WO2008126601A1 - プローブカード - Google Patents

プローブカード Download PDF

Info

Publication number
WO2008126601A1
WO2008126601A1 PCT/JP2008/054498 JP2008054498W WO2008126601A1 WO 2008126601 A1 WO2008126601 A1 WO 2008126601A1 JP 2008054498 W JP2008054498 W JP 2008054498W WO 2008126601 A1 WO2008126601 A1 WO 2008126601A1
Authority
WO
WIPO (PCT)
Prior art keywords
space transformer
probe head
probe card
retainer
presses
Prior art date
Application number
PCT/JP2008/054498
Other languages
English (en)
French (fr)
Inventor
Yoshio Yamada
Hiroshi Nakayama
Mitsuhiro Nagaya
Tsuyoshi Inuma
Takashi Akao
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to US12/450,145 priority Critical patent/US8456184B2/en
Priority to EP08721914.3A priority patent/EP2128630A4/en
Priority to JP2009509003A priority patent/JP5426365B2/ja
Priority to TW097108991A priority patent/TWI383154B/zh
Publication of WO2008126601A1 publication Critical patent/WO2008126601A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

　所定の基準面に対する平面度、平行度を精度よく保つことができるプローブカードを提供する。プローブヘッド１５の表面であって複数のプローブが突出する表面の縁端部近傍を全周にわたって基板の方向へ押さえ付けるリーフスプリング１７からプローブヘッド１５に加わる力の作用点Ｑをプローブヘッド１５の外縁よりも内側に位置させるとともに、スペーストランスフォーマ１４の縁端部近傍を全周にわたって基板の方向へ押さえ付けるリテーナ１６からスペーストランスフォーマ１４に加わる力の作用点Ｐをスペーストランスフォーマ１４の外縁よりも内側に位置させる。
PCT/JP2008/054498 2007-03-14 2008-03-12 プローブカード WO2008126601A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/450,145 US8456184B2 (en) 2007-03-14 2008-03-12 Probe card for a semiconductor wafer
EP08721914.3A EP2128630A4 (en) 2007-03-14 2008-03-12 PROBE CARD
JP2009509003A JP5426365B2 (ja) 2007-03-14 2008-03-12 プローブカード
TW097108991A TWI383154B (zh) 2007-03-14 2008-03-14 探針卡

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-065651 2007-03-14
JP2007065651 2007-03-14

Publications (1)

Publication Number Publication Date
WO2008126601A1 true WO2008126601A1 (ja) 2008-10-23

Family

ID=39863733

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054498 WO2008126601A1 (ja) 2007-03-14 2008-03-12 プローブカード

Country Status (5)

Country Link
US (1) US8456184B2 (ja)
EP (1) EP2128630A4 (ja)
JP (1) JP5426365B2 (ja)
TW (1) TWI383154B (ja)
WO (1) WO2008126601A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069439A1 (ja) * 2007-11-30 2009-06-04 Tokyo Electron Limited プローブカード
WO2010096707A2 (en) * 2009-02-19 2010-08-26 Touchdown Technologies, Inc. Microelectronic contactor assembly, structures thereof, and methods of constructing same
JP2020153962A (ja) * 2019-03-18 2020-09-24 中華精測科技股▲ふん▼有限公司Ｃｈｕｎｇｈｗａ Ｐｒｅｃｉｓｉｏｎ Ｔｅｓｔ Ｔｅｃｈ．Ｃｏ．，Ｌｔｄ プローブカード

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8018242B2 (en) * 2005-12-05 2011-09-13 Nhk Spring Co., Ltd. Probe card
DE102010033991A1 (de) * 2010-03-11 2011-12-01 Rhode & Schwarz Gmbh & Co. Kg Messspitze mit integriertem Messwandler
TWI435083B (zh) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
TWI454708B (zh) * 2010-08-31 2014-10-01 Can be adapted to different specifications of the test machine probe card structure
JP5805421B2 (ja) * 2011-04-04 2015-11-04 住友重機械工業株式会社 蓄冷器式冷凍機及び仕切り部材
WO2013006771A2 (en) * 2011-07-06 2013-01-10 Celadon Systems, Inc. Test systems with a probe apparatus and index mechanism
CN103827682B (zh) * 2011-07-06 2015-07-15 塞莱敦体系股份有限公司 具有一探针卡的测试设备及连接器机构
US9194887B2 (en) * 2012-11-15 2015-11-24 Advantest America, Inc. Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
JP6011103B2 (ja) * 2012-07-23 2016-10-19 山一電機株式会社 コンタクトプローブ及びそれを備えた半導体素子用ソケット
CN104885578B (zh) * 2013-02-26 2018-05-04 大自达电线股份有限公司 柔性印制线路板用补强部分、柔性印制线路板及屏蔽印制线路板
DE102013008324A1 (de) * 2013-05-08 2014-11-13 Feinmetall Gmbh Elektrische Kontaktiervorrichtung
WO2021182193A1 (ja) 2020-03-11 2021-09-16 日本発條株式会社 プローブカード
TWI788149B (zh) * 2021-12-20 2022-12-21 漢民測試系統股份有限公司 探針卡

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005164601A (ja) 2000-03-17 2005-06-23 Formfactor Inc 半導体接触器を平坦化するための方法と装置
JP2006023271A (ja) * 2004-07-05 2006-01-26 Yulim Hitech Inc 半導体検査用プローブカード
WO2006114885A1 (ja) * 2005-04-18 2006-11-02 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP2006300733A (ja) * 2005-04-20 2006-11-02 Yamaichi Electronics Co Ltd 半導体基板用検査装置の組立方法
WO2006126279A1 (ja) * 2005-05-23 2006-11-30 Kabushiki Kaisha Nihon Micronics プローブ組立体、その製造方法および電気的接続装置
JP2007003334A (ja) * 2005-06-23 2007-01-11 Micronics Japan Co Ltd プローブ組立体およびこれを用いた電気的接続装置
JP2007057438A (ja) * 2005-08-25 2007-03-08 Tokyo Electron Ltd プローブカード
WO2007066622A1 (ja) * 2005-12-05 2007-06-14 Nhk Spring Co., Ltd. プローブカード

Family Cites Families (21)

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JPH0338833Y2 (ja) * 1985-12-04 1991-08-15
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6292003B1 (en) * 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
JP2000241485A (ja) * 1999-02-24 2000-09-08 Jsr Corp 回路基板の電気抵抗測定装置および方法
US6509751B1 (en) * 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
JP2003322665A (ja) * 2002-05-01 2003-11-14 Jsr Corp 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法
TWI236723B (en) * 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device
WO2006017078A2 (en) * 2004-07-07 2006-02-16 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
EP1742073A1 (en) * 2004-04-27 2007-01-10 Kabushiki Kaisha Nihon Micronics Electric connecting device
JP2006010629A (ja) * 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード
US8058889B2 (en) * 2004-12-02 2011-11-15 Sv Probe Pte. Ltd. Probe card with segmented substrate
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
WO2007015314A1 (ja) * 2005-08-02 2007-02-08 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP4823667B2 (ja) * 2005-12-05 2011-11-24 日本発條株式会社 プローブカード
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
JP4842640B2 (ja) * 2005-12-28 2011-12-21 日本発條株式会社 プローブカードおよび検査方法
KR101025895B1 (ko) * 2006-06-08 2011-03-30 니혼 하츠쵸 가부시키가이샤 프로브 카드
JP5101060B2 (ja) * 2006-07-31 2012-12-19 日本発條株式会社 プローブカードの平行度調整機構
WO2009011365A1 (ja) * 2007-07-19 2009-01-22 Nhk Spring Co., Ltd. プローブカード

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005164601A (ja) 2000-03-17 2005-06-23 Formfactor Inc 半導体接触器を平坦化するための方法と装置
JP2006023271A (ja) * 2004-07-05 2006-01-26 Yulim Hitech Inc 半導体検査用プローブカード
WO2006114885A1 (ja) * 2005-04-18 2006-11-02 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP2006300733A (ja) * 2005-04-20 2006-11-02 Yamaichi Electronics Co Ltd 半導体基板用検査装置の組立方法
WO2006126279A1 (ja) * 2005-05-23 2006-11-30 Kabushiki Kaisha Nihon Micronics プローブ組立体、その製造方法および電気的接続装置
JP2007003334A (ja) * 2005-06-23 2007-01-11 Micronics Japan Co Ltd プローブ組立体およびこれを用いた電気的接続装置
JP2007057438A (ja) * 2005-08-25 2007-03-08 Tokyo Electron Ltd プローブカード
WO2007066622A1 (ja) * 2005-12-05 2007-06-14 Nhk Spring Co., Ltd. プローブカード

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2128630A4 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069439A1 (ja) * 2007-11-30 2009-06-04 Tokyo Electron Limited プローブカード
JP2009133724A (ja) * 2007-11-30 2009-06-18 Tokyo Electron Ltd プローブカード
WO2010096707A2 (en) * 2009-02-19 2010-08-26 Touchdown Technologies, Inc. Microelectronic contactor assembly, structures thereof, and methods of constructing same
WO2010096707A3 (en) * 2009-02-19 2010-11-18 Touchdown Technologies, Inc. Microelectronic contactor assembly, structures thereof, and methods of constructing same
US8232818B2 (en) 2009-02-19 2012-07-31 Advantest America, Inc. Probe head for a microelectronic contactor assembly, the probe head having SMT electronic components thereon
US8305101B2 (en) 2009-02-19 2012-11-06 Advantest America, Inc Microelectronic contactor assembly, structures thereof, and methods of constructing same
US8901950B2 (en) 2009-02-19 2014-12-02 Advantest America, Inc Probe head for a microelectronic contactor assembly, and methods of making same
JP2020153962A (ja) * 2019-03-18 2020-09-24 中華精測科技股▲ふん▼有限公司Ｃｈｕｎｇｈｗａ Ｐｒｅｃｉｓｉｏｎ Ｔｅｓｔ Ｔｅｃｈ．Ｃｏ．，Ｌｔｄ プローブカード
JP7042241B2 (ja) 2019-03-18 2022-03-25 中華精測科技股▲ふん▼有限公司 プローブカード

Also Published As

Publication number Publication date
EP2128630A1 (en) 2009-12-02
EP2128630A4 (en) 2014-05-14
TW200848749A (en) 2008-12-16
US20100164518A1 (en) 2010-07-01
US8456184B2 (en) 2013-06-04
JP5426365B2 (ja) 2014-02-26
JPWO2008126601A1 (ja) 2010-07-22
TWI383154B (zh) 2013-01-21

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