WO2007075014A1 - Composition de résine époxyde - Google Patents

Composition de résine époxyde Download PDF

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Publication number
WO2007075014A1
WO2007075014A1 PCT/KR2006/005676 KR2006005676W WO2007075014A1 WO 2007075014 A1 WO2007075014 A1 WO 2007075014A1 KR 2006005676 W KR2006005676 W KR 2006005676W WO 2007075014 A1 WO2007075014 A1 WO 2007075014A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
weight
parts
resin composition
reactive diluent
Prior art date
Application number
PCT/KR2006/005676
Other languages
English (en)
Inventor
Seong-Roon Jeong
Do-Hyun Kim
Jae-Won Lee
Young-Il Kim
Original Assignee
Sk Chemicals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sk Chemicals Co., Ltd. filed Critical Sk Chemicals Co., Ltd.
Priority to CN2006800494804A priority Critical patent/CN101351501B/zh
Priority to JP2008548406A priority patent/JP2009521589A/ja
Publication of WO2007075014A1 publication Critical patent/WO2007075014A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Definitions

  • liquid epoxy resin composition for encapsulation according to
  • the resin was evaluated by dropping the resin composition on one glass plate and

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La présente invention se rapporte à une composition de résine époxyde, en particulier à une composition de résine époxyde pouvant servir d'agent d'encapsulation pour des pièces électriques telles que des circuits intégrés de commande montés sur une carte de circuits imprimés. La composition de résine époxyde selon l'invention se présente sous la forme d'une phase liquide à température ambiante, et contient 100 parties en poids d'une résine époxyde renfermant au moins 2 groupes glycidyle par molécule, de 10 à 50 parties en poids d'un diluant réactif renfermant au moins 2 groupes glycidyle par molécule, de 50 à 200 parties en poids d'un agent de durcissement anhydre se présentant sous la forme d'une phase liquide à température ambiante pour 100 parties en poids de la résine époxyde et du diluant réactif, et de 1 à 20 parties en poids d'un accélérateur de durcissement latent pour 100 parties en poids de la résine époxyde, du diluant réactif et de l'agent de durcissement anhydre, ladite résine époxyde présentant une viscosité de 250-500 cp à 25° et un temps de gélification inférieur à 120 secondes à 150°.
PCT/KR2006/005676 2005-12-26 2006-12-22 Composition de résine époxyde WO2007075014A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2006800494804A CN101351501B (zh) 2005-12-26 2006-12-22 环氧树脂组合物
JP2008548406A JP2009521589A (ja) 2005-12-26 2006-12-22 エポキシ樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050129793A KR101148051B1 (ko) 2005-12-26 2005-12-26 에폭시 수지 조성물
KR10-2005-0129793 2005-12-26

Publications (1)

Publication Number Publication Date
WO2007075014A1 true WO2007075014A1 (fr) 2007-07-05

Family

ID=38218210

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2006/005676 WO2007075014A1 (fr) 2005-12-26 2006-12-22 Composition de résine époxyde

Country Status (5)

Country Link
JP (1) JP2009521589A (fr)
KR (1) KR101148051B1 (fr)
CN (1) CN101351501B (fr)
TW (1) TWI453229B (fr)
WO (1) WO2007075014A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109385047A (zh) * 2018-10-31 2019-02-26 成都市冠宇复合材料制品有限公司 一种树脂组合物及其制备方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100966260B1 (ko) * 2007-11-28 2010-06-28 (주)에버텍엔터프라이즈 저습성 및 고신뢰성을 갖는 다이 접착용 전기 전도성 접착조성물
KR101368986B1 (ko) 2007-12-28 2014-02-28 에스케이케미칼주식회사 엘시디 구동소자용 에폭시 수지 조성물
WO2013108629A1 (fr) * 2012-01-18 2013-07-25 三井化学株式会社 Composition, composition pour agent d'étanchéité de face d'extrémité de dispositif d'affichage comprenant la composition et dispositif d'affichage et son procédé de fabrication
CN103554835B (zh) * 2013-10-16 2015-09-09 太原理工大学 一种中低温快速固化增强用环氧树脂材料的制备方法
WO2015141717A1 (fr) * 2014-03-20 2015-09-24 日本ゼオン株式会社 Composition de résine sensible au rayonnement et composant électronique
JP6283624B2 (ja) * 2015-05-28 2018-02-21 日東電工株式会社 中空型電子デバイス封止用シート、中空型電子デバイスパッケージの製造方法、及び、中空型電子デバイスパッケージ
EP3395851B1 (fr) 2015-12-25 2021-03-10 Toray Industries, Inc. Composition de résine époxyde, matériau composite renforcé par des fibres, article moulé, et récipient sous pression
KR102258362B1 (ko) 2020-10-19 2021-06-01 권용문 문경약돌을 먹인 한우의 사골농축액을 이용한 다용도 간장소스 조성물 및 그 제조방법
KR20230157487A (ko) * 2021-07-12 2023-11-16 아사히 가세이 가부시키가이샤 에폭시 수지 조성물, 필름, 필름의 제조 방법, 및 경화물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US6342577B1 (en) * 1997-07-24 2002-01-29 Loctite Corporation Thermosetting resin compositions useful as underfill sealants
US20020106515A1 (en) * 2000-12-13 2002-08-08 Carpenter Neil M. Novel high temperature underfilling material with low exotherm during use
US20020142167A1 (en) * 2001-01-29 2002-10-03 Ube Industries, Ltd. Underfill material for COF mounting and electronic components

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JPS6456719A (en) * 1987-08-26 1989-03-03 Sanyu Resin Kk Casting resin composition for electronic parts
KR910010026B1 (ko) * 1988-12-19 1991-12-10 주식회사 럭키 액상에폭시 수지 조성물 및 그의 제조방법
JPH0627183B2 (ja) * 1990-03-30 1994-04-13 ソマール株式会社 液状エポキシ樹脂組成物
KR940014615A (ko) * 1992-12-29 1994-07-19 김충세 포커스 팩(focus pack)봉지제용 열경화성 에폭시수지 조성물
JP3141970B2 (ja) * 1993-06-30 2001-03-07 ソマール株式会社 液状エポキシ樹脂組成物
JPH09151303A (ja) * 1995-09-25 1997-06-10 Nissan Chem Ind Ltd エポキシ樹脂組成物
KR100573326B1 (ko) * 1998-01-16 2006-04-24 록타이트(알 앤 디) 리미티드 경화성 에폭시-기제 조성물
JP2000178411A (ja) * 1998-12-17 2000-06-27 Hitachi Chem Co Ltd 難燃性エポキシ樹脂組成物及びこの組成物を用いた電気部品
CN1178287C (zh) * 1999-06-17 2004-12-01 洛克泰特公司 可再处理的热固性树脂组合物
CN1125488C (zh) * 2000-08-25 2003-10-22 中国科学院化学研究所 一种半导体封装用的液体环氧组合物及其用途
JP2003002951A (ja) * 2001-06-25 2003-01-08 New Japan Chem Co Ltd 液状エポキシ樹脂組成物の薄膜硬化物
JP2003026766A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物
JP4068406B2 (ja) * 2001-07-27 2008-03-26 昭和電工株式会社 重合性化合物、該化合物の製造方法、該化合物を含む重合性組成物、該組成物を硬化してなる硬化物、及び該硬化物の製造方法
JP2003160644A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
TW200508314A (en) * 2003-06-04 2005-03-01 Sekisui Chemical Co Ltd A liquid crystal display device and curing resin composition, sealing material for the same
TW561162B (en) 2003-06-11 2003-11-11 Chang Chun Plastics Co Ltd Epoxy resin composition for encapsulation of optical semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US6342577B1 (en) * 1997-07-24 2002-01-29 Loctite Corporation Thermosetting resin compositions useful as underfill sealants
US20020106515A1 (en) * 2000-12-13 2002-08-08 Carpenter Neil M. Novel high temperature underfilling material with low exotherm during use
US20020142167A1 (en) * 2001-01-29 2002-10-03 Ube Industries, Ltd. Underfill material for COF mounting and electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109385047A (zh) * 2018-10-31 2019-02-26 成都市冠宇复合材料制品有限公司 一种树脂组合物及其制备方法

Also Published As

Publication number Publication date
TWI453229B (zh) 2014-09-21
CN101351501A (zh) 2009-01-21
TW200734367A (en) 2007-09-16
KR101148051B1 (ko) 2012-05-25
CN101351501B (zh) 2011-05-18
KR20070068071A (ko) 2007-06-29
JP2009521589A (ja) 2009-06-04

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