WO2007004619A1 - 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びプラズマディスプレイパネル用隔壁の製造方法。 - Google Patents
感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びプラズマディスプレイパネル用隔壁の製造方法。 Download PDFInfo
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- WO2007004619A1 WO2007004619A1 PCT/JP2006/313245 JP2006313245W WO2007004619A1 WO 2007004619 A1 WO2007004619 A1 WO 2007004619A1 JP 2006313245 W JP2006313245 W JP 2006313245W WO 2007004619 A1 WO2007004619 A1 WO 2007004619A1
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- photosensitive layer
- carbon atoms
- resist pattern
- photosensitive
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/36—Spacers, barriers, ribs, partitions or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
- H01J9/242—Spacers between faceplate and backplate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
- Y10S430/121—Nitrogen in heterocyclic ring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/127—Spectral sensitizer containing
Definitions
- Photosensitive resin composition photosensitive element using the same, resist pattern forming method, printed wiring board manufacturing method, and plasma display panel partition manufacturing method.
- the present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for forming a resist pattern, a method for manufacturing a printed wiring board, and a method for manufacturing a partition for a plasma display panel.
- a photosensitive resin composition As a resist material used for etching treatment, a photosensitive resin composition, or a photosensitive resin composition, which is laminated on a support and covered with a protective film, is used in the manufacturing technology of printed wiring boards. Photosensitive elements are widely used.
- a photosensitive element is made to adhere to a photosensitive resin composition layer (hereinafter referred to as a photosensitive layer) on a circuit forming substrate such as a copper substrate.
- Laminate laminate, etc.
- irradiate actinic rays to photocure pattern exposure
- the photocurable resin composition is photocured with
- the resist pattern is formed by removing (developing).
- a method is generally used in which a circuit forming substrate for forming a resist pattern is etched or plated to form a pattern, and then the photocured portion of the photosensitive resin composition is peeled off from the substrate. is there.
- PDP plasma display panel
- a color PDP having a fine and large number of display cells has received much attention.
- a front glass substrate and a back glass substrate are arranged in parallel and facing each other, and a partition wall is provided between the two while maintaining a constant interval.
- P The DP has a structure that discharges in a space surrounded by the front glass substrate, the rear glass substrate, and the barrier ribs. In such a space, an electrode for display, a dielectric layer, a phosphor and the like are attached. Then, the phosphor is caused to emit light by the ultraviolet rays generated by the sealed gas column by the discharge, and this light can be visually recognized by the observer.
- the partition wall has a width of 20 to 80 / ⁇ ⁇ and a height of 60 to 200. It has the shape of / ⁇ ⁇ .
- a sand blast method As a method for forming the partition walls, a sand blast method, a screen printing method, a photosensitive paste method, a photo embedding method, a mold transfer method and the like are mainly used. Recently, a new formation method using a wet etching process has been proposed.
- the barrier ribs are manufactured, for example, a barrier rib material layer is formed on a back glass substrate on which electrodes are formed, and the photosensitive element of the photosensitive element is laminated on the barrier rib material layer so as to adhere to the barrier rib material layer. Then, the photosensitive resin composition is photocured (pattern exposure) by irradiating with actinic rays, and then the photosensitive resin composition is photocured and then removed. A resist pattern is formed by (development). Finally, a method is generally used in which the barrier rib material layer is etched using the resist pattern as a mask to form the barrier rib pattern, and then the resist pattern is peeled off.
- a mercury lamp has been mainly used as a light source for pattern exposure of a photosensitive layer.
- mercury lamp light contains ultraviolet rays that are harmful to the human body, and there was a problem with work safety.
- an exposure method that uses a visible light laser as a light source. This method requires a resist sensitive to visible light, and this resist has to be handled in a dark room or under a red lamp.
- actinic rays that have been cut by 99.5% using a filter with light having a wavelength of 365 nm or less among the light that can also emit light from a mercury lamp have been proposed.
- a long-lived, high-power gallium nitride blue laser light source that oscillates light having a wavelength of 405 nm has been proposed.
- DLP Digital Light Processing
- This exposure method also uses water as a light source.
- Silver light source power Of the emitted light light with a wavelength of 365 nm or less can use an active light source that is 99.5% cut using a filter or a blue laser light source.
- Non-Patent Document 1 Electronics Packaging Technology June 2002 p. 74- 79
- conventional photosensitive elements are designed to exhibit optimum photosensitive characteristics for all wavelengths of a mercury lamp light source centered on light having a wavelength of 365 nm. Therefore, when it is intended to perform pattern exposure using light having a peak in the wavelength range of 350 nm or more and less than 440 nm, the photosensitive element for light having a peak in the wavelength range of 350 nm or more and less than 440 nm is used.
- the sensitivity is low. Therefore, when forming a resist pattern, sufficient resolution with a low throughput and a good resist shape could not be obtained.
- the present invention provides a photosensitive resin composition capable of forming a resist pattern with light having a peak in a wavelength range of 350 nm or more and less than 440 nm with sufficient sensitivity and resolution, and uses the same. It is an object of the present invention to provide a photosensitive element, a resist pattern forming method, a printed wiring board manufacturing method, and a plasma display panel partition manufacturing method.
- the present inventors have found that the above problems can be solved by a photosensitive resin composition containing a specific amount of a specific component, and have completed the present invention.
- the photosensitive resin composition according to the present invention comprises (A) a binder polymer, (B) a photopolymerizable compound having a polymerizable ethylenically unsaturated bond, and (C) 2, 4, 5 —A photo-radical polymerization initiator containing a triarylimidazo monomer or a derivative thereof, and (D) a compound represented by the following general formula (1).
- R 1 and R 2 are each independently an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 5 to 12 carbon atoms, a phenol group, a benzyl group, or 2 carbon atoms.
- R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , and 1 () are each independently a hydrogen atom, carbon number
- the alkyl group having 1 to 20 carbon atoms may be substituted with a hydroxyl group that may have an oxygen atom between main chain carbon atoms.
- the cycloalkyl group having 5 to 12 carbon atoms may be substituted with a hydroxyl group which may have an oxygen atom in the ring.
- the phenol group in R 1 and R 2 includes an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, a halogen atom, a cyan group, a carboxyl group, a phenol group, an alkoxy group having 1 to 6 carbon atoms, a phenoxy group.
- a group, and an alkoxycarbo group having 2 to 6 carbon atoms may be substituted with one or more groups selected from the group consisting of Z and atoms.
- the benzyl group includes an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, a phenol group, an alkoxy group having 1 to 6 carbon atoms, a phenoxy group, and 2 to 6 carbon atoms. It may be substituted with one or more groups selected from the group consisting of alkoxycarbo groups and Z or atoms.
- the benzoyl group includes an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, a halogen atom, a cyan group, a carboxyl group, a phenol group, an alkoxy group having 1 to 6 carbon atoms, a phenoxy group, and an alkoxy group having 2 to 6 carbon atoms.
- Carbon group may be substituted with one or more groups selected from the group consisting of Z and atoms.
- the photosensitive element of the present invention comprises a support and a photosensitive layer made of the photosensitive resin composition formed on the support.
- a conventional photosensitive element has low sensitivity and resolution with respect to light having a peak in a wavelength range of 390 nm or more and less than 440 nm. This is the conventional photosensitive element
- the optical density of the photosensitive element in the wavelength region is small, that is, the light in the wavelength region cannot be sufficiently absorbed, and it is difficult to initiate polymerization of the (B) photopolymerizable compound in the photosensitive element. Due mainly to.
- One of the features of the photosensitive resin composition according to the present invention is that it contains (D) a specific amount of the compound represented by the general formula (1).
- the photosensitive element according to the present invention is composed of a photosensitive layer containing a specific amount of the compound represented by (D) -general formula (1).
- the compound (D) represented by the general formula (1) contained in the photosensitive element has a large light absorption property with respect to light having a wavelength of 390 nm or more and less than 440 nm. Therefore, when light having a peak in the wavelength range of 390 nm or more and less than 440 nm is used as exposure light, sufficient sensitivity, resolution, and good resist shape can be obtained.
- the compound represented by (D) -general formula (1) contained in the photosensitive element has a large light absorption property even for light having a wavelength of 350 nm or more and less than 390 nm. Therefore, sufficient sensitivity, resolution, and good resist shape can be obtained even when light of all wavelengths of a mercury lamp light source centered on 365 nm wavelength light is used as exposure light.
- R 1 and R 2 represent an alkyl group having 1 to 4 carbon atoms, and R 3 to R 1G are Even a hydrogen atom! /.
- the photosensitive resin composition is useful for forming a resist pattern by exposure to light having a peak in a wavelength range of 350 nm or more and less than 440 nm.
- the resist pattern forming method of the present invention includes a photosensitive layer forming step of forming a photosensitive layer comprising a photosensitive resin composition on a substrate, and a predetermined portion of the photosensitive layer having a wavelength of 350 nm or more and less than 440 nm. And an exposure step of exposing to light having a peak within the range, and a development step of developing the exposed photosensitive layer to form a resist pattern.
- the resist pattern forming method of the present invention includes a photosensitive layer forming step of laminating a photosensitive layer of a photosensitive element on a substrate, and a predetermined portion of the photosensitive layer has a peak within a wavelength range of 350 nm or more and less than 440 nm.
- the method for producing a printed wiring board of the present invention comprises a photosensitive layer forming step of forming a photosensitive layer comprising a photosensitive resin composition on a substrate, and a predetermined portion of the photosensitive layer of 350 nm or more and less than 440 nm.
- the printed wiring board manufacturing method of the present invention includes a photosensitive layer forming step of laminating a photosensitive layer of a photosensitive element on a substrate, and a predetermined portion of the photosensitive layer within a wavelength range of 350 nm or more and less than 440 nm.
- the method for producing a partition for a plasma display panel of the present invention comprises a photosensitive layer forming step of forming a photosensitive layer comprising a photosensitive resin composition on a substrate, and a predetermined portion of the photosensitive layer having a wavelength of 350 nm or more and less than 440 nm.
- the method for producing a partition for a plasma display panel of the present invention comprises a photosensitive layer forming step of laminating a photosensitive layer of a photosensitive element on a substrate, and a predetermined portion of the photosensitive layer within a wavelength range of 350 nm or more and less than 44 Onm.
- a photosensitive resin composition capable of forming a resist pattern with light having a peak in a wavelength range of 350 nm or more and less than 440 nm with sufficient sensitivity and resolution, and A photosensitive element, a resist pattern forming method, a printed wiring board manufacturing method, and a plasma display panel partition manufacturing method using the same are provided.
- FIG. 1 is a schematic cross-sectional view showing an embodiment of a photosensitive element according to the present invention. Explanation of symbols
- the photosensitive resin composition of the present invention comprises (A) a binder polymer (hereinafter referred to as “component (A)”) and (B) a photopolymerizable polymer having a polymerizable ethylenically unsaturated bond.
- component (B) a binder polymer
- component (C) a photo radical polymerization initiator
- component (D) a compound represented by the above general formula (1)
- the component (A) of the present invention is not particularly limited as long as it is a photocurable polymer together with a photopolymerizable compound described later.
- the component (A) for example, an acrylic resin, a styrene resin, an epoxy resin, an amide resin, an amide epoxy resin containing (meth) acrylic acid and (meth) alkyl acrylate as structural units.
- examples thereof include organic polymers such as fat, alkyd series, phenol series, etc.
- the component (A) is preferably obtained by polymerizing a monomer (polymerizable monomer) having an ethylenically unsaturated double bond (such as radical polymerization). From the viewpoint of improving developability and peelability, an acrylic resin containing (meth) acrylic acid and (meth) alkyl acrylate as structural units is more preferable.
- Examples of such a monomer having an ethylenically unsaturated double bond include styrene; butyltoluene, ⁇ -methylstyrene, ⁇ -methylstyrene, ⁇ -ethylstyrene, ⁇ -methoxystyrene, ⁇ —Polystyrene derivatives such as ethoxystyrene, ⁇ -chlorostyrene, ⁇ -bromostyrene; acrylamides such as diacetone acrylamide; acrylonitrile; esters of butyl alcohol such as beluo ⁇ -butyl ether; (meth) acrylic acid Alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid jetylaminoethyl ester, (meth) acrylic acid glycidyl ester,
- (meth) acrylic acid means acrylic acid or methacrylic acid corresponding to it
- (meth) acrylate refers to acrylate or metatarate corresponding to (meth) attaroyl.
- the group means an taliloyl group or a corresponding methacryloyl group.
- Examples of the above (meth) acrylic acid alkyl ester include compounds represented by the following general formula (2) and compounds in which an alkyl group of these compounds is substituted with a hydroxyl group, an epoxy group, a halogen atom, or the like. Etc.
- R 11 represents a hydrogen atom or a methyl group
- R 12 represents an alkyl group having 1 to 12 carbon atoms.
- examples of the alkyl group having 1 to 12 carbon atoms represented by R 12 in the general formula (2) include, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group. , Heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, and structural isomers thereof.
- Examples of the compound represented by the general formula (2) include (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid propyl ester, (meth) acrylic acid butyl ester, and (meth) acrylic acid.
- Examples include acid pentyl ester, (meth) acrylic acid hexyl ester, (meth) acrylic acid heptyl ester, (meth) acrylic acid octyl ester, and (meth) acrylic acid 2-ethylhexyl ester. These can be used alone or in combination of two or more.
- the binder polymer as component (A) is preferably one or more of polymers having a carboxyl group.
- a (A) binder polymer can be produced, for example, by radical polymerization of a polymerizable monomer having a carboxyl group and another polymerizable monomer.
- the noder polymer as the component (A) is styrene or It is preferable to contain a styrene derivative as a polymerizable monomer.
- the content of styrene or styrene derivative in the component (A) is preferably 3 to 30% by mass based on the total mass of the molecule. 4 to 28% by mass is more preferable and 5 to 27% by mass is particularly preferable. If the content is less than 3% by mass, the adhesion tends to be inferior. On the other hand, if it exceeds 30% by mass, the peel piece tends to be large and the peel time tends to be long.
- the "styrene derivative" in the present invention is a styrene derivative in which a hydrogen atom in styrene is substituted with a substituent (such as an organic group of an alkyl group or a halogen atom)! Uh.
- a substituent such as an organic group of an alkyl group or a halogen atom
- the binder polymer as the component (A) is used alone or in combination of two or more.
- the binder polymer used in combination of two or more types include, for example, two or more types of binder polymers having different copolymer component forces, two or more types of binder polymers having different weight average molecular weights, and two or more types of binder polymers having different degrees of dispersion. Examples include binder polymers.
- a polymer having a multimode molecular weight distribution described in JP-A-11-327137 can also be used.
- the weight average molecular weight (Mw) and number average molecular weight (Mn) of the binder polymer as component (A) can be measured by gel permeation chromatography (GPC) (using standard polystyrene). Conversion based on a calibration curve).
- the Mw of the binder polymer is preferably a force S of 5000-300000, more preferably 20000-150000, and a force S of 25000-60000 is particularly preferred.
- Mw is less than 5,000, the developer resistance tends to decrease. On the other hand, when it exceeds 300,000, the development time tends to be longer.
- the binder polymer as the component (A) preferably has a dispersity (MwZMn) of 1.0 to 3.0, more preferably 1.0 to 2.0. If the degree of dispersion exceeds 3.0, the adhesion and resolution tend to decrease.
- MwZMn dispersity
- the content of the component (A) is preferably 30 to 70 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferable. This content When the amount is less than 20 parts by mass, the photocured portion of the photosensitive layer tends to become brittle, and when used as a photosensitive element, the coating property tends to be inferior. On the other hand, when the content exceeds 80 parts by mass, the photosensitivity tends to be insufficient.
- the photopolymerizable compound having an ethylenically unsaturated bond polymerizable in the molecule as component (B) (hereinafter referred to as “photopolymerizable compound”) will be described.
- the component (B) of the present invention is not particularly limited as long as it is a photopolymerizable compound having an ethylenically unsaturated bond polymerizable in the molecule, and examples thereof include the following photopolymerizable compounds. .
- a photopolymerizable compound having one polymerizable ethylenically unsaturated bond in the molecule and two or more polymerizable compounds in the molecule is preferable to use in combination with a photopolymerizable compound having a styrene unsaturated bond.
- the photopolymerizable compound as the component (ii) is a bisulfanol-based (meth) attareito toy compound or a urethane in the molecule from the viewpoint of resistance to adhesion and adhesion. It is preferable to contain a (meth) atareto toy compound having a bond as an essential component.
- the bisphenol A-based (meth) atalytoi compound is a carbon-carbon unsaturated double bond derived from a (meth) attalyloyl group or a (meth) attaroyl group, and bisphenol.
- Examples of the compound obtained by reacting the polyhydric alcohol with a, j8-unsaturated carboxylic acid include, for example, polyethylene glycol di (meth) acrylate having 2 to 14 ethylene groups and propylene.
- EO represents ethylene oxide
- PO represents propylene oxide
- PO-modified compounds have a propylene oxide group block structure.
- Examples of the bisphenol A-based (meth) attareito toy compound include 2, 2 bis (4
- Examples of the above 2,2bis (4 ((meth) atalyloxypolyethoxy) phenol) propane include 2,2bis (4-(((meth) atalyoxydiethoxy) phenol) propane, 2, 2 Bis (4 — (((meth) Ataryloxytriethoxy) phenol) propane, 2, 2 Bis (4 — (((Meth) Atarioxyxyethoxy) phenol) propane, 2, 2 Bis (4— (((Meth) Athaloxypentaethoxy) phenol) propane, 2, 2 bis (4 — (((Meth) Atalyloxyhexaethoxy) phenol) propane, 2, 2 bis (4— ((Meth) acryloxy Heptaethoxy) phenol) propane, 2, 2 bis (4-((meth) ataryloxytataethoxy) phenol) propane, 2,2 bis (4 — ((meth) atalyloxynonethoxy) ) Propane, 2, 2 Bis (4 ((Meth) Atari mouth oxidizer force Et)
- BPE-500 product name, manufactured by Shin-Nakamura Chemical Co., Ltd.
- Bis (4- (methacryloxypentadecaethoxy) phenyl) propane is commercially available as BPE-1300 (product name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
- the number of ethylene oxide groups (EO groups) in one molecule of the above 2,2bis (4 ((meth) atalyloxypolyethoxy) phenol) propane is preferably 4-20, More preferably, it is 15. These may be used alone or in any combination of two or more.
- Examples of the (meth) atalytoi compound having a urethane bond in the molecule include, for example, a (meth) acrylic monomer having an OH group at the ⁇ -position and a diisocyanate compound (isophorone disulfonate).
- Examples of the EO-modified urethane di (meth) acrylate include UA-11 (manufactured by Shin-Nakamura Engineering Co., Ltd., product name). Examples of the EO, PO-modified urethane di (meth) acrylate include UA-13 (product name, manufactured by Shin-Nakamura Engineering Co., Ltd.). These may be used alone or in combination of two or more.
- Examples of the norphenoxypolyethyleneoxy tartrate include, for example, norphenoxytetraethyleneoxytalylate, nourphenoxypentaethyleneoxytalylate, noulphenoxyhexaethyleneoxyloxy. Atalylate, Noyulphenoxyheptaethylene Nyleneoxytalylate, Noyulphenoxyoctaethyleneoxytalylate, Noyulfe Nonoxynonaethyleneoxytalarate, Noyulphenoxydecaethyleneoxytalate, Noyulphenoxy Nde force ethylene oxide tartrate. These may be used alone or in combination of two or more.
- Examples of the phthalic acid compounds include g-chloro-b hydroxypropyl b '(meth) a Examples thereof include acryloyloxychetil o o phthalate, b hydroxyalkyl b '(meth) attaoxy oxyalkyl o phthalate, and the like. These may be used alone or in combination of two or more.
- the content of the component (B) is preferably 30 to 70 parts by mass, preferably 20 to 80 parts by mass, with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferable.
- the content is less than 20 parts by mass, the photosensitivity of the photosensitive resin composition tends to be insufficient.
- this content exceeds 80 parts by mass, the photocured portion of the photosensitive layer tends to become brittle, and when used as a photosensitive element, the coating properties tend to be inferior.
- the photopolymerization initiator as the component (C) will be described.
- the photopolymerization initiator may be any compound that starts and Z or accelerates the photopolymerization of the above-mentioned photopolymerizable compound, and functions as a so-called sensitizer. May be.
- Examples of the component (C) of the present invention include 4,4, -bis (jetylamine) benzophenone, benzophenone, 2-benzyl-1-dimethylamino-1- (4-morpholinophenol) butanone 1, 2 —Methyl-1 [4 (methylthio) phenol] 2 Morpholinopropanone 1
- Aromatic ketone such as 1; Quinones such as alkyl anthraquinone; Benzoin compounds such as benzoin and alkylbenzoin; Benzoin ether such as benzoin alkyl ether Compound; Benzyl derivatives such as benzyl dimethyl ketal; 2— (o black mouth phenol) 4,5 diphenyl imidazolidone dimer, 2— (o black mouth phenyl) —4,5 di (methoxy phenol) ) Imidazole dimer, 2— (o Fluorophenol) —4,5 Diphenyl-Louimidazolunimer, 2 -——
- the component (C) of the present invention includes a 2, 4, 5 triarylimidazole dimer or a derivative thereof.
- These photopolymerization initiators (sensitizers) can be used alone or in combination of two or more. Used together.
- a coumarin compound is used as the component (C) other than the 2,4,5-triarylimidazole dimer or its derivative to be combined with the component (D) described later. It is preferable.
- the content of 2,4,5-triarylimidazole dimer and its derivative as component (C) is 0.1% relative to 100 parts by mass of the total amount of component (A) and component (B). It is more preferably 1 to 10 parts by mass, and even more preferably 0.5 to 6 parts by mass, even more preferably 1 to 4 parts by mass. If the content is less than 0.1 parts by mass, the adhesion and sensitivity tend to be insufficient, and if it exceeds 10 parts by mass, the curability of the resist bottom tends to be lowered.
- R 1 and R 2 are each independently an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 5 to 12 carbon atoms, a phenol group, a benzyl group, or 2 carbon atoms.
- R 3 to R 1G are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a halogen atom, a cyano group, a carboxyl group, a phenol group, an alkoxycarbo group having 2 to 6 carbon atoms or a benzoyl group.
- the alkyl group having 1 to 20 carbon atoms may be substituted with a hydroxyl group that may have an oxygen atom between main chain carbon atoms.
- the cycloalkyl group having 5 to 12 carbon atoms may be substituted with a hydroxyl group which may have an oxygen atom in the ring.
- the phenol group in R 1 and R 2 is an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, a phenol group, an alkoxy group having 1 to 6 carbon atoms, It may be substituted with one or more groups selected from the group consisting of a phenoxy group and an alkoxycarbo group having 2 to 6 carbon atoms, and Z or an atom.
- the benzyl group is an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, a nitrogen atom, a cyan group, a carboxyl group, a phenol group, an alkoxy group having 1 to 6 carbon atoms, a fluorine group. It may be substituted with one or more groups and / or atoms selected from the group consisting of an enoxy group and an alkoxycarbo group having 2 to 6 carbon atoms.
- the benzoyl group includes an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, a halogen atom, a cyan group, a carboxyl group, a phenol group, an alkoxy group having 1 to 6 carbon atoms, a phenoxy group, and an alkoxy group having 2 to 6 carbon atoms.
- Carbon substituents may be substituted with one or more groups selected from the group consisting of Z and atoms.
- the photosensitive resin composition of the present invention is exposed to light having a peak in a wavelength range of 350 nm or more and less than 440 nm to form a resist pattern. Useful.
- R 1 and R 2 in the component (D) include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group.
- Examples of the combination of R 1 and R 2 include a combination of ethyl groups, a combination of propyl groups, and a combination of butyl groups.
- R 3 to R 1C for example, a hydrogen atom, a methyl group, Echiru group, propyl group, butyl group, a pentyl group, a hexyl group, propenyl - group, Buteyuru group, pent - group, Examples include a hexyl group, a heptul group, an ethoxycarbol group, a hydroxyethoxycarboro group, or a phenoxy group.
- R 3 to R 1C are all combinations of hydrogen atoms; any one of them is a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a propenyl group, or a butenyl group.
- a pentenyl group, a hexenyl group, a heptenyl group, an ethoxycarbonyl group, a hydroxyethoxycarbon group, or a phenoxy group, and all the others are hydrogen atoms; any two of them are a methyl group, ethyl Group, propyl group, butyl group, pentyl group, hexyl group, probe group, butur group, pentyl group, hexyl group, heptul group, ethoxycarbonyl group, hydroxyethoxycarboro group , Or a phenoxy group, or a combination of these, and all the others are hydrogen atoms.
- Specific examples of the compound represented by the general formula (1) as the component (D) include 9, 10-dimethoxyanthracene, 9, 10-jetoxyanthracene, 9, 10-dibutoxyanthracene, and the like. Is mentioned.
- the content of component (D) is from 0.01 to 0.1 parts per 100 parts by mass of the total amount of component (A) and component (B). It is preferably 10 parts by mass, more preferably 0.05 to 5 parts by mass, and particularly preferably 0.1 to 2 parts by mass. If the content is less than 0.01 parts by mass, good sensitivity and resolution tend not to be obtained, and if it exceeds 10 parts by mass, a good pattern shape tends not to be obtained.
- the photosensitive resin composition of the present invention may contain components other than the components (A) to (D) described above, if necessary.
- components include photopolymerizable compounds having at least one cation-polymerizable cyclic ether group (such as oxetane compounds) in the molecule, cationic polymerization initiators, dyes such as malachite green, tribromophenolsulfone, and leucocris.
- Photo-coloring agents such as tar violet, thermal color-preventing agents, plasticizers such as p-toluenesulfonamide, pigments, fillers, antifoaming agents, flame retardants, stabilizers, adhesion-imparting agents, leveling agents, peeling accelerating Examples include accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents and the like. These should just be added to such an extent that the achievement of the object of the present invention is not inhibited.
- the amount of these components added can be about 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B). These may be used alone or in combination of two or more.
- the photosensitive resin composition of the present invention includes a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cetyl sorb, ethyl cetyl sorb, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether, and the like.
- a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cetyl sorb, ethyl cetyl sorb, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether, and the like.
- a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cetyl sorb, ethyl cetyl sorb, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether, and the like.
- it can be dissolved in these mixed solvents
- the above coating solution may be used to form a photosensitive layer of a photosensitive element by applying and drying on a support film described later.
- a metal plate for example, copper
- an iron-based alloy such as a copper-based alloy, nickel, chromium, iron, and stainless steel, preferably copper, copper-based alloy, or iron-based alloy, dried, and then coated with a protective film. May be.
- FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of the photosensitive element of the present invention.
- a photosensitive element 1 shown in FIG. 1 includes a support film 10 and a photosensitive layer 14 formed on the support film 10 and having a photosensitive resin composition strength. There is a protective film ( Not shown. ) May be further provided.
- the support film 10 for example, a polymer film having heat resistance and solvent resistance such as polyethylene terephthalate, polypropylene, polyethylene, and polyester can be used.
- the thickness of the support film 10 is preferably 1 to: LOO / zm. If the thickness is less than 5 m, the support film 10 tends to be broken when the support film 10 is peeled off before development, and if it exceeds 25 m, the resolution tends to decrease.
- One support film 10 may be laminated on both sides of the photosensitive layer 14 as one support for the photosensitive layer 14 and the other as a protective film for the photosensitive resin composition.
- the protective film for example, a polymer film having heat resistance and solvent resistance, such as polyethylene terephthalate, polypropylene, polyethylene, and polyester can be used.
- commercially available products include, for example, product names “Alphan MA-410” and “E-200C” manufactured by Oji Paper Co., Ltd., polypropylene films manufactured by Shin-Etsu Film Co., Ltd., and product names “PS-25” manufactured by Teijin Limited.
- the power of polyethylene terephthalate film such as PS series is not limited to these.
- the thickness of the protective film is 1 to: LOO / zm is preferably 5 to 50 / ⁇ ⁇ , more preferably 5 to 30 m. S Further preferred 15-30 Particularly preferred is ⁇ m.
- the protective film preferably has a smaller adhesive strength between the light-sensitive layer 14 and the protective film than the adhesive strength between the photosensitive layer 14 and the support film 10, and is preferably a low fish film.
- Fisheye is a material in which foreign materials, undissolved materials, degradation products of oxidation, etc. are taken into the film when the film is manufactured by melting, kneading, extruding, biaxial stretching, casting, etc. Is.
- the photosensitive layer 14 is strong after dissolving the photosensitive resin composition of the present invention in a solvent as described above to obtain a solution (coating solution) having a solid content of about 30 to 60% by mass. It is preferably formed by applying a solution (coating solution) on the support film 10 and drying.
- the coating can be performed by a known method using, for example, a roll coater, comma coater, gravure coater, air knife coater, die coater, bar coater or the like. Also, the above drying is 70-150 It can be performed at ° C for 5-30 minutes.
- the amount of the remaining organic solvent in the photosensitive resin composition is preferably 2% by mass or less with respect to the total amount of the photosensitive resin composition, from the viewpoint of preventing diffusion of the organic solvent in the subsequent step. .
- the thickness of the photosensitive layer 14 varies depending on the application.
- the thickness after drying is preferably 1 to: LOO m, more preferably 1 to 50 / ⁇ ⁇ . If the thickness is less than 1 m, there is a tendency that it is difficult to apply industrially.
- the photosensitive layer 14 has an absorbance of 0.
- 1 to 3 is preferred 0.15 to 2 is more preferred 0.2 to 1.5 is particularly preferred.
- the absorbance can be measured with a UV spectrometer, and examples of the UV spectrometer include a 228A type (product name, manufactured by Hitachi, Ltd.) W beam spectrophotometer.
- the photosensitive element 1 may further include an intermediate layer such as a cushion layer, an adhesive layer, a light absorption layer, and a gas barrier layer. Further, the obtained photosensitive element 1 can be stored in a sheet form or wound around a core in a roll form. At this time, it is preferable that the support is wound up so as to be on the outermost side. It is preferable that a moisture-proof end face separator is installed on the end face of the roll-shaped photosensitive element 1 roll from the viewpoint of edge resistance, in which it is preferable to install an end face separator for protecting the end face. Further, as a packing method, it is preferable to wrap and package in a black sheet with low moisture permeability.
- the core examples include plastics such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, ABS resin (acrylonitrile-butadiene-styrene copolymer), and the like. .
- the first resist pattern forming method includes a photosensitive layer forming step of forming a photosensitive layer made of a photosensitive resin composition on a circuit forming substrate, and a predetermined portion of the photosensitive layer within a wavelength range of 350 nm to less than 440 nm. It comprises an exposure step of exposing to light having a peak and a development step of developing the exposed photosensitive layer to form a resist pattern.
- the circuit forming substrate is a substrate having an insulating layer and a conductor layer formed on the insulating layer.
- the photosensitive layer forming step when the photosensitive element 1 described above is used, the protective film is gradually peeled off from the photosensitive layer 14, and at the same time, the portion of the surface of the photosensitive layer 14 that is gradually exposed. Is brought into close contact with the surface of the circuit forming substrate on which the circuit is to be formed.
- the resist pattern after removing the protective film, for example, while heating the photosensitive layer 14 to about 70 to 130 ° C., about 0.1 to 1 MPa (1 to: LOkgfZcm)
- a method of laminating by pressure bonding at a pressure of about 2 ) is suitably employed, and a method of laminating under reduced pressure is also preferred from the viewpoint of improving adhesion and followability (lamination step).
- Pre-heat treatment can also be performed.
- an actinic ray is irradiated onto the image through a negative or positive mask pattern called an artwork (mask exposure method).
- an artwork mask exposure method
- the support film 10 present on the photosensitive layer 14 is transparent to actinic rays during the exposure step, it can be irradiated with actinic rays through the support film 10, and the support film 10 is light-shielding.
- the photosensitive layer 14 can be irradiated with actinic rays after the support film 10 is removed.
- a method of irradiating actinic rays in an image form by a direct drawing method such as a laser direct drawing exposure method or a DLP (Digital Light Processing) exposure method may be employed.
- the light source of the actinic light a known light source, for example, a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, an Ar ion laser, a semiconductor laser, or the like, effectively emits ultraviolet light or visible light. Things are used.
- an actinic ray obtained by cutting 99.5% or more of light having a wavelength of 365 nm or less from a mercury lamp light source using a filter, or light having a wavelength of 405 nm from a semiconductor laser!
- a filter for cutting light having a wavelength of 365 nm or less for example, a sharp cut filter SCF-100S-39L (manufactured by Sigma Koki Co., Ltd., product name) can be used.
- the support is removed and then photocured by wet development or dry development.
- the resist pattern can be formed by removing and developing.
- an alkaline aqueous solution, an aqueous developer, an organic solvent, or the like that is safe and stable and has good operability corresponds to the type of the photosensitive resin composition. Used.
- known methods such as spraying, rocking immersion, brushing, and scraping are appropriately employed.
- Examples of the base of the alkaline aqueous solution include alkali metals such as lithium hydroxide, sodium hydroxide, potassium hydroxide and the like, which are hydroxides of lithium, sodium, and potassium; alkali metals, ammonium, and the like.
- Alkali carbonate or bicarbonate that is carbonate or bicarbonate of sodium; sodium phosphate that is alkali metal phosphate, potassium phosphate, etc .; sodium pyrophosphate and pyrophosphate that are alkali metal pyrophosphates
- a safe and stable material with good operability such as potassium is used.
- Examples of such an alkaline aqueous solution include a dilute solution of 0.1 to 5 mass% sodium carbonate, a dilute solution of 0.1 to 5 mass% potassium carbonate, and 0.1 to 5 mass% hydroxide.
- a dilute solution of sodium, a dilute solution of 0.1 to 5% by weight sodium tetraborate is preferred, and the pH is preferably in the range of 9 to L1.
- the temperature of the alkaline aqueous solution is adjusted in accordance with the developability of the light-sensitive layer 14.
- a small amount of an organic solvent such as a surfactant or an antifoaming agent may be mixed in the alkaline aqueous solution in order to accelerate development.
- aqueous developer one comprising water and an alkaline aqueous solution or one or more organic solvents is used.
- the base of the alkaline aqueous solution include those other than those described above, for example, borax, sodium metasilicate, hydroxyammonium tetramethylammonium, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-1-hydroxy. Examples include methyl-1,3 propanediol, 1,3 diaminopropanol 2, and morpholine.
- the pH of such an aqueous developer is preferably as low as possible within the range where development processing can be sufficiently performed, and is preferably between pH 8 and 12, more preferably between 9 and 10.
- Examples of the organic solvent include acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcoholate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether. Is used.
- the concentration of such an organic solvent is usually preferably 2 to 90% by mass.
- the temperature of such an organic solvent can be adjusted according to developability.
- Such organic solvents can be used alone or in combination of two or more.
- organic solvent-based developer examples include 1, 1, 1-trichloroethane, N-methylpyrrolidone, N, N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and ⁇ -butyrolatatone.
- an organic solvent such as a surfactant or an antifoaming agent may be mixed in the alkaline aqueous solution in order to promote development. It is preferable to add water in the range of 1 to 20% by mass to prevent ignition of the above organic solvents!
- development methods include dip method, battle method, spray method, high-pressure spray method, brushing, and slapping.
- the high-pressure spray method is the most suitable for improving resolution.
- the resist pattern may be further cured by heating at about 60 to 250 ° C. or exposure at about 0.2 to 10 mjZcm 2 as necessary.
- a cupric chloride solution, a ferric chloride solution, an alkali etching solution, or the like can be used.
- the second resist pattern is formed by using the first resist pattern except that a plasma display panel substrate provided with a partition wall material layer is used instead of the circuit forming substrate in the first resist pattern forming method. This is the same as the forming method.
- Examples of the plasma display substrate include PD-200 (trade name, manufactured by Asahi Glass Co., Ltd.).
- the partition wall material layer is formed by using, for example, RPW401 (trade name, manufactured by Asahi Glass Co., Ltd.).
- the method for producing a wire plate has a photosensitive layer forming step of forming a photosensitive layer made of a photosensitive resin composition on a circuit forming substrate, and a predetermined portion of the photosensitive layer has a peak in a wavelength range of 350 nm to less than 440 nm.
- the circuit forming substrate is a substrate provided with an insulating layer and a conductor layer formed on the insulating layer.
- the resist pattern obtained by the first resist pattern forming method of the present invention is used as a mask to etch or adhere to the surface of the circuit forming substrate. Processing is performed.
- a cupric chloride solution for example, a ferric chloride solution, an alkali etching solution, or a hydrogen peroxide etching solution can be used.
- a salty ferric solution is preferable because of its good etch factor.
- Examples of the above-mentioned plating treatment include, for example, copper plating treatment such as copper sulfate plating treatment and copper pyrophosphate plating treatment; solder plating treatment such as high-throw plating treatment; Well-known methods for performing nickel plating treatment such as (kel-nickel chloride) plating treatment and nickel sulfamate treatment; and gold plating treatment such as hard gold plating treatment and soft gold plating treatment can be suitably employed.
- the resist pattern may be peeled and removed using a stronger alkaline aqueous solution than the alkaline aqueous solution used for development. Good.
- a strong alkaline aqueous solution for example, a 1 to 10 mass% sodium hydroxide aqueous solution and a 1 to 10 mass% potassium hydroxide aqueous solution are used.
- examples of a method for peeling and removing the resist pattern include an immersion method and a spray method, and the immersion method and the spray method may be used alone or in combination.
- the method for producing a printed wiring board of the present invention is applicable not only to the production of a single-layer printed wiring board but also to the production of a multilayer printed wiring board, and has a small-diameter through-hole. It is also applicable to manufacturing such as.
- a method for producing a partition for a display panel includes a photosensitive layer forming step for forming a photosensitive layer comprising a photosensitive resin composition on a partition wall material layer provided on a plasma display panel substrate, and a predetermined portion of the photosensitive layer.
- a photosensitive layer forming step for forming a photosensitive layer comprising a photosensitive resin composition on a partition wall material layer provided on a plasma display panel substrate, and a predetermined portion of the photosensitive layer.
- the substrate for the plasma display panel and the partition wall material layer are the same as those used in the second resist pattern forming method.
- the partition material layer is etched using the resist pattern obtained by the second resist pattern forming method as a mask.
- Examples of the method for etching the partition wall material layer include a sand blast method and a wet etching process method.
- the partition wall material is etched by spraying cutting particles such as silica and alumina directly on the substrate.
- the partition wall material is etched with an acid solution such as nitric acid.
- Component (B) FA-321 M * 1 46 Coloring agent Leuco Crystal Violet 0.3 Dye Malachite Green 0.03
- a solution of the obtained photosensitive resin composition of Examples 1 to 6 and Comparative Examples 1 to 4 was used as a support and a 16 ⁇ m-thick polyethylene terephthalate film (product name “GS-16” manufactured by Teijin Limited).
- the photosensitive element was obtained by uniformly coating on top and drying with a hot air convection dryer at 70 ° C and 100 ° C for 10 minutes.
- the film thickness after drying of the photosensitive layer was 25 m.
- the optical density (OD value) with respect to the exposure wavelength of the photosensitive layer was measured using a UV spectrophotometer (manufactured by Hitachi, Ltd., product name “U-3310 spectrophotometer”).
- the measurement is based on the same type of polyethylene terephthalate film used as the support, and the UV absorption spectrum is obtained by continuous measurement with light of wavelength 550 to 300 nm in the absorbance mode. Among them, the absorbance value at 405 nm was defined as the OD value.
- Table 3 shows the measurement results.
- a photosensitive layer was laminated on a copper-clad laminate by the following method to obtain a laminate.
- the copper surface of a copper clad laminate product name “MCL-E-67”, manufactured by Hitachi Chemical Co., Ltd.
- a glass epoxy agent laminated with copper foil thickness 35 mm
- # 600 A polishing machine manufactured by Sankei Co., Ltd.
- the obtained copper-clad laminate was heated to 80 ° C, and the photosensitive layer was peeled off at 120 ° C under a pressure of 0.4 MPa while peeling off the protective film of the photosensitive element on the copper-clad laminate.
- the laminate is cooled to 23 ° C., and on the surface of the polyethylene terephthalate film located on the outermost layer of the laminate, a concentration region of 0.00-2.00, a concentration step of 0.05, a tablet (Rectangle) size 20mm X 187mm, each step (Rectangle) size force S3mmX 12mm photo tool with 41 step tablet and line width Z space width 6Z6 ⁇ 35Z35 ( A phototool having a wiring pattern (unit: mm) was laminated in order. Furthermore, a sharp cut filter SCF-100S-39L (product name) manufactured by Sigma Koki Co., Ltd. that cuts 99.5% or more of light having a wavelength of 365 nm or less was disposed thereon.
- SCF-100S-39L product name
- a rib base material (RPW401, manufactured by Asahi Glass Co., Ltd.) was applied on a plasma display panel substrate (PD200, manufactured by Asahi Glass Co., Ltd.) to form a partition wall material layer.
- the photosensitive layer of the obtained photosensitive element was laminated on the partition wall material layer of the PDP substrate provided with the partition wall material layer by the following method to obtain a laminate.
- the above laminate was performed by heating the PDP substrate provided with the partition wall material layer to 80 ° C and peeling off the protective film of the photosensitive element at 120 ° C under a pressure of 0.4 MPa. .
- Tables 3 and 4 show the measurement results of the photosensitivity and resolution tests as in Examples 1 to 6 and Comparative Examples 1 to 4.
- a photosensitive resin composition capable of performing resist pattern formation with light having a wavelength of 390 nm to 440 nm with sufficient sensitivity and resolution, and a photosensitive element and resist pattern using the same.
- a forming method, a printed wiring board manufacturing method, and a plasma display panel partition manufacturing method are provided.
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Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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US11/994,990 US8105759B2 (en) | 2005-07-05 | 2006-01-03 | Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition |
JP2007524058A JP4605223B2 (ja) | 2005-07-05 | 2006-07-03 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びプラズマディスプレイパネル用隔壁の製造方法。 |
KR1020077030100A KR100932580B1 (ko) | 2005-07-05 | 2006-07-03 | 감광성 수지 조성물, 및 이것을 이용한 감광성 엘리먼트,레지스트 패턴의 형성방법, 프린트 배선판의 제조방법 및플라즈마 디스플레이 패널용 격벽의 제조방법 |
CN2006800245159A CN101218538B (zh) | 2005-07-05 | 2006-07-03 | 感光性树脂组合物和使用其的感光性部件,抗蚀剂图案的形成方法,印刷配线板的制造方法和等离子显示面板用间隔壁的制造方法 |
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US (1) | US8105759B2 (ja) |
JP (1) | JP4605223B2 (ja) |
KR (1) | KR100932580B1 (ja) |
CN (1) | CN101218538B (ja) |
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WO2007126066A1 (ja) * | 2006-04-28 | 2007-11-08 | Kawasaki Kasei Chemicals Ltd. | 光重合開始剤及び光硬化性組成物 |
JP2009139932A (ja) * | 2007-11-16 | 2009-06-25 | Sumitomo Chemical Co Ltd | 重合性樹脂組成物、塗膜、パターンおよび表示装置 |
JP5098643B2 (ja) * | 2005-08-30 | 2012-12-12 | Jsr株式会社 | 感放射線性樹脂組成物およびメッキ造形物の製造方法 |
CN103091985A (zh) * | 2011-10-31 | 2013-05-08 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
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JP2018527418A (ja) * | 2015-06-24 | 2018-09-20 | 常州強力電子新材料股▲分▼有限公司CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS Co., Ltd. | Uv−led光硬化用の増感剤及びその製造方法ならびに使用 |
KR20190104639A (ko) | 2017-03-01 | 2019-09-10 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 |
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KR20190104639A (ko) | 2017-03-01 | 2019-09-10 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 |
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KR20210113404A (ko) | 2020-02-18 | 2021-09-15 | 쇼와덴코머티리얼즈가부시끼가이샤 | 감광성 수지 조성물, 감광성 엘리먼트, 배선 기판의 제조 방법, 및, 감광성 엘리먼트 롤 |
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US20090202944A1 (en) | 2009-08-13 |
JP4605223B2 (ja) | 2011-01-05 |
JPWO2007004619A1 (ja) | 2009-01-29 |
TW200712772A (en) | 2007-04-01 |
CN101218538B (zh) | 2011-02-02 |
KR20080014071A (ko) | 2008-02-13 |
KR100932580B1 (ko) | 2009-12-17 |
TWI396049B (zh) | 2013-05-11 |
CN101218538A (zh) | 2008-07-09 |
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