WO2008123552A1 - 粘着体、粘着シートおよびその用途 - Google Patents

粘着体、粘着シートおよびその用途 Download PDF

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Publication number
WO2008123552A1
WO2008123552A1 PCT/JP2008/056602 JP2008056602W WO2008123552A1 WO 2008123552 A1 WO2008123552 A1 WO 2008123552A1 JP 2008056602 W JP2008056602 W JP 2008056602W WO 2008123552 A1 WO2008123552 A1 WO 2008123552A1
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WO
WIPO (PCT)
Prior art keywords
group
formula
adhesive material
integer
carbon atoms
Prior art date
Application number
PCT/JP2008/056602
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English (en)
French (fr)
Inventor
Teruhiko Yasuda
Hitoshi Shimoma
Hisashi Sato
Original Assignee
Asahi Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Company, Limited filed Critical Asahi Glass Company, Limited
Priority to EP08739712A priority Critical patent/EP2133399A4/en
Priority to JP2009509280A priority patent/JP5040995B2/ja
Priority to CN2008800102258A priority patent/CN101646742B/zh
Publication of WO2008123552A1 publication Critical patent/WO2008123552A1/ja
Priority to US12/571,480 priority patent/US20100015443A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2609—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aliphatic hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2642—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds characterised by the catalyst used
    • C08G65/2645—Metals or compounds thereof, e.g. salts
    • C08G65/2663—Metal cyanide catalysts, i.e. DMC's
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/333—Polymers modified by chemical after-treatment with organic compounds containing nitrogen
    • C08G65/33348—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing isocyanate group
    • C08G65/33351—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing isocyanate group acyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Abstract

　低粘度で塗工性が良く、無溶剤化が可能であり、かつ被着体への密着性が良好であるとともに再剥離性に優れ、剥離帯電量が抑制され、かつ高速剥離性にも優れる粘着体を提供する。 　下記一般式（１）で表されるシリル基含有重合体（Ｓ）を含む硬化性組成物を硬化させて得られる粘着体。 　式（１）中、Ｒ１は一分子中にｔ個の水酸基を有する化合物から全部の水酸基を除いたｔ価の残基を示し、Ｒ２は２価の有機基を示し、Ｒ３は炭素数１～２０の１価の有機基を示し、Ｘは水酸基又は加水分解性基を示し、Ｙは一般式（Ａ）で表される２価の基または一般式（Ｂ）で表される２価の基を示し、ａは１～３の整数を示し、ｒは１～１０００の整数を示し、ｔは１～８の整数を示す。式（Ａ）中、Ｒ４は炭素数２～８のアルキレン基を示す。式（Ｂ）中、Ｒ５は炭素数２～４のアルキレン基を示す。
PCT/JP2008/056602 2007-04-03 2008-04-02 粘着体、粘着シートおよびその用途 WO2008123552A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08739712A EP2133399A4 (en) 2007-04-03 2008-04-02 ADHESIVE MATERIAL, ADHESIVE AND USE OF THE ADHESIVE
JP2009509280A JP5040995B2 (ja) 2007-04-03 2008-04-02 粘着体、粘着シートおよびその用途
CN2008800102258A CN101646742B (zh) 2007-04-03 2008-04-02 粘附体、粘附片及其用途
US12/571,480 US20100015443A1 (en) 2007-04-03 2009-10-01 Adherence substance, pressure sensitive adhesive sheet and its use

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007097307 2007-04-03
JP2007-097307 2007-04-03
JP2007-277803 2007-10-25
JP2007277803 2007-10-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/571,480 Continuation US20100015443A1 (en) 2004-06-29 2009-10-01 Adherence substance, pressure sensitive adhesive sheet and its use

Publications (1)

Publication Number Publication Date
WO2008123552A1 true WO2008123552A1 (ja) 2008-10-16

Family

ID=39831025

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056602 WO2008123552A1 (ja) 2007-04-03 2008-04-02 粘着体、粘着シートおよびその用途

Country Status (7)

Country Link
US (1) US20100015443A1 (ja)
EP (1) EP2133399A4 (ja)
JP (2) JP5040995B2 (ja)
KR (1) KR101392023B1 (ja)
CN (1) CN101646742B (ja)
TW (1) TWI402323B (ja)
WO (1) WO2008123552A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010013653A1 (ja) * 2008-07-28 2010-02-04 旭硝子株式会社 粘着体、粘着シートおよびその用途
WO2010038715A1 (ja) * 2008-09-30 2010-04-08 コニシ株式会社 粘着テープ又はシートの製造方法
JP2010242070A (ja) * 2009-03-17 2010-10-28 Asahi Glass Co Ltd 硬化性組成物
WO2010126054A1 (ja) * 2009-04-30 2010-11-04 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置
JP2010275524A (ja) * 2009-04-30 2010-12-09 Nitto Denko Corp 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置
US20110171465A1 (en) * 2008-10-08 2011-07-14 Asahi Glass Company, Limited Adhesive laminate
CN102473056A (zh) * 2009-08-05 2012-05-23 旭硝子株式会社 触摸屏
JP2013130895A (ja) * 2013-04-03 2013-07-04 Mitsubishi Rayon Co Ltd 保護フィルム付き成形体
US8648162B2 (en) 2008-09-05 2014-02-11 Asahi Glass Company, Limited Adherence substance, pressure sensitive adhesive sheet and its use
JP5700040B2 (ja) * 2010-04-23 2015-04-15 旭硝子株式会社 粘着積層体および表面保護シート
WO2015079903A1 (ja) * 2013-11-26 2015-06-04 リンテック株式会社 表面保護用粘着シートおよび表面保護用粘着シートの使用方法
JP2015163995A (ja) * 2015-06-15 2015-09-10 三菱レイヨン株式会社 保護フィルム付き成形体

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ES2385549B1 (es) * 2011-01-14 2013-05-10 Ceys, S. A. Composición adhesiva/sellante y despegable.
JP5912833B2 (ja) * 2011-05-26 2016-04-27 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着剤層付光学フィルムおよび画像表示装置
WO2013069870A1 (ko) * 2011-11-07 2013-05-16 제일모직 주식회사 광경화형 점착제 조성물, 이를 포함하는 광학 점착제 필름, 이를 포함하는 디스플레이 장치 및 이를 이용한 모듈 조립 방법
KR101686302B1 (ko) 2013-11-15 2016-12-13 주식회사 엘지화학 도전성 적층체 보호 필름용 점착제 조성물
CN104103648B (zh) * 2014-07-24 2017-12-05 上海天马微电子有限公司 柔性显示设备、柔性显示母板及其制作方法
JP6499897B2 (ja) * 2015-03-31 2019-04-10 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着剤層付光学フィルムおよび画像表示装置
JP6676311B2 (ja) * 2015-08-26 2020-04-08 リンテック株式会社 保護フィルムおよび積層体
JP2016011830A (ja) * 2015-10-13 2016-01-21 シャープ株式会社 冷蔵庫
CN112694864B (zh) * 2020-12-24 2022-08-09 广州市白云化工实业有限公司 硅酮密封胶及其制备方法和光伏组件

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010013653A1 (ja) * 2008-07-28 2010-02-04 旭硝子株式会社 粘着体、粘着シートおよびその用途
US8648162B2 (en) 2008-09-05 2014-02-11 Asahi Glass Company, Limited Adherence substance, pressure sensitive adhesive sheet and its use
JPWO2010038715A1 (ja) * 2008-09-30 2012-03-01 コニシ株式会社 粘着テープ又はシートの製造方法
WO2010038715A1 (ja) * 2008-09-30 2010-04-08 コニシ株式会社 粘着テープ又はシートの製造方法
JP5284362B2 (ja) * 2008-09-30 2013-09-11 コニシ株式会社 粘着テープ又はシートの製造方法
US8197896B2 (en) 2008-09-30 2012-06-12 Konishi Co., Ltd. Method for producing a pressure-sensitive adhesive tape or sheet
US20110171465A1 (en) * 2008-10-08 2011-07-14 Asahi Glass Company, Limited Adhesive laminate
JP2010242070A (ja) * 2009-03-17 2010-10-28 Asahi Glass Co Ltd 硬化性組成物
CN103122227A (zh) * 2009-04-30 2013-05-29 日东电工株式会社 光学薄膜用粘合剂组合物、光学薄膜用粘合剂层、粘合型光学薄膜及图像显示装置
WO2010126054A1 (ja) * 2009-04-30 2010-11-04 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置
US20190031815A1 (en) * 2009-04-30 2019-01-31 Nitto Denko Corporation Pressure-sensitive adhesive composition for optical film, pressure-sensitive adhesive layer for optical film, pressure-sensitive adhesive optical film and image display
KR101612991B1 (ko) * 2009-04-30 2016-04-15 닛토덴코 가부시키가이샤 광학 필름용 점착제 조성물, 광학 필름용 점착제층, 점착형 광학 필름 및 화상 표시 장치
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US20100015443A1 (en) 2010-01-21
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EP2133399A1 (en) 2009-12-16
KR20100014701A (ko) 2010-02-10
JP5040995B2 (ja) 2012-10-03
TWI402323B (zh) 2013-07-21
KR101392023B1 (ko) 2014-05-07
EP2133399A4 (en) 2010-07-28
JP5522197B2 (ja) 2014-06-18
JP2012211323A (ja) 2012-11-01
TW200911949A (en) 2009-03-16

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