁇ 2 minutes, the third stage 475 ° C. ⁇ 4 minutes, and 20 minutes after passing through the tenter.
  • Six rolls were passed to give a double-side free process, and finally slit to 500 mm width to obtain polyimide films A1 to A4.
  • Table 1 shows the physical property values of the obtained polyimide films A1 to A4.
  • the third stage is 400 ° C. ⁇ 4 minutes, and 20 minutes after passing through the tenter.
  • Six rolls were passed to give a double-side free process, and finally slit to 500 mm width to obtain polyimide film B.
  • Table 1 shows the physical property values of the obtained polyimide film B.
  • the polyamic acid solution C was coated on a non-lubricant surface of a polyethylene terephthalate film A-4100 (manufactured by Toyobo Co., Ltd.) using a comma coater, dried at 110 ° C. for 5 minutes, and without peeling off from the support.
  • the polyamic acid film was wound up.
  • the polyamic acid film is passed through a pin tenter having three heat treatment zones, the first stage is 150 ° C. ⁇ 2 minutes, the second stage is 220 ° C. ⁇ 2 minutes, the third stage is 460 ° C.
  • PAF is a tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer
  • FEP is a tetrafluoroethylene / hexafluoropropylene copolymer
  • EPE is a tetrafluoroethylene / hexafluoropropylene / perfluoroalkyl vinyl ether copolymer
  • ETFE represents a tetrafluoroethylene / ethylene copolymer.
  • the polyamic acid film was wound up.
  • the polyamic acid film is passed through a pin tenter having three heat treatment zones, the first stage 150 ° C. ⁇ 2 minutes, the second stage 220 ° C. ⁇ 2 minutes, the third stage 475 ° C. ⁇ 4 minutes, and 20 minutes after passing through the tenter.
  • Six rolls were passed to give a double-side free process, and finally slit to 500 mm width to obtain polyimide films a1 to a4.
  • Table 11 shows the physical properties of the obtained polyimide films a1 to a4. Next, sputtering and plating were performed.
  • the polyimide films a1 to a4 were cut to A4 size and fixed by being sandwiched between stainless steel frames having openings. This frame was fixed to a substrate holder in the sputtering apparatus. The substrate holder and the polyimide film are fixed in close contact. For this reason, the temperature of a polyimide film can be set by flowing a refrigerant in a substrate holder. Next, plasma treatment of the polyimide film surface was performed.
  • the plasma treatment conditions were as follows: argon gas, frequency 13.56 MHz, output 200 W, gas pressure 1 ⁇ 10 ⁇ 3 Torr, treatment temperature 2 ° C., treatment time 2 minutes.
  • sputtering was performed in contact with the SUS plate of the substrate holder to form a copper thin film having a thickness of 0.25 ⁇ m to obtain single-side underlying metal thin film-formed polyimide films a1 to a4.
  • the thickness of the copper and NiCr layers was confirmed by a fluorescent X-ray method.
  • the obtained single-side underlying metal thin film-formed polyimide films a1 to a4 were fixed to a plastic frame, and a copper layer having a thickness of 9 ⁇ m was formed using a copper sulfate plating bath.
  • the electrolytic plating conditions were immersion in an electrolytic plating solution (copper sulfate 80 g / l, sulfuric acid 210 g / l, HCl, a small amount of brightener), and electricity was passed through 1.5 Adm 2 . Subsequently, the substrate was heat-treated and dried at 120 ° C. for 10 minutes to obtain copper-clad laminates (CCL) a1 to a4 which are polyimide films having a copper layer formed on one side.
  • an electrolytic plating solution copper sulfate 80 g / l, sulfuric acid 210 g / l, HCl, a small amount of brightener
  • the third stage is 400 ° C. ⁇ 4 minutes, and 20 minutes after passing through the tenter.
  • Six rolls were passed to give a double-side free process, and finally slit to 500 mm width to obtain a polyimide film b.
  • Table 11 shows the physical property values of the obtained polyimide film b.
  • sputtering and plating were performed in the same manner as in Production Example 5 to obtain a copper-clad laminate (CCL) b.
  • the polyamic acid solution C was coated on a non-lubricant surface of a polyethylene terephthalate film A-4100 (manufactured by Toyobo Co., Ltd.) using a comma coater, dried at 110 ° C. for 5 minutes, and without peeling off from the support.
  • the polyamic acid film was wound up.
  • the polyamic acid film is passed through a pin tenter having three heat treatment zones, the first stage is 150 ° C. ⁇ 2 minutes, the second stage is 220 ° C. ⁇ 2 minutes, the third stage is 460 ° C.
  • a functional group-containing fluororesin film D1 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) is arranged on both sides of the polyimide film A1 cut out to a size of 150 mm ⁇ 150 mm, and 30 at 330 ° C. and 5 MPa which is equal to or higher than the melting point of the fluororesin film. Heat-press molding was performed for a minute to obtain a multilayer fluororesin film.
  • a functional group-containing fluororesin film D1 and a 9 ⁇ m-thick copper foil are arranged in this order on both sides of a polyimide film A1 cut out to a size of 150 mm ⁇ 150 mm.
  • the film was heated and pressed at 330 ° C. and 5 MPa for 30 minutes to obtain a double-sided copper-laminated multilayer fluororesin film.
  • the evaluation results of the obtained multilayer fluororesin film and double-sided copper-laminated multilayer fluororesin film are shown in Table 4.
  • the thickness ratio, the storage elastic modulus ratio, and the linear expansion coefficient are the evaluation results of the multilayer fluororesin film
  • the peel strength and the quality are the evaluation results of the double-sided copper-bonded multilayer fluororesin film.
  • Examples 2 and 3 A laminate was prepared and evaluated in the same manner as in Example 1 except that polyimide films A2 and A3 were used instead of polyimide film A1.
  • the evaluation results of the obtained multilayer fluororesin film and double-sided copper-laminated multilayer fluororesin film are shown in Table 4.
  • Example 4 A laminate was prepared and evaluated in the same manner as in Example 1 except that a functional group-containing fluororesin film D2 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) was used instead of the functional group-containing fluororesin film D1.
  • Table 5 shows the evaluation results of the obtained multilayer fluororesin film and the double-sided copper-laminated multilayer fluororesin film.
  • Example 5 A laminate was prepared and evaluated in the same manner as in Example 4 except that polyimide films A2 and A3 were used instead of polyimide film A1.
  • Table 5 shows the evaluation results of the obtained multilayer fluororesin film and the double-sided copper-laminated multilayer fluororesin film.
  • Example 7 A laminate was prepared and evaluated in the same manner as in Example 6 except that a functional group-containing fluororesin film D3 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) was used instead of the functional group-containing fluororesin film D2.
  • Table 5 shows the evaluation results of the obtained multilayer fluororesin film and the double-sided copper-laminated multilayer fluororesin film.
  • Example 8 to 11 The polyimide film A2 cut out to a size of 150 mm ⁇ 150 mm was set in a Nikketsu plasma treatment machine and evacuated to a vacuum. Then, oxygen gas was introduced to cause discharge, and plasma treatment was performed. The processing conditions are a degree of vacuum of 3 ⁇ 10 Pa, a gas flow rate of 1.5 SLM, and a discharge power of 12 KW.
  • Functional group-free fluororesin film E Fluon PFA, manufactured by Asahi Glass Co., Ltd.
  • F neoflon PFA, manufactured by Daikin Industries, Ltd.
  • G neoflon FEP, manufactured by Daikin Industries
  • Example 1 A laminate was prepared and evaluated in the same manner as in Example 2 except that polyimide film B was used instead of polyimide film A1.
  • Table 7 shows the evaluation results of the obtained multilayer fluororesin film and double-sided copper-laminated multilayer fluororesin film.
  • the linear expansion coefficient of the polyimide film is large, the linear expansion coefficient of the obtained multi-layer fluororesin is also large, and the deviation from the linear expansion coefficient of the copper foil is large, so that the adhesion and quality after the reliability test are lowered.
  • Example 2 was used except that functional group-containing fluororesin film I (Fluon LM-ETFE AH2000, manufactured by Asahi Glass Co., Ltd.) and J (neoflon EFEP RP5000, manufactured by Daikin Industries, Ltd.) were used instead of functional group-containing fluororesin film D1.
  • a laminate was prepared and evaluated in the same manner.
  • Table 7 shows the evaluation results of the obtained multilayer fluororesin film and double-sided copper-laminated multilayer fluororesin film. Since ETFE is inferior in heat resistance, moist heat resistance, and electrical properties as compared with perfluorinated resins such as PFA, FEP, and EPE, the adhesiveness and quality after the reliability test are lowered.
  • a functional group-free fluororesin film K (Fluon ETFE, manufactured by Asahi Glass Co., Ltd.) and L (neoflon ETFE, manufactured by Daikin Industries) are used in place of the functional group-free fluororesin film E in the same manner as in Example 8.
  • a laminate was prepared by the method and evaluated.
  • Table 7 shows the evaluation results of the obtained multilayer fluororesin film and double-sided copper-laminated multilayer fluororesin film. Since ETFE is inferior in heat resistance, moist heat resistance, and electrical properties as compared with perfluorinated resins such as PFA, FEP, and EPE, the adhesiveness and quality after the reliability test are lowered.
  • Example 6 A laminate was prepared and evaluated in the same manner as in Example 1 except that polyimide film A4 was used instead of polyimide film A1.
  • Table 8 shows the evaluation results of the obtained multilayer fluororesin film and the double-sided copper-laminated multilayer fluororesin film. If the thickness ratio of the fluororesin is too small, the linear expansion coefficient of the resulting multi-layer fluororesin will be small, but the contribution of low moisture absorption, which is a feature of the fluororesin, will be small. Decreased.
  • Comparative Example 7 A laminate was prepared and evaluated in the same manner as in Comparative Example 6 except that a functional group-containing fluororesin film D2 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) was used instead of the functional group-containing fluororesin film D1.
  • Table 8 shows the evaluation results of the obtained multilayer fluororesin film and the double-sided copper-laminated multilayer fluororesin film. If the thickness ratio of the fluororesin is too small, the linear expansion coefficient of the resulting multi-layer fluororesin will be small, but the contribution of low moisture absorption, which is a feature of the fluororesin, will be small. Decreased.
  • Examples 12 to 13, Comparative Examples 11 to 12 Evaluation of warping of copper-coated multilayer fluororesin film
  • a functional group-containing fluororesin film D3 is disposed on both sides of polyimide films A1 to A4 cut out to a size of 150 mm ⁇ 150 mm, and heat-press molding is performed at 330 ° C. and 5 MPa, which is equal to or higher than the melting point of the fluororesin film, A multilayer fluororesin film was obtained.
  • a functional group-containing fluororesin film D3 and a 9 ⁇ m-thick copper foil are arranged in this order on both surfaces of polyimide films A1 to A4 cut out to a size of 150 mm ⁇ 150 mm.
  • Heat-press molding was performed for 30 minutes at 330 ° C. and 5 MPa, which is higher than the melting point, to obtain a double-sided copper-laminated multilayer fluororesin film.
  • functional group-containing fluororesin film D3 is provided on one side of polyimide films A1 to A4 cut into a size of 150 mm ⁇ 150 mm, functional group-containing fluororesin film D3 is provided on the other side, and a 9 ⁇ m-thick copper foil (UWZ, Furukawa Circuit Foil).
  • UWZ Furukawa Circuit Foil
  • Examples 14 to 15, Comparative Example 13 Evaluation of warping of copper-coated multilayer fluororesin film
  • a functional group-containing fluororesin film D2 is arranged on both surfaces of polyimide films A2 to A4 cut out to a size of 150 mm ⁇ 150 mm, and heat-press molding is performed at 330 ° C. and 5 MPa, which is higher than the melting point of the fluororesin film, for 30 minutes, A multilayer fluororesin film was obtained.
  • a functional group-containing fluororesin film D2 and a 9 ⁇ m-thick copper foil are arranged in this order on both surfaces of polyimide films A2 to A4 cut out to a size of 150 mm ⁇ 150 mm.
  • Heat-press molding was performed for 30 minutes at 330 ° C. and 5 MPa, which is higher than the melting point, to obtain a double-sided copper-laminated multilayer fluororesin film.
  • functional group-containing fluororesin film D2 is provided on one side of polyimide films A2 to A4 cut out to a size of 150 mm ⁇ 150 mm, functional group-containing fluororesin film D3 is provided on the other side, and a 9 ⁇ m-thick copper foil (UWZ, Furukawa Circuit Foil).
  • UWZ Furukawa Circuit Foil
  • heat-pressure molding was performed at 330 ° C. and 5 MPa, which is higher than the melting point of the fluororesin film, for 30 minutes to obtain a single-sided copper-laminated multilayer fluororesin film.
  • Table 10 shows the evaluation results of the obtained single-sided and double-sided copper-clad multilayer fluororesin film.
  • the copper foil is warped inward in an asymmetric configuration such as a single-sided copper-laminated multilayer fluororesin film.
  • a functional group-containing fluororesin film D1 is placed on one side of a polyimide film A2 cut into a size of 150 mm ⁇ 150 mm, a functional group-containing fluororesin film D1 and a copper foil with a thickness of 9 ⁇ m are arranged in this order on the other side.
  • Heat-press molding was performed for 30 minutes at 330 ° C. and 5 MPa, which is higher than the melting point, to obtain a single-sided copper-laminated multilayer fluororesin film.
  • a photoresist (FR-200, manufactured by Shipley Co., Ltd.) was applied on one side, dried, and then closely exposed with a glass photomask. Development was performed with a% KOH aqueous solution. Next, using a cupric chloride etching line containing HCl and hydrogen peroxide, etching is performed at a spray pressure of 40 ° C. and 2 kgf / cm 2 to form a test pattern, followed by cleaning, and annealing at 125 ° C. for 1 hour. Processing was performed to obtain a single-sided copper-coated multilayer fluororesin film (printed wiring board) with a single-sided pattern.
  • Heat-press molding was performed for 30 minutes to obtain a multilayer printed wiring board as shown in FIG.
  • the obtained multilayer printed wiring board is very useful as a high-frequency member because the copper wiring is covered with a fluororesin having a low dielectric constant.
  • Example 16 A functional group-containing fluororesin film d1 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) is arranged on one side of a polyimide film a1 cut out to a size of 150 mm ⁇ 150 mm, and is 30 ° C. and 5 MPa at 330 ° C., which is equal to or higher than the melting point of the fluororesin film. Heat-press molding was performed for a minute, and the (A) layer (B) layer laminated body was obtained. Table 14 shows the evaluation results of the thickness ratio, storage elastic modulus ratio, and linear expansion coefficient of the obtained (A) layer (B) layer laminate.
  • a functional group-containing fluororesin film d1 and a 9 ⁇ m-thick copper foil are arranged in this order on the surface of the polyimide film a1 of a copper-clad laminate (CCL) a1 cut into a size of 150 mm ⁇ 150 mm. Then, heat-press molding was performed for 30 minutes at 330 ° C. and 5 MPa, which is higher than the melting point of the fluororesin film, to obtain a copper-bonded multilayer fluororesin film.
  • Table 14 shows the evaluation results of the heat and moisture resistance test and heat resistance test of the obtained copper-clad multilayer fluororesin film.
  • Examples 17 and 18 A laminate in the same manner as in Example 16 except that polyimide films a2 and a3 are used instead of polyimide film a1 and copper-clad laminates (CCL) a2 and a3 are used instead of copper-clad laminate (CCL) a1.
  • Table 14 shows the evaluation results of the thickness ratio, the storage elastic modulus ratio, the linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show.
  • Example 19 A laminate was prepared and evaluated in the same manner as in Example 16 except that a functional group-containing fluororesin film d2 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) was used instead of the functional group-containing fluororesin film d1.
  • Table 15 shows the evaluation results of the thickness ratio, the storage elastic modulus ratio, the linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show.
  • Example 20 and 21 A laminate in the same manner as in Example 19 except that polyimide films a2 and a3 are used instead of polyimide film a1 and copper-clad laminates (CCL) a2 and a3 are used instead of copper-clad laminate (CCL) a1.
  • Table 15 shows the evaluation results of the thickness ratio, the storage elastic modulus ratio, the linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show.
  • Example 22 A laminate was prepared and evaluated in the same manner as in Example 21, except that a functional group-containing fluororesin film d3 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) was used instead of the functional group-containing fluororesin film d2.
  • Table 15 shows the evaluation results of the thickness ratio, the storage elastic modulus ratio, the linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show.
  • Example 23 to 26 The polyimide film a2 cut out to a size of 150 mm ⁇ 150 mm was set in a Nikketsu plasma treatment machine and evacuated to a vacuum. Then, oxygen gas was introduced to cause discharge, and plasma treatment was performed.
  • the processing conditions are a degree of vacuum of 3 ⁇ 10 Pa, a gas flow rate of 1.5 SLM, and a discharge power of 12 KW.
  • Functional group-free fluorine resin film e (Fluon PFA, manufactured by Asahi Glass Co., Ltd.), f (neoflon PFA, manufactured by Daikin Industries, Ltd.), g (neoflon FEP, manufactured by Daikin Industries Co., Ltd.), h (EPE, manufactured by Daikin Industries, Ltd.), respectively, and heat-pressure molding was performed at 330 ° C. and 5 MPa, which is higher than the melting point of the fluororesin film, for 30 minutes to obtain a (A) layer (B) layer laminate.
  • Table 16 shows the evaluation results of the thickness ratio, storage elastic modulus ratio, and linear expansion coefficient of the obtained (A) layer (B) layer laminate.
  • the copper-clad laminate (CCL) a2 was set in a Nikketsu plasma treatment machine and evacuated to a vacuum. Then, oxygen gas was introduced to cause discharge, and plasma treatment was performed.
  • the processing conditions are a degree of vacuum of 3 ⁇ 10 Pa, a gas flow rate of 1.5 SLM, and a discharge power of 12 KW.
  • a functional group-free fluorine resin film e to h and a 9 ⁇ m thick copper foil are arranged in this order on the surface of the polyimide film a2 of the obtained plasma-treated copper-clad laminate (CCL) a2, and the melting point of the fluorine resin film is 330 or higher.
  • Heat-press molding was performed at 5 ° C. for 30 minutes at a temperature of 5 ° C. to obtain a copper-bonded multilayer fluororesin film.
  • Table 16 shows the evaluation results of the heat and moisture resistance test and heat resistance test of the obtained copper-clad multilayer fluororesin film.
  • Example 14 A laminate is prepared in the same manner as in Example 17 except that polyimide film b is used instead of polyimide film a1, and copper-clad laminate (CCL) b is used instead of copper-clad laminate (CCL) a1. evaluated.
  • Table 17 shows the evaluation results of the thickness ratio, the storage elastic modulus ratio, the linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show. When the linear expansion coefficient of the polyimide film is large, the linear expansion coefficient of the obtained multi-layer fluororesin is also large, and the deviation from the linear expansion coefficient of the copper foil is large, so that the adhesion and quality after the reliability test are lowered.
  • Example 17 and Example 17 were used except that a functional group-containing fluororesin film i (Fluon LM-ETFE AH2000, manufactured by Asahi Glass Co., Ltd.) and j (neoflon EFEP RP5000, manufactured by Daikin Industries, Ltd.) were used instead of the functional group-containing fluororesin film d1.
  • a laminate was prepared and evaluated in the same manner.
  • Table 17 shows the evaluation results of the thickness ratio, the storage elastic modulus ratio, the linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show. Since ETFE is inferior in heat resistance, moist heat resistance, and electrical properties as compared with perfluorinated resins such as PFA, FEP, and EPE, the adhesiveness and quality after the reliability test are lowered.
  • Example 19 A laminate is created in the same manner as in Example 16 except that polyimide film a4 is used instead of polyimide film a1, and copper-clad laminate (CCL) a4 is used instead of copper-clad laminate (CCL) a1. evaluated.
  • Table 18 shows the evaluation results of the thickness ratio, storage elastic modulus ratio, and linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show. If the thickness ratio of the fluororesin is too small, the linear expansion coefficient of the resulting multi-layer fluororesin will be small, but the contribution of low moisture absorption, which is a feature of the fluororesin, will be small. Decreased.
  • Comparative Example 20 A laminate was prepared and evaluated in the same manner as in Comparative Example 19 except that a functional group-containing fluororesin film d2 (Fluon PFA adhesive grade, manufactured by Asahi Glass Co., Ltd.) was used instead of the functional group-containing fluororesin film d1.
  • Table 18 shows the evaluation results of the thickness ratio, storage elastic modulus ratio, and linear expansion coefficient of the obtained (A) layer (B) layer laminate, the wet heat resistance test and the heat resistance test of the copper-coated multilayer fluororesin film. Show. If the thickness ratio of the fluororesin is too small, the linear expansion coefficient of the resulting multi-layer fluororesin will be small, but the contribution of low moisture absorption, which is a feature of the fluororesin, will be small. Decreased.
  • Example 29 to 30, Comparative Example 26 Evaluation of warping of copper-coated multilayer fluororesin film
  • a functional group-containing fluororesin film d2 is arranged on one side of polyimide films a2 to a4 cut out to a size of 150 mm ⁇ 150 mm, and heat-press molding is performed at 330 ° C. and 5 MPa, which is higher than the melting point of the fluororesin film, for 30 minutes,
  • (A) Layer (B) A layered product was obtained.
  • Table 20 shows the evaluation results of the thickness ratio, storage elastic modulus ratio, and linear expansion coefficient of the obtained (A) layer (B) layer laminate.
  • a functional group-containing fluororesin film d1 is placed on the surface of the polyimide film a2 of a copper-clad laminate (CCL) a2 cut out to a size of 150 mm ⁇ 150 mm, and heated at 330 ° C. and 5 MPa, which is higher than the melting point of the fluororesin film, for 30 minutes. Pressure molding was performed to obtain a multilayer fluororesin film.
  • a photoresist FR-200, manufactured by Shipley Co., Ltd.
  • the obtained multilayer printed wiring board is very useful as a high-frequency member because the copper wiring is covered with a fluororesin having a low dielectric constant.
  • a copper-coated multi-layer fluororesin film in which copper foil is laminated on the (A) surface of rumm and a printed wiring board having a circuit pattern obtained by removing a part of this copper foil is also used in high-temperature and high-humidity processing. It can withstand adhesion between copper foil and copper foil, improves the quality of the obtained printed wiring board and the like, improves the production yield, and realizes the production of high-quality electronic components.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention porte sur un stratifié contenant un film de polyimide ayant une résistance thermique élevée et une stabilité dimensionnelle élevée comme base. L'invention porte de façon spécifique sur un film de résine fluorée multicouche qui comprend une couche de résine fluorée, une couche de résine polyimide et une couche de résine fluorée stratifiée dans cet ordre, et qui a un coefficient de dilatation linéaire de 10 à 30 ppm/°C. L'invention porte également de façon spécifique sur un film de résine fluorée multicouche revêtu de cuivre, qui comprend le film de résine fluorée multicouche et une feuille de cuivre stratifiée sur au moins une surface du film de résine fluorée multicouche. L'invention porte en outre de façon spécifique sur une carte de circuits imprimés produite par retrait d'une partie de la feuille de cuivre sur le film de résine fluorée multicouche revêtu de cuivre afin de former un motif de circuit.
PCT/JP2010/050597 2009-01-20 2010-01-20 Film de résine fluorée multicouche et carte de circuits imprimés WO2010084867A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010512863A JP5625906B2 (ja) 2009-01-20 2010-01-20 多層フッ素樹脂フィルムおよびプリント配線板

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2009009626 2009-01-20
JP2009-009626 2009-01-20
JP2009017985 2009-01-29
JP2009-017985 2009-01-29
JP2009-110401 2009-04-30
JP2009110402 2009-04-30
JP2009-110402 2009-04-30
JP2009110401 2009-04-30

Publications (1)

Publication Number Publication Date
WO2010084867A1 true WO2010084867A1 (fr) 2010-07-29

Family

ID=42355919

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/050597 WO2010084867A1 (fr) 2009-01-20 2010-01-20 Film de résine fluorée multicouche et carte de circuits imprimés

Country Status (3)

Country Link
JP (1) JP5625906B2 (fr)
TW (1) TWI461119B (fr)
WO (1) WO2010084867A1 (fr)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012044831A (ja) * 2010-08-23 2012-03-01 Toyota Motor Corp コイル固定用絶縁樹脂シート、コイル固定用絶縁樹脂シートを用いたモータ用ステータおよびモータ用ステータの製造方法
WO2012114680A1 (fr) * 2011-02-21 2012-08-30 パナソニック株式会社 Plaque de stratifié plaquée de métal et plaque de circuit imprimé
WO2014171553A1 (fr) * 2013-04-19 2014-10-23 ダイキン工業株式会社 Corps stratifié plaqué de métal
WO2014171554A1 (fr) * 2013-04-19 2014-10-23 ダイキン工業株式会社 Corps de stratifie a revêtement métallique et carte de circuit imprime
JP5625906B2 (ja) * 2009-01-20 2014-11-19 東洋紡株式会社 多層フッ素樹脂フィルムおよびプリント配線板
JP2015109296A (ja) * 2013-12-03 2015-06-11 国立大学法人山形大学 フレキシブルデバイスの製造方法
JP2016045522A (ja) * 2014-08-19 2016-04-04 富士フイルム株式会社 積層体、転写フィルム、積層体の製造方法、導電膜積層体、静電容量型入力装置および画像表示装置
WO2016181936A1 (fr) * 2015-05-11 2016-11-17 旭硝子株式会社 Matériau pour carte de circuit imprimé, stratifié de métal, son procédé de fabrication, et procédé de fabrication de carte de circuit imprimé
JPWO2014192718A1 (ja) * 2013-05-31 2017-02-23 住友電気工業株式会社 金属樹脂複合体、配線材及び金属樹脂複合体の製造方法
WO2017069216A1 (fr) * 2015-10-22 2017-04-27 旭硝子株式会社 Procédé de fabrication de substrat de câblage
JP2017121807A (ja) * 2016-01-05 2017-07-13 荒川化学工業株式会社 銅張積層体及びプリント配線板
WO2017154926A1 (fr) * 2016-03-08 2017-09-14 旭硝子株式会社 Procédé de fabrication de stratifié et procédé de fabrication de carte de circuit imprimé
WO2019142790A1 (fr) * 2018-01-18 2019-07-25 Ａｇｃ株式会社 Stratifié long, procédé pour le produire, et carte à câblage imprimé
WO2019188611A1 (fr) * 2018-03-30 2019-10-03 株式会社有沢製作所 Film multicouche et feuille stratifiée métallique
WO2019203243A1 (fr) * 2018-04-20 2019-10-24 Ａｇｃ株式会社 Film de rouleau, procédé de production d'un film de rouleau, procédé de production d'un stratifié plaqué de cuivre et procédé de production d'une carte de circuit imprimé
CN110744839A (zh) * 2019-11-01 2020-02-04 中国电子科技集团公司第四十六研究所 一种基于低介电常数车削膜制备复合介质板的工艺
WO2020071473A1 (fr) * 2018-10-04 2020-04-09 株式会社村田製作所 Corps stratifié et son procédé de production
WO2020171024A1 (fr) * 2019-02-21 2020-08-27 Ａｇｃ株式会社 Stratifié et procédé de production d'un stratifié
KR20220142456A (ko) 2020-02-20 2022-10-21 에이지씨 가부시키가이샤 다층 필름, 및 그 제조 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503228B (zh) * 2013-12-05 2015-10-11 Taimide Technology Inc 低介電常數之多層聚醯亞胺膜、其疊合體及其製備方法
JP6816723B2 (ja) * 2015-10-22 2021-01-20 Ａｇｃ株式会社 配線基板の製造方法
CN110744890A (zh) * 2019-10-30 2020-02-04 深圳市弘海电子材料技术有限公司 一种氟聚酰亚胺高频无胶挠性覆铜板及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004195776A (ja) * 2002-12-18 2004-07-15 Asahi Glass Co Ltd ビルドアップ配線板用積層フィルム及びビルドアップ配線板
JP2005035300A (ja) * 2003-07-14 2005-02-10 E I Du Pont De Nemours & Co ポリイミド・コア層および高温フッ素重合体結合層を含む誘電性基材およびそれに関連する方法
JP2006059865A (ja) * 2004-08-17 2006-03-02 Unitika Ltd 基板及びその製造方法
WO2006067970A1 (fr) * 2004-12-20 2006-06-29 Asahi Glass Company, Limited Stratifie pour cartes imprimees souples
JP2007098905A (ja) * 2005-10-07 2007-04-19 Toyobo Co Ltd 多層ポリイミドフィルム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI461119B (zh) * 2009-01-20 2014-11-11 Toyoboseki Kabushikikaisha 多層氟樹脂膜及印刷配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004195776A (ja) * 2002-12-18 2004-07-15 Asahi Glass Co Ltd ビルドアップ配線板用積層フィルム及びビルドアップ配線板
JP2005035300A (ja) * 2003-07-14 2005-02-10 E I Du Pont De Nemours & Co ポリイミド・コア層および高温フッ素重合体結合層を含む誘電性基材およびそれに関連する方法
JP2006059865A (ja) * 2004-08-17 2006-03-02 Unitika Ltd 基板及びその製造方法
WO2006067970A1 (fr) * 2004-12-20 2006-06-29 Asahi Glass Company, Limited Stratifie pour cartes imprimees souples
JP2007098905A (ja) * 2005-10-07 2007-04-19 Toyobo Co Ltd 多層ポリイミドフィルム

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5625906B2 (ja) * 2009-01-20 2014-11-19 東洋紡株式会社 多層フッ素樹脂フィルムおよびプリント配線板
JP2012044831A (ja) * 2010-08-23 2012-03-01 Toyota Motor Corp コイル固定用絶縁樹脂シート、コイル固定用絶縁樹脂シートを用いたモータ用ステータおよびモータ用ステータの製造方法
WO2012114680A1 (fr) * 2011-02-21 2012-08-30 パナソニック株式会社 Plaque de stratifié plaquée de métal et plaque de circuit imprimé
CN103379995A (zh) * 2011-02-21 2013-10-30 松下电器产业株式会社 覆金属层压板及印刷线路板
US9480148B2 (en) 2011-02-21 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
JP5617028B2 (ja) * 2011-02-21 2014-10-29 パナソニック株式会社 金属張積層板、及びプリント配線板
WO2014171553A1 (fr) * 2013-04-19 2014-10-23 ダイキン工業株式会社 Corps stratifié plaqué de métal
JP2014223798A (ja) * 2013-04-19 2014-12-04 ダイキン工業株式会社 金属張積層体
JP2014223799A (ja) * 2013-04-19 2014-12-04 ダイキン工業株式会社 金属張積層体及びプリント配線基板
WO2014171554A1 (fr) * 2013-04-19 2014-10-23 ダイキン工業株式会社 Corps de stratifie a revêtement métallique et carte de circuit imprime
JPWO2014192718A1 (ja) * 2013-05-31 2017-02-23 住友電気工業株式会社 金属樹脂複合体、配線材及び金属樹脂複合体の製造方法
JP2015109296A (ja) * 2013-12-03 2015-06-11 国立大学法人山形大学 フレキシブルデバイスの製造方法
JP2016045522A (ja) * 2014-08-19 2016-04-04 富士フイルム株式会社 積層体、転写フィルム、積層体の製造方法、導電膜積層体、静電容量型入力装置および画像表示装置
CN107960156A (zh) * 2015-05-11 2018-04-24 旭硝子株式会社 印刷基板用材料、金属层叠板、它们的制造方法以及印刷基板的制造方法
TWI694751B (zh) * 2015-05-11 2020-05-21 日商Ａｇｃ股份有限公司 印刷基板用材料、金屬積層板、彼等之製造方法及印刷基板之製造方法
KR102507434B1 (ko) * 2015-05-11 2023-03-07 에이지씨 가부시키가이샤 프린트 기판용 재료, 금속 적층판, 그들의 제조 방법 및 프린트 기판의 제조 방법
KR20180004710A (ko) * 2015-05-11 2018-01-12 아사히 가라스 가부시키가이샤 프린트 기판용 재료, 금속 적층판, 그들의 제조 방법 및 프린트 기판의 제조 방법
US20180050516A1 (en) * 2015-05-11 2018-02-22 Asahi Glass Company, Limited Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board
JPWO2016181936A1 (ja) * 2015-05-11 2018-03-01 旭硝子株式会社 プリント基板用材料、金属積層板、それらの製造方法およびプリント基板の製造方法
WO2016181936A1 (fr) * 2015-05-11 2016-11-17 旭硝子株式会社 Matériau pour carte de circuit imprimé, stratifié de métal, son procédé de fabrication, et procédé de fabrication de carte de circuit imprimé
US10844153B2 (en) 2015-05-11 2020-11-24 AGC Inc. Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board
WO2017069216A1 (fr) * 2015-10-22 2017-04-27 旭硝子株式会社 Procédé de fabrication de substrat de câblage
US10271428B2 (en) 2015-10-22 2019-04-23 AGC Inc. Process for producing wiring substrate
JP2017121807A (ja) * 2016-01-05 2017-07-13 荒川化学工業株式会社 銅張積層体及びプリント配線板
JPWO2017154926A1 (ja) * 2016-03-08 2019-01-24 Ａｇｃ株式会社 積層体の製造方法およびプリント基板の製造方法
WO2017154926A1 (fr) * 2016-03-08 2017-09-14 旭硝子株式会社 Procédé de fabrication de stratifié et procédé de fabrication de carte de circuit imprimé
US10729018B2 (en) 2016-03-08 2020-07-28 AGC Inc. Process for producing laminate and process for producing printed board
WO2019142790A1 (fr) * 2018-01-18 2019-07-25 Ａｇｃ株式会社 Stratifié long, procédé pour le produire, et carte à câblage imprimé
US11632859B2 (en) 2018-01-18 2023-04-18 AGC Inc. Long laminate, method for its production and printed wiring board
JP7234944B2 (ja) 2018-01-18 2023-03-08 Ａｇｃ株式会社 長尺積層体、その製造方法及びプリント配線板
JPWO2019142790A1 (ja) * 2018-01-18 2021-01-28 Ａｇｃ株式会社 長尺積層体、その製造方法及びプリント配線板
JPWO2019188611A1 (ja) * 2018-03-30 2021-04-08 株式会社有沢製作所 多層フィルム及び金属積層板
US11376826B2 (en) 2018-03-30 2022-07-05 Arisawa Mfg. Co., Ltd. Multi-layer film and metal laminate
JP7141446B2 (ja) 2018-03-30 2022-09-22 株式会社有沢製作所 多層フィルム及び金属積層板
WO2019188611A1 (fr) * 2018-03-30 2019-10-03 株式会社有沢製作所 Film multicouche et feuille stratifiée métallique
WO2019203243A1 (fr) * 2018-04-20 2019-10-24 Ａｇｃ株式会社 Film de rouleau, procédé de production d'un film de rouleau, procédé de production d'un stratifié plaqué de cuivre et procédé de production d'une carte de circuit imprimé
JPWO2020071473A1 (ja) * 2018-10-04 2021-09-02 株式会社村田製作所 積層体及びその製造方法
US11445606B2 (en) 2018-10-04 2022-09-13 Murata Manufacturing Co., Ltd. Laminated body and method for manufacturing the same
WO2020071473A1 (fr) * 2018-10-04 2020-04-09 株式会社村田製作所 Corps stratifié et son procédé de production
JP7283481B2 (ja) 2018-10-04 2023-05-30 株式会社村田製作所 積層体及びその製造方法
WO2020171024A1 (fr) * 2019-02-21 2020-08-27 Ａｇｃ株式会社 Stratifié et procédé de production d'un stratifié
CN110744839A (zh) * 2019-11-01 2020-02-04 中国电子科技集团公司第四十六研究所 一种基于低介电常数车削膜制备复合介质板的工艺
KR20220142456A (ko) 2020-02-20 2022-10-21 에이지씨 가부시키가이샤 다층 필름, 및 그 제조 방법

Also Published As

Publication number Publication date
JP5625906B2 (ja) 2014-11-19
TWI461119B (zh) 2014-11-11
JPWO2010084867A1 (ja) 2012-07-19
TW201032680A (en) 2010-09-01

Similar Documents

Publication Publication Date Title
JP5625906B2 (ja) 多層フッ素樹脂フィルムおよびプリント配線板
JP2011051203A (ja) 多層ポリイミドフィルムおよびプリント配線板
JP5476821B2 (ja) 多層フッ素樹脂基板
JP3953051B2 (ja) ポリイミドフィルムおよびそれを用いた銅張積層フィルム
JP5556416B2 (ja) ポリイミドボード、金属積層ポリイミドボード、およびプリント配線板
JP2006269615A (ja) プリント配線板
JP2009056771A (ja) 金属樹脂複合体および回路基板、積層回路基板
JP2017177604A (ja) ポリイミド積層フィルム
JP2011011456A (ja) 多層フッ素樹脂フィルムおよび多層フッ素樹脂基板
JP2009083201A (ja) 多層ポリイミドフィルム及び構造体、多層回路基板
JP2009269372A (ja) 金属貼りポリイミド積層板およびプリント配線板
JP2006199740A (ja) ポリイミドフィルムとその製造方法
JP3912619B2 (ja) 接着シート、金属積層シートおよびプリント配線板
JP2007076231A (ja) 積層ポリイミドフィルム
JP4257587B2 (ja) フレキシブル金属箔積層体
JP2009286094A (ja) 多層ポリイミドフィルム
JP5610018B2 (ja) 多層フッ素樹脂基板
JP2005194318A (ja) ポリイミドフィルム
JP2009272583A (ja) ポリイミド多層基板
JP4876396B2 (ja) プリント配線板
JP4872466B2 (ja) 金属化ポリイミドフィルムとその製造方法
JP5206310B2 (ja) ポリイミドフィルム及びその製造方法
JP2007254530A (ja) 積層接着シート、金属層付き積層接着シートおよび回路基板
WO2024085047A1 (fr) Film de polyimide multicouche
JP2007186586A (ja) 金属化ポリイミドフィルム

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2010512863

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10733474

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10733474

Country of ref document: EP

Kind code of ref document: A1