WO2007091503A1 - ロボット装置 - Google Patents

ロボット装置 Download PDF

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Publication number
WO2007091503A1
WO2007091503A1 PCT/JP2007/051891 JP2007051891W WO2007091503A1 WO 2007091503 A1 WO2007091503 A1 WO 2007091503A1 JP 2007051891 W JP2007051891 W JP 2007051891W WO 2007091503 A1 WO2007091503 A1 WO 2007091503A1
Authority
WO
WIPO (PCT)
Prior art keywords
arm
length
coordinate position
predetermined
moving
Prior art date
Application number
PCT/JP2007/051891
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Takayuki Yazawa
Yutaka Yoshizawa
Hirokazu Watanabe
Original Assignee
Nidec Sankyo Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Sankyo Corporation filed Critical Nidec Sankyo Corporation
Priority to CN2007800001623A priority Critical patent/CN101309782B/zh
Priority to KR1020077019116A priority patent/KR101323884B1/ko
Publication of WO2007091503A1 publication Critical patent/WO2007091503A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • FIG. 2 is a perspective view showing one form of the robot apparatus when the first arm and the second arm move in a shifted state!
  • FIG. 5 is a perspective view showing one form of the robot apparatus when the second arm is further moved by a movable length L2 from the state shown in FIG. 4 and the leading end thereof reaches the coordinate position P3. .
  • FIG. 7 is a flowchart showing the second control means after being taught by the teaching means of FIGS. 2 to 5. It is
  • a slide mechanism capable of sliding the first arm 11 is provided in the second arm 12.
  • a slide mechanism capable of sliding the second arm 12 is provided in the base member 13.
  • a rotation mechanism that can turn the arm portion 2 via the vertical movement member 14 is provided in the base 15.
  • a vertical movement mechanism capable of moving the vertical movement member 14 up and down is provided in the base portion 15.
  • the robot apparatus 1 of the present invention has the control apparatus, and the control apparatus includes the teaching means described above. Therefore, the arm unit 2 is moved to the predetermined coordinate position P by the teaching means.
  • This can be uniquely determined by the control device including this teaching means by moving the second arm 12 after moving the first arm 11 by a predetermined length R1.
  • the teaching method will not change every time the operator only needs to be aware of the coordinate position P, or every time the operator changes, and the consistency of Rl 'R2 will be maintained. The burden is reduced.
  • the operation buttons for teaching work are also assigned to the robot coordinates, making it easy to operate.
  • the second control means is designated with a moving length R2 of the second arm 12,
  • R2 is within the range (R ⁇ L1 + R2), as shown in Figs.
  • the robot apparatus 1 of the present invention is preferably used in a general manufacturing process of a liquid crystal display panel, a plasma display panel (PDP) or the like. As shown in Fig. 1, a plurality of glass substrates are used.
  • This robot apparatus has a slider-type arm for taking out a glass substrate from the cassette 30 in which 31 is accommodated, or for accommodating the glass substrate after the TFT forming process and the wiring process in the cassette 30.
  • Such a robot apparatus 1 is excellent in straight-ahead accuracy and can narrow the pitch of the glass substrates 31 stored in the cassette 30.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Manipulator (AREA)
  • Numerical Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/JP2007/051891 2006-02-06 2007-02-05 ロボット装置 WO2007091503A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2007800001623A CN101309782B (zh) 2006-02-06 2007-02-05 机器人装置
KR1020077019116A KR101323884B1 (ko) 2006-02-06 2007-02-05 로봇 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006028293A JP4996102B2 (ja) 2006-02-06 2006-02-06 ロボット装置
JP2006-028293 2006-02-06

Publications (1)

Publication Number Publication Date
WO2007091503A1 true WO2007091503A1 (ja) 2007-08-16

Family

ID=38345103

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/051891 WO2007091503A1 (ja) 2006-02-06 2007-02-05 ロボット装置

Country Status (5)

Country Link
JP (1) JP4996102B2 (zh)
KR (1) KR101323884B1 (zh)
CN (1) CN101309782B (zh)
TW (1) TWI404611B (zh)
WO (1) WO2007091503A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010075830A1 (de) * 2008-12-17 2010-07-08 Grenzebach Maschinenbau Gmbh Verfahren und vorrichtung zum schnelltransport von glasplatten

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5272647B2 (ja) * 2008-10-24 2013-08-28 株式会社デンソーウェーブ ロボット
KR101211911B1 (ko) * 2010-11-02 2012-12-13 주식회사 로보스타 표시장치용 패널의 반전로봇
CN102380868B (zh) * 2011-11-09 2014-04-16 广东工业大学 具有两维平动和一维转动的三自由度机械手
CN103600590B (zh) * 2013-11-06 2016-03-16 青岛中科英泰商用系统股份有限公司 带有印泥补充装置和旋转机构的盖章机
CN103617520B (zh) * 2013-11-11 2016-07-06 青岛中科英泰商用系统股份有限公司 具有双导轨机构、文件输送和视频通话功能的盖章机
JP5785284B2 (ja) * 2014-02-17 2015-09-24 ファナック株式会社 搬送対象物の落下事故を防止するロボットシステム
KR102189275B1 (ko) * 2019-07-08 2020-12-09 세메스 주식회사 이송 로봇 및 이를 포함하는 이송 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01252382A (ja) * 1988-03-31 1989-10-09 Yokogawa Electric Corp ロボットの制御装置
JPH05224738A (ja) * 1992-02-17 1993-09-03 Yokogawa Electric Corp ロボット制御装置
JPH09128026A (ja) * 1995-11-06 1997-05-16 Matsushita Electric Ind Co Ltd ロボット動作プログラム変換方式とその実行装置
JP2003229466A (ja) * 2002-02-04 2003-08-15 Seiko Instruments Inc 真空処理装置
JP2004165579A (ja) * 2002-09-18 2004-06-10 Seiko Instruments Inc 真空処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2599618B2 (ja) * 1988-08-01 1997-04-09 株式会社フジタ 塔内作業ロボットシステム
JPH0661487U (ja) * 1993-01-29 1994-08-30 株式会社工研 キャリヤロボット
JPH08295492A (ja) * 1995-04-27 1996-11-12 Tokiyoshi Kuroda 多段伸縮アーム装置
JPH09323276A (ja) * 1996-06-03 1997-12-16 Toyota Autom Loom Works Ltd 搬送装置及びロボットアーム
JPH1110578A (ja) * 1997-06-18 1999-01-19 Kokuho:Kk 吊下装置
CN100342519C (zh) * 2003-07-16 2007-10-10 东京毅力科创株式会社 搬送装置及驱动机构
JP5011507B2 (ja) * 2007-03-14 2012-08-29 日本電産サンキョー株式会社 ロボット教示システム及びロボット教示方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01252382A (ja) * 1988-03-31 1989-10-09 Yokogawa Electric Corp ロボットの制御装置
JPH05224738A (ja) * 1992-02-17 1993-09-03 Yokogawa Electric Corp ロボット制御装置
JPH09128026A (ja) * 1995-11-06 1997-05-16 Matsushita Electric Ind Co Ltd ロボット動作プログラム変換方式とその実行装置
JP2003229466A (ja) * 2002-02-04 2003-08-15 Seiko Instruments Inc 真空処理装置
JP2004165579A (ja) * 2002-09-18 2004-06-10 Seiko Instruments Inc 真空処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010075830A1 (de) * 2008-12-17 2010-07-08 Grenzebach Maschinenbau Gmbh Verfahren und vorrichtung zum schnelltransport von glasplatten
US8911197B2 (en) 2008-12-17 2014-12-16 Grenzebach Maschinenbau Gmbh Method and apparatus for the rapid transport of glass sheets

Also Published As

Publication number Publication date
JP2007203434A (ja) 2007-08-16
CN101309782B (zh) 2012-01-25
CN101309782A (zh) 2008-11-19
TW200744809A (en) 2007-12-16
JP4996102B2 (ja) 2012-08-08
KR20080089145A (ko) 2008-10-06
KR101323884B1 (ko) 2013-10-30
TWI404611B (zh) 2013-08-11

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