WO2006112711A2 - Method and device for displacing electronic components ordered in a rectangualr structure - Google Patents

Method and device for displacing electronic components ordered in a rectangualr structure Download PDF

Info

Publication number
WO2006112711A2
WO2006112711A2 PCT/NL2006/050084 NL2006050084W WO2006112711A2 WO 2006112711 A2 WO2006112711 A2 WO 2006112711A2 NL 2006050084 W NL2006050084 W NL 2006050084W WO 2006112711 A2 WO2006112711 A2 WO 2006112711A2
Authority
WO
WIPO (PCT)
Prior art keywords
components
positioning table
transport
elements
during
Prior art date
Application number
PCT/NL2006/050084
Other languages
English (en)
French (fr)
Other versions
WO2006112711A3 (en
Inventor
Wilhelmus Hendrikus Johannes Harmsen
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Priority to KR1020077025730A priority Critical patent/KR101240546B1/ko
Priority to CN2006800127839A priority patent/CN101160651B/zh
Publication of WO2006112711A2 publication Critical patent/WO2006112711A2/en
Publication of WO2006112711A3 publication Critical patent/WO2006112711A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Definitions

  • the difference will remain behind on the positioning table. At least some of these remaining components are removed during the subsequent second transporting operation together with some of the components arranged during the intervening first transporting operation. This process is repeated until sufficient components have been collected on the positioning table to cany out two successive second transporting operations without an intervening first transporting operation. It is however also possible for the number of components removed during the second transporting operation to be greater than the number of components delivered during the first transporting operation. Two first transporting operations must then be first performed before a second transporting operation can be performed.
  • Figure 3 shows a cross-sectional view of the upper part 11 of the transport element.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/NL2006/050084 2005-04-20 2006-04-13 Method and device for displacing electronic components ordered in a rectangualr structure WO2006112711A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020077025730A KR101240546B1 (ko) 2005-04-20 2006-04-13 장방형 구조로 배열된 전자 부품의 이동 방법 및 장치
CN2006800127839A CN101160651B (zh) 2005-04-20 2006-04-13 用于移动以矩形结构排列的电子元件的方法和设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1028224 2005-02-08
NL1028824A NL1028824C2 (nl) 2005-04-20 2005-04-20 Werkwijze en inrichting voor het verplaatsen van in een rechthoekige structuur gerangschikte elektronische componenten.

Publications (2)

Publication Number Publication Date
WO2006112711A2 true WO2006112711A2 (en) 2006-10-26
WO2006112711A3 WO2006112711A3 (en) 2007-03-08

Family

ID=35447720

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2006/050084 WO2006112711A2 (en) 2005-04-20 2006-04-13 Method and device for displacing electronic components ordered in a rectangualr structure

Country Status (6)

Country Link
KR (1) KR101240546B1 (zh)
CN (1) CN101160651B (zh)
MY (1) MY154558A (zh)
NL (1) NL1028824C2 (zh)
TW (1) TWI392047B (zh)
WO (1) WO2006112711A2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1028907C2 (nl) * 2005-04-29 2006-10-31 Fico Bv Werkwijze en inrichting voor het aanvoeren en het afvoeren van dragers met elektronische componenten.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017743A1 (de) * 2001-08-14 2003-02-27 Datacon Semiconductor Equipment Gmbh Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen
WO2003103363A1 (en) * 2002-06-03 2003-12-11 Assembleon N.V. Method suitable for placing at least one component in a desired position on a substrate by means of a device, and such a device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
KR970007078Y1 (en) * 1994-06-03 1997-07-15 Lg Semicon Co Ltd Devices feeding apparatus
WO1997020455A1 (fr) * 1995-11-27 1997-06-05 Matsushita Electric Industrial Co., Ltd. Dispositif et procede de montage de composants electroniques
DE19625515C2 (de) * 1996-06-26 1999-03-18 Mci Computer Gmbh Vorrichtung zur Veränderung der Rasteranordnung von Aufnahmen einer Trägervorrichtung für Gegenstände, insbesondere elektronische Bauteile, und Verfahren zum Überführen von Gegenständen mittels einer derartigen Vorrichtung
KR100881908B1 (ko) * 2001-08-08 2009-02-04 파나소닉 주식회사 전자부품 실장장치 및 전자부품 실장방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017743A1 (de) * 2001-08-14 2003-02-27 Datacon Semiconductor Equipment Gmbh Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen
WO2003103363A1 (en) * 2002-06-03 2003-12-11 Assembleon N.V. Method suitable for placing at least one component in a desired position on a substrate by means of a device, and such a device

Also Published As

Publication number Publication date
CN101160651A (zh) 2008-04-09
CN101160651B (zh) 2010-12-01
TWI392047B (zh) 2013-04-01
KR101240546B1 (ko) 2013-03-08
NL1028824C2 (nl) 2006-10-23
KR20070121823A (ko) 2007-12-27
WO2006112711A3 (en) 2007-03-08
MY154558A (en) 2015-06-30
TW200639964A (en) 2006-11-16

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