TW200639964A - Method and device for displacing electronic components ordered in a rectangular structure - Google Patents

Method and device for displacing electronic components ordered in a rectangular structure

Info

Publication number
TW200639964A
TW200639964A TW095114073A TW95114073A TW200639964A TW 200639964 A TW200639964 A TW 200639964A TW 095114073 A TW095114073 A TW 095114073A TW 95114073 A TW95114073 A TW 95114073A TW 200639964 A TW200639964 A TW 200639964A
Authority
TW
Taiwan
Prior art keywords
electronic components
components
rectangular structure
displacing
incorrect
Prior art date
Application number
TW095114073A
Other languages
Chinese (zh)
Other versions
TWI392047B (en
Inventor
Wilhelmus Hendrikus Johannes Harmsen
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of TW200639964A publication Critical patent/TW200639964A/en
Application granted granted Critical
Publication of TWI392047B publication Critical patent/TWI392047B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to a method and a device for placing on a flat carrier electronic components ordered in a rectangular structure, comprising of picking up a number of components ordered in a matrix structure and placing the components on the flat carrier, wherein the components are placed initially on a positioning table after being picked up, and the products placed on the positioning table are subsequently picked up again before they are placed on the flat carrier. This is applicable in the production of semiconductors which are processed in different processing stations and transported between these processing stations. However, the processing stations usually deliver the batches of electronic components in a rectangular structure, but in incorrect numbers, with incorrect pitch or in incorrect orientation for further transport. Numbers of components, their pitch or orientation can be modified by displacing the groups of electronic components in two steps.
TW095114073A 2005-04-20 2006-04-20 Method and device for displacing electronic components ordered in a rectangular structure TWI392047B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1028824A NL1028824C2 (en) 2005-04-20 2005-04-20 Method and device for moving electronic components arranged in a rectangular structure.

Publications (2)

Publication Number Publication Date
TW200639964A true TW200639964A (en) 2006-11-16
TWI392047B TWI392047B (en) 2013-04-01

Family

ID=35447720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114073A TWI392047B (en) 2005-04-20 2006-04-20 Method and device for displacing electronic components ordered in a rectangular structure

Country Status (6)

Country Link
KR (1) KR101240546B1 (en)
CN (1) CN101160651B (en)
MY (1) MY154558A (en)
NL (1) NL1028824C2 (en)
TW (1) TWI392047B (en)
WO (1) WO2006112711A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1028907C2 (en) * 2005-04-29 2006-10-31 Fico Bv Method and device for supplying and removing carriers with electronic components.

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
KR970007078Y1 (en) * 1994-06-03 1997-07-15 Lg Semicon Co Ltd Devices feeding apparatus
WO1997020455A1 (en) * 1995-11-27 1997-06-05 Matsushita Electric Industrial Co., Ltd. Device and method for mounting electronic parts
DE19625515C2 (en) * 1996-06-26 1999-03-18 Mci Computer Gmbh Device for changing the grid arrangement of recordings of a carrier device for objects, in particular electronic components, and method for transferring objects by means of such a device
WO2003015491A1 (en) * 2001-08-08 2003-02-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic parts
AT414077B (en) * 2001-08-14 2006-08-15 Datacon Semiconductor Equip METHOD AND DEVICE FOR POSITION CHANGE OF ELECTRONIC COMPONENTS
EP1510117A1 (en) * 2002-06-03 2005-03-02 Assembléon N.V. Method suitable for placing at least one component in a desired position on a substrate by means of a device, and such a device

Also Published As

Publication number Publication date
CN101160651B (en) 2010-12-01
WO2006112711A2 (en) 2006-10-26
KR20070121823A (en) 2007-12-27
TWI392047B (en) 2013-04-01
KR101240546B1 (en) 2013-03-08
MY154558A (en) 2015-06-30
NL1028824C2 (en) 2006-10-23
CN101160651A (en) 2008-04-09
WO2006112711A3 (en) 2007-03-08

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