WO2009125649A1 - Appareil et procédé de fixation de feuille - Google Patents

Appareil et procédé de fixation de feuille Download PDF

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Publication number
WO2009125649A1
WO2009125649A1 PCT/JP2009/055011 JP2009055011W WO2009125649A1 WO 2009125649 A1 WO2009125649 A1 WO 2009125649A1 JP 2009055011 W JP2009055011 W JP 2009055011W WO 2009125649 A1 WO2009125649 A1 WO 2009125649A1
Authority
WO
WIPO (PCT)
Prior art keywords
adherend
adhesive sheet
sheet
double
sticking
Prior art date
Application number
PCT/JP2009/055011
Other languages
English (en)
Japanese (ja)
Inventor
野中英明
小林賢治
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to CN2009801128495A priority Critical patent/CN101990708A/zh
Priority to KR1020107022887A priority patent/KR101497639B1/ko
Publication of WO2009125649A1 publication Critical patent/WO2009125649A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a sheet sticking apparatus and a sticking method, and more particularly, sticking a sheet to an adherend having a plurality of adherend surfaces, and cutting the sheet according to the size of each adherend surface.
  • the present invention relates to a sheet sticking device and a sticking method.
  • an adhesive sheet made of a double-sided adhesive sheet or the like is applied to the mating surface, and a semiconductor wafer has a protective sheet or a back surface on its front side.
  • An adhesive sheet such as a die bonding sheet is attached to the side.
  • An apparatus and a method for applying such an adhesive sheet are disclosed in Patent Document 1, for example.
  • the sheet sticking device disclosed in this document is configured to stick adhesive sheets to a plurality of semiconductor wafers substantially simultaneously and cut the adhesive sheets according to the size of each semiconductor wafer.
  • Patent Document 1 has a disadvantage that the configuration of the support means becomes complicated due to a plurality of tables that support a plurality of semiconductor wafers to be adhered. There is an inconvenience that the number of steps of conveying the adherend increases according to the number of adherends supported by the means.
  • the present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to be able to affix an adhesive sheet to a plurality of adherend surfaces substantially simultaneously, and to support the adherend. It is in providing the sheet sticking apparatus and the sticking method which do not make the structure of this.
  • the present invention provides a sheet sticking apparatus for sticking an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend having an adherend surface at a plurality of locations.
  • a cutting means for cutting the adhered adhesive sheet according to the size of each adherent surface, and a recovery means for collecting an unnecessary adhesive sheet generated outside each adherent surface by the cutting are adopted. Yes.
  • the present invention provides a sheet sticking apparatus for sticking a double-sided adhesive sheet to an adherend having an adherend surface at a plurality of locations.
  • Support means for supporting the adherend, supply means for supplying a double-sided adhesive sheet with a release sheet temporarily attached to one surface to a position facing each of the adherend surfaces, and the double-sided adhesive sheet for each adherent surface
  • a sticking means for sticking to the surface; a cutting means for cutting the double-sided adhesive sheet attached to each of the adherend surfaces according to the size of each of the adherend surfaces; and an unnecessary adhesive sheet generated on the outside of the adherend surface by the cutting Recovery means, and the supply means, the sticking means, and the recovery means are also provided with a function of removing the release sheet temporarily attached to the double-sided adhesive sheet attached to each adherend surface.
  • a configuration can also be adopted.
  • the present invention provides a sheet sticking method for sticking an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend having an adherend surface at a plurality of locations.
  • a supporting step of supporting the adherend a supplying step of supplying an adhesive sheet to a position facing each of the adherend surfaces, an attaching step of attaching the adhesive sheet to each adherend surface, and each of the adherend surfaces
  • the present invention provides a sheet attaching method for attaching a double-sided adhesive sheet to an adherend having an adherend surface at a plurality of locations.
  • a supporting step for supporting the adherend a supplying step for supplying a double-sided adhesive sheet having a release sheet temporarily attached to one surface to a position facing each of the adherend surfaces, and the double-sided adhesive sheet for each surface to be adhered
  • a sticking step for sticking to the surface a cutting step for cutting the double-sided adhesive sheet affixed to each of the adherend surfaces in accordance with the size of each adherent surface, and an unnecessary adhesive sheet generated on the outside of the adherend surface by the cutting
  • a removal step of removing the release sheet temporarily attached to the double-sided adhesive sheet attached to each adherent surface by repeating the same steps as the supply step, the sticking step and the collecting step.
  • the method of including can be taken.
  • the adherend surface of the adhesive sheet in the adherend is present at a plurality of locations, by attaching the adhesive sheet to these adherend surfaces and cutting to the size of each adherent surface, An adhesive sheet can be affixed only to a necessary part of the adherend. Further, even if the adherend surface is dispersed at a plurality of locations, the adherend itself is a single member, and thus a plurality of conventional tables are not required. Further, if the supply means, the sticking means, and the collecting means are also provided with a function of removing the release sheet, the double-sided adhesive sheet is temporarily attached to the adherend surface after being stuck to the adherend surface. The necessity of providing a dedicated device for removing the release sheet can be eliminated, and the supply means, the sticking means, and the collecting means can be effectively used.
  • the schematic front view of the sheet sticking apparatus which concerns on this embodiment.
  • the schematic perspective view of the said sheet sticking apparatus The fragmentary sectional view of a table and a robot.
  • the schematic perspective view which shows the state which peels a 2nd peeling sheet from each to-be-adhered surface.
  • FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment
  • FIG. 2 shows a schematic perspective view thereof.
  • a sheet sticking apparatus 10 includes a table 13 (support means) for supporting a plate-like adherend W having adherend surfaces WS dispersed in a plurality of locations within a substantially same plane, and each adherend surface WS.
  • a supply unit 11 for supplying the double-sided adhesive sheet A to a position facing the substrate
  • a sticking unit 12 for applying a pressing force and sticking the double-sided adhesive sheet A to each adherend surface WS
  • an articulated robot 15 cutting means that cuts the double-sided adhesive sheet A in accordance with the size of each adherent surface WS, and for each adherent surface WS
  • a collecting means 19 for collecting the unnecessary adhesive sheet S1 generated outside.
  • the adherend W is arranged in a first plate-like body W1 having a substantially square shape in plan view, and in four recesses 101 in the plane of the first plate-like body W1. And a second plate-like body W2 having a substantially square shape in plan view.
  • the adherend surface WS in the present embodiment is positioned higher than the upper surface position of the first plate-like body W1, and the adherend W is bonded to a plate-like body (not shown) via the double-sided adhesive sheet A.
  • it is used as a component such as a multilayer glass.
  • the table 13 includes an outer table 51 having a substantially square shape in plan view, and an inner table 52 having a substantially rectangular shape in plan view disposed inside the outer table 51.
  • the outer table 51 can receive the inner table 52 provided so as to be movable up and down via the lifting mechanism 52A, and is provided so as to be lifted and lowered relative to the base plate BP via the lifting mechanism 51A.
  • the inner table 52 can be moved up and down so that the height position of the adherend surface WS is adjusted to a predetermined position with the upper surface of the outer table 51 as a reference position, while the outer table 51 is pressed against the pressing surface of the pressing roller 14.
  • the inner table 51 can incorporate a heating unit (not shown) in preparation for the case where the double-sided adhesive sheet A is heat-sensitive adhesive.
  • the supply unit 11 includes a support roller 20 that supports a raw fabric R on which a pressure-sensitive adhesive double-sided adhesive sheet A is temporarily attached between a first release sheet RL1 and a second release sheet RL2, and an original fabric R Between the peel plate 22 that peels off the first release sheet RL1 from the original fabric R, the winding roller 23 that winds up the first release sheet RL1, and the support roller 20 and the winding roller 23.
  • a plurality of guide rollers 25 to 32 arranged, and a tension measuring roller 40 arranged between the guide rollers 27 and 28 and supported by the load cell 39 are provided.
  • the peel plate 22, the guide rollers 27, 28, and 29 and the tension measuring roller 40 are integrally supported as a sticking angle maintaining means 37, and the second release sheet RL2 is temporarily attached by the synchronous movement with the sticking unit 12.
  • the double-sided adhesive sheet A can be attached to the adherend W.
  • the affixing unit 12 includes a pressing roller 14 that is supported by a portal frame 57 and that can be moved up and down by a cylinder 59.
  • the supply unit 11 and the pasting unit 12 are the same as those disclosed in Japanese Patent Application No. 2005-198806 filed by the present applicant, and detailed description thereof is omitted here.
  • the robot 15 includes a robot body 62 and a cutter blade 63 supported on the free end side of the robot body 62.
  • the robot body 62 includes a base portion 64, first arm 65A to sixth arm 65F disposed on the upper surface side of the base 64 portion and provided to be rotatable in the directions of arrows A to F, and the tip of the sixth arm 65F. And a tool holding chuck 69 attached to the side.
  • the second, third, and fifth arms 65B, 65C, and 65E are rotatably provided in the directions of arrows B, C, and E, respectively, in the Y ⁇ Z plane in FIG.
  • the sixth arms 65A, 65D, and 65F are rotatably provided in the directions of arrows A, D, and F, respectively, around their axes.
  • the double-sided adhesive sheet A temporarily attached with the second release sheet RL2 can be cut according to the size of each adherend surface WS.
  • the second release sheet RL2 and the double-sided adhesive sheet A generated on the outside of the adherend surface WS by this cutting are referred to as an unnecessary adhesive sheet S1.
  • the collection means 19 is supported on the free end side of the rotating arm 91 by a peeling roller section 18 composed of rollers 80 and 81 supported by a moving frame F, a driving roller 90 that rotates by driving of a motor M, and a spring 92. And a collection roller 93 that is in pressure contact with the outer peripheral surface of the drive roller 90.
  • the moving frame F includes a front frame F1 and a rear frame F2 connected via a connecting member 83.
  • the moving frame F is supported by the single-axis robot 85 and the guide rail 61 and can move in the X-axis direction. As a result, the single-axis robot 85 and the motor M are driven synchronously to move the moving frame F to the left in FIG. 1, and the separation roller unit 18 separates and collects the unnecessary adhesive sheet S1 from the adherend W.
  • the roller 93 is wound up and collected.
  • the robot 15 supports the suction arm 100 (see FIG. 2) with the tool holding chuck 69 and transfers the adherend W onto the inner table 52. Thereafter, the robot 15 is moved from the suction arm 100 to the cutter blade 63 and supported by the tool holding chuck 69 to prepare for cutting.
  • the double-sided adhesive sheet A on which the second release sheet RL2 is temporarily attached is supplied from the original fabric R supported by the support roller 20 to a position facing each adherend surface WS of the adherend W. Is done. This supply has already been performed by the collection process in the series of sheet pasting operations performed previously (see the collection process described later).
  • the double-sided adhesive sheet A affixed to each adherend surface WS of the adherend W is cut by the robot 15 according to the size of the adherend surface W together with the second release sheet RL2.
  • the second release sheet RL2 is left temporarily attached to the double-sided adhesive sheet A on the adherend surface WS.
  • the remaining second release sheet RL2 can be removed again by performing the same operations as in the (supplying step), (sticking step), and (collecting step). That is, (supplying step) The double-sided adhesive sheet A newly attached with the second release sheet RL2 is supplied to a position facing the adherend surface WS. (Pasting step) The double-sided adhesive sheet A is stuck to the adherend surface WS by the synchronous drive of the sticking angle maintaining means 37 and the sticking unit 12. (Recovery Step) The recovery means 19 moves to the left side in FIG.
  • the newly drawn double-sided adhesive sheet A is peeled off from the adherend W and recovered by the recovery roller 93.
  • the second release sheet RL2 left on the adherend surface WS is affixed to the double-sided adhesive sheet A and removed from the adherend surface WS.
  • the sticking angle maintaining means 37, the sticking unit 12 and the collecting means 19 are driven synchronously and returned to the position shown in FIG. 1, a new double-sided adhesive sheet A is pulled out by a predetermined length.
  • the adherend W in which only the double-sided adhesive sheet A is stuck on the adherend surface WS is transported to a subsequent process by the robot 15 that supports the suction arm 100 and is subjected to predetermined processing. . Thereafter, the same operation is repeated.
  • the single adherend W has a plurality of adherend surfaces WS, it can be integrally transferred or conveyed, and at the same time, the double-sided adhesive sheet A can be affixed. Further, even if there are a plurality of surfaces to which the double-sided adhesive sheet A is to be attached, the adherend W is a single plate-like body, and therefore can be quickly transferred or conveyed.
  • the table for supporting the can also be configured easily.
  • the adhesive sheet S may be configured using the second release sheet RL2 as the base sheet and the double-sided adhesive sheet A as the adhesive layer, and the removing step may be omitted.
  • a raw material not having the first release sheet RL1 can be used.
  • the guide rollers 30, 31 and the winding roller 23 are not necessary.
  • planar shape of the adherend surface is not limited to the illustrated configuration example, and may be a circle, an ellipse, a polygon, or a combination thereof.
  • the sheet sticking apparatus 10 of the present invention can be employed as a sheet sticking apparatus for sticking a protective sheet to a circuit surface of a semiconductor wafer, or a mounting apparatus for integrating a semiconductor wafer and a ring frame via an adhesive sheet. .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

L'invention concerne un appareil (10) de fixation de feuille muni d’une table (13), qui porte un corps (W) de fixation doté de surfaces (WS) de fixation au niveau d’une pluralité de sections ; d’un moyen (11) d’alimentation qui fournit une feuille adhésive (A) à double face, sur laquelle une deuxième feuille (RL2) décollable est fixée temporairement à des positions en regard des surfaces (WS) de fixation ; d’une unité (12) de fixation qui fixe la feuille adhésive (A) à double face à chacune des surfaces (WS) de fixation ; d’un robot (15) qui découpe la feuille adhésive (A) à double face fixée à chacune des surfaces (WS) de fixation en fonction de la taille de chaque surface (WS) de fixation ; et d’un moyen (19) de récupération qui récupère une feuille adhésive (S1) excédentaire de fixation générée à l’extérieur de chaque surface (WS) de fixation lorsque la feuille à double face est découpée. Le moyen (11) d’alimentation, l’unité (12) de fixation et le moyen (19) de récupération ont également pour fonction d’éliminer une deuxième feuille (RL2) décollable laissée sur chacune des surfaces (WS) de fixation.
PCT/JP2009/055011 2008-04-08 2009-03-16 Appareil et procédé de fixation de feuille WO2009125649A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801128495A CN101990708A (zh) 2008-04-08 2009-03-16 薄片粘贴装置及粘贴方法
KR1020107022887A KR101497639B1 (ko) 2008-04-08 2009-03-16 시트 첩부 장치 및 첩부 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008100347A JP5113599B2 (ja) 2008-04-08 2008-04-08 シート貼付装置及び貼付方法
JP2008-100347 2008-04-08

Publications (1)

Publication Number Publication Date
WO2009125649A1 true WO2009125649A1 (fr) 2009-10-15

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PCT/JP2009/055011 WO2009125649A1 (fr) 2008-04-08 2009-03-16 Appareil et procédé de fixation de feuille

Country Status (4)

Country Link
JP (1) JP5113599B2 (fr)
KR (1) KR101497639B1 (fr)
CN (1) CN101990708A (fr)
WO (1) WO2009125649A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014072229A (ja) * 2012-09-27 2014-04-21 Lintec Corp シート貼付装置およびシート貼付方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074657A (ja) * 2010-09-30 2012-04-12 Disco Abrasive Syst Ltd 粘着シート貼着用補助治具
JP2014030066A (ja) * 2013-11-14 2014-02-13 Lintec Corp シート貼付装置および貼付方法
JP2017130575A (ja) * 2016-01-21 2017-07-27 株式会社ディスコ 治具及び治具を用いた加工方法
JP6678516B2 (ja) * 2016-05-31 2020-04-08 リンテック株式会社 シート貼付装置および貼付方法
JP6779579B2 (ja) * 2017-01-31 2020-11-04 株式会社ディスコ 判定方法、測定装置、及び粘着テープ貼着装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019239A (ja) * 2005-07-07 2007-01-25 Lintec Corp シート貼付装置及び貼付方法
WO2007018041A1 (fr) * 2005-08-11 2007-02-15 Lintec Corporation Dispositif d'application de feuille et procede d'application
JP2008147249A (ja) * 2006-12-06 2008-06-26 Nitto Denko Corp 基板貼合せ方法およびこれを用いた装置
JP2008172159A (ja) * 2007-01-15 2008-07-24 Nitto Denko Corp 粘着テープ貼付け方法およびこれを用いた粘着テープ貼付け装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919938B2 (ja) * 1990-09-26 1999-07-19 日東電工株式会社 薄板に貼着した粘着テープのカット方法
JP4311522B2 (ja) * 2002-03-07 2009-08-12 日東電工株式会社 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019239A (ja) * 2005-07-07 2007-01-25 Lintec Corp シート貼付装置及び貼付方法
WO2007018041A1 (fr) * 2005-08-11 2007-02-15 Lintec Corporation Dispositif d'application de feuille et procede d'application
JP2008147249A (ja) * 2006-12-06 2008-06-26 Nitto Denko Corp 基板貼合せ方法およびこれを用いた装置
JP2008172159A (ja) * 2007-01-15 2008-07-24 Nitto Denko Corp 粘着テープ貼付け方法およびこれを用いた粘着テープ貼付け装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014072229A (ja) * 2012-09-27 2014-04-21 Lintec Corp シート貼付装置およびシート貼付方法

Also Published As

Publication number Publication date
KR20110008177A (ko) 2011-01-26
JP2009253083A (ja) 2009-10-29
KR101497639B1 (ko) 2015-03-02
CN101990708A (zh) 2011-03-23
JP5113599B2 (ja) 2013-01-09

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