WO2009041490A1 - 充填装置 - Google Patents

充填装置 Download PDF

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Publication number
WO2009041490A1
WO2009041490A1 PCT/JP2008/067287 JP2008067287W WO2009041490A1 WO 2009041490 A1 WO2009041490 A1 WO 2009041490A1 JP 2008067287 W JP2008067287 W JP 2008067287W WO 2009041490 A1 WO2009041490 A1 WO 2009041490A1
Authority
WO
WIPO (PCT)
Prior art keywords
charge
valve
passage
recovery
liquid
Prior art date
Application number
PCT/JP2008/067287
Other languages
English (en)
French (fr)
Inventor
Koji Nakagawa
Masaaki Muroi
Shinichi Torigoe
Fumihiro Nagaike
Ryohei Nakamura
Kenichi Higashi
Tsuyoshi Gouda
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Shibuya Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd., Shibuya Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Priority to CN2008801094719A priority Critical patent/CN101903284B/zh
Priority to KR1020107006309A priority patent/KR101523402B1/ko
Priority to US12/678,108 priority patent/US8409431B2/en
Publication of WO2009041490A1 publication Critical patent/WO2009041490A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D37/00—Processes of filtration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67C—CLEANING, FILLING WITH LIQUIDS OR SEMILIQUIDS, OR EMPTYING, OF BOTTLES, JARS, CANS, CASKS, BARRELS, OR SIMILAR CONTAINERS, NOT OTHERWISE PROVIDED FOR; FUNNELS
    • B67C3/00—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus; Filling casks or barrels with liquids or semiliquids
    • B67C3/02—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus
    • B67C3/22—Details
    • B67C3/28—Flow-control devices, e.g. using valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67C—CLEANING, FILLING WITH LIQUIDS OR SEMILIQUIDS, OR EMPTYING, OF BOTTLES, JARS, CANS, CASKS, BARRELS, OR SIMILAR CONTAINERS, NOT OTHERWISE PROVIDED FOR; FUNNELS
    • B67C3/00—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus; Filling casks or barrels with liquids or semiliquids
    • B67C3/02—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus
    • B67C3/22—Details
    • B67C3/28—Flow-control devices, e.g. using valves
    • B67C3/286—Flow-control devices, e.g. using valves related to flow rate control, i.e. controlling slow and fast filling phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Abstract

　レジスト液を濾過するフィルタ１４の前後の圧力変動を小さくする。 　レジスト液が貯留された充填液タンク２と、供給ポンプ１０によってこの充填液タンク２から送り出されたレジスト液を充填ノズル８に送る充填液通路４と、充填液通路４の途中の分岐部１８から分岐して充填液タンク２に連通された回収通路１６と、充填液通路４の分岐部１８よりも下流側（充填液通路４の下流部４Ｂ）に設けられた充填バルブ１２と、回収通路１６に設けられた回収バルブ２０と、前記ポンプ１０と分岐部１８との間に設けられたフィルタ１４と、充填バルブ１２および回収バルブ２０をそれぞれ駆動するサーボモータと、サーボモータを制御して充填バルブ１２と回収バルブ２０の開度を調整する制御装置２４とを備えており、フィルタ１４の上流側と下流側の圧力が変動しないように回収バルブ２０の開度を制御する。
PCT/JP2008/067287 2007-09-28 2008-09-25 充填装置 WO2009041490A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801094719A CN101903284B (zh) 2007-09-28 2008-09-25 填充装置
KR1020107006309A KR101523402B1 (ko) 2007-09-28 2008-09-25 충전 장치
US12/678,108 US8409431B2 (en) 2007-09-28 2008-09-25 Charging apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-254315 2007-09-28
JP2007254315A JP5034836B2 (ja) 2007-09-28 2007-09-28 充填装置

Publications (1)

Publication Number Publication Date
WO2009041490A1 true WO2009041490A1 (ja) 2009-04-02

Family

ID=40511373

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067287 WO2009041490A1 (ja) 2007-09-28 2008-09-25 充填装置

Country Status (6)

Country Link
US (1) US8409431B2 (ja)
JP (1) JP5034836B2 (ja)
KR (1) KR101523402B1 (ja)
CN (1) CN101903284B (ja)
TW (1) TWI452005B (ja)
WO (1) WO2009041490A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5136216B2 (ja) * 2008-05-29 2013-02-06 Ｊｓｒ株式会社 調製装置
JP5365139B2 (ja) * 2008-10-30 2013-12-11 Ｊｓｒ株式会社 樹脂組成物溶液の製造方法、及び製造装置
JP5428800B2 (ja) * 2009-11-25 2014-02-26 Ｊｓｒ株式会社 リソグラフィ組成物の充填装置、及びリソグラフィ組成物の充填方法
CA2907734C (en) * 2013-03-22 2019-05-14 Pepsico, Inc. Container filling system and valve for same
WO2016148326A1 (ko) * 2015-03-19 2016-09-22 디에스플랜트(주) 압력센서를 구비한 고속 유체 회전 충진시스템
JP6942497B2 (ja) * 2016-09-08 2021-09-29 東京エレクトロン株式会社 処理液供給装置
CN111232268A (zh) * 2020-03-06 2020-06-05 河北科技大学 液体药罐灌装控制方法及液体药罐灌装系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05346186A (ja) * 1992-06-12 1993-12-27 Toshiba Corp 低脈動式開閉バルブ装置
JPH06135471A (ja) * 1992-10-29 1994-05-17 Nippon Sheet Glass Co Ltd 流体搬送装置
JPH0857224A (ja) * 1994-08-17 1996-03-05 Toho Kasei Kk 処理液循環システム
JPH0994421A (ja) * 1995-10-03 1997-04-08 Nkk Corp 集塵システムの運転方法
JP2001108789A (ja) * 1999-10-08 2001-04-20 Ngk Insulators Ltd 放射性排水のろ過方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1235631B (it) * 1989-07-04 1992-09-12 Effedi Di Favaro Orfeo E Crosa Dispositivo elettroidraulico per comandare l'innesto della frizione in autoveicoli e simili.
KR0141059B1 (ko) * 1993-09-20 1998-06-01 코사이 아키오 액체공급시스템 액체공급방법
JPH10172881A (ja) 1996-12-06 1998-06-26 Sony Corp フォトレジスト塗布装置
JP2002062667A (ja) 2000-08-23 2002-02-28 Sumitomo Chem Co Ltd 微粒子量の低減されたフォトレジスト組成物の製造方法
JP3952872B2 (ja) * 2001-10-10 2007-08-01 株式会社デンソー 流動状物質の充填装置および充填方法
TW200706824A (en) * 2005-08-11 2007-02-16 Zheng-Tong Chen Treatment system for cooling and circulating water
DE102006024011A1 (de) * 2006-05-23 2007-11-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Einstellung und Ansteuerung eines hydrodynamischen Retarders eines Kraftfahrzeuges

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05346186A (ja) * 1992-06-12 1993-12-27 Toshiba Corp 低脈動式開閉バルブ装置
JPH06135471A (ja) * 1992-10-29 1994-05-17 Nippon Sheet Glass Co Ltd 流体搬送装置
JPH0857224A (ja) * 1994-08-17 1996-03-05 Toho Kasei Kk 処理液循環システム
JPH0994421A (ja) * 1995-10-03 1997-04-08 Nkk Corp 集塵システムの運転方法
JP2001108789A (ja) * 1999-10-08 2001-04-20 Ngk Insulators Ltd 放射性排水のろ過方法

Also Published As

Publication number Publication date
KR20100063085A (ko) 2010-06-10
JP5034836B2 (ja) 2012-09-26
KR101523402B1 (ko) 2015-05-27
CN101903284A (zh) 2010-12-01
CN101903284B (zh) 2012-09-19
TWI452005B (zh) 2014-09-11
JP2009083882A (ja) 2009-04-23
US20100236998A1 (en) 2010-09-23
TW200936486A (en) 2009-09-01
US8409431B2 (en) 2013-04-02

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