WO2009001732A1 - 半導体ウエハ研削方法とそれに用いる樹脂組成物及び保護シート - Google Patents
半導体ウエハ研削方法とそれに用いる樹脂組成物及び保護シート Download PDFInfo
- Publication number
- WO2009001732A1 WO2009001732A1 PCT/JP2008/061163 JP2008061163W WO2009001732A1 WO 2009001732 A1 WO2009001732 A1 WO 2009001732A1 JP 2008061163 W JP2008061163 W JP 2008061163W WO 2009001732 A1 WO2009001732 A1 WO 2009001732A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor wafer
- wafer
- backside
- grinding
- resin composition
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 8
- 238000000034 method Methods 0.000 title abstract 4
- 230000001681 protective effect Effects 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009520520A JP5517615B2 (ja) | 2007-06-22 | 2008-06-18 | 半導体ウエハ研削方法とそれに用いる樹脂組成物及び保護シート |
CN2008800196560A CN101681823B (zh) | 2007-06-22 | 2008-06-18 | 半导体晶片磨削方法和在其中使用的树脂组合物以及保护片 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007164934 | 2007-06-22 | ||
JP2007-164951 | 2007-06-22 | ||
JP2007-164934 | 2007-06-22 | ||
JP2007164951 | 2007-06-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009001732A1 true WO2009001732A1 (ja) | 2008-12-31 |
Family
ID=40185551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061163 WO2009001732A1 (ja) | 2007-06-22 | 2008-06-18 | 半導体ウエハ研削方法とそれに用いる樹脂組成物及び保護シート |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5517615B2 (ja) |
KR (1) | KR20100032361A (ja) |
CN (1) | CN101681823B (ja) |
TW (1) | TWI469204B (ja) |
WO (1) | WO2009001732A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010267653A (ja) * | 2009-05-12 | 2010-11-25 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2010278235A (ja) * | 2009-05-28 | 2010-12-09 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2011046153A (ja) * | 2009-08-28 | 2011-03-10 | Disco Abrasive Syst Ltd | 加工方法 |
CN102213917A (zh) * | 2010-04-08 | 2011-10-12 | 东友精细化工有限公司 | 黑色感光性树脂组合物、用其制得的黑色矩阵及具有该黑色矩阵的彩色滤光片 |
JP2015133481A (ja) * | 2013-12-12 | 2015-07-23 | 株式会社半導体エネルギー研究所 | 剥離方法及び剥離装置 |
JP2016115800A (ja) * | 2014-12-15 | 2016-06-23 | 株式会社ディスコ | ウエーハの加工方法 |
JP2018190855A (ja) * | 2017-05-09 | 2018-11-29 | 株式会社ディスコ | ウェーハの加工方法 |
JPWO2018135492A1 (ja) * | 2017-01-23 | 2019-12-19 | 東京エレクトロン株式会社 | 半導体基板の処理方法及び半導体基板の処理装置 |
TWI708333B (zh) * | 2018-06-21 | 2020-10-21 | 矽創電子股份有限公司 | 凸塊結構 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013067673A (ja) * | 2011-09-20 | 2013-04-18 | Hitachi Chemical Co Ltd | 樹脂ペースト組成物及び半導体装置 |
JP2013084770A (ja) * | 2011-10-11 | 2013-05-09 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
CN103065957B (zh) * | 2012-12-27 | 2016-04-20 | 日月光半导体制造股份有限公司 | 半导体基板切割的装置及半导体晶圆切割的制造方法 |
JP2015233077A (ja) * | 2014-06-10 | 2015-12-24 | 株式会社ディスコ | ウエーハの加工方法 |
JP2016001677A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社ディスコ | ウエーハの加工方法 |
JP2016174102A (ja) | 2015-03-17 | 2016-09-29 | 株式会社東芝 | 半導体製造方法および積層体 |
CN106088146B (zh) * | 2016-07-22 | 2018-12-18 | 中国建筑第八工程局有限公司 | 一种临时地连墙拆除施工方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270387A (ja) * | 1997-03-26 | 1998-10-09 | Sharp Corp | 半導体装置の製造方法 |
JP2000234079A (ja) * | 1999-02-15 | 2000-08-29 | Nitta Ind Corp | 半導体ウエハ加工用シート |
JP2002343747A (ja) * | 2001-05-17 | 2002-11-29 | Lintec Corp | ダイシングシート及びダイシング方法 |
JP2003113355A (ja) * | 2001-10-03 | 2003-04-18 | Bridgestone Corp | 光硬化型仮固定用シート |
JP2003201451A (ja) * | 2002-01-09 | 2003-07-18 | Sumitomo Bakelite Co Ltd | 半導体加工用粘着シート |
JP2004043762A (ja) * | 2001-08-27 | 2004-02-12 | Hitachi Chem Co Ltd | 接着シート並びに半導体装置及びその製造方法 |
JP2004331743A (ja) * | 2003-05-02 | 2004-11-25 | Lintec Corp | 粘着シートおよびその使用方法 |
JP2006245348A (ja) * | 2005-03-03 | 2006-09-14 | Sharp Corp | 半導体装置の製造方法 |
JP2007046018A (ja) * | 2005-08-12 | 2007-02-22 | Denki Kagaku Kogyo Kk | 粘着剤、それを用いた粘着シート、及び粘着シートを用いた電子部品製造方法。 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315304A (ja) * | 1992-05-12 | 1993-11-26 | Sony Corp | ウエハの裏面研削方法 |
JPH07106285A (ja) * | 1993-10-08 | 1995-04-21 | Oki Electric Ind Co Ltd | 半導体製造方法 |
JP3097619B2 (ja) * | 1997-10-02 | 2000-10-10 | 日本電気株式会社 | 電界放射冷陰極の製造方法 |
US20020127821A1 (en) * | 2000-12-28 | 2002-09-12 | Kazuyuki Ohya | Process for the production of thinned wafer |
US20020160597A1 (en) * | 2001-04-30 | 2002-10-31 | Wen-Kun Yang | Wafer level package and the process of the same |
JP4427308B2 (ja) * | 2003-12-10 | 2010-03-03 | 株式会社ディスコ | 半導体ウェーハの分割方法 |
JP4993662B2 (ja) * | 2005-05-12 | 2012-08-08 | 日東電工株式会社 | ダイシング用粘着シート、及びそれを用いたダイシング方法 |
JP2007031494A (ja) * | 2005-07-22 | 2007-02-08 | Furukawa Electric Co Ltd:The | ウエハ貼着用粘着シート |
JP2007100064A (ja) * | 2005-09-07 | 2007-04-19 | Furukawa Electric Co Ltd:The | ダイシング用粘着テープ |
-
2008
- 2008-06-18 JP JP2009520520A patent/JP5517615B2/ja active Active
- 2008-06-18 WO PCT/JP2008/061163 patent/WO2009001732A1/ja active Application Filing
- 2008-06-18 CN CN2008800196560A patent/CN101681823B/zh active Active
- 2008-06-18 KR KR1020097024208A patent/KR20100032361A/ko active Search and Examination
- 2008-06-20 TW TW97123071A patent/TWI469204B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270387A (ja) * | 1997-03-26 | 1998-10-09 | Sharp Corp | 半導体装置の製造方法 |
JP2000234079A (ja) * | 1999-02-15 | 2000-08-29 | Nitta Ind Corp | 半導体ウエハ加工用シート |
JP2002343747A (ja) * | 2001-05-17 | 2002-11-29 | Lintec Corp | ダイシングシート及びダイシング方法 |
JP2004043762A (ja) * | 2001-08-27 | 2004-02-12 | Hitachi Chem Co Ltd | 接着シート並びに半導体装置及びその製造方法 |
JP2003113355A (ja) * | 2001-10-03 | 2003-04-18 | Bridgestone Corp | 光硬化型仮固定用シート |
JP2003201451A (ja) * | 2002-01-09 | 2003-07-18 | Sumitomo Bakelite Co Ltd | 半導体加工用粘着シート |
JP2004331743A (ja) * | 2003-05-02 | 2004-11-25 | Lintec Corp | 粘着シートおよびその使用方法 |
JP2006245348A (ja) * | 2005-03-03 | 2006-09-14 | Sharp Corp | 半導体装置の製造方法 |
JP2007046018A (ja) * | 2005-08-12 | 2007-02-22 | Denki Kagaku Kogyo Kk | 粘着剤、それを用いた粘着シート、及び粘着シートを用いた電子部品製造方法。 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010267653A (ja) * | 2009-05-12 | 2010-11-25 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2010278235A (ja) * | 2009-05-28 | 2010-12-09 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2011046153A (ja) * | 2009-08-28 | 2011-03-10 | Disco Abrasive Syst Ltd | 加工方法 |
CN102213917A (zh) * | 2010-04-08 | 2011-10-12 | 东友精细化工有限公司 | 黑色感光性树脂组合物、用其制得的黑色矩阵及具有该黑色矩阵的彩色滤光片 |
CN102213917B (zh) * | 2010-04-08 | 2013-03-27 | 东友精细化工有限公司 | 黑色感光性树脂组合物、用其制得的黑色矩阵及具有该黑色矩阵的彩色滤光片 |
JP2015133481A (ja) * | 2013-12-12 | 2015-07-23 | 株式会社半導体エネルギー研究所 | 剥離方法及び剥離装置 |
JP2016115800A (ja) * | 2014-12-15 | 2016-06-23 | 株式会社ディスコ | ウエーハの加工方法 |
JPWO2018135492A1 (ja) * | 2017-01-23 | 2019-12-19 | 東京エレクトロン株式会社 | 半導体基板の処理方法及び半導体基板の処理装置 |
JP2018190855A (ja) * | 2017-05-09 | 2018-11-29 | 株式会社ディスコ | ウェーハの加工方法 |
TWI708333B (zh) * | 2018-06-21 | 2020-10-21 | 矽創電子股份有限公司 | 凸塊結構 |
Also Published As
Publication number | Publication date |
---|---|
KR20100032361A (ko) | 2010-03-25 |
JP5517615B2 (ja) | 2014-06-11 |
CN101681823A (zh) | 2010-03-24 |
TWI469204B (zh) | 2015-01-11 |
CN101681823B (zh) | 2012-05-23 |
TW200917353A (en) | 2009-04-16 |
JPWO2009001732A1 (ja) | 2010-08-26 |
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