WO2006093949A1 - Two-component epoxy adhesive composition - Google Patents

Two-component epoxy adhesive composition Download PDF

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Publication number
WO2006093949A1
WO2006093949A1 PCT/US2006/007053 US2006007053W WO2006093949A1 WO 2006093949 A1 WO2006093949 A1 WO 2006093949A1 US 2006007053 W US2006007053 W US 2006007053W WO 2006093949 A1 WO2006093949 A1 WO 2006093949A1
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WO
WIPO (PCT)
Prior art keywords
component
epoxy
weight percent
adhesive composition
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/007053
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English (en)
French (fr)
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WO2006093949A9 (en
Inventor
Karsten Frick
Andreas Lutz
Isabell Wipf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
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Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Priority to AT06721115T priority Critical patent/ATE431837T1/de
Priority to EP20060721115 priority patent/EP1885764B1/en
Priority to JP2007558128A priority patent/JP4991575B2/ja
Priority to DE200660006907 priority patent/DE602006006907D1/de
Priority to CA 2599400 priority patent/CA2599400A1/en
Priority to KR1020077019536A priority patent/KR101247047B1/ko
Priority to BRPI0607978-4A priority patent/BRPI0607978A2/pt
Publication of WO2006093949A1 publication Critical patent/WO2006093949A1/en
Publication of WO2006093949A9 publication Critical patent/WO2006093949A9/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Definitions

  • the present invention relates to a two-component epoxy adhesive composition, a wash-off resistant epoxy adhesive composition obtainable by mixing the two components, a process for bonding together at least two surfaces and parts bonded together by the epoxy adhesive composition .
  • the invention further relates to the use of a two- component epoxy adhesive composition for bonding together oily metal surfaces and for bonding together parts of a vehicle into a crash-stable assembly. It also relates to the use of an amine compound as a reactive agent in an epoxy adhesive composition.
  • Epoxy adhesive compositions are reaction adhesive compositions comprising an epoxy resin, a curing agent and usually a latent accelerator. Upon heating, the epoxy groups of the epoxy resin react with the curing agent linking the epoxy resin compounds by a polyaddition reaction to obtain a cured product.
  • Such a cured product is known to have good mechanical properties and a corrosion resistance superior to the cured product of other reaction adhesives. These characteristics make epoxy based adhesive compositions particularly useful for demanding applications where stringent mechanical requirements must be satisfied, for example, in the automotive industry.
  • Adhesives for bonding parts of the body structure of a vehicle, for example, a car, a lorry (truck), a bus or a train, are called structural adhesives.
  • heat-curable epoxy adhesives are used as structural adhesives.
  • the heat-curable structural adhesive which has been applied to the body-in-white structure is subjected to spray-wash or other cleaning methods followed by phosphatizing and e-coating prior to the final heat- curing of the structural adhesive in the e-coat oven.
  • thermal methods such as inductive pre-curing or by using a body-in-white oven.
  • body- in-white ovens are expensive.
  • Two-component epoxy adhesives comprise two separate components, the first comprising the epoxy resin and the second comprising the epoxy reactive compound. Such two-component epoxy adhesives generally cure immediately after mixing the two components and do not require the equipment used for the pre-curing and the curing of heat-curable epoxy adhesives.
  • US-B-4,728,737 discloses a two-component structural adhesive comprising an epoxy resin component and a hardener component (incorporated herein by reference).
  • US-B-4,916,187 relates to a two-component epoxy resin adhesive composition consisting of a first polyepoxide component and a second curing component comprising a finely dispersed solid salt of a polyamine and a polyphenol in a liquid adduct (incorporated herein by reference).
  • US-B-5,629,380 discloses a two-component epoxy adhesive comprising a First component including an epoxy catalyst and an amine curing agent and a second component including an epoxy resin having a functionality of more than 1 (incorporated herein by reference).
  • US 2002/0164485 and US-B-6,577,971 both relate to a two-component epoxy adhesive composition comprising a first component including an epoxy resin and a silane coupling agent and a second component including an aliphatic amine and a polyamine (incorporated herein by reference).
  • US-B-6,248,204 discloses a room-temperature curable epoxy resin composition
  • a first component including an epoxy resin and a second component including an amine-based hardener (incorporated herein by reference).
  • compositions have however several disadvantages which limit their use as structural adhesives.
  • Their pot life i.e., the time available for using the epoxy adhesive composition after the components are mixed, is short since the curing starts at room temperature immediately after mixing.
  • the assembly of the parts to be bonded together has to be carried out shortly after application of the epoxy adhesive.
  • said two-component epoxy adhesive compositions lead to cured products which do not meet the requirements generally demanded of structural adhesives.
  • the crash stability of the cured product of said two-component epoxy adhesives does not comply with the stringent requirements for this application.
  • the glass transition temperature of a cured two-component epoxy adhesive is low. Their oil uptake is poor which is particularly disadvantageous in the manufacture of vehicles where oily steels are bonded together.
  • the object of the present invention is to provide a two-component structural adhesive which is wash-off resistant without thermal pre-curing, which has an assembly time of several hours, can be stored in the uncured state up to several weeks and which results in a cured product having a high crash stability, a high glass transition point and a good oil uptake.
  • a two-component epoxy adhesive composition comprising: a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups, said amine compound having a molecular weight of less than about 450 g/mol, wherein the ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is about 0.01 : 1 to about 0.5: 1 and the mixing of the two components a) and b) results in a wash-off resistant composition, said wash-off resistant composition resulting upon heat-curing in a crash-stable structural adhesive.
  • the amine compound in component b) acts as a reactive agent leading to wash-off resistance.
  • the viscosity of the epoxy adhesive composition increases from a value less than about 1,000 Pa-S to a plateau of a substantially constant value of at least about 2,000 Pa-s (at 23°C and at a shear rate of 0.01) due to the reaction of the epoxy resins with the amine compound.
  • Such a pre-reacted composition i.e., a non-fully cured composition having a higher viscosity than the individual components, is wash-off resistant. Consequently, the epoxy adhesive composition applied to the body-in- white structure is not washed off when subjected to spray-wash or other cleaning methods.
  • the duration between the mixing of the two components and the build-up of the wash-off resistance varies in the range of about 30 minutes to about 24 hours, depending on the amount of amine compound in the composition.
  • Figure 1 is a plot of the viscosity of Formulation A5/B5 over time.
  • Figure 2 is a plot of viscosity of Formulation A3/B2 over time.
  • Figure 3 is a plot of viscosity of Formulation A4/B4 over time.
  • Figure 4 is a plot of viscosities and yield stress against time for Formulation A3/B2.
  • Figure 5 is a plot of viscosity and yield stress over time for Formulation A4/B4.
  • Figure 6 is a plot of lap shear strength and impact peel strength over time for Formulation
  • Figure 7 is a plot of the lap shear strength and impact strength against time for Formulation
  • the pre-reacted epoxy adhesive composition of the present invention shows a very low humidity sensitivity. It has a very long open time of up to about 4 weeks at 23°C and 50 percent relative humidity.
  • pre-curing methods such as inductive pre-curing can be applied to accelerate or enhance the pre-reaction.
  • the epoxy adhesive composition is subjected to a final curing step by heating it to a temperature of at least about 12O 0 C, preferably above about 140 0 C for at least about 10 minutes and preferably at least about 20 minutes.
  • the epoxy adhesive composition of the present invention shows all the properties of an excellent structural adhesive. In particular, its lap shear strength and impact peel strength is higher compared to the ones resulting of conventional two-component structural adhesives. Accordingly, the crash stability of the cured epoxy adhesive of the present invention is vastly improved.
  • the adhesive upon cure demonstrates an impact peel strength on steel of about at least 20 N/mm or greater, more preferably from about 25 to about 50 N/mm, when tested according to ISO 1 1343 on 1 mm cold rolled steel (CRS), e.g., 1403 type.
  • CRS 1 mm cold rolled steel
  • the epoxy adhesive composition of the present invention has a better oil uptake compared to the conventional two-component epoxy adhesives. This is of particular importance in the manufacture of vehicles where oily metal surfaces are bonded together. When heating the epoxy adhesive composition in the final curing step, it softens and effectively takes up the remaining oil on the surface to be bonded.
  • the first epoxy resin is a rigid epoxy resin.
  • Epoxy resins which may be employed in the compositions of the invention are those which contain groups illustrated in the following formula
  • R 8 is hydrogen or C 1-4 alkyl, preferably hydrogen or methyl and most preferably hydrogen.
  • rigid epoxy resins refer to epoxy resins having bisphenol moieties in the backbone of the epoxy resin. Representative of preferred bisphenol resins useful in this invention are those disclosed in U.S. 5,308,895 at column 8, line 6 and represented by Formula 6. Relevant portions of such patent are incorporated herein by reference.
  • the rigid epoxy resin is a liquid epoxy resin or a mixture of a solid epoxy resin dispersed in a liquid epoxy resin.
  • the most preferred rigid epoxy resins are bisphenol and bisphenol-F A based resins.
  • the first epoxy resin preferably can be a liquid epoxy resin, such as D.E.RTM 330 and D.E.R.TM 331 Bisphenol A based epoxy resins
  • the second epoxy resin is generally flexibilized by known flexibilization techniques which are for example described in EP-A-1,359,202 and U.S. 2005/159511
  • the amine compound with one or more primary and/or secondary amino groups may be chosen from aliphatic or cycloaliphatic di- or polyamines including polyether di- and polyamines as well as polyimines.
  • the amine compound is selected from the group consisting of4,7,10-trioxatridecan-l ,13-diamine, diethylenetriamine, triethylenetetramine, tetraethylenepentami ⁇ e, aminoethylpiperazine as well as polyetherdianiines and polyetherti ⁇ amines, e.g,. of the JEFFAM1NETM polyetherpolyamine type (available from Huntsman Corporation).
  • the first and the second component have a viscosity of less than about 1,000 Pa-s at 23°C and at a shear rate of 0.01, allowing the two components to be mixed easily and the epoxy adhesive composition to be applied to the substrate by conventional methods, such as bead application by a robot or manual application out of cartridges.
  • At least one of the two components a) and b) further comprises a toughener. More preferably, the toughener is selected from the group consisting of compounds of Formula I
  • R is an n-valent radical of an elastomeric prepolymer after the removal of the terminal isocyanate, amino or hydroxyl group, the elastomeric prepolymer being soluble or dispersible in epoxy resin
  • W and X are independently -O- or - NR 3 -, at least one of W and X being -NR 3 -
  • R 2 is an m+1-valent radical of a polyphenol or aminophenol after the removal of the phenolic hydroxyl group and optionally of the amino group
  • R 3 is hydrogen, a Ci-C ⁇ alkyl or phenol, and compounds of Formula Il
  • R 4 is a residue of a hydroxyl-, mercapto- or ami no-terminated polyether prepolymer or of a hydroxyl-, mercapto- or am ino-term ' mated prepolymeric, segmented polyester, polythioester or polyamid
  • R 5 is a carbocyclic aromatic or araliphatic p+1-valent radical with groups Z bonded directly to the aromatic ring
  • R 6 is hydrogen, Ci-C 6 alkyl or phenyl
  • R 7 is methyl or hydrogen.
  • the composition can comprise a mixture of both a toughener of Formula I and a toughener of Formula II. A detailed description of the toughener of Formula I is given in
  • EP-A-0,308,664 page 5, line 14, to page 13, line 24
  • a detailed description of the toughener of Formula II is given in EP-A- 0,353,190 (page 3, line 51, to page 6, line 62), (U.S. 5,073,601, column 1, line 59 to column 2, line 16, column 3, line 60 to column 9, line 21 and U.S. 2005/0760634, paragraphs 0014 to 0053), the disclosures of which are (incorporated herein by reference).
  • toughener examples include FLEXIBILIZERTM DY 965 (prepared as described in Example 13 of EP 308,664 incorporated herein by reference) and DY 3333 (toughener B described in U.S. Patent Publication 2005/070634, paragraphs 0074 and 0075, incorporated herein by reference.
  • Other examples of the toughener are "toughener A” and "toughener C” described in international patent application WO 2005/007766 (U.S. 2005/070634, paragraphs 0072- 0073 and 0076-0077 (incorporated herein by reference).
  • the elastomer flexibilizing the second epoxy resin is an acrylonitrile-butadiene rubber.
  • At least one of the two components a) and b) comprises a latent hardener in a total amount of less than 10 weight percent based on the total weight of the composition.
  • a latent hardener is a compound which is inactive at room temperature but acts as a curing agent at elevated temperatures. Preferred latent hardness are described in EP 197,892 (U.S. 4,659,779 at column 4, lines 17 to 34 and U.S. Patent Publication 2005/070,634, paragraph 62 (incorporated herein by reference). Most preferably, the latent hardener is dicyandiamide.
  • the second component b) comprises a hydrophobic diluent.
  • the hydrophobic diluent preferably has a boiling point of at least 200 0 C more preferably at least 220 0 C and most preferably at least 250 0 C. This allows to further adjust the viscosity of component b) as desired.
  • the hydrophobic diluent is a hydrocarbon based material. Preferably, it is liquid at room temperature (23°C). More preferably, an aromatic alkyl substituted aromatic for instance, alkyl substituted naphthalene. Among more preferred diluents are diisopropyl naphthalene and triisopropyl naphthalene.
  • At least one of the two components a) and b) comprises one or more additives selected from the group of latent accelerators, adhesion promoters, epoxy silane, fumed silica, wetting agents and inorganic fillers, such as calcium oxide, calcium carbonate, wollastonite or talcum.
  • at least one of the two components a) and b) comprises at least one tertiary mono- or polyamine or a mixture thereof as accelerator.
  • the term "polyamine” includes diamine. Due to the accelerator, an initial green strength, i.e., a strength above about 0.2 MPa, is achieved within hours after mixing the two components.
  • Preferred amine accelerators are described in WO 2005/07,766, page 15, lines 29 to 32 and U.S. 2005/070,634 at paragraph 65 (incorporated herein by reference).
  • An example of such an accelerator is 2,4,6-tris(dimethylaminomethyl)phenol.
  • the mono- or polyamine is comprised in component a), it is embedded in a polymer matrix as disclosed in EP 197,892 (U.S. 4,659,779, column 2, lines 39 to 57 and column 4, line 34 to column 6, line 51, incorporated herein by reference.
  • An example of such an embedded polyamine is EP 796 as disclosed in European Patent No. EP-B-0, 197, 892 (U.S. 4,659,779 (incorporated herein by reference).
  • the weight ratio of the First component a) to the second component b) is from about 2: 1 to about 10: 1 and the ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is from about 0.06: 1 to about 0.2: 1.
  • the first component comprises about 30 to about 80 weight percent of the first epoxy resin, about 5 to about 30 weight percent of the second epoxy resin and about 20 weight percent or less of the toughener
  • the second component comprises about 1 to about 40 weight percent of the amine compound, about 10 to about 80 weight percent of the toughener and about 10 to about 30 weight percent of the hydrophobic diluent
  • at least one of the two components a) and b) comprises an inorganic filler, epoxy silane, a wetting agent, fumed silica, a latent hardener, a latent accelerator or a mixture thereof.
  • the two-component epoxy adhesive of the present invention is particularly well suited for bonding together oily metal surfaces due to its high oil uptake.
  • the present invention further relates to a wash-off resistant epoxy adhesive composition obtainable by mixing the first component a) and the second component b) of the above described two-component epoxy adhesive composition.
  • the mixed composition becomes sufficiently precured to be wash-off resistant after about one hour to several days, preferably about 1 hour to about 24 hours.
  • the premixed adhesive is preferably contacted with the substrates immediately after mixing and preferably no more than 20 minutes, more preferably no more than 10 minutes after mixing.
  • It also relates to a wash-off resistant epoxy adhesive composition obtainable by mixing the first component a) and the second component b) of the above described two- component epoxy adhesive composition and pre-curing the resulting mixture by thermal methods.
  • component a) and component b) of the above described two-component epoxy adhesive composition are mixed, the resulting mixture is applied to at least one surface, the surfaces are brought together and the epoxy adhesive composition between the surfaces is cured at a temperature above about 120 0 C, preferably above about 140 0 C for at least about 10 minutes and preferably at least about 20 minutes.
  • the curing is performed at about 200 0 C or less.
  • the epoxy adhesive composition can be cured up to about 4 weeks after bringing together the surfaces.
  • the present invention also relates to the use of the two-component epoxy adhesive composition for bonding together parts of a vehicle into a crash-stable assembly. Accordingly, the present invention also relates to parts bonded together by the two- component epoxy adhesive composition into a crash-stable assembly.
  • component Al has been prepared as follows: 14.1 weight percent of a nitrile-rubber modified epoxy resin (STRUKTOLTM 3604 modified epoxy resin available from Schill + Seilacher), 48.6 weight percent of a liquid epoxy resin (D.E.RTM 330 epoxy resin available from The Dow Chemical Company), 10.1 weight percent of solid epoxy resin (D.E.R.TM 671 epoxy resin available from The DO ⁇ V Chemical Company), 1.5 weight percent of neo-decanoic acid glycidyl ester, 1 weight percent of a polymeric epoxy silane, (SILQUESTTM Al 87 available from GE Silicones) and 12.1 weight percent of a toughener (RAMTM 965 toughener available from Huntsman Corporation) were mixed for 30 minutes under vacuum.
  • a nitrile-rubber modified epoxy resin (STRUKTOLTM 3604 modified epoxy resin available from Schill + Seilacher)
  • D.E.RTM 330 epoxy resin available from The Dow Chemical Company 10.1 weight percent of solid epoxy resin (D.E
  • Component A2 has been prepared according to the procedure described for Al, but by using 14.0 weight percent of STRUKTOLTM3604 modified epoxy resin, 58.2 weight percent of D.E.RTM 330 epoxy resin, 1.5 weight percent of neo-decanoic acid glycidyl ester, 1.0 weight percent of SILQUESTTM A 187, 12.0 weight percent of RAMTM 965 toughener, 6.8 weight percent of AEROSILTM fumed silica, 1.0 weight percent of ANCAMINETM 2441 blocked amine and 5.5 weight percent of dicyandiamide.
  • Component A3 has been prepared according to the procedure described for Al, but by using 13.2 weight percent of STRUKTOLTM3604 modified epoxy resin, 54.7 weight percent of D.E.RTM 330 epoxy resin, 1.4 weight percent of neo-decanoic acid glycidyl ester, 0.9 weight percent of SILQUESTTM Al 87, 1 1.3 weight percent of RAMTM 965 toughener, 6.4 weight percent of AEROSILTM fumed silica, 0.9 weight percent of ANCAMINETM 2441 blocked amine and 5.2 weight percent of dicyandiamide. Additionally, 6.0 weight percent of CaO has been added.
  • Component A4 has been prepared according to the procedure described for Al, but by using 17.0 weight percent of
  • STRUKTOLTM 3604 modified epoxy resin 70.5 weight percent of D.E.RTM 330 epoxy resin, 1.8 weight percent of neo-decanoic acid glycidyl ester, 1.2 weight percent , 8.3 weight percent AEROSILTM fumed silica and 1.2 weight percent of ANCAMINETM2441 blocked amine.
  • Component A5 has been prepared according to the procedure described for Al, but by using 17.2 weight percent of STRUKTOLTM3604 modified epoxy resin, 69.2 weight percent of D.E.RTM 330 epoxy resin, 1.7 weight percent of neo-decanoic acid glycidyl ester, 1.0 weight percent, 5.2 weight percent of AEROSILTM silicon oxide and 5.2 weight percent of dicyandiamide.
  • component B 1 of the two-component epoxy adhesive has been prepared as follows:
  • Component B3 has been prepared according to the procedure described for Bl , but by using 47.1 weight percent of RAMTM 965 toughener, 14.9 weight percent of dicyandiamide, 1.6 weight percent of AEROSILTM silicon oxide, 12.0 weight percent of CaO, 5.4 weight percent of trioxatridecandiamine, and 17.9 weight percent of a mixture of tri- and tetraisopropylnaphthalene.
  • Component B4 has been prepared according to the procedure described for Bl, but by using 44.4 weight percent of RAMTM 965 toughener, 14.8 weight percent of dicyandiamide, 1.6 weight percent of AEROSILTM fumed silica, 1 1.3 weight percent of CaO, 10.0 weight percent of trioxatridecandiamine, and 19.0 weight percent of a mixture of tri- and tetraisopropylnaphthalene.
  • Component B5 has been prepared according to the procedure described for Bl, but by using 62.1 weight percent of RAMTM 965 toughener, 0.9 weight percent of a latent EP 796 latent accelerator (available from Huntsman Corporation) (accelerator 2 or 13 of U.S.
  • the viscosity and the yield stress after mixing the two components a) and b) was determined over a term of 14 days on a Bohlin rheometer (cone (4°)- plate) at room temperature and at a frequency of 0.1 to 20 s "1 .
  • the Casson model was applied. The corresponding results after 1 hour, 24 hours, 3 days, 8 days and 14 days are given in Table 1 for mixture A3/B2 and in Table 2 for mixture A4/B4.
  • Examples Al, A2 and A3 of component a) have been mixed with respective examples Bl and B2 of component b) in a weight ratio of 10:1.
  • heat-curable epoxy adhesive compositions Al /Bl, A2/B1 and A3/B2 have been prepared. After a duration specified in Table 1 (called "open time"), the composition has been heated to 18O 0 C for 30 minutes and thus subjected to final curing.
  • the lap shear strength and the impact peel strength has been determined according to DIN EN 1465 and ISO 11343, respectively.
  • CRS 1403 cold rolled steel
  • 1.5mm was used as substrate.
  • CRS 140 cold rolled steel
  • 3 1.0mm was used as substrate.
  • the oil used in the tests was Anticorit 5012S oil.
  • composition A3/B2 the glass transition temperature has been determined by differential scanning calorimetry (DSC) in the range of 25°C to 180 0 C.
  • Example A4 of component a) has been mixed with respective examples B3 and B4 of component b) in a weight ratio of 2: 1.
  • heat-curable epoxy adhesive compositions A4/B3 and A4/B4 have been prepared.
  • After a duration specified in Table 2 (called "open time"), the composition has been subjected to final curing by heating it to
  • CRS 1403 cold rolled steel
  • 1.5mm was used as substrate.
  • CRS 1403 cold rolled steel
  • 1.Omm was used as substrate.
  • the oil used in the tests was Anticorit 5012S oil.
  • composition A4/B4 the glass transition temperature has been determined by differential scanning calorimetry (DSC) in the range of 25°C to 18O 0 C. The results are given in Table 4.
  • the cured epoxy adhesive compositions of the present invention have a lap shear strength of at least 18 MPa and an impact peel strength higher than 20 N/min.
  • the results of the impact peel strength measured on oily steels are comparable to the results measured on degreased steels.
  • the above mixture was induction pre-cured. After applying the mixture to the substrate and assembling the substrates, the temperature was raised during 10 seconds from room temperature to 130 0 C and 140 0 C, respectively, and held at these temperatures for 30 seconds.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
PCT/US2006/007053 2005-02-28 2006-02-28 Two-component epoxy adhesive composition Ceased WO2006093949A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT06721115T ATE431837T1 (de) 2005-02-28 2006-02-28 Zweikomponentige epoxidklebstoffzusammensetzung
EP20060721115 EP1885764B1 (en) 2005-02-28 2006-02-28 Two-component epoxy adhesive composition
JP2007558128A JP4991575B2 (ja) 2005-02-28 2006-02-28 二成分エポキシ接着剤組成物
DE200660006907 DE602006006907D1 (de) 2005-02-28 2006-02-28 Zweikomponentige epoxidklebstoffzusammensetzung
CA 2599400 CA2599400A1 (en) 2005-02-28 2006-02-28 Two-component epoxy adhesive composition
KR1020077019536A KR101247047B1 (ko) 2005-02-28 2006-02-28 2 성분 에폭시 접착제 조성물
BRPI0607978-4A BRPI0607978A2 (pt) 2005-02-28 2006-02-28 composição de adesivo epóxi bicomponente, composição de adesivo epóxi resistente à lavagem, processo para unir superfìcies separadas, peças, uso da composição de adesivo epóxi bicomponente e uso de um composto de amina

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05004304.1 2005-02-28
EP20050004304 EP1695990A1 (en) 2005-02-28 2005-02-28 Two-component epoxy adhesive composition

Publications (2)

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WO2006093949A1 true WO2006093949A1 (en) 2006-09-08
WO2006093949A9 WO2006093949A9 (en) 2006-11-09

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US8637614B2 (en) 2008-07-23 2014-01-28 3M Innovative Properties Company Reactive liquid modifiers
US9783704B2 (en) 2011-03-09 2017-10-10 Nitto Denko Corporation Double-sided adhesive tape
WO2014020439A2 (en) 2012-07-31 2014-02-06 Dow Global Technologies Llc Method for making fire-resistant foam insulation panels
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US20090065143A1 (en) 2009-03-12
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JP4991575B2 (ja) 2012-08-01
KR20070106534A (ko) 2007-11-01
EP1885764B1 (en) 2009-05-20
CN101128503A (zh) 2008-02-20
ES2323894T3 (es) 2009-07-27
US7951456B2 (en) 2011-05-31
JP2008531817A (ja) 2008-08-14
BRPI0607978A2 (pt) 2009-10-27
KR101247047B1 (ko) 2013-03-25
CA2599400A1 (en) 2006-09-08
US20060205897A1 (en) 2006-09-14
US7834091B2 (en) 2010-11-16
DE602006006907D1 (de) 2009-07-02
ATE431837T1 (de) 2009-06-15
EP1885764A1 (en) 2008-02-13
US7511097B2 (en) 2009-03-31

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