WO2008146793A1 - 電気装置、接続方法及び接着フィルム - Google Patents
電気装置、接続方法及び接着フィルム Download PDFInfo
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- WO2008146793A1 WO2008146793A1 PCT/JP2008/059666 JP2008059666W WO2008146793A1 WO 2008146793 A1 WO2008146793 A1 WO 2008146793A1 JP 2008059666 W JP2008059666 W JP 2008059666W WO 2008146793 A1 WO2008146793 A1 WO 2008146793A1
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- curing
- curing region
- electric device
- region
- adhesive film
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/325—Material
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/01—Chemical elements
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800173145A CN101681855B (zh) | 2007-05-24 | 2008-05-26 | 电气装置、连接方法及粘接膜 |
KR1020097000461A KR101203017B1 (ko) | 2007-05-24 | 2008-05-26 | 전기 장치, 접속 방법 및 접착 필름 |
HK10105445.8A HK1139506A1 (en) | 2007-05-24 | 2010-06-02 | Electric device, connecting method and adhesive film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-137921 | 2007-05-24 | ||
JP2007137921 | 2007-05-24 |
Publications (1)
Publication Number | Publication Date |
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WO2008146793A1 true WO2008146793A1 (ja) | 2008-12-04 |
Family
ID=40032036
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059667 WO2008143358A1 (ja) | 2007-05-24 | 2008-05-26 | 電気装置、接続方法及び接着フィルム |
PCT/JP2008/059666 WO2008146793A1 (ja) | 2007-05-24 | 2008-05-26 | 電気装置、接続方法及び接着フィルム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059667 WO2008143358A1 (ja) | 2007-05-24 | 2008-05-26 | 電気装置、接続方法及び接着フィルム |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP5013114B2 (zh) |
KR (1) | KR101203017B1 (zh) |
CN (1) | CN101681855B (zh) |
HK (1) | HK1139506A1 (zh) |
TW (2) | TWI422294B (zh) |
WO (2) | WO2008143358A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015133221A1 (ja) * | 2014-03-07 | 2015-09-11 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5608504B2 (ja) * | 2010-10-06 | 2014-10-15 | デクセリアルズ株式会社 | 接続方法及び接続構造体 |
KR101712043B1 (ko) * | 2010-10-14 | 2017-03-03 | 삼성전자주식회사 | 적층 반도체 패키지, 상기 적층 반도체 패키지를 포함하는 반도체 장치 및 상기 적층 반도체 패키지의 제조 방법 |
WO2013038468A1 (ja) * | 2011-09-12 | 2013-03-21 | 株式会社メイコー | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |
JP5926590B2 (ja) * | 2012-03-23 | 2016-05-25 | デクセリアルズ株式会社 | 接続体の製造方法、及び電子部品の接続方法 |
US9740067B2 (en) * | 2012-09-03 | 2017-08-22 | Sharp Kabushiki Kaisha | Display device and method for producing same |
JP6307308B2 (ja) * | 2014-03-06 | 2018-04-04 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
JP2016001574A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社デンソー | ラミネート外装電池 |
JP6759578B2 (ja) | 2014-12-22 | 2020-09-23 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
CN109790425B (zh) * | 2016-10-03 | 2022-03-04 | 昭和电工材料株式会社 | 导电性膜、卷绕体、连接结构体和连接结构体的制造方法 |
TWI763750B (zh) * | 2016-12-01 | 2022-05-11 | 日商迪睿合股份有限公司 | 異向性導電膜 |
CN109964371B (zh) * | 2016-12-01 | 2021-03-12 | 迪睿合株式会社 | 各向异性导电膜 |
KR102066934B1 (ko) * | 2018-07-11 | 2020-01-16 | 주식회사 비에이치 | Pen fpcb를 이용한 접합 방법 및 이를 이용해 제조된 대면적 pen fpcb 조립체 |
TWI724911B (zh) * | 2020-05-26 | 2021-04-11 | 友達光電股份有限公司 | 發光裝置及其製造方法 |
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JPH06260533A (ja) * | 1993-03-08 | 1994-09-16 | Sony Chem Corp | Icチップ実装方法 |
JPH09330950A (ja) * | 1996-06-13 | 1997-12-22 | Nec Corp | 半導体装置及びその製造方法 |
JPH11354582A (ja) * | 1998-04-07 | 1999-12-24 | Shinko Electric Ind Co Ltd | 半導体チップの実装構造 |
JP2004071857A (ja) * | 2002-08-07 | 2004-03-04 | Sharp Corp | 基板接続部の構造、並びに該構造を有する電子部品及び液晶表示装置 |
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JP3225800B2 (ja) * | 1995-08-09 | 2001-11-05 | 三菱電機株式会社 | 半導体装置 |
JP3506003B2 (ja) * | 1998-05-19 | 2004-03-15 | ソニーケミカル株式会社 | 異方性導電接着材 |
MY124944A (en) * | 2000-02-09 | 2006-07-31 | Hitachi Chemical Co Ltd | Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards |
JP2003086633A (ja) * | 2001-09-13 | 2003-03-20 | Canon Inc | 配線基板及びこれを備えた表示装置 |
JP5076292B2 (ja) * | 2005-08-08 | 2012-11-21 | パナソニック株式会社 | 異方導電膜貼付装置及び方法 |
KR100780956B1 (ko) | 2006-08-17 | 2007-12-03 | 삼성전자주식회사 | 이종 언더필 반도체 패키지 및 그의 제조 방법 |
-
2008
- 2008-05-26 WO PCT/JP2008/059667 patent/WO2008143358A1/ja active Application Filing
- 2008-05-26 TW TW097119331A patent/TWI422294B/zh not_active IP Right Cessation
- 2008-05-26 WO PCT/JP2008/059666 patent/WO2008146793A1/ja active Application Filing
- 2008-05-26 JP JP2008136368A patent/JP5013114B2/ja active Active
- 2008-05-26 JP JP2008136369A patent/JP5152499B2/ja not_active Expired - Fee Related
- 2008-05-26 KR KR1020097000461A patent/KR101203017B1/ko not_active IP Right Cessation
- 2008-05-26 CN CN2008800173145A patent/CN101681855B/zh not_active Expired - Fee Related
- 2008-05-26 TW TW097119330A patent/TWI387412B/zh not_active IP Right Cessation
-
2010
- 2010-06-02 HK HK10105445.8A patent/HK1139506A1/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06260533A (ja) * | 1993-03-08 | 1994-09-16 | Sony Chem Corp | Icチップ実装方法 |
JPH09330950A (ja) * | 1996-06-13 | 1997-12-22 | Nec Corp | 半導体装置及びその製造方法 |
JPH11354582A (ja) * | 1998-04-07 | 1999-12-24 | Shinko Electric Ind Co Ltd | 半導体チップの実装構造 |
JP2004071857A (ja) * | 2002-08-07 | 2004-03-04 | Sharp Corp | 基板接続部の構造、並びに該構造を有する電子部品及び液晶表示装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015133221A1 (ja) * | 2014-03-07 | 2015-09-11 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2015170529A (ja) * | 2014-03-07 | 2015-09-28 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI422294B (zh) | 2014-01-01 |
KR20090085017A (ko) | 2009-08-06 |
TWI387412B (zh) | 2013-02-21 |
KR101203017B1 (ko) | 2012-11-20 |
HK1139506A1 (en) | 2010-09-17 |
JP5152499B2 (ja) | 2013-02-27 |
WO2008143358A1 (ja) | 2008-11-27 |
JP5013114B2 (ja) | 2012-08-29 |
JP2009004768A (ja) | 2009-01-08 |
JP2009004767A (ja) | 2009-01-08 |
CN101681855B (zh) | 2013-03-13 |
TW200847866A (en) | 2008-12-01 |
CN101681855A (zh) | 2010-03-24 |
TW200850094A (en) | 2008-12-16 |
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