WO2007020793A1 - 絶縁性硬化性組成物、及びその硬化物並びにそれを用いたプリント配線板 - Google Patents
絶縁性硬化性組成物、及びその硬化物並びにそれを用いたプリント配線板 Download PDFInfo
- Publication number
- WO2007020793A1 WO2007020793A1 PCT/JP2006/315164 JP2006315164W WO2007020793A1 WO 2007020793 A1 WO2007020793 A1 WO 2007020793A1 JP 2006315164 W JP2006315164 W JP 2006315164W WO 2007020793 A1 WO2007020793 A1 WO 2007020793A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- printed wiring
- curable resin
- insulating
- wiring boards
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 32
- 239000011342 resin composition Substances 0.000 claims abstract description 72
- 239000002245 particle Substances 0.000 claims abstract description 50
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims description 29
- 239000002253 acid Substances 0.000 claims description 28
- -1 oxetane compound Chemical class 0.000 claims description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 239000004593 Epoxy Substances 0.000 claims description 18
- 238000001723 curing Methods 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 4
- 238000013007 heat curing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 22
- 238000003860 storage Methods 0.000 abstract description 12
- 238000004062 sedimentation Methods 0.000 abstract description 6
- 230000002776 aggregation Effects 0.000 abstract description 3
- 238000004220 aggregation Methods 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- 239000000047 product Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920000193 polymethacrylate Polymers 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 2
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 201000006747 infectious mononucleosis Diseases 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 229940113165 trimethylolpropane Drugs 0.000 description 2
- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- SSUJUUNLZQVZMO-UHFFFAOYSA-N 1,2,3,4,8,9,10,10a-octahydropyrimido[1,2-a]azepine Chemical compound C1CCC=CN2CCCNC21 SSUJUUNLZQVZMO-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- DLEWDCPFCNLJEY-UHFFFAOYSA-N 1-morpholin-4-ylpropan-1-one Chemical compound CCC(=O)N1CCOCC1 DLEWDCPFCNLJEY-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical class COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- NBBXSWKUFZWAMU-UHFFFAOYSA-N 2-[2-(dimethylamino)ethyl]benzoic acid Chemical compound CN(C)CCC1=CC=CC=C1C(O)=O NBBXSWKUFZWAMU-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- YDIYEOMDOWUDTJ-UHFFFAOYSA-N 4-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=C(C(O)=O)C=C1 YDIYEOMDOWUDTJ-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- ZKIMSKKHHLEOHN-UHFFFAOYSA-N C(C)(=O)C1=CC=CC=C1.CSC1=CC=C(C=C1)O Chemical class C(C)(=O)C1=CC=CC=C1.CSC1=CC=C(C=C1)O ZKIMSKKHHLEOHN-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- XTKDAFGWCDAMPY-UHFFFAOYSA-N azaperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCN(C=2N=CC=CC=2)CC1 XTKDAFGWCDAMPY-UHFFFAOYSA-N 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 150000001559 benzoic acids Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 150000003983 crown ethers Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229940117969 neopentyl glycol Drugs 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229940113115 polyethylene glycol 200 Drugs 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Definitions
- Insulating curable composition Insulating curable composition, cured product thereof, and printed wiring board using the same
- the present invention relates to an insulating curable resin composition excellent in thermal conductivity, a cured product thereof, and a printed wiring board using the same, and more particularly, to a package substrate or a surface-mounted light emitting diode.
- the present invention relates to an insulating curable resin composition having thermal conductivity useful for a fat insulating layer and the like and excellent storage stability, a cured product thereof, and a printed wiring board using the same.
- a metal plate such as copper or aluminum is used as a circuit board with good heat dissipation, and an electrical insulating layer such as a pre-preda or a thermosetting resin composition is formed on one or both sides of the metal plate.
- a metal base substrate on which a circuit pattern is formed via a substrate for example, see Patent Document 1).
- the strong metal base substrate has a poor thermal conductivity of the electrical insulating layer, and thus the insulating layer needs to be thinned. As a result, a problem of withstand voltage may occur. .
- solder resist compositions (see, for example, Patent Document 2) and interlayer insulating materials used for such package substrates are based on low molecular weight epoxy compounds, and the filler is also electrically insulating and chemical resistant. Silica and precipitated sodium sulfate, which have good properties, have poor heat dissipation. In addition, when alumina, which is expected to have heat dissipation, electrical insulation, and chemical resistance, is used as a filler, the sedimentation of the filler is severe. The fallen filler is agglomerated and becomes unusable, and is not practical in terms of storage stability.
- a light-emitting diode chip is disposed on a resin insulating layer on which a terminal portion is formed, and is packaged with a sealing resin that also serves as a lens layer on top of the light-emitting diode chip. In the diode, the heat dissipation of the resin insulation layer becomes a problem.
- Patent Document 1 JP-A-6-224561 (Claims)
- Patent Document 2 JP-A-11 288091 (Claims)
- the present invention was developed in view of the above-mentioned problems, and its main purpose is to have useful thermal conductivity for a resin insulating layer in a package substrate or a surface-mounted light emitting diode, and to ensure stable storage. It is providing the insulating curable resin composition excellent in property.
- a cured product having a thermal conductivity of 2 WZm'K or more obtained by irradiating active energy rays and Z or thermosetting the above curable resin composition, and using it as an interlayer insulating material solder resist Another object is to provide a printed wiring board.
- the present invention has the following requirements.
- the insulating curable resin composition for printed wiring boards according to (1) wherein the acid aluminum particles (A) are particles having a particle size of 30 ⁇ m or less.
- the acid oxide aluminum particles (A) have a first acid oxide particle content of 100 parts by mass of the first acid oxide aluminum particles having a particle diameter in the range of 5 m to 20 m. Insulating hardening for printed wiring boards according to (1) or (2), containing 20 to 100 parts by mass of second aluminum oxide particles in the range of 1Z2 to 1Z10 with an average particle diameter of aluminum particles! Rosin composition.
- thermosetting resin composition (B-1) is an epoxy compound and a Z or oxetane compound, and the resin composition for a printed wiring board further comprises the thermosetting resin.
- the photocurable resin composition (B-2) contains (6) a compound having one or more ethylenically unsaturated bonds in one molecule and a photopolymerization initiator.
- the insulating layer is obtained by curing the insulating curable resin composition according to any one of (1) to (7) by irradiation with active energy rays and Z or heat curing. And a printed wiring board on which a Z or solder resist layer is formed.
- the acid-aluminum particles used in the present invention are spherical, they can be highly filled without significantly increasing the viscosity of the composition, and in particular, spherical acid particles having a particle size distribution that provides close-packing.
- spherical acid particles having a particle size distribution that provides close-packing.
- Such a curable resin composition having excellent thermal conductivity and excellent storage stability can be suitably used for printed wiring boards equipped with semiconductors and light-emitting diodes that generate a large amount of heat. Since it is excellent in performance, it is possible to reduce the size and weight. [0022] (Definitions, etc.)
- spherical of “spherical acid-aluminum particles” means a state in which the shape is rounded as a result of pulverizing a mineral or a synthetic product and then heat-treating it. It does not mean a true sphere.
- the "average particle diameter” refers to a value measured using a laser particle size distribution measuring machine.
- the basic aspect of the insulating curable resin composition of the present invention is: (A) Thermal conductivity 15 WZm.
- K or more spherical acid / aluminum particles (B) containing a curable resin composition and the volume occupancy of the aluminum oxide particles (A) is 60% by volume with respect to the total volume of the cured product. It is characterized by including the above.
- the spherical acid / aluminum particles (A) used in the present invention a spherical acid / aluminum having a thermal conductivity of 15W Zm'K or more and a purity of 92% or more can be used.
- the average particle diameter of the aluminum oxide particles (A) is 0.01 m to 30 ⁇ m, more preferably 0.0 1 ⁇ to 20 / ⁇ m. If it is less than 0.01 ⁇ m, the viscosity of the composition becomes too high, so that it is difficult to disperse and it is difficult to apply to the object. When it is larger than 30 m, cueing to the coating film occurs, and the sedimentation speed increases and the storage stability deteriorates.
- the amount of acid-aluminum particles is determined based on the cured product of the resin composition for printed wiring boards in consideration of heat dissipation characteristics and flexibility. 60 to 95 parts by volume are preferable in 100 parts by volume of the product.
- the aluminum oxide particles can be made to have a higher packing density by blending two or more types having an average particle size with a particle size distribution that results in the closest packing, and storage stability.
- the both side forces of thermal conductivity are preferable. For example, if the particle size distribution is close packed, For 100 parts by mass of the first aluminum oxide particles in the diameter range of 20-5 ⁇ m, this first
- the second aluminum oxide particles having an average particle size of 1 aluminum oxide particles in the range of 1Z2 to 1Z10 are mixed with 20 to: LOO parts by mass.
- DAW- 05 (Denki Kagaku Kogyo, average particle size 5 ⁇ m)
- DAW-10 (Denki Kagaku Kogyo, average particle size 10 ⁇ m)
- AS-40 Mer by Showa Denko, Average particle size 12 ⁇ m) m
- AS-50 (manufactured by Showa Denko KK, average particle size 9 ⁇ m), and the like.
- the curable resin composition (B) used in the present invention comprises (B-1) a thermosetting resin composition, and Z or (B-2) a photocurable resin composition! /.
- thermosetting resin composition (B-1) examples include a composition that is cured by heating and exhibits electrical insulation, such as an epoxy-based yarn composition, an oxetane-based yarn composition, and a melamine resin composition.
- a thermosetting resin composition comprising an epoxy compound and Z or oxetane compound, and a curing agent and Z or a curing catalyst can be preferably used.
- epoxy compound known compounds can be used as long as they have one or more, preferably two or more epoxy groups in one molecule.
- bisphenol A type epoxy resin bisphenol S type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, tri Methylolpropane triglycidyl ether, phenol—; L, 3 -diglycidyl ether, biphenyl 4,4'-diglycidyl ether, 1,6-hexane diol diglycidyl ether, ethylene glycol or propylene glycol
- examples include compounds having two or more epoxy groups in one molecule such as sidyl ether, sorbitol polyglycidyl ether, tris (2,3-epoxypropyl) isocyanurate, triglycidyltris (2-hydroxyethyl) isocyanurate, etc.
- Mono-epoxy compounds such as butyl daricidyl ether, ferric glycidyl ether, and glycidyl (meth) acrylate can be added as long as the coating properties are not deteriorated! ,.
- R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- Specific examples of the compound include 3-ethyl-3-hydroxymethyloxetane (trade name OXT-101, manufactured by Toagosei Co., Ltd.), 3 ethyl 3- (phenoxymethyl) oxetane (trade name OXT-211, manufactured by Toagosei Co., Ltd.).
- 3 ethyl 3- (2-ethylhexyloxymethyl) oxetane (trade name OXT 212, manufactured by Toagosei Co., Ltd.), 1,4 bis ⁇ [((3 ethyl 3-oxeta-l) methoxy] methyl ⁇ benzene (Dongguan Examples thereof include trade name OXT-121) manufactured by Synthetic Co., Ltd., and bis (3-ethyl-3-oxeta-rumethyl) ether (trade name OXT-221 manufactured by Toagosei Co., Ltd.).
- a phenolic novolak-type oxetane compound is also included.
- the oxetane compound can be used in combination with the epoxy compound or used alone. However, since the reactivity is lower than that of the epoxy compound, care should be taken to increase the curing temperature. is necessary.
- polyfunctional phenol compounds, polycarboxylic acids and acid anhydrides thereof, aliphatic or aromatic primary or secondary amines, polyamide resins, polymercapto are used as curing agents. Compound etc. are mentioned. Of these, polyfunctional phenolic compounds, and polycarboxylic acids and acid anhydrides thereof are preferably used from the viewpoint of workability and insulating properties.
- the polyfunctional phenolic compound has two or more phenolic hydroxyl groups in one molecule. Any known compound can be used. Specifically, phenol novolac resin, cresol novolac resin, bisphenol A, arylated bisphenol A, bisphenol? Bisphenol A novolak resin, vinylphenol copolymer resin, and the like are preferable, and phenol novolac resin is particularly preferable because of its high reactivity and high heat resistance effect.
- Such a polyfunctional phenol compound is subjected to an addition reaction with the epoxy compound and Z or oxetane compound in the presence of a suitable curing catalyst.
- the polycarboxylic acid and the acid anhydride thereof are a compound having two or more carboxyl groups in one molecule and an acid anhydride thereof, such as a copolymer of (meth) acrylic acid, maleic anhydride, and the like. Examples thereof include copolymers and dibasic acid condensates.
- Commercially available products include Jonkrill (product group name) manufactured by Johnson Polymer Co., Ltd., SMA resin (product group name) manufactured by Arco Chemical Co., and polyazeline acid anhydride manufactured by Shin Nippon Science Co., Ltd.
- Examples of the curing catalyst include a compound serving as a curing catalyst for the reaction of an epoxy compound and Z or oxetane compound, a polyfunctional phenol compound and Z or polycarboxylic acid and an acid anhydride thereof, or a curing agent.
- Examples of compounds that can be used as polymerization catalysts in the absence of benzene such as tertiary amines, tertiary amine salts, quaternary onium salts, tertiary phosphines, crown ether complexes, and phospho-muylides. Any of these can be selected, and these can be used alone or in combination of two or more.
- imidazoles such as trade names 2E4MZ, C11Z, C17Z and 2PZ, AZINE compounds of imidazoles such as trade names 2MZ-A and 2E4MZ-A, and trade names 2MZ—OK. , 2PZ—OK, etc.
- the blending amount of these curing catalysts is sufficient in the usual quantitative ratio, for example, 0.1 parts by mass or more and 10 parts by mass or less per 100 parts by mass in total of the epoxy compound and Z or oxetane compound. Is appropriate.
- thermosetting resin composition (B-1) is applied to a composition for a flexible substrate, in the present invention, as an epoxy compound, a product manufactured by Japan Epoxy Resin Co., Ltd.
- an epoxy compound a product manufactured by Japan Epoxy Resin Co., Ltd.
- any resin composition that is cured by irradiation with active energy rays and exhibits electrical insulation can be used.
- a resin composition containing a compound having at least one ethylenically unsaturated bond and a photopolymerization initiator is preferred because of excellent heat resistance and electrical insulation.
- Examples of the photopolymerizable oligomer include unsaturated polyester oligomers and (meth) acrylate oligomers.
- Examples of (meth) acrylate oligomers include phenol novolak epoxy (meth) acrylate, cresol novolac epoxy (meth) acrylate.
- Epoxy (meth) acrylate such as bisphenol type epoxy (meth) acrylate, urethane (meth) acrylate, epoxy urethane (meth) acrylate, polyester (meth) acrylate, polyether (meth) acrylate And polybutadiene-modified (meth) acrylate.
- (meth) atalylate is a term that collectively refers to talate, metatalate, and a mixture thereof, and other similar expressions! The same is true.
- Examples of the photopolymerizable butyl monomer include known and commonly used monomers such as 2-ethyl hexyl (meth) acrylate, lauryl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, isopolo -Le (meth) acrylate, ferrule (meth) acrylate, phenoxychetyl Esters of (meth) acrylic acid such as (meth) acrylate; hydroxyalkyl (meth) acrylates such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, pentaerythritol tri (meth) acrylate Rates; alkoxyalkylene glycol mono (meth) acrylates such as methoxyethyl (meth) acrylate and ethoxy shetyl (meth) acrylate; ethylene glycol di (meth) acrylate, butanedio
- Examples of the photopolymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether and their alkyl ethers; acetophenone, 2,2-dimethoxy-2-phenol. -Luacetophenone, 2-hydroxy-2-methyl 1-phenolpropane 1-one, diethoxyacetophenone, 2, 2-diethoxy 2-phenylacetophenone, 1, 1-dichloroacetophenone, 1— Hydroxycyclohexyl phenyl ketone, 2-methyl 1
- Acetophenones such as 2 morpholinopropane 1-one; methylanthoraquinone, 2-ethyl anthoraquinone, 2-tertiarybutyl anthraquinone, 1-claw anthraquinone, 2-amino Anthoraquinones, such as leansoraquinone; thixanthone, 2,4 jetylthioxanthone, 2 cyclodithioxanthone, 2,4-dicyclodithioxanthone, 2-methylthioxanthone, 2,4 diisopropylthioxa Thixanthones such as nton; acetophenone dimethyl ketal, benzyl dimethyl ketal
- -Ketals such as benzene; benzophenones such as benzophenone and 4, 4-bismethylaminominobenzophenone. These can be used alone or in admixture of two or more kinds. Further, tertiary amines such as trihetanolamine, methyljetanolamine and the like; 2 dimethylaminoethylbenzoic acid, 4 dimethylaminobenzoic acid and other benzoic acids It can be used in combination with a photoinitiator aid such as a derivative.
- a wet 'dispersing agent can be added as necessary to facilitate high filling.
- a wet dispersing agent include compounds having a polar group such as a carboxyl group, a hydroxyl group, and an acid ester, polymer compounds such as acid-containing compounds such as phosphate esters, and copolymers containing an acid group. Hydroxyl group-containing polycarboxylic acid esters, polysiloxanes, salts of long-chain polyaminoamides and acid esters, and the like can be used.
- Examples of commercially available wetting / dispersing agents that can be used particularly favorably include Disperbyk (registered trademark) 1 101, 1 103, 1 110, 1 111, 1 160, 1 17 1, —174, — 190, -300, Bykumen (registered trademark), BYK-P 105,-P104,-P 104S, one 240 (all manufactured by Bic 'Kemiichi' Japan), EFKA-polymer 150, EF KA-44, -63 , -64, -65, -66, -71, -764, -766, N (all manufactured by F-Power Co., Ltd.).
- Disperbyk registered trademark
- BYK-P 105,-P104,-P 104S one 240 (all manufactured by Bic 'Kemiichi' Japan)
- EFKA-polymer 150 EF KA-44, -63 , -64, -65, -66, -71
- the insulating curable resin composition of the present invention may contain an organic solvent for adjusting the composition and adjusting the viscosity.
- organic solvent include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; cellosolve, methylcetosolve, butylcetosolve, carbitol, and methylcarbitol.
- Glycol ethers such as ethyl, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol jetyl ether, tripropylene glycol monomethyl ether; ethyl acetate, butylacetate, butyl lactate, cellosolve acetate, butylcetosolve Acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether Acetates, esters such as propylene carbonate; octane, aliphatic hydrocarbons decane; petroleum ether, petroleum naphtha Organic solvents such as petroleum solvents such as solvent naphtha can be used. These organic solvents can be used alone or in combination of two or more.
- the insulating curable resin composition of the present invention may further include phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, carbon black, naphthalene black and the like, if necessary.
- Known conventional colorants known conventional thermal polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, pyrogallol, phenothiazine, known conventional thickeners such as fine silica, organic bentonite, montmorillonite, silicone
- conventional additives such as Z-leveling agents, Z-leveling agents, imidazole-type, thiazole-type, triazole-type silane coupling agents, etc. it can.
- the insulating curable resin composition of the present invention is adjusted to a viscosity suitable for the coating method with the organic solvent, and coated on the substrate by a method such as screen printing.
- the insulating curable resin composition is a thermosetting resin composition (B-1)
- it is heated to a temperature of about 140 ° C to 180 ° C and thermally cured.
- a cured coating film can be obtained.
- the insulating curable resin composition is a photocurable resin composition (B-2)
- the composition is irradiated with ultraviolet rays using a high pressure mercury lamp, a metal halide lamp, a xenon lamp, etc. A cured coating can be obtained.
- Example 1 and Comparative Examples 1, 3, and 4 shown in Table 1 below were kneaded with a three-roll mill to obtain a thermosetting resin composition.
- Table 3 shows the storage stability evaluation results of the obtained thermosetting resin composition, and
- Table 4 shows the characteristics evaluation results.
- volume occupancy of acid aluminum was determined from the volume V0 of the components excluding aluminum oxide and the volume VI after the addition of acid aluminum as follows.
- the volume occupancy of the spherical silica was determined from the volume VO of the components excluding the spherical silica and the volume VI after adding the spherical silica force as follows.
- volume fraction of spherical silica (V1 -V0) / V1 X 100
- Example 2 The blending components of Example 2 and Comparative Examples 2, 5, and 6 shown in Table 2 below were kneaded with a three-roll mill to obtain a photocurable resin composition.
- Table 3 shows the storage stability evaluation results of the obtained photocurable resin composition, and
- Table 4 shows the characteristics evaluation results.
- volume occupancy of acid aluminum was determined from the volume V0 of the components excluding acid aluminum and the volume VI after addition of acid aluminum as follows.
- volume fraction of aluminum oxide (V1 -V0) / V1 X 100
- the volume occupancy of the spherical silica was determined from the volume V0 of the components excluding the spherical silica and the volume VI after adding the spherical silica force as follows.
- volume fraction of spherical silica (V1 -V0) / V1 X 100
- thermosetting compositions of Example 1 and Comparative Examples 1, 3, and 4 were stored in a sealed black container made of polyethylene at 5 ° C. The sedimentation state was evaluated after 2, 7, 30, and 90 days. Further, the photocurable compositions of Example 2 and Comparative Example 2 were put in a polyethylene sealed black container and stored in a dark place at 20 ° C. The sedimentation state was evaluated after 2, 7, 30, and 90 days.
- thermosetting compositions of Example 1 and Comparative Examples 1, 3, and 4 were applied onto the test substrate by screen printing so that the cured coating film was about 40 m, and cured at 150 ° C. for 60 minutes.
- the photocurable compositions of Example 2 and Comparative Examples 2, 5, and 6 were applied onto the test substrate by screen printing so that the cured coating film was about 40 m, and a wavelength of 350 nm was applied using a metal halide lamp. in was cured by irradiation with integrated light quantity of 2jZcm 2. At 25-125 ° C The thermal conductivity of was measured by the laser flash method.
- thermosetting compositions of Example 1 and Comparative Examples 1, 3, and 4 were pattern-printed on a circuit-formed FR-4 substrate by screen printing so that the dry coating thickness was about 40 m, at 150 ° C. Cured for 60 minutes.
- the photocurable compositions of Example 2 and Comparative Examples 2, 5, and 6 were subjected to screen printing on a FR-4 substrate on which a circuit was formed so that the dried coating film had a thickness of about 40 ⁇ m, and a metal halide was formed.
- the lamp was cured by irradiating an integrated light amount of 2j / cm 2 at a wavelength of 350 nm.
- the obtained substrate was immersed in propylene glycol monomethyl ether acetate for 30 minutes, dried, and then subjected to a peel test using a cellophane adhesive tape to evaluate the peeling and discoloration of the coating film.
- thermosetting compositions of Example 1 and Comparative Examples 1, 3, and 4 were screen printed on the FR-4 substrate on which the IPC standard B pattern comb-shaped electrode was formed, so that the dry film thickness was about 40 ⁇ m. To Turn printed and cured at 150 ° C for 60 minutes.
- the photocurable compositions of Example 2 and Comparative Examples 2, 5, and 6 were screen-printed on a FR-4 substrate on which an IPC standard B pattern comb-shaped electrode was formed. The pattern was printed in such a way that it was cured by irradiating an integrated light quantity of 2j / cm 2 at a wavelength of 350 nm with a metalno and ride lamp. The insulation resistance value between the electrodes of the obtained substrate was measured at an applied voltage of 500V.
- the thermal conductivity exceeds 2 WZm′K in both thermosetting and photocuring, and A cured product having sufficient characteristics as a heat-resistant insulating material for printed wiring boards can be obtained.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005234154A JP4920929B2 (ja) | 2005-08-12 | 2005-08-12 | ソルダーレジスト組成物、及びその硬化物並びにそれを用いたプリント配線板 |
| JP2005-234154 | 2005-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007020793A1 true WO2007020793A1 (ja) | 2007-02-22 |
Family
ID=37757458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2006/315164 WO2007020793A1 (ja) | 2005-08-12 | 2006-07-31 | 絶縁性硬化性組成物、及びその硬化物並びにそれを用いたプリント配線板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4920929B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20080035619A (enrdf_load_stackoverflow) |
| CN (1) | CN101238760A (enrdf_load_stackoverflow) |
| TW (1) | TW200738075A (enrdf_load_stackoverflow) |
| WO (1) | WO2007020793A1 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006722A (zh) * | 2010-11-15 | 2011-04-06 | 中山市格普斯纳米电热科技有限公司 | 快速散热线路板 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011037986A (ja) * | 2009-08-11 | 2011-02-24 | Taiyo Holdings Co Ltd | 光硬化性ペースト及びその硬化物 |
| CN102958269A (zh) * | 2011-08-31 | 2013-03-06 | 冠品化学股份有限公司 | 导热软质印刷电路板结构 |
| JP5458215B1 (ja) * | 2013-03-11 | 2014-04-02 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板 |
| KR101792755B1 (ko) | 2014-10-28 | 2017-11-01 | 주식회사 엘지화학 | 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트 |
| WO2020105215A1 (ja) * | 2018-11-20 | 2020-05-28 | 太陽インキ製造株式会社 | 高耐電圧放熱絶縁性樹脂組成物、およびそれを用いた電子部品 |
| CN115141460B (zh) * | 2021-03-30 | 2023-09-01 | 太阳油墨（苏州）有限公司 | 热固性树脂组合物、固化物以及电子部件 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09207270A (ja) * | 1996-01-31 | 1997-08-12 | Matsushita Electric Works Ltd | 金属箔、プリプレグ及び紙基材積層板 |
| JP2001348488A (ja) * | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品 |
| JP2003268076A (ja) * | 2002-03-18 | 2003-09-25 | Toppan Printing Co Ltd | 感光性樹脂組成物およびそれを用いたプリント配線板 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0940751A (ja) * | 1995-07-27 | 1997-02-10 | Taiyo Ink Mfg Ltd | 耐衝撃性絶縁樹脂組成物 |
| JP3505170B2 (ja) * | 1996-10-09 | 2004-03-08 | 松下電器産業株式会社 | 熱伝導基板及びその製造方法 |
| JP3614844B2 (ja) * | 1996-10-09 | 2005-01-26 | 松下電器産業株式会社 | 熱伝導基板 |
| JP3346263B2 (ja) * | 1997-04-11 | 2002-11-18 | イビデン株式会社 | プリント配線板及びその製造方法 |
| JP2002171050A (ja) * | 1997-04-11 | 2002-06-14 | Ibiden Co Ltd | プリント配線板 |
| JPH1146049A (ja) * | 1997-07-25 | 1999-02-16 | Matsushita Electric Ind Co Ltd | 放熱性樹脂基板およびその製造方法 |
| JP3581268B2 (ja) * | 1999-03-05 | 2004-10-27 | 株式会社東芝 | ヒートシンク付半導体装置およびその製造方法 |
| JP3921630B2 (ja) * | 2000-04-05 | 2007-05-30 | 株式会社日立製作所 | エポキシ樹脂複合材料及びそれを用いた装置 |
| JP2002179886A (ja) * | 2000-12-15 | 2002-06-26 | Nagase Chemtex Corp | 高熱伝導性エポキシ樹脂組成物、該組成物からなるシート状物および該シート状物からなる高熱伝導性基板 |
| JP2003213089A (ja) * | 2002-01-28 | 2003-07-30 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP4280200B2 (ja) * | 2003-05-19 | 2009-06-17 | 株式会社日本触媒 | 放熱材用樹脂組成物 |
| JP3908198B2 (ja) * | 2003-05-29 | 2007-04-25 | ナミックス株式会社 | 層間絶縁膜用樹脂組成物 |
| JP4231748B2 (ja) * | 2003-07-10 | 2009-03-04 | 太陽インキ製造株式会社 | プリント配線基板用プリプレグ及びそれを用いて作製された多層プリント配線板 |
| JP2005146229A (ja) * | 2003-11-20 | 2005-06-09 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
-
2005
- 2005-08-12 JP JP2005234154A patent/JP4920929B2/ja not_active Expired - Lifetime
-
2006
- 2006-07-31 CN CNA2006800286981A patent/CN101238760A/zh active Pending
- 2006-07-31 WO PCT/JP2006/315164 patent/WO2007020793A1/ja active Application Filing
- 2006-07-31 KR KR1020087003264A patent/KR20080035619A/ko not_active Ceased
- 2006-08-07 TW TW095128862A patent/TW200738075A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09207270A (ja) * | 1996-01-31 | 1997-08-12 | Matsushita Electric Works Ltd | 金属箔、プリプレグ及び紙基材積層板 |
| JP2001348488A (ja) * | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品 |
| JP2003268076A (ja) * | 2002-03-18 | 2003-09-25 | Toppan Printing Co Ltd | 感光性樹脂組成物およびそれを用いたプリント配線板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006722A (zh) * | 2010-11-15 | 2011-04-06 | 中山市格普斯纳米电热科技有限公司 | 快速散热线路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI331489B (enrdf_load_stackoverflow) | 2010-10-01 |
| JP4920929B2 (ja) | 2012-04-18 |
| KR20080035619A (ko) | 2008-04-23 |
| CN101238760A (zh) | 2008-08-06 |
| TW200738075A (en) | 2007-10-01 |
| JP2007049064A (ja) | 2007-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5089885B2 (ja) | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 | |
| CN105549324B (zh) | 光固化和热固化树脂组合物和干膜型阻焊剂 | |
| WO2011024719A1 (ja) | 異方性導電材料、接続構造体及び接続構造体の製造方法 | |
| WO2007020793A1 (ja) | 絶縁性硬化性組成物、及びその硬化物並びにそれを用いたプリント配線板 | |
| JP4864545B2 (ja) | フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法 | |
| WO2006129663A1 (ja) | 硬化性樹脂組成物及びその硬化物 | |
| JP5735238B2 (ja) | インクジェット用硬化性組成物及びプリント配線板の製造方法 | |
| CN117120553A (zh) | 固化性树脂组合物 | |
| JP4673931B2 (ja) | 異方性導電材料及び接続構造体 | |
| TWI819033B (zh) | 高耐電壓散熱絕緣性樹脂組成物，及使用其之電子零件 | |
| JP5884477B2 (ja) | 半導体装置の製造方法、それにより得られる半導体装置及びそれに用いる熱硬化性樹脂組成物 | |
| JP2012188463A (ja) | 半導体用接着剤組成物、半導体装置及び半導体装置の製造方法 | |
| TWI813658B (zh) | 散熱絕緣性樹脂組成物及使用其之印刷配線板 | |
| JP2011071107A (ja) | 接続構造体の製造方法及び異方性導電材料 | |
| JP2012167268A (ja) | インクジェット用硬化性組成物及び電子部品の製造方法 | |
| JP4713948B2 (ja) | 硬化性樹脂組成物及びその硬化物 | |
| JP5719206B2 (ja) | 硬化性組成物及び接続構造体 | |
| JP2016028143A (ja) | インクジェット用硬化性組成物及びプリント配線板の製造方法 | |
| JP5879416B2 (ja) | インクジェット用硬化性組成物 | |
| JP2013213221A (ja) | インクジェット用硬化性組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200680028698.1 Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 1020087003264 Country of ref document: KR |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 06782042 Country of ref document: EP Kind code of ref document: A1 |