TW201015247A - Exposure apparatus and method for the assembly of the same, and device manufacturing method - Google Patents
Exposure apparatus and method for the assembly of the same, and device manufacturing method Download PDFInfo
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- TW201015247A TW201015247A TW098134887A TW98134887A TW201015247A TW 201015247 A TW201015247 A TW 201015247A TW 098134887 A TW098134887 A TW 098134887A TW 98134887 A TW98134887 A TW 98134887A TW 201015247 A TW201015247 A TW 201015247A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
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Abstract
Description
201015247 '六、發明說明： 【發明所屬之技術領域】 本發明係關於曝光裝置及其組裝方法以及元件製造方 法，更詳細係關於於製造例如液晶顯示元件等平板型之電 子元件（微元件）之微影製程中所使用之曝光裝置及其組裝 方法以及使用前述曝光裝置之元件製造方法。 【先前技術】 β 於液晶顯示元件等平板型之電子元件（微元件）之製造 係使用將形成於光罩之圖案轉印至感光性基板上之光微影 手法。在使用此光微影手法之製程中，係使用光罩載置於 在2維面内移動之光罩載台，將形成於該光罩之圖案透過 投影光學系統投影至至少在2維平面内移動之基板載台所 裝載之感光性基板上之投影曝光裝置（例如，參考專利文獻 1) 〇 近年來’以液晶顯示元件為首之平板型之電子元件（微 瘳元件）逐漸大型化。隨之，光罩及基板（以及光罩載台及基板 載台）大型化，進而光罩載台及基板載台之行程日漸變長。 因此’支持光罩載台及基板載台之架台亦逐漸大型化。又， 光罩載台、基板載台、投影光學系統、照明光學系統、支 持此等之架台等曝光裝置本體之全體，係收納於以由框架 構造構成之機架、及組裝於該機架之面板所構成之腔室内。 然而，曝光裝置之構成各部，會因將之運輸、搬送之 車輛、航空機等運輸、搬送手段之承載重量等限制或運輸、 201015247 搬送能力[而使其大小 '重量等受限。因此特別是在 構成腔室之機架等在組裝狀態下無法以運輸、搬送手段搬 送’而係以組裝前之分散狀態搬入工廠内當場組裝。關於 機架以外之大型裝置亦有同樣的狀況存在。 因此，過去在工廠之組裝作業需要長時間至裝置可 運轉亦需要長㈣（長時間）n習知曝光裝置隨光罩及 基板(光罩載台及基板載台)之大型化，欲確保裝置對振動、 地震等具有充分強度亦日漸困難。 [先行技術文獻] [專利文獻] 【專利文獻π美國專利申請公開第2008/0030702號 說明書。 【發明内容】 本發明係在上述狀況之下被完成，若從第1觀點，係 一種曝光裝置，照射能量束而於物體上形成圖案，其特徵 在於具備：於前述物體上生成圖案之圖案生成裝置；由支 持前述圖案生成裝置及附設於該裝置之裝置構 少一部份之複數個單元構成之機架。 藉此，由於具備由支持前述圖案生成裝置及附設於該 裝置之裝置構成各部之至少一部份之複數個單元構成之機 架，故可考慮運輸、搬送手段之重量限制、運輪、 力等設定各單元之大小。另外，由於複數個單元可各自支 持構成各部之至少-部份，故可分散作用於機架之荷重。 201015247 又由於由複數個單元構築1個機架，故做為機架全體容 易使充分之強度維持。因此，可容易且在短時間組裝大型 之曝光裝置。X，由於可使機架之強度為充分之等級，故 亦可對應振動、地震等，可圖大型、大重量之曝光裝置精 度之提升。 本發明若從第2觀點，係一種元件製造方法，包含使 用本發明之曝光裝置將物體曝光、將前述被曝光之物體顯 影。 m ❹ 本發明右從第3觀點’係一種具備照射能量束而於物 上t成圖案之圖案生成裝置、由支持該圖案生成裝置及 附α於該裝置之裝置構成各部之至少—部份之複數個單元 構成之機架之曝光裝置之組裝方法，其特徵在於包含：進 ^裝置設置之準備作業；除含前述圖案生成裝置之束源之 伤之本體之組裝、做為前述機架之部組組裝複數個 前述複數個單元之一部份…單元之上搭载射 出來自刖述束源之能量|夕昭a日么 此菫末之照明系統；然後，為在將前述 本體部收容於内部之狀離 狀態下組裝刖述機架，以既定之順序 結合包含被部組之前述第〗里 疋弟1早70之前述複數個單元。 【實施方式】 以下根據圖卜圖23說明本發明之一實施形態。 圖1係概略顯示-實施形態之曝光裝置之構成之圖。 圖係概略顯示除全體機架之曝光裳置之構成之圖。 曝光裝置100具備框架構造物即全體機架50、以及昭 5 201015247 明系統IOP受該全縣丄 t體機架50支持之曝光裝置本體。曝光裝 置本體如圖2所不’係以曝光用照明光(曝光用光)照明光罩 M將紅由光罩M之照明光透過投影單SPU(投影光學系統） 投射；表面塗布有光阻(感光劑)之玻璃板(以下簡稱為 板）P於板件P上形成形成於光罩M之圖案之像。曝光裝 置本體包含照明系、统I〇p與本鱧部刚，。另外照明系統 IOP之至7冑份(例如包含照明光學系統)被包含於本體部 亦可。 本實施形態中，附設於曝光裝置本艘之光罩搬送裝置 (以下亦適田稱為光罩裝載具）9G等亦受全體機架50支持。 另外’關於曝光裝置本體之構成等於後詳述。 全體機架50，如w 3所示，具備3個機架單元（以下簡 稱為單兀）52、54、56，該3個單元52、54、56彼此連結而 構成全體機架50。連結方法後述。以下，方便上，以單元 52、54、56 之速 逆作万向為γ轴方向進行說明（參照圖3)。又， 以在平行於設置有全體機架50之地面（或底板）F之面内垂 直 軸方向之方向為X轴方向，以垂直於X轴方向及γ 軸方向之方向為Z軸方向。 早疋52、54、56分別被設定為χ軸方向之寬度（長度） 比Υ軸方向之寬度（長度）長。 單兀52,如圖4所示，從γ軸方向觀察為具有門之形 狀之門形嚴； 〇〇 _ 早凡5 2全體之外觀係由矩形之網狀構造體 (除Ο如將管材等—般構造材加以組合之構造體外亦包含 網狀之矩形板構件等）構成’具有平行於χγ平面配置之頂 201015247 之+X端部、_χ端部、 52b。頂部52c具有 部52c、以及上端分別固定於頂部52c 從下方支持頂部52c之一對腳部52a 支持荷重之水平材（樑）之機能。 腳部52a、52b各係由以既定間隔配置之複數根（例如3 根）柱、將此等連結之複數根（例如4根）襟構件構成。於頂 部52c形成有開口部52d。 早兀54係如圖5所 -"π紙芾碲具有門之形狀 之門形單元。單元54全體之外觀係由矩形之網狀之構造體 (例如使管材等-般構造材組合之構造體 形之板構件）構成，具有平行於χ 』狀之矩 力丁叮孓χγ千面被配置之頂部54c、 上端分別固定於頂部54C2+X 部一對腳部― 二：揮St腳頂部Μ做為支持荷重之水平 大54雖係X抽方向之長度與單元52 9 5但Υ轴方向之長度比單元52短。又，單 比單元52高度低。 又早兀54 腳。P 54a、54b各係由以既定之間隔被配 將此耸揸紝真根之柱、 之標構件構成。又，腳部54d包含從下 方支持未被腳部54a、54b支持之頂部…之 下 數根（例如2根）之柱、將此# 側端部之複 (例如2根）之樑構件。 '' 複數根 54a、54b。 ° d係透過樑構件連結於腳部 如圖 述單元52、54係如圖3所 所示，構成單元52$ 方向分離配置。 …2之腳部52…側之柱與構成單 7 201015247 :54之腳部54atY側之柱，係使用由襟構件構成之2根 連接構件58連接（連結）。同樣地，構成單元52之腳部— 之+γ側之柱與構成單元54之腳部54b<_Y側之柱，係使 用由樑構件構成之2根連接構件58連接（連結）。 單元56,如圖3所*，係連結高度相異之單元μ 之連結單元。詳言之，單元％，如圖6所示具有由例如 全體之外觀為矩形之網狀構造體（例如使管材卜般構造材 組合之構造㈣，亦包含網狀之矩形之板構件）構成之頂部 56c'上端分別固定於頂部56ctY端部、+γ端部之高度 相異之2個腳部56a、働。腳部鳩，係由以大致等間隔配 置之複數根（例如4根）柱、將此等複數根柱連結之複數根⑽ 如3根）樑構件構成。腳部—雖係構成為與腳部⑽相同， 但z軸方向之長度(尺寸)比腳部_短單元52與單元“之 =之量…腳部56a、56b之，端部之間係以樑構[Technical Field] The present invention relates to an exposure apparatus, an assembly method thereof, and a device manufacturing method, and more particularly to the manufacture of a flat type electronic component (micro component) such as a liquid crystal display element. An exposure apparatus used in a lithography process, an assembly method thereof, and a component manufacturing method using the above exposure apparatus. [Prior Art] The production of a flat type electronic component (microdevice) such as a liquid crystal display device uses a photolithography method in which a pattern formed on a photomask is transferred onto a photosensitive substrate. In the process of using the photolithography method, a photomask is placed on a photomask stage that moves in a two-dimensional plane, and a pattern formed on the photomask is projected through the projection optical system to at least a two-dimensional plane. A projection exposure apparatus on a photosensitive substrate on which a substrate carrier is moved (for example, refer to Patent Document 1) In recent years, a flat type electronic component (micro-inch element) including a liquid crystal display element has been gradually enlarged. As a result, the mask and the substrate (and the mask stage and the substrate stage) are enlarged, and the travel time of the mask stage and the substrate stage is gradually increased. Therefore, the gantry that supports the photomask stage and the substrate stage has also been gradually enlarged. Further, the whole of the exposure apparatus main body such as the mask stage, the substrate stage, the projection optical system, the illumination optical system, and the gantry supporting these are housed in a frame configured by a frame structure and assembled in the frame. The chamber formed by the panel. However, the components of the exposure device are limited in terms of the weight of the transportation and transportation means of the vehicle and the aircraft to be transported and transported, and the transportation capacity of the transportation device, and the capacity of the 201015247 is limited. Therefore, in particular, the rack or the like constituting the chamber cannot be transported by the transport or transport means in the assembled state, and is placed in the factory in the dispersed state before assembly. The same situation exists for large devices outside the rack. Therefore, in the past, the assembly work in the factory took a long time to the device to operate, and it was required to be long (four) (long time). The conventional exposure device was enlarged with the mask and the substrate (the mask stage and the substrate stage), and the device was to be secured. It is also increasingly difficult to have sufficient strength for vibration, earthquakes, and the like. [Prior Art Document] [Patent Document] [Patent Document π U.S. Patent Application Publication No. 2008/0030702. SUMMARY OF THE INVENTION The present invention has been made under the above circumstances. According to a first aspect, an exposure apparatus is configured to irradiate an energy beam to form a pattern on an object, and is characterized by: generating a pattern for generating a pattern on the object The device comprises a frame formed by a plurality of units supporting the pattern generating device and the device attached to the device. Therefore, since the rack is formed by a plurality of units that support the pattern generating device and the device attached to the device to form at least a part of each portion, weight restrictions, transport wheels, forces, etc. of the transport and transport means can be considered. Set the size of each unit. In addition, since a plurality of units can each support at least a portion of each portion, the load acting on the frame can be dispersed. 201015247 Since a single rack is constructed by a plurality of units, it is easy to maintain sufficient strength as a whole rack. Therefore, a large exposure apparatus can be assembled easily and in a short time. X, because the strength of the frame can be made to a sufficient level, it can also respond to vibration, earthquakes, etc., and can improve the accuracy of large-scale and large-weight exposure devices. According to a second aspect of the invention, there is provided a method of manufacturing a device comprising exposing an object using the exposure apparatus of the present invention and developing the object to be exposed. m ❹ the present invention from the third aspect of the present invention is a pattern generating device having an irradiation energy beam and a pattern on the object t, and at least a part of each of the parts supporting the pattern generating device and the device attached to the device A method for assembling an exposure device of a plurality of units, comprising: preparing for the installation of the device; assembling the body of the wound containing the beam source of the pattern generating device, as part of the rack One part of the plurality of units is assembled, and the unit is equipped with an illumination system that emits energy from the source of the beam, and the illumination system of the end of the day; and then, the body portion is housed inside. The arranging of the arranging frame is carried out in a state of being separated, and the aforementioned plurality of units including the aforementioned corpora of the quilt 1 of the quilt group 1 are combined in a predetermined order. [Embodiment] An embodiment of the present invention will be described below with reference to Fig. 23. Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment. The diagram outlines the composition of the exposure skirts of the entire rack. The exposure apparatus 100 includes an entire frame 50, which is a frame structure, and an exposure apparatus body that is supported by the whole body of the county. As shown in FIG. 2, the exposure apparatus body is not irradiated with illumination light for exposure (exposure light), and the illumination light of the mask M is projected through a projection single SPU (projection optical system); the surface is coated with a photoresist ( A glass plate (hereinafter simply referred to as a plate) P of the sensitizer) forms an image of a pattern formed on the reticle M on the plate member P. The exposure unit body includes an illumination system, a system I〇p, and a body unit. In addition, up to 7 parts of the illumination system IOP (for example, including an illumination optical system) may be included in the body portion. In the present embodiment, the photomask transporting device (hereinafter also referred to as a mask mount) 9G attached to the exposure apparatus is also supported by the entire rack 50. Further, the constitution of the main body of the exposure apparatus is equal to that described later. As shown by w3, the entire rack 50 includes three rack units (hereinafter simply referred to as "units") 52, 54, and 56, and the three units 52, 54, and 56 are connected to each other to constitute the entire rack 50. The connection method will be described later. Hereinafter, in the convenience, the speed of the units 52, 54, and 56 is reversed as the γ-axis direction (see Fig. 3). Further, the direction perpendicular to the vertical axis direction of the surface (or the bottom plate) F on which the entire frame 50 is provided is the X-axis direction, and the direction perpendicular to the X-axis direction and the γ-axis direction is the Z-axis direction. The early turns 52, 54, and 56 are set such that the width (length) in the x-axis direction is longer than the width (length) in the x-axis direction. As shown in FIG. 4, the single cymbal 52 is a gate shape having a shape of a door as viewed from the γ-axis direction; 〇〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The structure in which the structure is combined is also composed of a rectangular rectangular plate member, etc., which constitutes a +X end portion, a χ end portion, and 52b having a top 201015247 parallel to the χγ plane configuration. The top portion 52c has a portion 52c and a function in which the upper end is fixed to the top portion 52c to support the horizontal member (beam) supporting the load from one of the top portions 52c to the foot portion 52a. Each of the leg portions 52a and 52b is composed of a plurality of (for example, three) columns arranged at predetermined intervals, and a plurality of (for example, four) members connected to each other. An opening 52d is formed in the top portion 52c. The early 54 is a door-shaped unit having the shape of a door as shown in Fig. 5 -" The overall appearance of the unit 54 is composed of a rectangular mesh-shaped structure (for example, a structural member having a structural shape in which a tubular material or the like is combined), and has a rectangular force parallel to the χ-shaped shape. The top 54c and the upper end are respectively fixed to the top 54C2+X part of the pair of feet-two: the top of the swinging foot Μ as the horizontal level of the supporting load 54 is the length of the X pumping direction and the unit 52 9 5 but the axis direction The length is shorter than unit 52. Further, the single ratio unit 52 has a low height. I have 54 feet early. Each of P 54a and 54b is composed of a column and a standard member which are arranged at a predetermined interval. Further, the leg portion 54d includes a plurality of (for example, two) columns that support the top portion that is not supported by the leg portions 54a, 54b, and a plurality of (for example, two) beam members that terminate the # side end portion. '' Multiple roots 54a, 54b. ° d is connected to the leg by the beam member. As shown in Fig. 3, the units 52 and 54 are arranged in a direction separated by the unit 52$. The column on the side of the leg portion 52 of the ... 2 and the column on the 54atY side of the leg portion of the structure 7 201015247: 54 are connected (connected) by using two connecting members 58 each composed of a weir member. Similarly, the column on the +γ side of the leg portion of the unit 52 and the leg portion on the leg portion 54b <_Y side of the unit 54 are connected (connected) by two connecting members 58 each composed of a beam member. The unit 56, as shown in Fig. 3, is a connecting unit that connects the units μ of different heights. In detail, the unit % has a mesh structure (for example, a structure in which a pipe-like structure is combined (four), and a rectangular rectangular plate member) as shown in FIG. The upper ends of the top portions 56c' are respectively fixed to the two end portions 56a and 働 at the top end of the 56ctY and the height of the +γ end. The foot 鸠 is composed of a plurality of (for example, four) columns arranged at substantially equal intervals, and a plurality of (10), for example, three) beam members connecting the plurality of columns. The foot portion is configured to be the same as the foot portion (10), but the length (size) in the z-axis direction is smaller than the leg portion_short unit 52 and the unit "the amount of the foot portions 56a, 56b". Beam structure
固定=3所示’於單元52之頂部52e之+Y側之端部上面 二早元56之腳部56a之下端，於單元“之頂部A Γ此Λ之端部上面固定有單元56之腳部56ba之下端。採 ==，使用連結單元56連結2個門形單元Μ，，據 元5广54、56_艘化、具有充分強度之全體 望 外’單疋52、54、56彼此間之固定雖係使用螺 =進行，但使料接亦可。另外，於全體機架50安裝例 如用以防塵等之壁材（或面板）亦可。 又，構成全體機架50之3個之單元52、5心％，各為 201015247 不超過車輛㈣送手段、運輸手段之重量 及大小。但即使至少！個之單元超過 ^ = 實施形態各單元係由腳部與頂部之複數個零:構：於故” =:開搬送零件並在現場組裝各單元，重量限制之問題； 以下根據圖2、圖7、圖8、圖9說明曝光裝置本體之 構成等。此處’亦視需要一併說明曝光震置本體及其附屬 裝置之構成各部之以全體機架5〇之支持方法等。 © 於圖7顯示全體機架50及受全體機架5〇支持之曝光 裝置本體及附設裝置之構成各部之配置，圖8係以立體圖 概略顯示配置於全體機架5〇之内部之本體部1〇〇，之構成 之圖。又，® 9係顯示曝光裝置1〇〇之控制系統之主要之 構成之方塊圖。控制系統係以包含統括控制裝置全體 電腦（或工作站）等之主控制裝置20為中心構成。 、曝光裝置本體，如圖2所示，具備照明系統I〇p、保持 _光罩Μ之光罩載台MST、將形成於光罩¥之圖案投影至板 件Ρ上之投影單元pu、保持板件ρ之板件載台pST等。 照明單元IOP之構成，與揭示於例如美國專利申請公 開第2001/0033490號說明書、美國專利第5,729,331號說明 書、美國專利第6,288,772號說明書等之照明系統相同。亦 即，照明系統IOP包含由射出同調之曝光用光例如紫外區 之輝線（例如波長436 nm之g線、波長365 nm之i線等）超 高壓水銀燈構成之光源及透過送光光學系統連接於該光源 之照明光學系統。照明系統I0P朝光罩Μ射出曝光用光。 9 201015247 另外，做為光源並不限於超高壓水銀燈，可使用KrF準分 子雷射光（輸出波長248 nm)或ArF準分子雷射光（輸出波長 193 nm)等脈衝雷射光源或固體雷射裝置等。 照明系統IOP係如圖7所示搭載於單元52之頂部52c 上。此時，照明系統I〇p係在將設於+γ側端部之下端之射 出端部（構成照明系統Ι〇ρ之一部份之照明光學系統之一部 份）插入前述頂部52c之開口 52d内部之狀態下，搭載於單 兀52之頂部52c上。亦即，照明系統ι〇 ❿ 頂部-從下方支持…中，省略了配置於全體機架5之〇 内部之本體部100’之圖示。 此處根據圖8並適當的參照其他圖面說明本體部1〇〇， 之構成。 本體部100’係如圖8所示具備設置於地面？上之本體 參照圖2)、搭載於該本體BD之光罩載台刪、將形成 於光罩Μ之圖案投影至板件p上之投影單元pu(在圖8係 圖示省略’參照圖2)、保持板件p之板件載台psT、驅動 ◎ =罩載D MST之光罩載台驅動系統MSD、以及驅動板件載 台pst之板件載台驅動系統PSD(圖8中皆未圖示 9)等。 多’、、、圓 本體BD係如圖8所示包含：於γ軸方向隔既 配置為平行且各自之長邊方向（X轴方向）之兩端部透過防 振系統（支持構件）65被支持於地面F上之_對架台6心 ㈣、設置於一對架台66a、66b上面之¥轴方向長之長方 形板狀之平台68、設置於__對架台66a、⑽之±χ端部上 10 201015247 之以γ軸方向為長邊 机w机 邊方向之—對辅助架台64a、64b、以及 :長=辅助架台―上…軸方向為長邊方向 之兩❹狀之架台62。—對架台㈤、㈣各於長邊方向 兩端部附近形成有一斜 W對&0卩，該等段部下側之面（内部底 面）與段部上側之面為平杆 " 囬马十仃。此外，於一對架台66a、6讣之 内部底面上設置有平台68 ^ 構成本體BD之一對架台66a、66b與一對輔助架台Fixed=3 is shown at the lower end of the leg portion 56a on the +Y side of the top 52e of the unit 52, and the foot 56a is fixed on the top of the unit. The lower end of the part 56ba. The use of the connection unit 56 is used to connect the two gate-shaped units Μ, according to the element 5, 54, 56_the ship, and the full strength of the whole lookout 'single 52, 54, 56 between each other Although it is possible to use the screw to perform the fixing, it is also possible to attach the material to the wall 50. For example, a wall material (or a panel) for dustproofing or the like may be attached to the entire frame 50. Further, three units of the entire frame 50 may be formed. 52, 5 heart%, each for 201015247 does not exceed the weight of the vehicle (4) means and means of transportation. But even if at least one unit exceeds ^ = the embodiment of each unit is a plurality of zeros from the foot and the top: Therefore: =: The problem of weight limitation is to open the parts and assemble the units on site; the structure of the main body of the exposure apparatus will be described below with reference to Figs. 2, 7, 8, and 9. Here, the support method of the entire rack 5 of the components of the exposure vibrating body and its attachments is also described. © Fig. 7 shows the arrangement of the entire frame 50 and the components of the exposure apparatus body and the attachment device supported by the entire frame 5, and Fig. 8 shows the main body 1 disposed inside the entire frame 5A in a perspective view. Oh, the picture of the composition. Further, the ® 9 series is a block diagram showing the main components of the control system of the exposure apparatus. The control system is mainly constituted by a main control device 20 including all the computers (or workstations) of the control device. As shown in FIG. 2, the exposure apparatus main body includes an illumination system I〇p, a photomask stage MST that holds the photomask, and a projection unit pu that projects the pattern formed on the mask to the panel, and holds Plate ρ's plate carrier pST and so on. The illumination unit IOP is constructed in the same manner as the illumination system disclosed in, for example, the specification of U.S. Patent Application Publication No. 2001/0033490, the specification of U.S. Patent No. 5,729,331, and the specification of U.S. Patent No. 6,288,772. That is, the illumination system IOP includes a light source composed of an ultrahigh pressure mercury lamp that emits coherent exposure light such as a bright line of an ultraviolet region (for example, a g line having a wavelength of 436 nm, an i line having a wavelength of 365 nm, etc.) and is connected to the light transmitting optical system. The illumination optical system of the light source. The illumination system I0P emits exposure light toward the mask. 9 201015247 In addition, as a light source, it is not limited to an ultra-high pressure mercury lamp, and a pulsed laser source such as KrF excimer laser light (output wavelength 248 nm) or ArF excimer laser light (output wavelength 193 nm) or a solid laser device can be used. . The illumination system IOP is mounted on the top 52c of the unit 52 as shown in FIG. At this time, the illumination system I〇p is inserted into the opening end of the lower portion of the end portion of the +γ side (one part of the illumination optical system constituting a part of the illumination system )ρ) into the opening of the top portion 52c. In the state of 52d, it is mounted on the top 52c of the single cymbal 52. That is, in the illumination system 〇 顶部 top - from the lower support ..., the illustration of the main body portion 100' disposed inside the entire rack 5 is omitted. Here, the configuration of the main body portion 1A will be described with reference to FIG. 8 and other reference drawings. The main body portion 100' is provided on the ground as shown in Fig. 8 Referring to FIG. 2), the mask unit mounted on the main body BD is deleted, and the projection unit pu that projects the pattern formed on the mask 投影 onto the panel p is omitted (see FIG. 8 for illustration). ), the plate carrier psT of the plate member p, the drive ◎ = the reticle stage drive system MSD of the cover D MST, and the plate stage drive system PSD of the drive plate stage pst (not shown in Fig. 8) Figure 9) and so on. As shown in FIG. 8, the multi-', and the circular body BD includes both end portions that are arranged in parallel in the γ-axis direction and each of the longitudinal directions (X-axis directions) are transmitted through the vibration-proof system (support member) 65. Supported on the ground F, the yoke 6 core (four), the rectangular plate-shaped platform 68 disposed on the upper side of the pair of gantry 66a, 66b in the direction of the ¥ axis, is disposed on the __ end of the gantry 66a, (10) 10 201015247 The γ-axis direction is the side of the long-side machine w--the auxiliary gantry 64a, 64b, and the long = auxiliary gantry-up... the axial direction is the two-framed gantry 62 in the longitudinal direction. - for the gantry (5) and (4), a slanting W pair & 0 形成 is formed in the vicinity of both ends of the longitudinal direction, and the lower surface of the segments (the inner bottom surface) and the upper surface of the segment are flat rods. Hey. In addition, a platform 68 is disposed on the inner bottom surface of the pair of gantry 66a, 6 ^. One of the main body BD is formed on the gantry 66a, 66b and a pair of auxiliary gantry
3 64b，由以上說明可知，被組裝為井形狀。又，架台 62，如後所述，由於係發揮支持投影單元pu(包含投影光學 系、、先之鏡筒）之鏡筒平台之功能，故在以下稱為鏡筒平台 62 〇 由上述說明可知，本體BD係與全體機架5〇獨立地設 置於地面F上。 光罩載台MST，由圖2可知，係配置於照明系統I〇p 之下方。此處，於光罩載台MST上載置有形成有圖案之光 軍Μ。 光罩載台MST，係透過未圖示之空氣軸承等以非接觸 方式支持於設在鏡筒平台62上、延伸於Υ轴方向之一對導 引件63a、63b上。光罩載台MST可藉由光罩載台驅動系統 MSD在一對導引件63a、63b上在既定行程内驅動於γ軸方 向，且可於X軸方向及繞Z軸之旋轉方向（0Z方向）微驅動。 詳言之，光罩載台驅動系統MSD包含一對線性馬達 71、7 2。此處，由圖2及圖7可知’構成一對線性馬達71、 72之—對固定子71a、72a係垂吊支持於（構成）單元52、 11 201015247 54(之頂部52c、54c)。固定子71a、72a係以單元52、54之 排列方向為長邊，彼此於X軸方向分離配置。 另外’將各固定子71a、72a分解為複數個零件，分別 使用單元52、54支持複數個零件之一部份與其餘之一部份 亦可。 固定子71a、72a係如圖8所示由剖面U字狀之磁石單 儿構成。於一方之固定子7丨a内部沿γ軸方向以既定之節 距配置有複數個永久磁石’以沿γ轴方向形成交變磁場。 此時，彼此鄰接之永久磁石間、彼此對向之永久磁石間極 0 性不同。 於另一方之固定子72a之内部以與固定子71a側同樣之 配置沿Y軸方向以既定之節距排列有複數個永久磁石。此 外，於固定子72a之内部於上下之對向面分別配置有於γ 轴方向細長延伸之例如2個之永久磁石。此時，彼此鄰接 之永久磁石間、彼此對向之永久磁石間極性不同。 於光罩載台MST之±χ端部突設有插入固定子71a、72a 之内邛工間並分別與各固定子7丨a、72a構成線性馬達71、 ❹ 72之由電樞單元（線圏單元）構成之可動子7ib、7几。於可 動子71b、72b以對應於對應之固定子71a、72a側之磁石配 之配置配置有複數個電樞線圈。此時，線性馬達7 1係 產j對可動子711)之¥抽方向驅動力（推力）之γ線性馬達。、 方面線挫馬達72係除對可動子72b之γ軸方向驅動 (推力）外亦產生χ轴方向驅動力（推力）之m維之線 達此時可動子72b之Y軸方向之行程雖與固定子 12 201015247 72a之長度同程度，但χ軸方向之行程比固定子72&之χ 轴方向寬度短。 光罩載台MST在XY平面内之位置，係以對設於（或形 成於）光罩载台MST之反射面照射測長束之光罩載台干涉 儀MSI(參照圖9)加以量測。該量測結果被供給至主控制襞 置20(參照圖9)。主控制裝置2〇根據被供給之量測結果透 過光罩載台驅動系統MSD驅動光罩載台MST，控制光罩載 σ MST之位置（及速度）。另外，可如揭示於美國專利申請 ® 公開第2007/0288 121號以編碼器系統量測光罩載台MST之 位置資訊。 投影單元PU係如圖2所示’在光罩載台MST之下方 受鏡筒平台62支持。投影單元PU具有與例如美國專利第 6’552,775號說明書等所揭示之投影光學系統同樣構成之投 影光學系統。亦即，投影單元PU包含配置為交錯狀之複數 個投影光學系統，此複數個投影光學系統與具有以χ軸方 向為長邊方向之長方形狀單一像場之投影光學系統同等發 揮機能。本實施形態中，做為複數個投影光學系統係使用 例如兩側遠心且等倍系形成正立正像者。複數個投影光學 系統亦可分別稱為投影光學模組等。 因此，當以來自照明系統ΙΟΡ之曝光用光照明光罩Μ 上之複數個照明區域時，藉由通過圖案面配置成與投影光 學系統之第1面（物體面）大致一致之光罩賊之曝光用光， 將該照明區域内之光罩Μ之電路圖案之投影像（部分正立 像）’透過投影光學系統形成於配置在投影光學系統之第2 13 201015247 面（像面）側、在表面塗布有光阻（感光劑）之板件p上與前述 照明區域共軛之曝光用光之照射區域（曝光區域之後，藉 由光罩載台MST與板件載台PST之同步驅動使光罩皿相對 複數個照明區域（曝光用光）移動於掃描方向（γ軸方向），並 使板件P相對複數個曝光區域（曝光用光）移動於掃描方向 (Y轴方向），據以進行板件P上照射區域（區劃區域）之掃描 曝光，將光罩Μ之圖案轉印至該照射區域。 板件載台PST係如圖2所示配置於投影單元PU之下 方。此處，於板件載台PST上載置有板件ρ。板件載台psT， 〇 如圖8所示，係透過未圖示之空氣轴承等以非接觸方式被 支持於平台68上、於X轴方向分離設置以γ轴方向為長邊 方向之一對導引件69a、69b上。板件載台PST可藉由板件 栽σ驅動系統PSD在一對導引件69a、69b上於γ軸方向在 既定之行程内驅動，亦可於X轴方向、0Z方向、2軸方向、 對XY平面之傾斜方向（繞X軸之旋轉方向（θχ方向）、繞γ 抽之旋轉方向（0y方向））微驅動。 詳言之，板件載台驅動系統pSD包含一對線性馬達 ◎ 73、74。此處，由圖8可知，構成一對線性馬達乃、之 :對固定子73a、74a皆係由以Y轴方向為長邊之剖面口字 形狀構件構成，長邊方向之兩端分別被支持於架台“a、Mb 之前述各段部之上面。此處，固定子73a、74a於χ軸方向 彼此分離，以位於其中央之配置於架台6 二 Λ t刖达内 #底面上設置有平台68。㈣子73a係構成與前述固定子 7U相同，固定子7牦係構成為與前述固定子72&相同。 14 201015247 於板件載台PST之+x端部突設有可動子73b。可動子 73b係前端部插入固定子73a之内部空間之狀態。可動子 由與前述可動子71b同樣之電料元（線 定子〜—起構成與前述線性馬達71同樣之線性馬成達;固 又，於^件載台PST之-X端部突設有可動子74b。可動子 74b係前端部插入固定子74a之内部空間之狀態。可動子^ 由與前述可動子72b同樣之電拖單元（線圈單元）構成，與固 定子7乜一起構成與前述線性馬達72同樣之χγ2維線性馬 板件載台pst，係、藉由線性馬達73、74以以長行程驅 動γ軸方向，並微驅動於χ軸方向及02方向。 板件載台驅㈣統PSD另包含將板件載台psT驅動於 Z軸方向、ΘΧ方向、方向之2傾斜驅動裝置（未圖示）。 z傾斜驅動裝置做為—例可由分別將板件載台微驅動 於Z轴方向、包含例如音圈馬達之3個（或4個）Z驅動裝置 構成。3 64b, as can be seen from the above description, is assembled into a well shape. Further, as described later, the gantry 62 functions as a lens barrel platform that supports the projection unit pu (including the projection optical system and the first lens barrel), and is hereinafter referred to as a barrel platform 62. The main body BD is provided on the floor F independently of the entire rack 5〇. The mask stage MST, as shown in Fig. 2, is disposed below the illumination system I〇p. Here, a light armor in which a pattern is formed is placed on the mask stage MST. The mask stage MST is supported in a non-contact manner by an air bearing (not shown) on one of the guide members 63a and 63b provided on the barrel stage 62 and extending in the x-axis direction. The mask stage MST can be driven in the γ-axis direction in a predetermined stroke by the mask stage driving system MSD on the pair of guiding members 63a, 63b, and can be rotated in the X-axis direction and the Z-axis direction (0Z). Direction) Micro drive. In particular, the reticle stage drive system MSD includes a pair of linear motors 71, 72. 2 and 7, it can be seen that the pair of linear motors 71 and 72 are supported by the fixed members 71a and 72a on the (construction) units 52 and 11 201015247 54 (the top portions 52c and 54c). The stators 71a and 72a have long sides arranged in the direction in which the cells 52 and 54 are arranged, and are disposed apart from each other in the X-axis direction. Further, each of the stators 71a, 72a is decomposed into a plurality of parts, and the units 52, 54 are used to support one of the plurality of parts and the other part. The stators 71a and 72a are composed of a magnet having a U-shaped cross section as shown in Fig. 8 . A plurality of permanent magnets are disposed at a predetermined pitch in the γ-axis direction inside one of the stators 7A to form an alternating magnetic field in the γ-axis direction. At this time, the permanent magnets adjacent to each other have different polarities between the permanent magnets facing each other. Inside the other stator 72a, a plurality of permanent magnets are arranged at a predetermined pitch in the Y-axis direction in the same arrangement as the side of the stator 71a. Further, for example, two permanent magnets elongated in the γ-axis direction are disposed on the upper and lower opposing faces of the stator 72a. At this time, the permanent magnets adjacent to each other have different polarities between the permanent magnets facing each other. The armature unit (line) of the linear motor 71 and the cymbal 72 is formed in the inner end of the reticle stage MST at the end portion of the reticle stage MST, and is inserted into the inner working chambers of the stators 71a and 72a, respectively.圏 unit) The movable members 7ib and 7 are formed. A plurality of armature coils are disposed in the movable members 71b and 72b in a configuration corresponding to the magnets on the side of the corresponding stators 71a and 72a. At this time, the linear motor 7 1 is a γ linear motor that generates a driving force (thrust) in the direction of the movable member 711). In addition, in the γ-axis direction drive (thrust) of the movable member 72b, the m-dimensional line of the driving force (thrust) in the x-axis direction is generated, and the stroke of the movable member 72b in the Y-axis direction is The length of the stator 12 201015247 72a is the same, but the stroke in the x-axis direction is shorter than the width of the stator 72 & The position of the mask stage MST in the XY plane is measured by a mask stage interferometer MSI (see Fig. 9) that irradiates the length measuring beam on the reflecting surface provided on (or formed in) the mask stage MST. This measurement result is supplied to the main control unit 20 (refer to Fig. 9). The main control unit 2 drives the mask stage MST through the mask stage drive system MSD based on the supplied measurement result to control the position (and speed) of the mask load σ MST. In addition, the position information of the reticle stage MST can be measured by the encoder system as disclosed in U.S. Patent Application Publication No. 2007/0288 121. The projection unit PU is supported by the barrel platform 62 below the mask stage MST as shown in Fig. 2 . The projection unit PU has a projection optical system constructed in the same manner as the projection optical system disclosed in, for example, the specification of U.S. Patent No. 6,552,775. That is, the projection unit PU includes a plurality of projection optical systems arranged in a staggered manner, and the plurality of projection optical systems are equivalent to the projection optical system having a rectangular single image field having a longitudinal direction in the x-axis direction. In the present embodiment, a plurality of projection optical systems are used, for example, in which both sides are telecentric and the octaves form an erect positive image. A plurality of projection optical systems may also be referred to as projection optical modules, respectively. Therefore, when a plurality of illumination regions on the mask Μ are illuminated by the exposure light from the illumination system, the exposure of the mask thief substantially aligned with the first surface (object surface) of the projection optical system is arranged through the pattern surface. By using the light, the projection image (partial erect image) of the circuit pattern of the mask in the illumination area is formed by the projection optical system on the surface of the second optical plane (image surface) of the projection optical system, and coated on the surface. An irradiation area of the exposure light conjugated to the illumination area on the plate member p having the photoresist (sensitizer) (after the exposure area, the photomask is driven by the synchronization of the mask stage MST and the plate stage PST The plurality of illumination regions (exposure light) are moved in the scanning direction (γ-axis direction), and the plate member P is moved in the scanning direction (Y-axis direction) with respect to the plurality of exposure regions (exposure light), thereby performing the plate member Scanning exposure of the irradiation area (division area) on P, and transferring the pattern of the mask to the irradiation area. The board stage PST is disposed below the projection unit PU as shown in Fig. 2. Here, the board The plate P is placed on the table PST. The plate stage psT, as shown in Fig. 8, is supported on the platform 68 in a non-contact manner by an air bearing or the like (not shown), and is disposed in the X-axis direction to be γ. The axial direction is one of the longitudinal directions on the guide members 69a, 69b. The plate stage PST can be in the γ-axis direction on the pair of guide members 69a, 69b by the plate σ drive system PSD. The internal drive can also be micro-driven in the X-axis direction, the 0Z direction, the 2-axis direction, and the tilt direction of the XY plane (rotation direction around the X-axis (θχ direction), and the direction of rotation around the γ pump (0y direction). In other words, the plate stage driving system pSD includes a pair of linear motors ◎ 73, 74. Here, as can be seen from Fig. 8, a pair of linear motors are formed: the pair of stators 73a, 74a are oriented in the Y-axis direction. The cross-sectional shape member of the long side is formed, and both ends of the longitudinal direction are supported on the upper surfaces of the aforementioned sections of the gantry "a, Mb. Here, the stators 73a, 74a are separated from each other in the z-axis direction, The platform located at the center of the platform 6 is located on the bottom of the floor. The platform 68 is provided on the bottom surface. (4) Sub-73a The stator 7 is the same as the stator 7U described above, and the stator 7 is configured to be the same as the stator 72 & 14 201015247 A movable member 73b is protruded from the +x end of the plate stage PST. The movable portion 73b is inserted into the front end portion. The state of the internal space of the stator 73a. The movable element is made of the same material element as the movable element 71b (the linear stator is configured to form the same linearity as the linear motor 71; the solid is again on the piece carrier PST - A movable member 74b is protruded from the X end portion, and the distal end portion of the movable member 74b is inserted into the internal space of the stator 74a. The movable member is constituted by the same electric tow unit (coil unit) as the movable member 72b, and the fixed member 7 Together with the linear motor 72, the χ 2 two-dimensional linear pallet stage pst is driven by the linear motors 73 and 74 to drive the γ-axis direction with a long stroke, and is micro-driven in the χ-axis direction and the 02-direction. The plate carrier drive (four) system PSD further includes a tilt drive device (not shown) that drives the plate carrier psT in the Z-axis direction, the ΘΧ direction, and the direction. The z-tilt drive device can be constructed by, for example, three (or four) Z-drive devices that respectively drive the plate stage to the Z-axis direction and include, for example, a voice coil motor.
板件載口 pst之在χγ平面内之位置(及傾斜μ X旋 轉、旋轉）)係使用對設於（或形成於）板件載# psT之反 射面照射測長束之柄株栽&工，土，β 败件載σ干涉儀psi(參照圖9)量測，該 量測結果供給至主控制驻要η ^ 制裝置2〇(參照圖9)。主控制裝置20 根據供給之量測結果读；两, 禾透過板件載台驅動系統PSD驅動板件 載台PST，控制板件葡a PCT1 什戰σ PST之位置（及速度）。另外，與光 罩載台M S T同樣地，-5p丨ν / 了以編碼器糸統量測板件載台PST之 位置資訊。 15 201015247 如前所述，本體BD與全體機架5〇獨立地設置於地面 ^上。因此，搭載於本體BD之各部之光罩載台㈣、投影 单元PU、板件載台PST等係與全體機架5〇為獨立 於地面F上》 :，於本實施形態之曝光…〇〇備有量測載置於板 件載台PST之板件p之面位置（表面之z軸方向之位置）之 面位置量測系統AF(參照圖9)。做為面位置量測系統AF， :如，係使用美國專利第6,552,775號說明書所 系統。 本體部刚，另包含配置於板件載台PST上方之複數 個對準系統AL(圖8中未圖示’參照圖9)。對準系統从與 投影單元pu—起垂吊支持於鏡筒平台62。 做為對準系統AL，例如，係使用影像處理方式之 =A(Field Image Alignment)系統。對準系统al之檢出結果 (對像標記之位置資訊）透過對準信號處理系統（未圖示）供給 至主控制裝置2〇(參照圖9)。 ❹ 又於板件載口 PST上設置有複數個標記板（未圖示）。 此處’標記板（未圖示）之表面高度與載置於板件載台聊 上之板件P之高度大致相同。於標記板（未圖示）表面形成有 以上述對準系統AL檢出之基準標記。 又，於板件載台PST内部，於上述複數個標記板（未圖 不）中之若干個下方分別配置有分別包含透鏡系統與攝影元 ^(CCD等）之標記像檢出系統MD(參照圖9)。標記像檢出 '、統MD係同時檢出以曝光用光IL照明之光罩μ上之對準 16 201015247 標記（未圖示）因投影光學系統及透鏡系統所產生之像、以及 基準標記因透鏡系統所產生之像，量測以基準標記（之像） 為基準之對準標記（之像）之位置。該量測結果供給至主控制 裝置20(參照目9)。另夕卜，檢出系，统md並不受限於拍攝標 己像之方式，亦可為透過設於板件載台上面之光透射 部檢出曝光用光江之方式等。The position of the plate carrier pst in the χγ plane (and the tilt μ X rotation, rotation) is used to irradiate the length of the beam on the reflective surface provided on (or formed on) the plate carrier # psT The soil, beta, and σ interferometer psi (see Fig. 9) are measured, and the measurement result is supplied to the main control station η^ device 2 (refer to Fig. 9). The main control device 20 reads according to the measurement result of the supply; and, through the plate carrier driving system PSD, drives the plate carrier PST to control the position (and speed) of the plate PCT1 σ1. Further, similarly to the mask stage M S T , -5p 丨 ν / The position information of the board stage PST is measured by the encoder system. 15 201015247 As described above, the main body BD is disposed independently of the entire rack 5 地面 on the ground. Therefore, the mask holder (four), the projection unit PU, the panel stage PST, and the like mounted on the respective portions of the main body BD are independent of the floor F from the entire chassis 5: Exposure in the present embodiment... A surface position measuring system AF (see FIG. 9) is provided which is placed on the surface position of the plate member P of the plate stage PST (the position in the z-axis direction of the surface). As a surface position measuring system AF, for example, the system of the specification of U.S. Patent No. 6,552,775 is used. The main body portion includes a plurality of alignment systems AL (not shown in Fig. 8) disposed above the panel stage PST (see Fig. 9). The alignment system is supported by the lens stage platform 62 from the projection unit pu. As the alignment system AL, for example, an image processing method = A (Field Image Alignment) system is used. The detection result of the alignment system a1 (position information of the image mark) is supplied to the main control unit 2 (see Fig. 9) by an alignment signal processing system (not shown). ❹ A plurality of marking plates (not shown) are provided on the plate carrier PST. Here, the height of the surface of the marking plate (not shown) is substantially the same as the height of the plate P placed on the table carrier. A reference mark detected by the alignment system AL described above is formed on the surface of the marking plate (not shown). Further, inside the panel stage PST, a mark image detecting system MD including a lens system and a photographing unit (CCD or the like) is disposed below each of the plurality of marking sheets (not shown) (refer to Figure 9). The mark image is detected, and the system MD detects the alignment on the photomask μ illuminated by the exposure light IL. 16 201015247 mark (not shown) is caused by the projection optical system and the lens system, and the reference mark The image produced by the lens system measures the position of the alignment mark (image) based on the reference mark (image). This measurement result is supplied to the main control unit 20 (refer to item 9). In addition, the detection system and the system md are not limited to the method of photographing the target image, and may be a method of detecting the exposure light source through the light transmission portion provided on the upper surface of the plate carrier.
本實施形態之曝光裝置1〇〇附設有於光罩載台MST上 搬送光罩Μ之光罩搬送裝置9〇。光罩搬送裝置9〇係例如 圖7所示垂吊支持於（構成）單元56(之頂部56c)。光罩搬送 裝置9〇係例如圖2及圖7所示，具備於頂部56c在垂吊狀 態下被固定並於χ軸方向延伸之軌道構件Μ、以及可产設 於該軌道構件91之未圖示之導引部在軌道構件Μ之^方 於X軸方向移動之光罩裝載器本體92。軌道構件91之X 侧端部’由圖1可知，突出至全體機架50之外部。光罩Μ :載。MST之裝載及光罩Μ從光罩載台MST之卸載 方進行。因此，光罩裝載器本體92係構成為可在全 架50外部之光罩交付位置與光罩載台MST上方之對光 罩載。MST之光罩交付位置之間往復移動。 另外，本實施形態之曝光裝置100於本體部100，外 =置有安全栅。如從^所示之曝光裝置剛除去^ —-—.I： :心及從圖10除去單元54及單元52之圖u所示， 安全栅1 本體部之+¥側配置有俯視U字狀之安全栅％。 1由圖10可知，係配置於單元54之内部。又於 17 201015247 本體部HH)’之·χ側，如圖1G及圖u所示配置有安全拇 sr2、sr3。安全柵Sr2配置於單元54 久單元52之間，具 體而言，係在腳部54b與腳部52b之Μ 、 :單元〜部，而言，係二 =場所亦設有安全柵。此等安全栅係為使腔室内部為 ⑽，之特定部份而設。該特定部;vm誤接觸本體部 部份等。 疋p伤係例如精密部份、危險The exposure apparatus 1 of the present embodiment is attached to a mask transport apparatus 9 that transports a mask on the mask stage MST. The mask transport unit 9 is supported by a (construction) unit 56 (top portion 56c) as shown in Fig. 7, for example. The reticle conveying device 9 is provided, for example, as shown in Figs. 2 and 7, and includes a rail member 固定 which is fixed in the hanging state in the hanging state and extends in the y-axis direction, and a non-illustrator which can be produced in the rail member 91. The guide portion shown in the guide member is moved in the X-axis direction of the track member body 92. The X-side end portion of the rail member 91 is known from Fig. 1 and protrudes to the outside of the entire frame 50. Photomask Μ: Load. The loading and masking of the MST is performed from the unloading side of the reticle stage MST. Therefore, the mask loader body 92 is configured to be capable of being carried over the reticle delivery position outside the gantry 50 and above the reticle stage MST. The MST's reticle transfer position reciprocates. Further, in the exposure apparatus 100 of the present embodiment, a safety barrier is placed outside the main body unit 100. As shown in the figure u from the exposure apparatus shown by ^, the heart and the figure u of the unit 54 and the unit 52 are removed from Fig. 10, and the +¥ side of the main body of the barrier 1 is arranged in a U shape. % of the barrier. As can be seen from FIG. 10, it is disposed inside the unit 54. Further, on the side of the body portion HH) of 17 201015247, the safety thumb sr2 and sr3 are arranged as shown in Fig. 1G and Fig. The safety barrier Sr2 is disposed between the unit 54 and the long unit 52, and is specifically located between the leg portion 54b and the leg portion 52b, and the unit to the portion. These safety barriers are provided for a specific portion of the chamber (10). The specific portion; vm mistakenly contacts the body portion and the like.疋p injury, such as precision parts, danger
G ⑽其 =:圖12〜23說明於液晶顯示元件之製造工場 (/絮淨至）之曝光裝置1〇〇之組裝流程。 在工場(潔淨室)内進行為設置裝置之定位，亦即 為決疋裝置設置位置及決定固定螺栓之 寸量測、全體機架50之設置位置高度 面尺 '，平订進行本趙部100,之組裝及全體機架50之次组 裝（亦即3個之單元52、54、56 ·、 统j〇p在蔣1 &山 ，，裝）。此時，將照明系 統ΙΟΡ在將其射出端部（構成照明系統_卜 ❹ 光學系統之一部份）插入前述頂部52c之開口 52=α…、明 態下搭載於單元52之頂部 邛之狀 ^ , 只1 上本體部100’ ，係以钵 確保既定機械精度、電子精度、 ’、b 成本趙部！〇〇,之-部份各種子Λ 式將分別構 確保此等各種精度，在組裝前後 製：。為了 了達成先學精度之調整、對各種機械系地 械精度之調整、對各種電 仃為了達成機 調整。本體部100，之组裝 精度之 裝包含各種子系統間機械性連接' 18 201015247 電路配線連接、氣麗線路管線連接等β 然後’全體機架50之結合，亦即，以下述流程結合在 上述全體機架50之次組裝所組裝之3個單元52、54、56。 首先，如圖12所示，於單元52分別安裝單元52之定 位工具102a、l〇2b、l〇2c。另外，此時，於單元52安裝有 工具用之攔杆部103。 其次’透過未圖示之书具以未圖示之門形升降機吊 起，將定位工具l〇2a、l〇2b、102c壓接於本體BD並降下 β 單元52。此時’定位工具102a、102b、l〇2c分別被壓接於 圖13所示之定位工具接觸面i〇4a、1〇朴、i〇4c。 另外’亦可不使用定位工具l〇2a ' 102b、102c，而採 用對準在上述定位所決定之定位線以設置單元5 2之方法。 其次’從單元52拆除未圖示之吊具及定位工具i〇2a、 l〇2b、l〇2c，於單元52安裝固定螺栓及其餘面板。於圖14 中’顯示有此固定螺栓等之安裝結束後之狀態。 . 其次’如圖15所示’使單元54、單元56、光罩裝載 器90往本體部丨00’之+γ側移動。此移動係使用未圖示之 門型升降機及/或空氣懸浮，由作業員進行。 其次’如圖16所示，於單元54安裝定位工具1〇6a、 106b ° 其次’將单元54從圖17所示位置透過未圖示之吊具 以未圖示之門形升降機吊起，以定位工具1〇6a、l〇6b定位 後降至既定位置（圖1 8所示位置）。 其次，從單元54拆除未圖示之吊具及定位工具1〇6a、 19 201015247 1 8係顯示 l〇6b，於單元54安裝固定螺栓及其餘面板。圖 此固定螺检等之安裂結束後狀態。 如圖19所示，於單元56安裝橋架108。另外， 圖19中於單元56之聊部56a、56b安裝有移動用之腳輪。 其次’如圖20所示，將單元56透過未圖示之吊具以 未圖不之門形升降機吊起後，降至搭載於台車11G上之光 罩裝載器90’將單元56與光罩裝載器％加以結合。結合G (10) = = Figs. 12 to 23 illustrate the assembly flow of the exposure apparatus 1 of the manufacturing process of the liquid crystal display element. Positioning the setting device in the workshop (clean room), that is, setting the position of the smashing device and determining the measurement of the fixing bolts, and setting the height gauge of the entire frame 50, and ordering the Zhao 100 , the assembly and the assembly of the entire rack 50 (that is, the three units 52, 54, 56 ·, j j in the Chiang 1 & mountain,, installed). At this time, the illumination system is inserted into the opening end 52 (which constitutes one part of the illumination system _ 光学 optical system) into the opening 52=α of the top portion 52c, and is mounted on the top of the unit 52 in the bright state. ^ , Only 1 on the body part 100', to ensure the established mechanical precision, electronic precision, ', b cost Zhao! 〇〇, - Some of the various sub-forms will be constructed separately to ensure these various precisions, before and after assembly: In order to achieve the adjustment of the pre-study precision, the adjustment of the mechanical precision of various mechanical systems, and the adjustment of various electric motors. The mounting accuracy of the main body portion 100 includes mechanical connections between various subsystems. 18 201015247 circuit wiring connection, gas line connection, etc. β and then the combination of the entire rack 50, that is, the above process is combined The three units 52, 54, 56 assembled are assembled in the entire rack 50. First, as shown in Fig. 12, positioning means 102a, l2b, l2c of unit 52 are mounted in unit 52, respectively. Further, at this time, the barrier portion 103 for the tool is attached to the unit 52. Next, the book holders (not shown) are hoisted by a door lift (not shown), and the positioning tools 10a, 2b, and 102c are pressed against the main body BD to lower the β unit 52. At this time, the positioning tools 102a, 102b, and 10c are respectively crimped to the positioning tool contact faces i〇4a, 1 and i4c shown in Fig. 13. Alternatively, the positioning means l〇2a ' 102b, 102c may be used instead of the positioning line determined by the above positioning to set the unit 52. Next, the spreader and the positioning tools i〇2a, l〇2b, and l2c, which are not shown, are removed from the unit 52, and the fixing bolts and the remaining panels are attached to the unit 52. In Fig. 14, the state after the mounting of the fixing bolt or the like is completed is shown. Next, as shown in Fig. 15, the unit 54, the unit 56, and the mask loader 90 are moved to the +γ side of the body portion 丨00'. This movement is performed by a worker using a door lift and/or air suspension not shown. Next, as shown in Fig. 16, the positioning tool 1〇6a, 106b is attached to the unit 54. Next, the unit 54 is lifted from a position shown in Fig. 17 through a spreader (not shown) by a gate lift (not shown). The positioning tools 1〇6a, l〇6b are positioned and lowered to a predetermined position (the position shown in Fig. 18). Next, the spreader (not shown) and the positioning tool 1〇6a, 19 201015247 1 8 are displayed from the unit 54 to display the bundle 6b, and the fixing bolts and the remaining panels are attached to the unit 54. Fig. This is the state after the end of the cracking of the fixed thread check. As shown in Figure 19, a bridge 108 is mounted to unit 56. Further, in FIG. 19, the casters 56a and 56b of the unit 56 are mounted with casters for movement. Next, as shown in FIG. 20, the unit 56 is hoisted by a sling which is not shown, and then lowered to the hood loader 90' mounted on the carriage 11G, and the unit 56 and the reticle are removed. The loader % is combined. Combine
單兀56與光罩裝栽器9〇後，解除光罩裝載器90與台車11〇 之連接（結合）。 其次，如圖21所示，將結合有光罩裝載器9〇之單元 56透過未圖示之吊具以未圖示之門形升降機吊起後，降至 單兀54與單70 52之間，將單元56結合於單元54與單元 52。於此結合之際成為障礙之腳輪係於結合前先從單元56 之腳°卩拆除。圖22係顯示單元56結合於單元54與單元52 之狀態。 ' 之後，於正規位置安裝橋架1〇8，從單元56拆除吊具， 於單元，54與單元52之間安裝連結兩者之複數個連接構❿ 件。之後，將其餘之單元（驅動器 '空壓箱等）置於單元W、 匕4: 56,安裝光罩裝載器9〇用之作業用腳手架(鷹架），從 早兀54拆除工具用之攔杆部。至此，全體機架5〇之結合 結束。於圖23顯示全體機架5〇之結合結束後之狀態。其 後，於全體機架50之外面組裝複數個面板以構成腔室。至 此，曝光裝置100之組裝結束。其後，進行综合調整以 確保做為曝光裝置全體之各種精度。另外，關於安全栅之 20 201015247 設置作業等省略說明。 如以上說明，根據本實施形態之曝光裝置1〇〇，具備支 持曝光裝置本體及附設於曝光裝置本體之裝置（例如搬送裝 置90等）構成各部之至少一部份之由複數個、此處係3個單 元52、54、56構成之全體機架50。因此，可考慮車輛等搬 送手段、運輸手段之重量限制、運送、搬送能力來設定各 單7L 52、54、56之大小。另外，由於複數個單元52、54、After the unit 56 and the photomask loader are 9 turns, the connection (joining) of the photomask loader 90 and the carriage 11 is released. Next, as shown in FIG. 21, the unit 56 to which the mask loader 9 is coupled is lifted by a not-shown spreader (not shown), and then lowered between the unit 54 and the single 70 52. Unit 56 is coupled to unit 54 and unit 52. At the time of this combination, the caster that becomes the obstacle is removed from the foot of the unit 56 before being combined. Figure 22 is a diagram showing the state in which the display unit 56 is coupled to the unit 54 and the unit 52. After that, the bridge 1〇8 is installed at a regular position, the spreader is removed from the unit 56, and a plurality of connection members connecting the two are mounted between the unit 54 and the unit 52. After that, place the remaining units (driver 'air compressor box, etc.) in unit W, 匕4: 56, install the scaffolding (scrubber) for the mask loader 9 and remove the tool from the early 兀54 Rod. At this point, the combination of the entire rack is completed. Fig. 23 shows the state after the end of the assembly of the entire rack 5〇. Thereafter, a plurality of panels are assembled on the outer surface of the entire frame 50 to form a chamber. Thus, the assembly of the exposure apparatus 100 is completed. Thereafter, comprehensive adjustment is made to ensure various precisions of the entire exposure apparatus. In addition, the description of the safety gate 20 201015247 setting operation and the like is omitted. As described above, the exposure apparatus 1A according to the present embodiment includes a plurality of supporting portions of the exposure unit and the apparatus (for example, the transport unit 90) attached to the main body of the exposure apparatus. The three units 52, 54, 56 form the entire rack 50. Therefore, the size of each of the single 7Ls 52, 54, and 56 can be set in consideration of the transportation means such as the vehicle, the weight restriction of the transportation means, and the transportation and transportation capabilities. In addition, due to a plurality of units 52, 54,
56可各支持上述構成各部之至少一部份，故可分散作用於 全體機架50之荷重。又，由於從複數個單元52、54、％ 構築單一之全體機架5〇，故容易使全體機架5〇全體擁有充 分之強度。本實施形態由於係採用高強度之門形單元做為 各單元，故於此點亦可圖強度之提升。因此，可容易且在 短期間（短時間）組裝大型之曝光裝置。 又’根據本實施形態之曝光裝置1〇〇,如前述，由於容 易使全體機架50全體擁有充分之強度，故可充分因應振 動、地震等，T圖大型、大重量之曝光裝置精度之提升。 又，根據本實施形態之曝光裝置100，本體BD係與全 體機架50獨立且透過防振系統65設置於地面f上。此外， 驅動光罩載台MST之一對線性馬達71、72之固定子71&、 72a係垂吊支持全體機架5〇。因此，在以線性馬達71、Η 驅動光罩載台MST之際，作用於固定子71a、72^驅動力 之反力透過該固定子71a、傳達至全體機架50,透過該 全體機架50以機械方式釋放至地面（大地）。亦即，固定子 71a、72a係發揮例如美國專利第5,874，㈣號說明書所揭示 21 201015247 之反應架之機能。因此，驅動 ^ _ 助尤罩载台MST之際作用於固 疋子71a、72a之驅動力之c六笙 之反力等’不會成為於本體BD之 一部份受支持之投影單元PU之振動原因。另外，亦可如日 本特開+ 8-63231冑公報（對應英國專利申請公 一號說明書)等之揭示’將固定子71心作成可相 對垂吊支持於全體機架5G之支持構件移動之構成，藉由上 述反力之作用依動量守㈣律使固定子仏、724與光罩 載台MST(可動子71b、72b)相反方向移動，據以排除上述 反力成為投影單元PU之振動原因。亦即可以固定子川、 72 a作為所謂之配衡質量。 又’根據本實施形態之曝光裝置丨⑽，光罩裝載器9〇 之執道構件91係從單元56之頂部561吊，鮮裝載器本 體92係構成為沿設於該軌道構件9ι之未圖示之導引部， 在全體機架50外部之光罩交付位置與光罩載台Μ”上方之 光罩Μ對光罩載台黯之交付位置之間往復移動。據此， 可從上方進行光罩Μ對鮮心MST之裝似光罩輯 先軍載台MST之卸載。又，可抑制（阻止）隨光罩搬送而產 生之光罩裝載H 90之振動傳送至與全_架5()獨立地設 置於地面F上之本體BD(本體部1〇〇,），*可圖曝光裝置 精度之提升。 另外，上述實施形態雖係以2個門形單元52、54與連 結該門形單元52、54之連結單元56之3個單元構成全體 機架50,但本發明並不限定於此。例如門形單元可設置丄 個或3個，連結單元可設置複數個。例如，設置3個以上 22 201015247 Η形單元時’使用該3個以 72a亦可。藉此，可容易的心1形皁兀支持固定子7la、 了谷易的加長光罩載a 門形單元及連結單元之至少 ° 《行程。但 又，在因上述實施形態中定須设置。 重而無法以運輸手段運輸時等，；過咖 與天板部搬送。亦即，可將複 =之至幻個構成為可分割成複數個構件，在搬' 為該複數個構件’而在現地組 丄 ❹…個單元’將組裝後之該至少i個單 以組合設置。 ’、共他皁兀加 =點是’只要全體機架50是由支持上述曝光裝置本體 等之圖案生成裝置及附設於該裝置之裝置之構成各部之至 少-部份之複數個單元構成的話，則其單元數不拘。 另外，上述安全柵可視其機能而稱為分隔構件、保護 構件或隔壁構件。因此，例如將安全栅做為分隔構件使用 時，藉由分隔腔室之内部空間可提高例如其内部空間之空 W 調效率。 又，於全體機架50之内側且安全柵之外側配置進行板 件P之除電之離化器’而作業員（或操作貢）為維修保養等目 的進入曝光裝置内部時，在關閉離化器後才能進入全體機 架50内。又，進入全體機架5〇内之作業員可通過安全柵 目視曝光裝置本體之動作狀態。 又，由支持上述曝光裝置本體等之圖案生成裝置及附 設於該裝置之裝置之構成各部之至少一部份之複數個單元 23 201015247 構成全體機架so之上述實施形態之曝光裝置，*僅在從曝 造m往元件製造工廠’在為進行曝光裝置 往其他元件製造工廠移設之運輸及/或組裝等亦為有效。 另外’上述實施形態係使用光罩載台干涉儀Msi量測 光罩載台MST之位置，並使用板件載台干涉儀psi量測板 件載口 PST之位置。但不限於此，可使用編碼器(由複數個 編碼器構成之編碼器系統）取代光罩載台干涉儀MSI。或可 併用光罩載台干㈣MSI與編碼器。同樣地，亦可使用編 I器（由複數個編碼器構成之編碼器系統）取代板件載台干 ❹ 涉儀PSI。或可併用板件載台干涉儀PSI與編碼器。 又，上述實施形態中，可使用將從例如DFB半導體雷 射或光纖雷射發振之紅外區或可見區之單一波長雷射光以 例如摻铒（或铒與镱兩者）光纖放大器增幅並使用非線性光 學結晶將其波長轉換至紫外光之高諧波做為曝光用光。 又亦可使用固趙雷射（波長3 55nm、266nm)等。 另外，上述實施形態雖係說明投影單元pu為具備複數 個投影光學系統之多透鏡方式之狀況，但投影光學單元之❹ 根數只要為1根以上即可。又，不限於多透鏡方式之投影 光學系統’亦可為使用反射型大型鏡之投影光學系統等。 又’上述實施形態雖係說明使用投影倍率為等倍者做 為投影光學系統之狀況，但不限於此，投影光學系統亦可 為縮小系統或放大系統之任一者。 又’上述實施形態雖係說明本發明被適用於非液浸式 曝光裝置之狀況，但不限於此，本發明亦可適用於例如美 24 201015247 國專利申請公開第2005/0259234號說明書等所揭示之，對 投影光學系統與曝光對象之基板之間供給液體，透過該液 體對基板投射曝光用光之液浸曝光方式之曝光裝置。 另外，上述實施形態雖使用於光透射性之光罩基板上 形成有特定遮光圖案（或相位圖案、減光圖案）之光透射型光 罩，但亦可使用使用例如美國專利第6,778,257號說明書所 揭示之根據待曝光圖案之電子資料形成透射圖案、反射圖 案、發光圖案之電子光罩（可變成形光罩），例如，非發光型 ® 影像顯示元件（亦被稱為空間光調變器）之一種、即 DMD(Digital Micro-mirror Device)之可變成形光罩。 另外，具備上述實施形態之全體機架5〇等機架之本發 明之曝光裝置，對尺寸（包含外徑、對角線、一邊之至少i 個）為500mm以上之基板，例如液晶顯示元件等平板顯示器 (FPD)用大型基板之曝光裝置適用特別有效。此係因本發明 為因應基板之大型化而為。 另外上述實施形態雖係說明本發明適用於進行掃描 曝光之投影曝光裝置之狀況，但不限於此，本發明亦可適 用於不使用投影光學系統之近接方式之曝光裝置。又本 發明亦可適用於步進重複方式之曝光裝置（所謂步進機）或 步進接合方式之曝光裝置。 又，曝光裝置之用途並不受限於對方型玻璃板轉印液 晶顯示元件®案之曝光裝置，亦可廣泛適用於例如半導體 製造用之曝光裝置、製造薄膜磁頭、微機器、dna晶片等 之曝光裝置。又，不僅半導體元件等微元件，於為製造在 25 201015247 光曝光裝置、EUV曝光裝置、X射線曝光裝置、電子射線 曝光裝置等所使用之光罩或標線片而對玻璃基板或矽晶圓 等轉印電路圖案之曝光裝置亦可適用本發明。另外，作為 曝光對象物體並不受限於玻璃板，可為例如晶圓、陶瓷基 板、膜構件或光罩基板等其他物體。 又，本發明亦可適用於例如國際公開第2001/035168號 所揭示之藉由於晶圓上形成干涉條紋而於晶圓上形成線與 空間圖案之曝光裝置（微影系統）。56 can each support at least a portion of each of the above-described components so that it can be distributed to the load of the entire frame 50. Further, since a single unit rack 5 is constructed from a plurality of units 52, 54 and %, it is easy to provide sufficient strength to the entire rack 5 unit. In this embodiment, since a high-strength gate-shaped unit is used as each unit, the strength of the figure can be improved at this point. Therefore, a large exposure apparatus can be assembled easily and in a short period of time (short time). Further, according to the exposure apparatus 1 of the present embodiment, as described above, since it is easy to provide sufficient strength to the entire rack 50, it is possible to sufficiently cope with vibration, earthquake, and the like, and the accuracy of the large-sized and large-weight exposure apparatus of the T-picture is improved. . Further, according to the exposure apparatus 100 of the present embodiment, the main body BD is provided separately from the entire chassis 50 and is provided on the floor surface f through the vibration isolating system 65. Further, one of the driving reticle stage MST supports the stators 71 & 72a of the linear motors 71 and 72 to support the entire chassis 5 。. Therefore, when the mask stage MST is driven by the linear motor 71 and Η, the reaction force acting on the driving forces of the stators 71a and 72 is transmitted through the stator 71a to the entire chassis 50, and is transmitted through the entire chassis 50. Mechanically released to the ground (earth). That is, the anchors 71a, 72a function as a reaction rack of, for example, 21 201015247 as disclosed in the specification of U.S. Patent No. 5,874, (4). Therefore, the driving force of the driving force of the solid scorpions 71a and 72a when the driving _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The cause of vibration. In addition, as disclosed in Japanese Laid-Open Patent Publication No. 8-63231 (corresponding to the specification of the British Patent Application No. 1), etc., the fixing member 71 is formed as a support member that can support the movement of the supporting member in the entire frame 5G. By the action of the reaction force, the fixed 仏, 724 and the mask stage MST (the moveable members 71b, 72b) are moved in opposite directions, thereby eliminating the above-mentioned reaction force and causing the vibration of the projection unit PU. That is, it is possible to fix Zichuan and 72 a as the so-called balance quality. Further, according to the exposure apparatus (10) of the present embodiment, the mask member 91 of the mask loader 9 is suspended from the top 561 of the unit 56, and the fresh loader body 92 is configured to be disposed along the rail member 9 The guiding portion is reciprocated between the mask delivery position outside the entire frame 50 and the mask 上方 above the reticle stage Μ to the delivery position of the reticle stage. Accordingly, it can be performed from above The mask Μ 鲜 鲜 MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS MS The main body BD (main body portion 〇〇) which is independently provided on the floor F, * can improve the accuracy of the exposure apparatus. In addition, in the above embodiment, the two gate units 52 and 54 are connected to the gate shape. The three units of the connecting unit 56 of the units 52 and 54 constitute the entire frame 50. However, the present invention is not limited thereto. For example, one or three of the gate units may be provided, and a plurality of connecting units may be provided. For example, setting 3 More than 22 201015247 Η-shaped unit when 'use the three to 72a can also. The heart-shaped saponin supports the stator 7la, the extended photomask of the valley, and the at least a gate unit and the connecting unit. The stroke is set. However, it is required to be set in the above embodiment. When transporting, etc.; passing the coffee and the Celestial Department, that is, the complex = illusion can be divided into a plurality of components, in the move to 'the plural components' and in the field group... The unit 'sets at least i of the assembled sheets in combination. ', the total saponification plus = point is 'as long as the entire frame 50 is a pattern generating device supporting the above-mentioned exposure device body or the like and a device attached thereto In the case where a plurality of units constituting at least a part of each unit are formed, the number of units is not limited. The safety barrier may be referred to as a partition member, a protective member or a partition member depending on its function. Therefore, for example, a safety barrier is used as a partition. When the member is used, the space of the internal space can be increased by, for example, the internal space of the partition chamber. Further, the ionizer for removing the plate member P is disposed on the inner side of the entire frame 50 and outside the safety barrier. 'When the operator (or operation) enters the interior of the exposure unit for maintenance and other purposes, it can enter the entire rack 50 after closing the ionizer. In addition, the operator entering the entire rack 5 can pass the safety barrier. The operation state of the main body of the exposure apparatus is visually observed. Further, the plurality of units 23 201015247 supporting at least a part of each of the components of the apparatus for the exposure apparatus and the apparatus attached to the apparatus constitute the above-described implementation of the entire rack The exposure apparatus of the form is also effective only in the transportation and/or assembly for moving the exposure apparatus to other component manufacturing plants from the exposure to the component manufacturing factory. In addition, the above embodiment uses the photomask stage. The interferometer Msi measures the position of the reticle stage MST and measures the position of the plate carrier PST using the plate stage interferometer psi. However, it is not limited thereto, and an encoder (an encoder system composed of a plurality of encoders) may be used instead of the reticle stage interferometer MSI. Or use the reticle stage to dry (4) MSI and encoder. Similarly, an encoder (an encoder system composed of a plurality of encoders) can be used instead of the panel carrier dryness PSI. Alternatively, the plate carrier interferometer PSI and the encoder can be used in combination. Further, in the above embodiment, a single-wavelength laser light from an infrared region or a visible region in which a DFB semiconductor laser or a fiber laser is excited may be used to amplify and use, for example, an erbium-doped (or both erbium and germanium) fiber amplifier. Nonlinear optical crystallization converts its wavelength to the high harmonics of ultraviolet light as exposure light. It is also possible to use a solid laser (wavelength 3 55 nm, 266 nm) or the like. In the above embodiment, the projection unit pu is a multi-lens system having a plurality of projection optical systems. However, the number of the projection optical units may be one or more. Further, the projection optical system of the multi-lens type is not limited to a projection optical system using a large reflective mirror. In the above embodiment, the case where the projection magnification is equal to one is used as the projection optical system is described. However, the present invention is not limited thereto, and the projection optical system may be either a reduction system or an amplification system. In the above-described embodiment, the present invention is applied to a non-liquid immersion exposure apparatus. However, the present invention is not limited thereto, and the present invention is also applicable to, for example, the disclosure of the specification of the Japanese Patent Application Publication No. 2005/0259234. A liquid immersion exposure type exposure apparatus that supplies a liquid between a projection optical system and a substrate to be exposed, and projects the exposure light through the liquid. Further, in the above embodiment, a light-transmitting type mask in which a specific light-shielding pattern (or a phase pattern or a light-reducing pattern) is formed on a light-transmitting mask substrate is used, but it is also possible to use, for example, the specification of US Pat. No. 6,778,257. An electronic mask (variable shaped mask) for forming a transmissive pattern, a reflective pattern, or a light-emitting pattern according to an electronic material of an image to be exposed, for example, a non-light-emitting type image display element (also referred to as a spatial light modulator) A variable forming mask of DMD (Digital Micro-mirror Device). In addition, the exposure apparatus of the present invention having the above-described frame of the entire frame 5 of the above-described embodiment has a size (including at least i of the outer diameter, the diagonal, and one side) of a substrate of 500 mm or more, for example, a liquid crystal display element or the like. Flat panel displays (FPDs) are particularly effective for use with large substrate exposure devices. This is because the present invention is in response to an increase in the size of the substrate. Further, in the above embodiment, the present invention is applied to a projection exposure apparatus for performing scanning exposure. However, the present invention is not limited thereto, and the present invention is also applicable to an exposure apparatus of a proximity type which does not use a projection optical system. Further, the present invention is also applicable to an exposure apparatus of a step-and-repeat type (so-called stepper) or an exposure apparatus of a step-and-join type. Further, the use of the exposure apparatus is not limited to the exposure apparatus of the counterpart type glass plate transfer liquid crystal display element®, and can be widely applied to, for example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, a dna wafer, or the like. Exposure device. Further, not only micro-elements such as semiconductor elements but also photomasks or reticle used for manufacturing a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, etc., on a glass substrate or a wafer The exposure apparatus of the equal transfer circuit pattern can also be applied to the present invention. Further, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a film member, or a mask substrate. Further, the present invention is also applicable to an exposure apparatus (lithography system) for forming a line and space pattern on a wafer by forming interference fringes on a wafer as disclosed in, for example, International Publication No. 2001/035168.
另外’援用上述說明所引用之與曝光裝置等相關之所 有公報、國際公開公報、美國專利申請公開說明書、美國 專利說明書之揭示做為本說明書記載之一部份。 «元件製造方法》 其次，說明在微影製程使用上述實施形態之曝光裝置 100之微7L件製造方法。上述實施形態之曝光裝置1〇〇可藉 由於板件（玻璃基板）上形成特定圖案（電路圖案、電極圖案 等）獲得做為微元件之液晶顯示元件。Further, the disclosures of all the publications, the international publications, the U.S. Patent Application Publications, and the U.S. Patent Application, which are incorporated by reference to the above-mentioned specification, are incorporated herein by reference. «Element Manufacturing Method>> Next, a method of manufacturing the micro 7L device using the exposure apparatus 100 of the above embodiment in the lithography process will be described. In the exposure apparatus 1 of the above embodiment, a liquid crystal display element which is a micro element can be obtained by forming a specific pattern (circuit pattern, electrode pattern, or the like) on a plate member (glass substrate).
<圖案形成步驟> 首先，使用上述實施形態之曝光裝置100，實行於感 性基板(塗布有光阻之玻璃基板等)形成圖案像之所謂光 I步驟。藉由此光微影步驟於感光性基板上形成包含多 電極等之特定圖案。其後，經曝光之基板經顯影步驟、 =驟、光_離步料各步驟，據以於基板上形成特 〈彩色渡光片形成步称> 26 201015247 其次’形成具有多數斜庙 欺對應 R(Red)、G(Green)、B(Blue) 之3個點之組排列成矩陣壯、+收沐* 人疋》*平狀、或將複數個r、g、b之3條 條紋之濾光片組排列於水平播 八十掃描線方向之彩色濾光片。 <單元組裝步驟> 其次’使用在圖案形成步驟所得之具有特定圖案之基 板:在瀘、光片形成步驟所得之濾光片等組裝液晶面板（液晶 單70)。例如，在圖案形成步驟所得之具有特定圖案之基板 與在濾光片形成步驟所得之濾光片之間注入液晶，以製造 參液晶面板（液晶單元）。 〈模組組裝步驟> 其後，女裝用以進行經組裝之液晶面板（液晶單元）之顯 不動作之電路、背光等各零件以完成液晶顯示元件。 此時’由於圖案形成步驟係使用上述實施形態之曝光 裝置以局產率且高精度進行板件之曝光，其結果可提升液 晶顯示元件之生產性。 本發明之曝光裝置，適於製造如液晶顯示元件等之平 板型大型電子元件（微元件）。 【圖式簡單說明】 圖1係概略顯示一實施形態之曝光裝置之構成之圖。 圖2係概略顯示除全體機架之曝光裝置之構成之圖。 圖3係概略顯示全體機架之構成之圖。 圖4係概略顯示構成全體機架之第1門形單元之構成 之圖。 27 201015247 圖 之圖。 係概略顯示構成全體機架之第2n形單元之構成 圖6係概略顯示構成全體機架之遠 咬苑早兀之構成之圖。 圖7係顯示全體機架及受其支持之曝光裝置本體及附 設裝置之構成各部之配置之圖。 圖8係概略顯示配置於全體機架内之本體部之構成之 圖。 圖9係顯示一實施形態之曝光裝置之控制系統之主要 之構成之方塊圖。 圖10係顯示從圖1所示之曝光裝置1〇〇去除曝光裝置 本體（包含本艎部100’ ）與單元56之其餘部位之立體圖。 圖11係從圖10去除單元54及單元52,顯示安全柵之 配置之圖。 圖12係說明曝光裝置之組裝流程之圖（其丨）。 圖13係說明曝光裝置之組裝流程之圖（其2)。 圖14係說明曝光裝置之組裝流程之圖（其3)。 圖15係說明曝光裝置之組裝流程之圖（其4)。 0 圖16係說明曝光裝置之組裝流程之圖（其5)。 圖17係說明曝光裝置之組裝流程之圖（其6)。 圖18係說明曝光裝置之組裝流程之圖（其7)。 圖19係說明曝光裝置之組裝流程之圖（其8)。 圖20係說明曝光裝置之組裝流程之圖（其9)。 圖21係說明曝光裝置之組裝流程之圖（其1〇)。 圖22係說明曝光裝置之組裝流程之圖（其丨丨）。 28 201015247 圖23係說明曝光裝置之組裝流程之圖（其12)。 【主要元件符號說明】 20 :主控制裝置 50 :全體機架 52、54、56 :單元 58 :連接構件 90 :搬送裝置 翁 100 :曝光裝置 100’ ：本體部 IOP :照明系統 PU :投影單元 Μ :光罩 MSD :光罩載台驅動系統 MST :光罩載台 Ρ :板件 . PSD :板件載台驅動系統 PST :板件載台 29<Pattern forming step> First, the exposure apparatus 100 of the above-described embodiment is used to perform a so-called light I step of forming a pattern image on an inductive substrate (a glass substrate coated with a photoresist). A specific pattern including a plurality of electrodes or the like is formed on the photosensitive substrate by the photolithography step. Thereafter, the exposed substrate is subjected to a development step, a step, a photo-off-step, and a step of forming a special color plane on the substrate to form a step name > 26 201015247 followed by 'formation with a majority of oblique temples The three points of R (Red), G (Green), and B (Blue) are arranged in a matrix of strong, + 收 * * 疋 * * flat, or a plurality of strips of r, g, b The filter set is arranged in a color filter that horizontally broadcasts eighty scan lines. <Unit assembly step> Next, a substrate having a specific pattern obtained in the pattern forming step is used: a liquid crystal panel (liquid crystal cell 70) is assembled in a crucible, a filter obtained in a light sheet forming step, or the like. For example, liquid crystal is injected between the substrate having a specific pattern obtained in the pattern forming step and the filter obtained in the filter forming step to fabricate a liquid crystal panel (liquid crystal cell). <Module assembly step> Thereafter, the women's clothing is used to perform various steps such as a circuit for operating the assembled liquid crystal panel (liquid crystal cell) and a backlight to complete the liquid crystal display element. At this time, since the pattern forming step uses the exposure apparatus of the above-described embodiment to expose the sheet member with a high yield and high precision, the productivity of the liquid crystal display element can be improved. The exposure apparatus of the present invention is suitable for producing a flat type large electronic component (micro component) such as a liquid crystal display element. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view schematically showing the configuration of an exposure apparatus according to an embodiment. Fig. 2 is a view schematically showing the configuration of an exposure apparatus in addition to the entire frame. Fig. 3 is a view schematically showing the configuration of the entire frame. Fig. 4 is a view schematically showing the configuration of a first gate unit constituting the entire frame. 27 201015247 Diagram of the diagram. The configuration of the second n-shaped unit constituting the entire frame is schematically shown in Fig. 6. Fig. 6 is a view schematically showing the configuration of the long-distance garden which constitutes the entire frame. Fig. 7 is a view showing the arrangement of the entire frame and the components of the exposure apparatus main body and the attachment device supported by the same. Fig. 8 is a view schematically showing the configuration of a main body portion disposed in the entire frame. Fig. 9 is a block diagram showing the main constitution of a control system of an exposure apparatus of an embodiment. Fig. 10 is a perspective view showing the removal of the exposure apparatus main body (including the main body portion 100') and the remaining portion of the unit 56 from the exposure apparatus 1 shown in Fig. 1. Figure 11 is a diagram showing the arrangement of the barriers by removing unit 54 and unit 52 from Figure 10. Fig. 12 is a view (Fig. 12) showing the assembly flow of the exposure apparatus. Fig. 13 is a view (2) showing the assembly flow of the exposure apparatus. Fig. 14 is a view (3) showing the assembly flow of the exposure apparatus. Fig. 15 is a view showing the assembly flow of the exposure apparatus (4). 0 Figure 16 is a diagram (5) illustrating the assembly process of the exposure apparatus. Fig. 17 is a view (6) showing the assembly flow of the exposure apparatus. Fig. 18 is a view (7) showing the assembly flow of the exposure apparatus. Fig. 19 is a view showing the assembly flow of the exposure apparatus (8). Fig. 20 is a view (9) illustrating the assembly flow of the exposure apparatus. Fig. 21 is a view showing the assembly flow of the exposure apparatus (1). Fig. 22 is a view (Fig. 22) showing the assembly flow of the exposure apparatus. 28 201015247 FIG. 23 is a diagram (12) illustrating the assembly process of the exposure apparatus. [Main component symbol description] 20: Main control device 50: Whole frame 52, 54, 56: Unit 58: Connection member 90: Transport device Weng 100: Exposure device 100': Main body portion IOP: Illumination system PU: Projection unit Μ : Photomask MSD : Photomask Stage Drive System MST : Photomask Stage Ρ : Plate. PSD : Plate Stage Drive System PST : Plate Stage 29
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| KR (2) | KR101904685B1 (en) |
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| CN102636961B (en) * | 2011-02-12 | 2014-08-20 | 上海微电子装备有限公司 | Rotatory lithography machine |
| US10246287B2 (en) * | 2014-09-04 | 2019-04-02 | Nikon Corporation | Processing system and device manufacturing method |
| DE102019102215B3 (en) * | 2019-01-29 | 2020-06-25 | Nanoscribe Gmbh | System for building a laser lithography device and module carrier therefor |
| CN114625156A (en) * | 2020-12-10 | 2022-06-14 | 中国科学院微电子研究所 | Mask plate carrying method and mask plate carrying system using unmanned aerial vehicle |
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| JP2002203771A (en) * | 2000-12-28 | 2002-07-19 | Nikon Corp | Aligner, transportation method |
| JP2002353096A (en) | 2001-05-22 | 2002-12-06 | Nikon Corp | Method for conveying substrate, apparatus and method for exposure |
| JP4269610B2 (en) * | 2002-09-17 | 2009-05-27 | 株式会社ニコン | Exposure apparatus and method of manufacturing exposure apparatus |
| JP4383911B2 (en) * | 2004-02-03 | 2009-12-16 | キヤノン株式会社 | Exposure apparatus and semiconductor device manufacturing method |
| EP3255652B1 (en) * | 2004-06-21 | 2018-07-25 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
| JP4440031B2 (en) * | 2004-07-29 | 2010-03-24 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
| JP2006055930A (en) * | 2004-08-18 | 2006-03-02 | Fuji Photo Film Co Ltd | Suction device, its mounting structure, and carrying device and image forming device provided with suction device |
| JP2006147778A (en) | 2004-11-18 | 2006-06-08 | Nikon Corp | Manufacturing method of exposure device and micro device |
| JP2006337700A (en) * | 2005-06-01 | 2006-12-14 | Fujifilm Holdings Corp | Exposure device, exposure device system, and exposure method |
| CN2832754Y (en) * | 2005-10-13 | 2006-11-01 | 广辉电子股份有限公司 | Light shield transporting device |
| WO2007077920A1 (en) * | 2005-12-28 | 2007-07-12 | Nikon Corporation | Exposure device and fabrication method thereof |
| KR101111933B1 (en) * | 2007-04-03 | 2012-04-06 | 닛본 세이고 가부시끼가이샤 | Exposure apparatus and exposure method |
| JP2009094184A (en) * | 2007-10-05 | 2009-04-30 | Toray Ind Inc | Substrate treatment apparatus and treating method |
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| TWI670574B (en) * | 2012-04-04 | 2019-09-01 | 日商尼康股份有限公司 | Exposure apparatus, flat-panel display manufacturing method, and electronic device manufacturing method |
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