WO2008108097A1 - 液滴吐出装置および方法 - Google Patents

液滴吐出装置および方法 Download PDF

Info

Publication number
WO2008108097A1
WO2008108097A1 PCT/JP2008/000433 JP2008000433W WO2008108097A1 WO 2008108097 A1 WO2008108097 A1 WO 2008108097A1 JP 2008000433 W JP2008000433 W JP 2008000433W WO 2008108097 A1 WO2008108097 A1 WO 2008108097A1
Authority
WO
WIPO (PCT)
Prior art keywords
plunger
liquid
droplet discharging
leading end
discharging device
Prior art date
Application number
PCT/JP2008/000433
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering, Inc. filed Critical Musashi Engineering, Inc.
Priority to KR1020147015070A priority Critical patent/KR101521902B1/ko
Priority to KR1020157002787A priority patent/KR101600432B1/ko
Priority to KR1020097018853A priority patent/KR101499597B1/ko
Priority to CN2008800075621A priority patent/CN101646502B/zh
Priority to JP2009502468A priority patent/JP5271254B2/ja
Publication of WO2008108097A1 publication Critical patent/WO2008108097A1/ja
Priority to HK10107193.8A priority patent/HK1140720A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04586—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2002/041—Electromagnetic transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/05—Heads having a valve

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
PCT/JP2008/000433 2007-03-08 2008-03-04 液滴吐出装置および方法 WO2008108097A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020147015070A KR101521902B1 (ko) 2007-03-08 2008-03-04 액적 토출 장치 및 방법
KR1020157002787A KR101600432B1 (ko) 2007-03-08 2008-03-04 액적 토출 장치 및 방법
KR1020097018853A KR101499597B1 (ko) 2007-03-08 2008-03-04 액적 토출 장치 및 방법
CN2008800075621A CN101646502B (zh) 2007-03-08 2008-03-04 液滴排出装置及方法
JP2009502468A JP5271254B2 (ja) 2007-03-08 2008-03-04 液滴吐出装置および方法
HK10107193.8A HK1140720A1 (en) 2007-03-08 2010-07-27 Liquid droplet discharging device and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-057963 2007-03-08
JP2007057963 2007-03-08

Publications (1)

Publication Number Publication Date
WO2008108097A1 true WO2008108097A1 (ja) 2008-09-12

Family

ID=39737994

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000433 WO2008108097A1 (ja) 2007-03-08 2008-03-04 液滴吐出装置および方法

Country Status (6)

Country Link
JP (4) JP5271254B2 (zh)
KR (3) KR101499597B1 (zh)
CN (1) CN101646502B (zh)
HK (1) HK1140720A1 (zh)
TW (4) TWI590904B (zh)
WO (1) WO2008108097A1 (zh)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100294810A1 (en) * 2007-03-30 2010-11-25 Musashi Engineering, Inc. Liquid material discharge device and liquid material discharge method
WO2011001810A1 (ja) * 2009-07-01 2011-01-06 武蔵エンジニアリング株式会社 液体材料吐出方法、装置およびプログラム
JP2011224436A (ja) * 2010-04-16 2011-11-10 Alps Electric Co Ltd 吐出装置及び吐出方法
WO2013008799A1 (ja) 2011-07-11 2013-01-17 武蔵エンジニアリング株式会社 液滴吐出装置および方法
WO2013118669A1 (ja) 2012-02-06 2013-08-15 武蔵エンジニアリング株式会社 液体材料の吐出装置および吐出方法
JP2014030813A (ja) * 2012-08-06 2014-02-20 Fujitsu Ltd 塗布ノズル、塗布装置、及び塗布方法
KR20140074974A (ko) 2011-10-07 2014-06-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 토출 장치 및 토출 방법
WO2015039783A1 (de) * 2013-09-20 2015-03-26 Smart Pac Gmbh Technology Services Anordnung und verfahren zum reproduzierbaren aufbringen kleiner flüssigkeitsmengen
WO2018221432A1 (ja) * 2017-05-31 2018-12-06 武蔵エンジニアリング株式会社 液体材料塗布方法および当該方法を実施するための装置
IT201700067828A1 (it) * 2017-06-19 2018-12-19 Kromia S R L Macchina di smaltatura per supporti ceramici.
EP3104979B1 (en) * 2014-02-14 2020-07-22 Nordson Corporation Jetting dispenser, and a method for jetting droplets of fluid material
CN114405764A (zh) * 2022-02-23 2022-04-29 无锡冰平自动化技术有限公司 一种阀座型腔开合行程相同的注胶管体

Families Citing this family (16)

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KR101869089B1 (ko) * 2011-01-04 2018-06-19 주식회사 탑 엔지니어링 점성물질 젯팅 장치
JP6180283B2 (ja) * 2013-11-06 2017-08-16 武蔵エンジニアリング株式会社 液体材料吐出装置および方法
KR101512766B1 (ko) * 2013-11-14 2015-04-16 한형수 솔더 페이스트 토출 장치
JP6538649B2 (ja) * 2014-03-10 2019-07-03 武蔵エンジニアリング株式会社 塗布装置および塗布方法
JP5802347B1 (ja) * 2014-05-20 2015-10-28 エンジニアリングシステム株式会社 微量液体滴下方法および微量液体ディスペンサ
US10221060B2 (en) * 2014-05-20 2019-03-05 Engineering System Co., Ltd. Microvolume-liquid dispensing method and microvolume-liquid dispenser
JP6582238B2 (ja) * 2016-01-18 2019-10-02 パナソニックＩｐマネジメント株式会社 液体吐出装置
JP6842152B2 (ja) * 2016-05-31 2021-03-17 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
CN106076693A (zh) * 2016-07-15 2016-11-09 苏州锡友微连电子科技有限公司 一种锡膏喷射阀
JP6772725B2 (ja) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
WO2018189586A2 (zh) * 2017-04-14 2018-10-18 伊利诺斯工具制品有限公司 用于提供锡膏的组件及其方法
JP6892686B2 (ja) * 2017-12-27 2021-06-23 株式会社日本スペリア社 はんだ塗布装置用ノズル
AT522763B1 (de) * 2019-12-05 2021-01-15 Metallconcept Gmbh Druckkopf
KR102446597B1 (ko) * 2020-11-17 2022-09-23 주식회사 엠아이티 고정밀 솔더링 장치 및 이의 제어방법
JP7066229B2 (ja) * 2021-01-06 2022-05-13 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
TWI775477B (zh) * 2021-06-07 2022-08-21 萬潤科技股份有限公司 液室機構及液材擠出裝置

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8448818B2 (en) * 2007-03-30 2013-05-28 Musashi Engineering, Inc. Drop forming discharge device having collision member and method of using same
US20100294810A1 (en) * 2007-03-30 2010-11-25 Musashi Engineering, Inc. Liquid material discharge device and liquid material discharge method
US8807400B2 (en) 2007-03-30 2014-08-19 Musashi Engineering, Inc. Liquid droplet discharging device having advanced position specifying mechanism
WO2011001810A1 (ja) * 2009-07-01 2011-01-06 武蔵エンジニアリング株式会社 液体材料吐出方法、装置およびプログラム
JP2011011142A (ja) * 2009-07-01 2011-01-20 Musashi Eng Co Ltd 液体材料吐出方法、装置およびプログラム
JP2011224436A (ja) * 2010-04-16 2011-11-10 Alps Electric Co Ltd 吐出装置及び吐出方法
JP2013017945A (ja) * 2011-07-11 2013-01-31 Musashi Eng Co Ltd 液滴吐出装置および方法
EP2732883A4 (en) * 2011-07-11 2016-11-23 Musashi Engineering Inc DEVICE AND METHOD FOR EXPULSION OF DROPLETS
WO2013008799A1 (ja) 2011-07-11 2013-01-17 武蔵エンジニアリング株式会社 液滴吐出装置および方法
US9440781B2 (en) 2011-07-11 2016-09-13 Musashi Engineering, Inc. Droplet discharge device and method
US9919336B2 (en) 2011-10-07 2018-03-20 Musashi Engineering, Inc. Liquid material discharge apparatus and method
KR20140074974A (ko) 2011-10-07 2014-06-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 토출 장치 및 토출 방법
US9260234B2 (en) 2011-10-07 2016-02-16 Musashi Engineering, Inc. Liquid material discharge apparatus and method
JPWO2013118669A1 (ja) * 2012-02-06 2015-05-11 武蔵エンジニアリング株式会社 液体材料の吐出装置および吐出方法
US9889463B2 (en) 2012-02-06 2018-02-13 Musashi Engineering, Inc. Liquid material discharge device and discharge method
CN104245152A (zh) * 2012-02-06 2014-12-24 武藏工业株式会社 液体材料的吐出装置及吐出方法
KR20140127306A (ko) 2012-02-06 2014-11-03 무사시 엔지니어링 가부시키가이샤 액체 재료의 토출 장치 및 토출 방법
WO2013118669A1 (ja) 2012-02-06 2013-08-15 武蔵エンジニアリング株式会社 液体材料の吐出装置および吐出方法
JP2014030813A (ja) * 2012-08-06 2014-02-20 Fujitsu Ltd 塗布ノズル、塗布装置、及び塗布方法
JP2016533266A (ja) * 2013-09-20 2016-10-27 スマート パック ゲゼルシャフト ミット ベシュレンクテル ハフツンク − テクノロジー サーヴィシズ 少量の液体を再現可能に塗布するための構成および方法
WO2015039783A1 (de) * 2013-09-20 2015-03-26 Smart Pac Gmbh Technology Services Anordnung und verfahren zum reproduzierbaren aufbringen kleiner flüssigkeitsmengen
US9975195B2 (en) 2013-09-20 2018-05-22 Pac Tech-Packaging Technologies Gmbh Arrangement and method for the reproducible application of small amounts of liquid
EP3104979B1 (en) * 2014-02-14 2020-07-22 Nordson Corporation Jetting dispenser, and a method for jetting droplets of fluid material
WO2018221432A1 (ja) * 2017-05-31 2018-12-06 武蔵エンジニアリング株式会社 液体材料塗布方法および当該方法を実施するための装置
JPWO2018221432A1 (ja) * 2017-05-31 2020-04-16 武蔵エンジニアリング株式会社 液体材料塗布方法および当該方法を実施するための装置
JP7100373B2 (ja) 2017-05-31 2022-07-13 武蔵エンジニアリング株式会社 液体材料塗布方法および当該方法を実施するための装置
US11958072B2 (en) 2017-05-31 2024-04-16 Musashi Engineering, Inc. Liquid material application method and device for implementing said method
IT201700067828A1 (it) * 2017-06-19 2018-12-19 Kromia S R L Macchina di smaltatura per supporti ceramici.
CN114405764A (zh) * 2022-02-23 2022-04-29 无锡冰平自动化技术有限公司 一种阀座型腔开合行程相同的注胶管体

Also Published As

Publication number Publication date
TW201427788A (zh) 2014-07-16
CN101646502A (zh) 2010-02-10
CN101646502B (zh) 2013-02-20
KR101521902B1 (ko) 2015-05-20
JP2013208613A (ja) 2013-10-10
TW200918229A (en) 2009-05-01
JP2017006916A (ja) 2017-01-12
JP6312758B2 (ja) 2018-04-18
KR101499597B1 (ko) 2015-03-06
TWI590904B (zh) 2017-07-11
TW201642983A (zh) 2016-12-16
JP2015134347A (ja) 2015-07-27
TW201733685A (zh) 2017-10-01
HK1140720A1 (en) 2010-10-22
KR20150029008A (ko) 2015-03-17
JP5990290B2 (ja) 2016-09-14
TWI631997B (zh) 2018-08-11
KR20140077222A (ko) 2014-06-23
KR20090119770A (ko) 2009-11-19
JPWO2008108097A1 (ja) 2010-06-10
JP5271254B2 (ja) 2013-08-21
TWI537084B (zh) 2016-06-11
JP5684853B2 (ja) 2015-03-18
KR101600432B1 (ko) 2016-03-08
TWI426973B (zh) 2014-02-21

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