WO2009028485A1 - 有機電子デバイス、有機電子デバイスの製造方法、有機電子デバイスの製造装置、基板処理システム、保護膜の構造体、および制御プログラムが記憶された記憶媒体 - Google Patents
有機電子デバイス、有機電子デバイスの製造方法、有機電子デバイスの製造装置、基板処理システム、保護膜の構造体、および制御プログラムが記憶された記憶媒体 Download PDFInfo
- Publication number
- WO2009028485A1 WO2009028485A1 PCT/JP2008/065166 JP2008065166W WO2009028485A1 WO 2009028485 A1 WO2009028485 A1 WO 2009028485A1 JP 2008065166 W JP2008065166 W JP 2008065166W WO 2009028485 A1 WO2009028485 A1 WO 2009028485A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic device
- organic electronic
- organic
- device manufacturing
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009530120A JP5410978B2 (ja) | 2007-08-31 | 2008-08-26 | 有機電子デバイスの製造方法および制御プログラムが記憶された記憶媒体 |
| CN2008801050744A CN101796885B (zh) | 2007-08-31 | 2008-08-26 | 有机电子设备、有机电子设备的制造方法、有机电子设备的制造装置、基板处理系统、保护膜的构造体以及存储有制造程序的存储介质 |
| KR1020107002908A KR101319947B1 (ko) | 2007-08-31 | 2008-08-26 | 유기 전자 디바이스, 유기 전자 디바이스의 제조 방법, 유기 전자 디바이스의 제조 장치, 기판 처리 시스템, 보호막의 구조체 및, 제어 프로그램이 기억된 기억 매체 |
| DE112008002319T DE112008002319T5 (de) | 2007-08-31 | 2008-08-26 | Bauteil, Herstellungsverfahren für ein organisches elektronisches Bauteil, Herstellungsvorrichtung für ein organisches elektronisches Bauteil, Substratverarbeitungssystem, Schutzfilmstruktur und Speichermedium mit darauf gespeichertem Steuerprogramm |
| US12/675,351 US20100243999A1 (en) | 2007-08-31 | 2008-08-26 | Organic electronic device, organic electronic device manufacturing method, organic electronic device manufacturing apparatus, substrate processing system, protection film structure and storage medium with control program stored therein |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-225144 | 2007-08-31 | ||
| JP2007225144 | 2007-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009028485A1 true WO2009028485A1 (ja) | 2009-03-05 |
Family
ID=40387205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/065166 Ceased WO2009028485A1 (ja) | 2007-08-31 | 2008-08-26 | 有機電子デバイス、有機電子デバイスの製造方法、有機電子デバイスの製造装置、基板処理システム、保護膜の構造体、および制御プログラムが記憶された記憶媒体 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100243999A1 (ja) |
| JP (1) | JP5410978B2 (ja) |
| KR (1) | KR101319947B1 (ja) |
| CN (1) | CN101796885B (ja) |
| DE (1) | DE112008002319T5 (ja) |
| TW (1) | TW200930135A (ja) |
| WO (1) | WO2009028485A1 (ja) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010219112A (ja) * | 2009-03-13 | 2010-09-30 | Tokyo Electron Ltd | アモルファスハイドロカーボンナイトライド(a−CN:Hx)膜の成膜方法、有機ELデバイスおよびその製造方法 |
| WO2011162151A1 (ja) * | 2010-06-23 | 2011-12-29 | 東京エレクトロン株式会社 | 封止膜形成方法、封止膜形成装置、有機発光素子 |
| JP2012204520A (ja) * | 2011-03-24 | 2012-10-22 | Tokyo Electron Ltd | 表面処理方法及び成膜方法 |
| JP2012204519A (ja) * | 2011-03-24 | 2012-10-22 | Tokyo Electron Ltd | 表面処理方法及び成膜方法 |
| JP2013062150A (ja) * | 2011-09-13 | 2013-04-04 | Nitto Denko Corp | 有機エレクトロルミネッセンスデバイス、および、有機エレクトロルミネッセンスデバイスの製造方法 |
| WO2013137116A1 (ja) * | 2012-03-15 | 2013-09-19 | 東京エレクトロン株式会社 | 有機電子デバイス、有機電子デバイスの製造方法、プラズマ処理装置 |
| WO2014017194A1 (ja) * | 2012-07-25 | 2014-01-30 | 東京エレクトロン株式会社 | ベーク処理システム |
| WO2014030558A1 (ja) * | 2012-08-23 | 2014-02-27 | 東京エレクトロン株式会社 | シリコン窒化膜の成膜方法、有機電子デバイスの製造方法及びシリコン窒化膜の成膜装置 |
| KR20140088243A (ko) * | 2012-12-28 | 2014-07-09 | 재단법인 포항산업과학연구원 | 고밀착력 박막을 포함하는 사출금형 및 그 제조방법 |
| JP2015206076A (ja) * | 2014-04-21 | 2015-11-19 | 東京エレクトロン株式会社 | 封止膜の形成方法及び封止膜製造装置 |
| JP2016523442A (ja) * | 2013-06-29 | 2016-08-08 | アイクストロン、エスイー | 高性能コーティングの堆積方法及びカプセル化電子デバイス |
| WO2016199739A1 (ja) * | 2015-06-12 | 2016-12-15 | シャープ株式会社 | El表示装置及びel表示装置の製造方法 |
| CN109473564A (zh) * | 2017-09-08 | 2019-03-15 | 株式会社日本有机雷特显示器 | 有机el显示面板、有机el显示装置及其制造方法 |
| CN109863616A (zh) * | 2017-01-09 | 2019-06-07 | 应用材料公司 | 用于具有所期望的轮廓控制的oled应用的封装膜堆叠 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010103082A (ja) * | 2008-09-26 | 2010-05-06 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子及びその製造方法 |
| JP5495940B2 (ja) * | 2010-05-21 | 2014-05-21 | 三菱重工業株式会社 | 半導体素子の窒化珪素膜、窒化珪素膜の製造方法及び装置 |
| WO2012029709A1 (ja) * | 2010-08-31 | 2012-03-08 | 株式会社島津製作所 | 非晶質窒化珪素膜およびその製造方法 |
| JP5781393B2 (ja) * | 2011-08-05 | 2015-09-24 | 株式会社アルバック | 成膜方法 |
| KR102120896B1 (ko) * | 2013-07-25 | 2020-06-10 | 삼성디스플레이 주식회사 | 대향 타겟 스퍼터링 장치를 이용한 유기발광표시장치 및 그 제조방법 |
| KR102107109B1 (ko) * | 2013-10-17 | 2020-05-29 | 삼성디스플레이 주식회사 | 유기 발광 장치 및 이의 제조 방법 |
| KR102631878B1 (ko) * | 2016-06-28 | 2024-01-30 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| JP6787813B2 (ja) | 2017-02-16 | 2020-11-18 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置およびプログラム |
| US10748759B2 (en) * | 2019-01-15 | 2020-08-18 | Applied Materials, Inc. | Methods for improved silicon nitride passivation films |
| JP7529777B2 (ja) | 2019-12-19 | 2024-08-06 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | カプセル化されて個別化された構成要素およびカプセル化されて個別化された構成要素を製造する方法 |
Citations (14)
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| JP2000133440A (ja) * | 1998-10-23 | 2000-05-12 | Nec Corp | Dlc保護膜と該保護膜を用いた有機el素子及びそれらの製造方法 |
| JP2002329720A (ja) * | 2001-04-27 | 2002-11-15 | Samco International Inc | デバイス用保護膜及びその作製方法 |
| JP2003217845A (ja) * | 2002-01-25 | 2003-07-31 | Semiconductor Energy Lab Co Ltd | 発光装置の作製方法 |
| JP2003282237A (ja) * | 2002-03-22 | 2003-10-03 | Toyota Central Res & Dev Lab Inc | 有機電界発光素子及びその製造装置及び電子デバイス |
| JP2005512299A (ja) * | 2001-12-13 | 2005-04-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ディスプレイ装置のための密封構造 |
| JP2005209356A (ja) * | 2004-01-20 | 2005-08-04 | Toppan Printing Co Ltd | 有機el素子及びカラーフィルター |
| JP2005222733A (ja) * | 2004-02-03 | 2005-08-18 | Shimadzu Corp | 有機エレクトロルミネッセンス素子およびその製造方法 |
| JP2005222732A (ja) * | 2004-02-03 | 2005-08-18 | Shimadzu Corp | 有機エレクトロルミネッセンス素子およびその製造方法 |
| JP2005353426A (ja) * | 2004-06-11 | 2005-12-22 | Dainippon Printing Co Ltd | フィルタ基板、及びこれを用いたカラーディスプレイ |
| US20050287686A1 (en) * | 2004-06-25 | 2005-12-29 | Won Tae K | Method to improve water-barrier performance by changing film surface morphology |
| JP2006351806A (ja) * | 2005-06-15 | 2006-12-28 | Tokyo Electron Ltd | 基板の処理方法,コンピュータ読み取り可能な記録媒体及び基板処理装置 |
| JP2007220646A (ja) * | 2006-01-19 | 2007-08-30 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子 |
| WO2007145075A1 (ja) * | 2006-06-16 | 2007-12-21 | Toray Engineering Co., Ltd. | シリコン系薄膜及びシリコン系薄膜の形成方法 |
| JP2008153004A (ja) * | 2006-12-15 | 2008-07-03 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子 |
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| KR100906926B1 (ko) * | 2001-05-16 | 2009-07-10 | 세키스이가가쿠 고교가부시키가이샤 | 경화성 수지 조성물, 표시 소자용 시일제 및 표시 소자용주입구 밀봉제 |
| JP2003282242A (ja) | 2002-03-25 | 2003-10-03 | Toyota Central Res & Dev Lab Inc | 有機電界発光素子及び有機電子デバイス |
| US20060079100A1 (en) * | 2004-03-15 | 2006-04-13 | Sharp Laboratories Of America, Inc. | High density plasma grown silicon nitride |
| US20050241669A1 (en) * | 2004-04-29 | 2005-11-03 | Tokyo Electron Limited | Method and system of dry cleaning a processing chamber |
| WO2006007313A2 (en) * | 2004-06-25 | 2006-01-19 | Applied Materials, Inc. | Improving water-barrier performance of an encapsulating film |
| US7696683B2 (en) * | 2006-01-19 | 2010-04-13 | Toppan Printing Co., Ltd. | Organic electroluminescent element and the manufacturing method |
-
2008
- 2008-08-20 TW TW097131754A patent/TW200930135A/zh unknown
- 2008-08-26 CN CN2008801050744A patent/CN101796885B/zh not_active Expired - Fee Related
- 2008-08-26 US US12/675,351 patent/US20100243999A1/en not_active Abandoned
- 2008-08-26 KR KR1020107002908A patent/KR101319947B1/ko not_active Expired - Fee Related
- 2008-08-26 WO PCT/JP2008/065166 patent/WO2009028485A1/ja not_active Ceased
- 2008-08-26 DE DE112008002319T patent/DE112008002319T5/de not_active Withdrawn
- 2008-08-26 JP JP2009530120A patent/JP5410978B2/ja not_active Expired - Fee Related
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| JP2000133440A (ja) * | 1998-10-23 | 2000-05-12 | Nec Corp | Dlc保護膜と該保護膜を用いた有機el素子及びそれらの製造方法 |
| JP2002329720A (ja) * | 2001-04-27 | 2002-11-15 | Samco International Inc | デバイス用保護膜及びその作製方法 |
| JP2005512299A (ja) * | 2001-12-13 | 2005-04-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ディスプレイ装置のための密封構造 |
| JP2003217845A (ja) * | 2002-01-25 | 2003-07-31 | Semiconductor Energy Lab Co Ltd | 発光装置の作製方法 |
| JP2003282237A (ja) * | 2002-03-22 | 2003-10-03 | Toyota Central Res & Dev Lab Inc | 有機電界発光素子及びその製造装置及び電子デバイス |
| JP2005209356A (ja) * | 2004-01-20 | 2005-08-04 | Toppan Printing Co Ltd | 有機el素子及びカラーフィルター |
| JP2005222733A (ja) * | 2004-02-03 | 2005-08-18 | Shimadzu Corp | 有機エレクトロルミネッセンス素子およびその製造方法 |
| JP2005222732A (ja) * | 2004-02-03 | 2005-08-18 | Shimadzu Corp | 有機エレクトロルミネッセンス素子およびその製造方法 |
| JP2005353426A (ja) * | 2004-06-11 | 2005-12-22 | Dainippon Printing Co Ltd | フィルタ基板、及びこれを用いたカラーディスプレイ |
| US20050287686A1 (en) * | 2004-06-25 | 2005-12-29 | Won Tae K | Method to improve water-barrier performance by changing film surface morphology |
| JP2006351806A (ja) * | 2005-06-15 | 2006-12-28 | Tokyo Electron Ltd | 基板の処理方法,コンピュータ読み取り可能な記録媒体及び基板処理装置 |
| JP2007220646A (ja) * | 2006-01-19 | 2007-08-30 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子 |
| WO2007145075A1 (ja) * | 2006-06-16 | 2007-12-21 | Toray Engineering Co., Ltd. | シリコン系薄膜及びシリコン系薄膜の形成方法 |
| JP2008153004A (ja) * | 2006-12-15 | 2008-07-03 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子 |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102348777A (zh) * | 2009-03-13 | 2012-02-08 | 东京毅力科创株式会社 | 非晶碳氢氮化物(a-CN:Hx)膜的成膜方法、有机EL器件及其制造方法 |
| JP2010219112A (ja) * | 2009-03-13 | 2010-09-30 | Tokyo Electron Ltd | アモルファスハイドロカーボンナイトライド(a−CN:Hx)膜の成膜方法、有機ELデバイスおよびその製造方法 |
| US8674397B2 (en) | 2010-06-23 | 2014-03-18 | Tokyo Electron Limited | Sealing film forming method, sealing film forming device, and light-emitting device |
| WO2011162151A1 (ja) * | 2010-06-23 | 2011-12-29 | 東京エレクトロン株式会社 | 封止膜形成方法、封止膜形成装置、有機発光素子 |
| JP5211265B2 (ja) * | 2010-06-23 | 2013-06-12 | 東京エレクトロン株式会社 | 封止膜形成方法、封止膜形成装置 |
| JP2012204520A (ja) * | 2011-03-24 | 2012-10-22 | Tokyo Electron Ltd | 表面処理方法及び成膜方法 |
| JP2012204519A (ja) * | 2011-03-24 | 2012-10-22 | Tokyo Electron Ltd | 表面処理方法及び成膜方法 |
| JP2013062150A (ja) * | 2011-09-13 | 2013-04-04 | Nitto Denko Corp | 有機エレクトロルミネッセンスデバイス、および、有機エレクトロルミネッセンスデバイスの製造方法 |
| WO2013137116A1 (ja) * | 2012-03-15 | 2013-09-19 | 東京エレクトロン株式会社 | 有機電子デバイス、有機電子デバイスの製造方法、プラズマ処理装置 |
| WO2014017194A1 (ja) * | 2012-07-25 | 2014-01-30 | 東京エレクトロン株式会社 | ベーク処理システム |
| WO2014030558A1 (ja) * | 2012-08-23 | 2014-02-27 | 東京エレクトロン株式会社 | シリコン窒化膜の成膜方法、有機電子デバイスの製造方法及びシリコン窒化膜の成膜装置 |
| JP2014060378A (ja) * | 2012-08-23 | 2014-04-03 | Tokyo Electron Ltd | シリコン窒化膜の成膜方法、有機電子デバイスの製造方法及びシリコン窒化膜の成膜装置 |
| KR20140088243A (ko) * | 2012-12-28 | 2014-07-09 | 재단법인 포항산업과학연구원 | 고밀착력 박막을 포함하는 사출금형 및 그 제조방법 |
| JP2016523442A (ja) * | 2013-06-29 | 2016-08-08 | アイクストロン、エスイー | 高性能コーティングの堆積方法及びカプセル化電子デバイス |
| JP2015206076A (ja) * | 2014-04-21 | 2015-11-19 | 東京エレクトロン株式会社 | 封止膜の形成方法及び封止膜製造装置 |
| WO2016199739A1 (ja) * | 2015-06-12 | 2016-12-15 | シャープ株式会社 | El表示装置及びel表示装置の製造方法 |
| CN109863616A (zh) * | 2017-01-09 | 2019-06-07 | 应用材料公司 | 用于具有所期望的轮廓控制的oled应用的封装膜堆叠 |
| CN109863616B (zh) * | 2017-01-09 | 2022-07-12 | 应用材料公司 | 用于具有所期望的轮廓控制的oled应用的封装膜堆叠 |
| CN109473564A (zh) * | 2017-09-08 | 2019-03-15 | 株式会社日本有机雷特显示器 | 有机el显示面板、有机el显示装置及其制造方法 |
| JP2019050113A (ja) * | 2017-09-08 | 2019-03-28 | 株式会社Joled | 有機el表示パネル、有機el表示装置、およびその製造方法 |
| CN109473564B (zh) * | 2017-09-08 | 2021-05-04 | 株式会社日本有机雷特显示器 | 有机el显示面板、有机el显示装置及其制造方法 |
| US10998526B2 (en) | 2017-09-08 | 2021-05-04 | Joled Inc. | Organic EL display panel including a multilayer sealing layer, organic EL display device, and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112008002319T5 (de) | 2010-08-12 |
| KR20100038438A (ko) | 2010-04-14 |
| CN101796885B (zh) | 2013-11-06 |
| KR101319947B1 (ko) | 2013-10-18 |
| TW200930135A (en) | 2009-07-01 |
| JPWO2009028485A1 (ja) | 2010-12-02 |
| CN101796885A (zh) | 2010-08-04 |
| US20100243999A1 (en) | 2010-09-30 |
| JP5410978B2 (ja) | 2014-02-05 |
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