WO2010044268A1 - 露光装置及びその組立て方法、並びにデバイス製造方法 - Google Patents

露光装置及びその組立て方法、並びにデバイス製造方法 Download PDF

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Publication number
WO2010044268A1
WO2010044268A1 PCT/JP2009/005385 JP2009005385W WO2010044268A1 WO 2010044268 A1 WO2010044268 A1 WO 2010044268A1 JP 2009005385 W JP2009005385 W JP 2009005385W WO 2010044268 A1 WO2010044268 A1 WO 2010044268A1
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WO
WIPO (PCT)
Prior art keywords
exposure apparatus
unit
units
mask
pattern
Prior art date
Application number
PCT/JP2009/005385
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English (en)
French (fr)
Japanese (ja)
Inventor
菊池孝幸
河合佑哉
桑原智尋
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to JP2010533832A priority Critical patent/JPWO2010044268A1/ja
Priority to KR1020117010936A priority patent/KR101763859B1/ko
Priority to KR1020177021003A priority patent/KR101904685B1/ko
Priority to CN200980140868.9A priority patent/CN102187280B/zh
Publication of WO2010044268A1 publication Critical patent/WO2010044268A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Definitions

  • the present invention relates to an exposure apparatus, an assembling method thereof, and a device manufacturing method, and more specifically, an exposure apparatus used in a lithography process for manufacturing a flat panel type electronic device (microdevice) such as a liquid crystal display element, and the like.
  • the present invention relates to an assembling method and a device manufacturing method using the exposure apparatus.
  • a photolithography technique is used to transfer a pattern formed on a mask onto a photosensitive substrate.
  • a mask is placed on a mask stage that moves in a two-dimensional plane, and a pattern formed on the mask is transferred at least in a two-dimensional plane via a projection optical system.
  • a projection exposure apparatus that projects onto a photosensitive substrate placed on a substrate stage that moves in (1) is used (for example, see Patent Document 1).
  • the entire exposure apparatus main body such as a mask stage, a substrate stage, a projection optical system, an illumination optical system, and a gantry for supporting them is configured by a frame having a framework structure and a panel assembled to the frame. It is stored in the chamber.
  • the size and weight of each part of the exposure apparatus are limited by restrictions on the load weight of transportation / conveying means such as vehicles / aircrafts that transport / convey the exposure apparatus, or transportation / conveyance capability.
  • transportation / conveying means such as vehicles / aircrafts that transport / convey the exposure apparatus, or transportation / conveyance capability.
  • the frame constituting the chamber cannot be transported by the transport / transport means in its assembled state, but is brought into the factory in a disassembled state before assembly and assembled on the spot. The same situation existed for large devices other than frames.
  • the present invention is an exposure apparatus that forms a pattern on an object by irradiating an energy beam, and generates the pattern on the object.
  • An exposure apparatus comprising: a pattern generation apparatus; and a frame configured by a plurality of units that support at least a part of each component of the pattern generation apparatus and the apparatus attached to the pattern generation apparatus.
  • the frame composed of a plurality of units that support at least a part of the configuration units of the pattern generation apparatus and the apparatus attached to the pattern generation apparatus is provided, the size of each unit can be transported. ⁇ It can be set in consideration of the weight limit of transport means, transportation / transport capacity, etc. Further, since each of the plurality of units can support at least a part of each component, the load applied to the frame can be dispersed. Moreover, since one frame is constructed from a plurality of units, it is easy to give sufficient strength to the entire frame. Therefore, a large exposure apparatus can be assembled easily and in a short period of time. Further, since the strength of the frame can be set to a sufficient level, it is possible to cope with vibrations, earthquakes, and the like, and it is possible to improve the accuracy of a large-sized and heavy exposure apparatus.
  • the present invention is a device manufacturing method including: exposing an object using the exposure apparatus of the present invention; and developing the exposed object.
  • the present invention supports a pattern generation device that generates a pattern on an object by irradiating an energy beam, and at least a part of each component of the pattern generation device and the device attached to the device.
  • An exposure apparatus assembling method comprising: a frame composed of a plurality of units that perform a preparatory work for apparatus installation; and a body portion excluding a part including a beam source of the pattern generation apparatus Assembling and assembling a plurality of units as a part of the frame, and mounting an illumination system for emitting an energy beam from the beam source on a first unit of a part of the plurality of units;
  • the plurality of units including the first unit assembled are docked in a predetermined procedure. It is grayed as; an assembly method for an exposure apparatus including a.
  • FIG. 2 is a perspective view showing a remaining part obtained by removing an exposure apparatus main body (including a main body part 100 ′) and a unit 56 from the exposure apparatus 100 shown in FIG. 1. It is a figure which removes the unit 54 and the unit 52 from FIG. 10, and shows arrangement
  • FIG. (1) for demonstrating the procedure of an assembly of exposure apparatus.
  • FIG. (2) for demonstrating the procedure of an assembly of exposure apparatus.
  • FIG. (3) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG.
  • FIG. (4) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG. (5) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG. (6) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG. (7) for demonstrating the procedure of the assembly of exposure apparatus. It is FIG. (8) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG. (9) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG. (10) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG. (11) for demonstrating the procedure of an assembly of exposure apparatus. It is FIG. (12) for demonstrating the procedure of an assembly of exposure apparatus.
  • FIG. 1 shows a part of the entire configuration of an exposure apparatus 100 according to an embodiment.
  • FIG. 2 schematically shows a configuration of the exposure apparatus 100 from which an entire frame 50 described later is removed.
  • the exposure apparatus 100 includes an entire frame 50 that is a framework structure, and an exposure apparatus body that supports the illumination system IOP by the entire frame 50.
  • the exposure apparatus main body illuminates the mask M with exposure illumination light (exposure light), and illuminates the illumination light via the mask M on the surface via the projection unit PU (projection optical system).
  • the light is projected onto a glass plate (hereinafter abbreviated as “plate”) P coated with a resist (photosensitive agent), and an image of a pattern formed on the mask M is formed on the plate P.
  • the exposure apparatus main body includes an illumination system IOP and a main body 100 '. Note that at least a part of the illumination system IOP (including the illumination optical system, for example) may be included in the main body.
  • the entire frame 50 also supports a mask transfer device (hereinafter also referred to as a mask loader as appropriate) 90 attached to the exposure apparatus main body.
  • a mask transfer device hereinafter also referred to as a mask loader as appropriate
  • the configuration of the exposure apparatus body will be described in detail later.
  • the entire frame 50 includes three frame units (hereinafter abbreviated as units) 52, 54, and 56, and the three units 52, 54, and 56 are connected to each other. It consists of The connection method will be described later.
  • the connecting direction of the units 52, 54 and 56 is the Y-axis direction (see FIG. 3).
  • the direction perpendicular to the Y-axis direction is the X-axis direction
  • the direction parallel to the X-axis direction and the Y-axis direction is the Z-axis direction.
  • Each of the units 52, 54 and 56 has a width (length) in the X-axis direction longer than a width (length) in the Y-axis direction.
  • the unit 52 is a gate-type unit having a gate shape when viewed from the Y-axis direction, as shown in FIG.
  • the unit 52 consists of a rectangular mesh-like structure (including, for example, a structure in which general structural materials such as pipes are combined, as well as a mesh-like rectangular plate member), and is parallel to the XY plane.
  • the ceiling portion 52c is disposed, and a pair of leg portions 52a and 52b that support the ceiling portion 52c from below are fixed to the + X end portion and the ⁇ X end portion of the ceiling portion 52c.
  • the ceiling part 52c functions as a horizontal member (beam) that supports the load.
  • Each of the leg portions 52a and 52b includes a plurality of (for example, three) pillars arranged at a predetermined interval and a plurality of (for example, four) beam members for connecting them.
  • An opening 52d is formed in the ceiling 52c.
  • the unit 54 is a gate-type unit having a gate shape when viewed from the -Y direction, as shown in FIG.
  • the unit 54 consists of a rectangular mesh-like structure (including, for example, a structure in which general structural materials such as pipes are combined, and a mesh-like rectangular plate member) in parallel to the XY plane.
  • a pair of leg parts 54a and 54b the upper ends of which are respectively fixed to the + X end part and the -X end part of the ceiling part 54c, and supporting the ceiling part 54c from below, and the leg parts 54a and 54b
  • a leg portion 54d that supports the ceiling portion 54c from below.
  • the ceiling part 54c functions as a horizontal member (beam) that supports the load.
  • the unit 54 has substantially the same length in the X-axis direction as the unit 52, but the length in the Y-axis direction is shorter than the unit 52.
  • the unit 54 is lower than the unit 52.
  • Each of the leg portions 54a and 54b is composed of two pillars arranged at a predetermined interval and a plurality of (for example, two) beam members connecting them.
  • the leg portion 54d includes a plurality of (for example, two) columns that support the + Y side end of the ceiling portion 54c that is not supported by the leg portions 54a and 54b, and a plurality of these columns. And a plurality of (for example, two) beam members to be connected.
  • the leg portion 54d is connected to the leg portions 54a and 54b via a beam member.
  • the above-described units 52 and 54 are spaced apart from each other in the Y-axis direction as shown in FIG.
  • two connecting members 58 each of which includes a beam member and a + Y side column that forms the leg portion 52a of the unit 52 and a ⁇ Y side column that forms the leg portion 54a of the unit 54.
  • the + Y side column constituting the leg portion 52b of the unit 52 and the ⁇ Y side column constituting the leg portion 54b of the unit 54 are connected by using two connection members 58 made of beam members. ing.
  • the unit 56 is a connecting unit that connects the units 52 and 54 having different heights as shown in FIG. More specifically, as shown in FIG. 6, the unit 56 has, for example, a rectangular mesh-like structure (for example, a structure in which general structural materials such as pipes are combined) or a rectangular mesh-like appearance.
  • a ceiling portion 56c including a plate member and the like, and two leg portions 56a and 56b having different heights each having an upper end fixed to the ⁇ Y end portion and the + Y end portion of the ceiling portion 56c.
  • the leg portion 56b is composed of a plurality of (for example, four) columns arranged at substantially equal intervals and a plurality of (for example, three) beam members that connect the plurality of columns.
  • the leg portion 56a is configured in the same manner as the leg portion 56b, but the length (dimension) in the Z-axis direction is shorter than the leg portion 56b by the height difference between the unit 52 and the unit 54. Further, the + X side end portions of the leg portions 56a and 56b are connected by a beam member.
  • the lower end of the leg portion 56a of the unit 56 is fixed to the upper surface of the + Y side end portion of the ceiling portion 52c of the unit 52, and the ⁇ Y side end portion of the ceiling portion 54c of the unit 54 is fixed.
  • the lower end of the leg portion 56b of the unit 56 is fixed to the upper surface.
  • each of the three units 52, 54, and 56 constituting the entire frame 50 has a weight and a size that do not exceed the weight limit of a transportation means / transport means such as a vehicle.
  • each unit is composed of a plurality of parts including a leg part and a ceiling part. Transporting and assembling each unit on site will eliminate the weight limitation problem.
  • FIG. 2 the configuration of the exposure apparatus main body will be described with reference to FIGS. 2, 7, 8, and 9.
  • FIG. 1 if necessary, a method of supporting the constituent parts of the exposure apparatus main body and its accessory apparatus by the entire frame 50 will also be described.
  • FIG. 7 shows the arrangement of the constituent parts of the entire frame 50 and the exposure apparatus main body supported by the entire frame 50 and its accessory apparatus
  • FIG. 8 shows the main body section 100 ′ arranged inside the entire frame 50. Is schematically shown in a perspective view.
  • FIG. 9 is a block diagram showing the main configuration of the control system of the exposure apparatus 100.
  • the control system is mainly configured of a main controller 20 including a microcomputer (or workstation) that performs overall control of the entire apparatus.
  • the exposure apparatus main body includes an illumination system IOP, a mask stage MST that holds the mask M, a projection unit PU that projects a pattern formed on the mask M onto the plate P, and a plate that holds the plate P.
  • a stage PST and the like are provided.
  • the illumination system IOP includes an illumination system disclosed in, for example, US Patent Application Publication No. 2001/0033490, US Pat. No. 5,729,331, and US Pat. No. 6,288,772. It is constituted similarly. That is, the illumination system IOP is connected to a light source composed of an ultra-high pressure mercury lamp that emits coherent exposure light, for example, an ultraviolet bright line (for example, g-line, i-line, etc.), and the light source via a light transmission optical system. Including illumination optics. The illumination system IOP emits exposure light toward the mask M.
  • the light source is not limited to an ultrahigh pressure mercury lamp, and a pulse laser light source such as an ArF excimer laser (output wavelength 193 nm) or a KrF excimer laser (output wavelength 248 nm), or a solid-state laser device can be used.
  • a pulse laser light source such as an ArF excimer laser (output wavelength 193 nm) or a KrF excimer laser (output wavelength 248 nm), or a solid-state laser device can be used.
  • the illumination system IOP is mounted on the ceiling 52c of the unit 52 as shown in FIG.
  • the illumination system IOP has an exit end (a part of the illumination optical system that constitutes a part of the illumination system IOP) provided at the lower end of the + Y side end within the opening 52d of the ceiling 52c described above. It is mounted on the ceiling portion 52c in a state of being inserted into the ceiling. That is, the illumination system IOP is supported from below by the ceiling 52 c of the unit 52.
  • the main body 100 ′ disposed inside the entire frame 50 is not shown.
  • the main body 100 ′ includes a body BD (see FIG. 2) installed on the floor F, a mask stage MST, a plate stage PST, and a projection unit PU mounted on the body BD. (Not shown in FIG. 8, see FIG. 2), and a mask stage drive system MSD for driving the mask stage MST and a plate stage drive system PSD for driving the plate stage PST (both not shown in FIG. 8, see FIG. 9) Etc.
  • the body BD is arranged in parallel with a predetermined interval in the Y-axis direction, and both end portions in the respective longitudinal directions (X-axis direction) are interposed via a vibration isolation system (support member) 65.
  • a pair of mounts 66a and 66b supported on the floor surface F, a rectangular plate-shaped surface plate 68 long in the Y-axis direction installed on the upper surfaces of the pair of mounts 66a and 66b, and ⁇ X ends of the mounts 66a and 66b A pair of auxiliary mounts 64a and 64b placed on the parts with the Y-axis direction as the longitudinal direction, and a rectangular plate-like mount 62 installed on the pair of auxiliary mounts 64a and 64b with the X-axis direction as the longitudinal direction Including.
  • Each of the pair of mounts 66a and 66b has a pair of step portions in the vicinity of both ends in the longitudinal direction, and the lower surface (inner bottom surface) of the step portions is parallel to the upper surface of the step portion.
  • the surface plate 68 is installed on the internal bottom face of a pair of mount frame 66a, 66b.
  • the pair of mounts 66a and 66b and the pair of auxiliary mounts 64a and 64b constituting the body BD are assembled in a well shape as is apparent from the above description. Further, since the gantry 62 serves as a lens barrel surface plate that supports the projection unit PU (including the lens barrel of the projection optical system) as will be described later, it is hereinafter referred to as a lens barrel surface plate 62.
  • the body BD is installed on the floor surface F independently of the entire frame 50.
  • the mask stage MST is disposed below the illumination system IOP, as is apparent from FIG.
  • the mask M on which a pattern is formed is placed on the mask stage MST.
  • the mask stage MST is supported on a pair of guides 63a and 63b installed on the lens barrel surface plate 62 in the Y-axis direction in a non-contact manner via an air bearing (not shown).
  • the mask stage MST can be driven within a predetermined stroke in the Y-axis direction on the guides 63a and 63b by the mask stage drive system MSD, and is finely driven in the rotation direction ( ⁇ z direction) around the X-axis direction and the Z-axis. Is possible.
  • the mask stage drive system MSD includes a pair of linear motors 71 and 72. 2 and 7, the pair of stators 71a and 72a constituting the pair of linear motors 71 and 72 are suspended from the units 52 and 54 (the ceiling portions 52c and 54c constituting the units). It is supported by lowering.
  • the stators 71a and 72a are arranged with the arrangement direction of the units 52 and 54 (that is, the Y-axis direction that is the connection direction) as the longitudinal direction and are spaced apart from each other in the X-axis direction.
  • each of the stators 71a and 72a may be disassembled into a plurality of parts, and a part of the plurality of parts and the remaining part may be supported using the units 52 and 54, respectively.
  • Stator 71a, 72a consists of a magnet unit with a U-shaped cross section, as shown in FIG.
  • a plurality of permanent magnets are arranged at a predetermined pitch along the Y-axis direction so that an alternating magnetic field is formed along the Y-axis direction.
  • the permanent magnets adjacent to each other and the permanent magnets facing each other have different polarities.
  • stator 72a a plurality of permanent magnets are arranged along the Y-axis direction in the same arrangement as the stator 71a side.
  • stator 72a for example, two permanent magnets that are elongated in the Y-axis direction are respectively disposed on the upper and lower opposing surfaces. Also in this case, the permanent magnets adjacent to each other and the permanent magnets facing each other have different polarities.
  • an armature unit (coil unit) is inserted into the internal space of the stators 71a and 72a and constitutes the linear motors 71 and 72 together with the stators 71a and 72a.
  • Movers 71b and 72b are provided so as to project.
  • a plurality of armature coils are arranged in an arrangement corresponding to the arrangement of the magnets on the corresponding stators 71a and 72a side.
  • the linear motor 71 is a Y linear motor that generates a driving force (thrust) in the Y-axis direction with respect to the mover 71b.
  • the linear motor 72 is an XY two-dimensional linear motor that generates a driving force (thrust) in the X-axis direction in addition to a driving force (thrust) in the Y-axis direction with respect to the mover 72b.
  • the stroke in the Y-axis direction of the mover 72b is approximately the same as the length of the stator 72a, but the stroke in the X-axis direction is shorter than the width of the stator in the X-axis direction.
  • the position of the mask stage MST in the XY plane is measured by a mask stage interferometer MSI (see FIG. 9) that irradiates a length measuring beam onto a reflective surface provided (or formed) on the mask stage MST.
  • the measurement result is supplied to the main controller 20 (see FIG. 9).
  • Main controller 20 drives mask stage MST via mask stage drive system MSD based on the supplied measurement result, and controls the position (and speed) of mask stage MST.
  • the position information of the mask stage MST may be measured by an encoder system as disclosed in, for example, US Patent Application Publication No. 2007/0288121.
  • the projection unit PU is supported by the lens barrel surface plate 62 below the mask stage MST.
  • the projection unit PU has a projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775. That is, the projection unit PU includes a plurality of projection optical systems arranged in a staggered manner, and the plurality of projection optical systems have a single rectangular image field whose longitudinal direction is the X-axis direction. Works as well.
  • each of the plurality of projection optics for example, an apparatus that forms an erect image with a double-sided telecentric, equal-magnification system is used.
  • Each of the plurality of projection optical systems can also be called a projection optical module.
  • the mask M in which the first surface (object surface) of the projection optical system and the pattern surface are substantially aligned is arranged.
  • the mask M is relatively moved in the scanning direction (Y-axis direction) with respect to the plurality of illumination regions (exposure light), and the plurality of exposure regions (exposure light).
  • the plate P is moved relative to the scanning direction (Y-axis direction) to perform scanning exposure of the shot area (partition area) on the plate P, and the pattern of the mask M is transferred to the shot area.
  • the plate stage PST is arranged below the projection unit PU as shown in FIG. Here, the plate P is placed on the plate stage PST. As shown in FIG. 8, the plate stage PST is installed on a surface plate 68 spaced apart in the X-axis direction via a pair of guides 69a and 69b with the Y-axis direction as a longitudinal direction via an air bearing or the like. It is supported without contact.
  • the plate stage PST can be driven within a predetermined stroke in the Y-axis direction on the guides 69a and 69b by the plate stage drive system PSD, and is inclined in the X-axis direction, the ⁇ z direction, the Z-axis direction, and the tilt direction with respect to the XY plane ( It can also be finely driven in the rotation direction around the X axis ( ⁇ x direction) and the rotation direction around the Y axis ( ⁇ y direction).
  • the plate stage drive system PSD includes a pair of linear motors 73 and 74.
  • the stators 73a and 74a constituting the pair of linear motors 73 and 74 are both made of a U-shaped member having a longitudinal direction in the Y-axis direction. 66b is supported on the upper surface of each step described above.
  • the stators 73a and 74a are spaced apart from each other in the X-axis direction, and the surface plate 68 is installed on the above-described internal bottom surfaces of the mounts 66a and 66b in an arrangement located in the center thereof.
  • the stator 73a is configured in the same manner as the above-described stator 71a
  • the stator 74a is configured in the same manner as the above-described stator 72a.
  • a mover 73b is projected from the + X end of the plate stage PST.
  • the mover 73b is in a state where the tip is inserted into the internal space of the stator 73a.
  • the mover 73b is composed of an armature unit (coil unit) similar to the mover 71b described above, and constitutes a Y linear motor 73 similar to the linear motor 71 described above together with the stator 73a.
  • a movable element 74b is projected from the ⁇ X end of the plate stage PST.
  • the mover 74b is in a state where the tip is inserted into the internal space of the stator 74a.
  • the mover 74b is configured by an armature unit (coil unit) similar to the mover 72b described above, and constitutes an XY two-dimensional linear motor 74 similar to the linear motor 72 described above together with the stator 74a.
  • the plate stage PST is driven by the linear motors 73 and 74 with a long stroke in the Y-axis direction and is finely driven in the X-axis direction and the ⁇ z direction.
  • the plate stage drive system PSD includes a Z / tilt drive (not shown) for driving the plate stage PST in the Z-axis direction, the ⁇ x direction, and the ⁇ y direction.
  • the Z / tilt driving device can be configured by three (or four) Z driving devices including, for example, a voice coil motor, which finely drives the plate stage PST in the Z-axis direction.
  • the position (and inclination ( ⁇ x rotation and ⁇ y rotation)) of the plate stage PST in the XY plane is a plate stage interferometer PSI that irradiates a length measuring beam to a reflecting surface provided (or formed) on the plate stage PST. (See FIG. 9) and the measurement result is supplied to the main controller 20 (see FIG. 9).
  • Main controller 20 drives plate stage PST via plate stage drive system PSD based on the supplied measurement results, and controls the position (and speed) of plate stage PST.
  • the position information of the plate stage PST may be measured by an encoder system, similarly to the mask stage MST side.
  • the body BD is installed on the floor surface F independently of the entire frame 50. Accordingly, the mask stage MST, projection unit PU, plate stage PST, and the like mounted on each part of the body BD are installed on the floor surface F independently of the entire frame 50.
  • the exposure apparatus 100 of the present embodiment is provided with a surface position measurement system AF (see FIG. 9) that measures the surface position (position of the surface in the Z-axis direction) of the plate P placed on the plate stage PST. ing.
  • a surface position measuring system AF for example, a measuring system disclosed in US Pat. No. 6,552,775 is used.
  • the main body 100 'further includes a plurality of alignment systems AL (not shown in FIG. 8, refer to FIG. 9) disposed above the plate stage PST.
  • the alignment system AL is suspended and supported on the lens barrel surface plate 62 together with the projection unit PU.
  • the alignment system AL for example, an image processing type FIA (Field Image Alignment) system is used.
  • the detection result (position information of the target mark) of the alignment system AL is supplied to the main controller 20 via an alignment signal processing system (not shown) (see FIG. 9).
  • a plurality of mark plates are installed on the plate stage PST.
  • the height of the surface of the mark plate is substantially equal to that of the plate P placed on the plate stage PST.
  • a reference mark that is detected by the alignment system AL is formed on the surface of a mark plate (not shown).
  • a mark image detection system MD (FIG. 9) includes a lens system and an imaging device (CCD or the like) below some of the plurality of mark plates (not shown). Are respectively arranged.
  • the mark image detection system MD simultaneously detects the image of the alignment mark (not shown) on the mask M illuminated by the exposure light IL and the image of the reference mark lens system and the image of the reference mark lens system. The position of the alignment mark (image) with respect to (image) is measured. The measurement result is supplied to the main controller 20 (see FIG. 9).
  • the detection system MD is not limited to a method of capturing a mark image, and may be a method of detecting the exposure light IL through a light transmission portion provided on the upper surface of the plate stage PST.
  • the exposure apparatus 100 of the present embodiment is provided with a mask transfer device 90 that transfers the mask M onto the mask stage MST.
  • the mask transfer device 90 is supported by being suspended by a unit 56 (a ceiling portion 56 c constituting the unit 56).
  • the mask transfer device 90 is fixed to the ceiling portion 56 c in a suspended state and extends in the X-axis direction, and a rail member 91 (not shown) provided on the rail member 91.
  • a mask loader main body 92 that is movable in the X-axis direction below the rail member 91 along the guide is provided.
  • the end portion of the rail member 91 on the ⁇ X side protrudes outside the entire frame 50 as can be seen from FIG.
  • the mask loader main body 92 is configured to be reciprocally movable between a mask delivery position outside the entire frame 50 and a mask delivery position with respect to the mask stage MST above the mask stage MST.
  • FIG. 11 is a perspective view showing the remaining part of the exposure apparatus 100 shown in FIG. 1 from which the exposure apparatus main body (including the main body 100 ′) and the unit 56 are removed, and FIG. 11 from which the unit 54 and the unit 52 are removed.
  • safety fence SR 1 in plan view U-shape is arranged.
  • the safety fence SR 1 is disposed inside the unit 54.
  • safety fences SR 2 and SR 3 are arranged on the ⁇ X side of the main body 100 ′.
  • Safety fence SR 2 is provided between the unit 54 and unit 52, more specifically is disposed between the leg portion 54b and the leg 52b. Also, safety fence SR 3, the internal unit 54, specifically, is arranged on the inner side of the leg portion 54b. Safety fences are also installed in other locations. These safety fences have a double structure inside the chamber, and are provided in order to prevent an operator who entered the inside of the chamber from accidentally contacting a specific part of the main body 100 ′. Yes.
  • the specific part is, for example, a precise part or a dangerous part.
  • the assembly of the main body 100 ′ and the assembly of the entire frame 50 are performed in parallel.
  • the illumination system IOP is inserted into the opening 52d of the ceiling part 52c described above with its exit end (a part of the illumination optical system constituting a part of the illumination system IOP) of the unit 52 Mounted on the ceiling 52c.
  • the main body 100 ′ is manufactured by assembling various subsystems that respectively constitute a part of the main body 100 ′ so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy.
  • various optical systems are adjusted to achieve optical accuracy
  • various mechanical systems are adjusted to achieve mechanical accuracy
  • various electrical systems are Adjustments are made to achieve electrical accuracy.
  • the assembly of the main body portion 100 ′ includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between various subsystems.
  • the whole frame is docked, that is, the three units 52, 54, and 56 that are part of the above-described whole frame 50 are docked in the following procedure.
  • the positioning tools 102a, 102b and 102c of the unit 52 are attached to the unit 52, respectively.
  • a handrail 103 for a tool is attached to the unit 52.
  • the unit 52 is lifted by a portal lifter (not shown) through a lifting tool (not shown), and the unit 52 is lowered while pressing the positioning tools 102a, 102b and 102c against the body BD. At this time, the positioning tools 102a, 102b, and 102c are pressed against the positioning tool contact surfaces 104a, 104b, and 104c shown in FIG.
  • FIG. 14 shows a state in which the attachment of the anchor bolt or the like has been completed.
  • the unit 54, the unit 56, and the mask loader 90 are moved to the + Y side of the main body 100 '. This movement is performed by an operator using a portal lifter and / or an air hover (not shown).
  • positioning tools 106 a and 106 b are attached to the unit 54.
  • the unit 54 is lifted from a position shown in FIG. 17 by a portal lifter (not shown) through a lifting tool (not shown), and is positioned by positioning tools 106a and 106b (shown in FIG. 18). ).
  • FIG. 18 shows a state in which the attachment of the anchor bolt or the like has been completed.
  • the bridge frame 108 is attached to the unit 56.
  • moving casters are attached to the legs 56 a and 56 b of the unit 56.
  • the unit 56 is lifted by a portal lifter (not shown) via a lifting tool (not shown), and lowered onto a mask loader 90 mounted on the carriage 110. 90. After the unit 56 and the mask loader 90 are fastened, the connection (fastening) between the mask loader 90 and the carriage 110 is released.
  • FIG. 21 shows a state in which the unit 56 is fastened to the unit 54 and the unit 52.
  • FIG. 23 shows a state where docking of the entire frame is completed. Thereafter, a plurality of panels are assembled on the outer surface of the entire frame to constitute a chamber. Thereby, the assembly of the exposure apparatus 100 is completed. Thereafter, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. In addition, explanation about the installation work of the safety fence was omitted.
  • An entire frame 50 composed of two units 52, 54 and 56 is provided.
  • the size of each of the units 52, 54, and 56 can be set in consideration of the weight limit of transportation / conveyance means such as a vehicle, transportation / conveyance capability, and the like.
  • the load applied to the entire frame 50 can be dispersed.
  • one whole frame 50 is constructed from the plurality of units 52, 54, 56, it is easy to give sufficient strength to the whole frame 50 as a whole.
  • a high-strength portal unit is employed as each unit, the strength can be improved also in this respect. Therefore, a large exposure apparatus can be assembled easily and in a short period (short time).
  • the entire frame 50 can be easily given sufficient strength, it can sufficiently cope with vibrations, earthquakes, etc., and is large and heavy. It becomes possible to improve the accuracy of the exposure apparatus.
  • the body BD is installed on the floor surface F independently of the entire frame 50 and through the vibration isolation system 65.
  • the stators 71 a and 72 a of the pair of linear motors 71 and 72 that drive the mask stage MST are supported by being suspended from the entire frame 50. Therefore, when the mask stage MST is driven by the linear motors 71 and 72, the reaction force of the driving force acting on the stators 71a and 72a is transmitted to the entire frame 50 via the stators, and the entire frame 50 Is mechanically released to the floor (ground). That is, the stators 71a and 72a function as a reaction frame disclosed in, for example, US Pat. No. 5,874,820.
  • the reaction force of the driving force that drives the mask stage MST does not become a vibration factor of the projection unit PU supported by a part of the body BD.
  • the stators 71a and 72a are supported on the whole frame 50 by being supported by suspension.
  • the reaction force is projected by moving the stators 71a and 72a in the opposite direction to the mask stage MST (movable elements 71b and 72b) according to the law of conservation of momentum by the action of the reaction force. You may exclude that it becomes a vibration factor of unit PU. That is, the stators 71a and 72a may be so-called counter masses.
  • the rail member 91 of the mask loader 90 is suspended from the ceiling portion 56 c of the unit 56, and the mask loader main body 92 moves along the rail member 91 to the mask outside the entire frame 50. And a mask transfer position with respect to the mask stage MST above the mask stage MST. Thereby, the mask can be loaded onto the mask stage MST and the mask can be unloaded from the mask stage MST from above. Further, the vibration of the mask loader 90 caused by the mask conveyance is suppressed (blocked) from being transmitted to the body BD (main body portion 100 ′) installed on the floor surface F independently of the entire frame 50. Thus, the exposure accuracy can be improved.
  • the entire frame 50 is configured by three units of the two portal units 52 and 54 and the connecting unit 56 that couples the portal units 52 and 54.
  • the present invention is not limited thereto. It is not limited.
  • one or three or more portal units may be provided, and a plurality of connection units may be provided.
  • the stators 71a and 72a may be supported using the three or more portal units. This facilitates the extension of the stroke of the mask stage MST.
  • at least one of the portal unit and the connecting unit is not necessarily provided.
  • the units 52, 54, 56 in the above embodiment are too large or heavy and cannot be transported by transportation means
  • the units 52, 54, 56 are, for example, a leg portion and a top plate portion. You may make it convey by dividing
  • the entire frame is composed of a plurality of units that support at least a part of the components of the pattern generating apparatus such as the exposure apparatus main body and the apparatus attached to the apparatus, the number of units is as follows. It does n’t matter.
  • the fence safety fence mentioned above can also be called a partition member, a protection member, or a partition member from the function. Therefore, for example, when a safety fence is used as a partition member, for example, the air conditioning efficiency of the internal space can be increased by partitioning the internal space of the chamber.
  • an ionizer for removing the electricity from the plate P is disposed inside the entire frame 50 and outside the safety fence.
  • the ionizer When an operator (or an operator) enters the exposure apparatus for maintenance or the like, the ionizer is turned off. It becomes possible to enter the entire frame 50 for the first time. An operator who enters the entire frame 50 can visually check the operation state of the exposure apparatus main body through a safety fence.
  • the exposure apparatus of the above embodiment in which the entire frame is composed of a plurality of units that support at least a part of the constituent parts of the pattern generation apparatus such as the exposure apparatus main body and the apparatus attached to the apparatus, is a This is effective not only for transportation from a factory to a device manufacturing factory but also for transportation and / or assembly for transferring an exposure apparatus to another device manufacturing factory.
  • the position of the mask stage MST is measured using the mask stage interferometer MSI
  • the position of the plate stage PST is measured using the plate stage interferometer PSI.
  • an encoder an encoder system including a plurality of encoders
  • mask stage interferometer MSI and an encoder may be used in combination.
  • an encoder an encoder system including a plurality of encoders
  • the plate stage interferometer PSI and the encoder may be used in combination.
  • erbium (or both erbium and ytterbium) is doped with, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser.
  • a harmonic wave amplified by a fiber amplifier and wavelength-converted to ultraviolet light using a nonlinear optical crystal may be used.
  • a solid laser (wavelength: 355 nm, 266 nm) or the like may be used.
  • the projection unit PU is a multi-lens system including a plurality of projection optical systems.
  • the number of projection optical units may be one or more.
  • the projection optical system is not limited to a multi-lens projection optical system, and may be a projection optical system using an Offner type large mirror.
  • the projection optical system has a projection magnification of the same magnification.
  • the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.
  • the present invention is not limited thereto, and is disclosed in, for example, US Patent Application Publication No. 2005/0259234.
  • the present invention can also be applied to an immersion exposure type exposure apparatus that supplies liquid between the projection optical system and the substrate to be exposed and projects exposure light onto the substrate through the liquid. .
  • a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used.
  • an electronic mask (variable shaping mask) that forms a transmission pattern or a reflection pattern, or a light emission pattern, for example, You may use the variable shaping
  • DMD Digital * Micro-mirror * Device
  • the exposure apparatus of the present invention having a frame such as the entire frame of the above embodiment is a substrate having a size (including at least one of an outer diameter, a diagonal line, and one side) of 500 mm or more, for example, a flat panel such as a liquid crystal display element. It is particularly effective to apply to an exposure apparatus that exposes a large substrate for a display (FPD). This is because the present invention has been made to cope with an increase in the size of the substrate.
  • FPD liquid crystal display
  • the present invention is applied to a projection exposure apparatus that performs scanning exposure.
  • the present invention is not limited to this, and the present invention is applied to a proximity type exposure apparatus that does not use a projection optical system. Can also be applied.
  • the present invention can also be applied to a step-and-repeat type exposure apparatus (so-called stepper) or a step-and-stitch type exposure apparatus.
  • the use of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern onto a square glass plate.
  • the present invention can also be widely applied to an exposure apparatus for manufacturing.
  • the present invention can also be applied to an exposure apparatus that transfers a circuit pattern.
  • the object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks.
  • the present invention is also applied to an exposure apparatus (lithography system) that forms line and space patterns on a wafer by forming interference fringes on the wafer.
  • the invention can be applied.
  • a micro device manufacturing method using the exposure apparatus 100 of the above embodiment in a lithography process will be described.
  • a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate).
  • ⁇ Pattern formation process First, using the exposure apparatus 100 described above, a so-called photolithography process is performed in which a pattern image is formed on a photosensitive substrate (such as a glass substrate coated with a resist). By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to various processes such as a developing process, an etching process, and a resist stripping process, whereby a predetermined pattern is formed on the substrate.
  • a photosensitive substrate such as a glass substrate coated with a resist.
  • ⁇ Color filter formation process> a set of three dots corresponding to R (Red), G (Green), and B (Blue) is arranged in a matrix, or a set of three stripe filters of R, G, and B A color filter arranged in a plurality of horizontal scanning line directions is formed.
  • a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step, the color filter obtained in the color filter forming step, and the like.
  • liquid crystal is injected between a substrate having a predetermined pattern obtained in the pattern formation step and a color filter obtained in the color filter formation step to manufacture a liquid crystal panel (liquid crystal cell).
  • the exposure apparatus of the present invention is suitable for manufacturing a flat panel type large electronic device (micro device) such as a liquid crystal display element.

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  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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PCT/JP2009/005385 2008-10-15 2009-10-15 露光装置及びその組立て方法、並びにデバイス製造方法 WO2010044268A1 (ja)

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JP2010533832A JPWO2010044268A1 (ja) 2008-10-15 2009-10-15 露光装置及びその組立て方法、並びにデバイス製造方法
KR1020117010936A KR101763859B1 (ko) 2008-10-15 2009-10-15 노광 장치와 그 조립 방법, 및 디바이스 제조 방법
KR1020177021003A KR101904685B1 (ko) 2008-10-15 2009-10-15 노광 장치와 그 조립 방법, 및 디바이스 제조 방법
CN200980140868.9A CN102187280B (zh) 2008-10-15 2009-10-15 曝光装置及其组装方法、以及器件制造方法

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WO2013150790A1 (ja) * 2012-04-04 2013-10-10 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
EP3693797A1 (de) * 2019-01-29 2020-08-12 Nanoscribe GmbH System zum aufbau einer laserlithografievorrichtung und modulträger hierfür

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KR20170089986A (ko) 2017-08-04
TW201015247A (en) 2010-04-16
TWI480706B (zh) 2015-04-11
KR101904685B1 (ko) 2018-10-04
JPWO2010044268A1 (ja) 2012-03-15
JP2014160263A (ja) 2014-09-04
KR101763859B1 (ko) 2017-08-01
CN102187280A (zh) 2011-09-14
JP5963122B2 (ja) 2016-08-03

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