JP2001500962A - 少量材料分配用装置 - Google Patents
少量材料分配用装置Info
- Publication number
- JP2001500962A JP2001500962A JP10507367A JP50736798A JP2001500962A JP 2001500962 A JP2001500962 A JP 2001500962A JP 10507367 A JP10507367 A JP 10507367A JP 50736798 A JP50736798 A JP 50736798A JP 2001500962 A JP2001500962 A JP 2001500962A
- Authority
- JP
- Japan
- Prior art keywords
- valve
- nozzle
- flow path
- liquid
- orifice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F13/00—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
- G01F13/006—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups measuring volume in function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Nozzles (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.貫通して延びている第一流路を有して、該第一流路出口端付近に配置したバ ルブ座(38,612)と、該第一流路内に配置された往復運動バルブ(92, 432,444)とを有するバルブ組立体(32,416)の該第一流路の入口 端に液体材料を供給し、 ノズル組立体(40,424,602)を貫通して延びていて、該第一流路の 出口端から該液体材料をうけとるための入口部と、該液体が分配されるノズル組 立体(40,446,602)を貫通して延びるオリフィス(100,622) を有する出口部と、を備えた第二流路(96,418,608)を、該バルブ( 92,432,444)が該バルブ座(38,420,612)から離れた第一 位置にあるときに、該液体材料で満たし、 該第一位置から、該第一流路(36,412)内のほとんどの液体材料が該第 一流路の入口端方向に流れ、該第一流路内の液体残材が該出口端から該第二流路 (96,418,608)内に流れて該ノズル組立体(40,424,602) の出口からの液体材料の流れとしてオリフィスを通して分配される箇所にある該 第一位置よりも該バルブ座(38,420,612)に近くに配置される第二位 置まで、該バルブ(92,432,444)を加速し、 該第二位置から、該第一流路(36,412)の該入口端方向に該液体材料の 流れを減少し、該第二流路(96,418,608)の該液体材料流れを増加さ せる該バルブ座(38,420,612)と嵌合する第三位置に、該バルブ(9 2, 432,444)を移動し、 該第二流路(96,418,608)が遮断され、該ノズル組立体(40,4 24,602)の該出口からオリフィス(100,622)を通して分配される 該液体材料の流れを該ノズル組立体の該出口から小滴を形成するまでの間で堰止 める該バルブ座(38,420,612)に該バルブを配置する該第三流路に、 該バルブ(92,432,444)を移動する、 ステップを特徴とする、少量の液体材料の分配用の方法。 2.請求項1において、さらに、該オリフィス(100,622)の直径の約3 倍よりも短い任意の距離に、該第二位置を配置するステップを特徴とする方法。 3.請求項2において、さらに、該オリフィス(100,622)の直径の約1 .5倍よりも短い任意の距離に、該第二位置を配置するステップを特徴とする方 法。 4.請求項1において、さらに、該バルブ(92,432)を、該第一位置と該 第三位置の間を、約22.6ミリ秒より短い時間内に、往復運動させるステップ を特徴とする方法。 5.請求項1において、さらに、長さ対直径の比が少なくとも約3対1である該 ノズル組立体(40,446)の該オリフィス(100)を通して、液体材料の 該流れを分配するステップを特徴とする方法。 6.請求項5において、さらに、約0.0020インチから0.0625インチ の範囲の径を有する該オリフィス(100,622)を通して、液体材料の該流 れを分配する手順を具備したことを特徴とした方法。 7.貫通して延びている第一流路(36,412)を備えてその中に、該バルブ 流路出口付近に配置されるバルブ座(38,420,612)と、該バルブ内に 配置される往復運動バルブ(92,432,444)とを具備するバルブ組立体 と、 貫通して延びている第二流路(96,418,608)を備えてその中に、該 第一流路(36,412)の該出口端につながる入口部と、貫通して延びている ノズルオリフィス(100,622)を有して、ノズルチップ外径が約0.01 20インチから0.0625インチの間である延長ノズル(40,446,61 6)を形成する出口部と、を具備するバルブ組立体(40,424,602)と 、 を有することを特徴とする少量の液体の分配用の装置。 8.請求項7において、該ノズルオリフィス(100,622)の外径が、約0 .002インチから0.016インチの間であることを特徴とする装置。 9.請求項8において、さらに、該ノズルオリフィス(100,622)の長さ 対直径の比が、少なくとも約3対1であることを特徴とする装置。 10.請求項9において、さらに、該ノズルオリフィス(100,622)の長さ 対直径の比が、少なくとも約25対1であることを特徴とする装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/682,160 US5747102A (en) | 1995-11-16 | 1996-07-17 | Method and apparatus for dispensing small amounts of liquid material |
US08/682,160 | 1996-07-17 | ||
PCT/US1997/012317 WO1998010251A1 (en) | 1996-07-17 | 1997-07-15 | Device for dispensing small amounts of material |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003123874A Division JP3762384B2 (ja) | 1996-07-17 | 2003-04-28 | 少量材料分配用装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001500962A true JP2001500962A (ja) | 2001-01-23 |
JP3506716B2 JP3506716B2 (ja) | 2004-03-15 |
Family
ID=24738497
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50736798A Expired - Lifetime JP3506716B2 (ja) | 1996-07-17 | 1997-07-15 | 少量材料分配用装置 |
JP2003123874A Expired - Lifetime JP3762384B2 (ja) | 1996-07-17 | 2003-04-28 | 少量材料分配用装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003123874A Expired - Lifetime JP3762384B2 (ja) | 1996-07-17 | 2003-04-28 | 少量材料分配用装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5747102A (ja) |
JP (2) | JP3506716B2 (ja) |
AU (1) | AU3800497A (ja) |
CA (1) | CA2260155C (ja) |
WO (1) | WO1998010251A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008108097A1 (ja) * | 2007-03-08 | 2008-09-12 | Musashi Engineering, Inc. | 液滴吐出装置および方法 |
WO2008126373A1 (ja) | 2007-03-30 | 2008-10-23 | Musashi Engineering, Inc. | 液材吐出装置および液材吐出方法 |
WO2008146464A1 (ja) | 2007-05-18 | 2008-12-04 | Musashi Engineering, Inc. | 液体材料吐出方法および装置 |
KR20160132381A (ko) | 2014-03-10 | 2016-11-18 | 무사시 엔지니어링 가부시키가이샤 | 도포 장치 및 도포 방법 |
WO2018056120A1 (ja) * | 2016-09-26 | 2018-03-29 | セイコーエプソン株式会社 | 流動性材料吐出装置 |
KR102326763B1 (ko) * | 2020-07-15 | 2021-11-16 | 주식회사 위너스에프에이 | 디스펜서 |
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US6253957B1 (en) | 1995-11-16 | 2001-07-03 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
US6267266B1 (en) | 1995-11-16 | 2001-07-31 | Nordson Corporation | Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate |
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JPH1050769A (ja) * | 1996-07-30 | 1998-02-20 | Toshiba Corp | 半導体パッケージの製造装置および製造方法 |
JPH10125618A (ja) * | 1996-10-23 | 1998-05-15 | Fujitsu Ltd | 半導体装置の製造方法 |
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JPH10224099A (ja) | 1997-02-04 | 1998-08-21 | Fuji Mach Mfg Co Ltd | 回路部品装着方法および回路部品装着システム |
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JPH11197571A (ja) * | 1998-01-12 | 1999-07-27 | Nordson Kk | 吐出ガンの弁機構の開閉速度制御方法及び装置並びに液状体の吐出塗布方法 |
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US5350084A (en) * | 1993-09-03 | 1994-09-27 | Liquid Control Corporation | Mixing, metering and dispensing device |
-
1996
- 1996-07-17 US US08/682,160 patent/US5747102A/en not_active Expired - Lifetime
-
1997
- 1997-07-15 JP JP50736798A patent/JP3506716B2/ja not_active Expired - Lifetime
- 1997-07-15 AU AU38004/97A patent/AU3800497A/en not_active Abandoned
- 1997-07-15 CA CA002260155A patent/CA2260155C/en not_active Expired - Fee Related
- 1997-07-15 WO PCT/US1997/012317 patent/WO1998010251A1/en active Application Filing
-
2003
- 2003-04-28 JP JP2003123874A patent/JP3762384B2/ja not_active Expired - Lifetime
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WO2008108097A1 (ja) * | 2007-03-08 | 2008-09-12 | Musashi Engineering, Inc. | 液滴吐出装置および方法 |
US8807400B2 (en) | 2007-03-30 | 2014-08-19 | Musashi Engineering, Inc. | Liquid droplet discharging device having advanced position specifying mechanism |
WO2008126373A1 (ja) | 2007-03-30 | 2008-10-23 | Musashi Engineering, Inc. | 液材吐出装置および液材吐出方法 |
US8448818B2 (en) | 2007-03-30 | 2013-05-28 | Musashi Engineering, Inc. | Drop forming discharge device having collision member and method of using same |
US9393787B2 (en) | 2007-05-18 | 2016-07-19 | Musashi Engineering, Inc. | Method and apparatus for discharging liquid material |
US9156054B2 (en) | 2007-05-18 | 2015-10-13 | Musashi Engineering, Inc. | Method and apparatus for discharging liquid material |
WO2008146464A1 (ja) | 2007-05-18 | 2008-12-04 | Musashi Engineering, Inc. | 液体材料吐出方法および装置 |
US9701143B2 (en) | 2007-05-18 | 2017-07-11 | Musashi Engineering, Inc. | Method and apparatus for discharging liquid material |
KR20160132381A (ko) | 2014-03-10 | 2016-11-18 | 무사시 엔지니어링 가부시키가이샤 | 도포 장치 및 도포 방법 |
US10449565B2 (en) | 2014-03-10 | 2019-10-22 | Musashi Engineering, Inc. | Application device and application method |
WO2018056120A1 (ja) * | 2016-09-26 | 2018-03-29 | セイコーエプソン株式会社 | 流動性材料吐出装置 |
JP2018051436A (ja) * | 2016-09-26 | 2018-04-05 | セイコーエプソン株式会社 | 流動性材料吐出装置 |
KR102326763B1 (ko) * | 2020-07-15 | 2021-11-16 | 주식회사 위너스에프에이 | 디스펜서 |
Also Published As
Publication number | Publication date |
---|---|
JP3762384B2 (ja) | 2006-04-05 |
JP3506716B2 (ja) | 2004-03-15 |
AU3800497A (en) | 1998-03-26 |
WO1998010251A1 (en) | 1998-03-12 |
US5747102A (en) | 1998-05-05 |
JP2004031927A (ja) | 2004-01-29 |
CA2260155A1 (en) | 1998-03-12 |
CA2260155C (en) | 2003-09-23 |
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