JP4991575B2 - 二成分エポキシ接着剤組成物 - Google Patents

二成分エポキシ接着剤組成物 Download PDF

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Publication number
JP4991575B2
JP4991575B2 JP2007558128A JP2007558128A JP4991575B2 JP 4991575 B2 JP4991575 B2 JP 4991575B2 JP 2007558128 A JP2007558128 A JP 2007558128A JP 2007558128 A JP2007558128 A JP 2007558128A JP 4991575 B2 JP4991575 B2 JP 4991575B2
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Japan
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component
epoxy resin
epoxy
composition
adhesive composition
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Expired - Fee Related
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JP2007558128A
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English (en)
Japanese (ja)
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JP2008531817A (ja
JP2008531817A5 (https=
Inventor
フリック，カルステン
ルッツ，アンドレアス
ビフ，イザベル
Original Assignee
ダウ グローバル テクノロジーズ エルエルシー
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Publication of JP2008531817A5 publication Critical patent/JP2008531817A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
JP2007558128A 2005-02-28 2006-02-28 二成分エポキシ接着剤組成物 Expired - Fee Related JP4991575B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05004304.1 2005-02-28
EP20050004304 EP1695990A1 (en) 2005-02-28 2005-02-28 Two-component epoxy adhesive composition
PCT/US2006/007053 WO2006093949A1 (en) 2005-02-28 2006-02-28 Two-component epoxy adhesive composition

Publications (3)

Publication Number Publication Date
JP2008531817A JP2008531817A (ja) 2008-08-14
JP2008531817A5 JP2008531817A5 (https=) 2009-04-16
JP4991575B2 true JP4991575B2 (ja) 2012-08-01

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Family Applications (1)

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JP2007558128A Expired - Fee Related JP4991575B2 (ja) 2005-02-28 2006-02-28 二成分エポキシ接着剤組成物

Country Status (11)

Country Link
US (3) US7511097B2 (https=)
EP (2) EP1695990A1 (https=)
JP (1) JP4991575B2 (https=)
KR (1) KR101247047B1 (https=)
CN (1) CN101128503A (https=)
AT (1) ATE431837T1 (https=)
BR (1) BRPI0607978A2 (https=)
CA (1) CA2599400A1 (https=)
DE (1) DE602006006907D1 (https=)
ES (1) ES2323894T3 (https=)
WO (1) WO2006093949A1 (https=)

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CN106753143A (zh) * 2016-12-21 2017-05-31 南京诺邦新材料有限公司 一种具有导热功能的低温固化底部填充胶及其制备方法
CN108300389B (zh) * 2017-01-13 2019-03-12 杭州之江有机硅化工有限公司 一种环氧胶粘剂组合物及其制备方法以及应用
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CN115637124B (zh) * 2021-07-19 2023-09-22 沃顿科技股份有限公司 双组分环氧树脂胶粘剂的制备方法及由其制备的双组分环氧树脂胶粘剂
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Also Published As

Publication number Publication date
WO2006093949A9 (en) 2006-11-09
US20110020652A1 (en) 2011-01-27
US20090065143A1 (en) 2009-03-12
EP1695990A1 (en) 2006-08-30
WO2006093949A1 (en) 2006-09-08
KR20070106534A (ko) 2007-11-01
EP1885764B1 (en) 2009-05-20
CN101128503A (zh) 2008-02-20
ES2323894T3 (es) 2009-07-27
US7951456B2 (en) 2011-05-31
JP2008531817A (ja) 2008-08-14
BRPI0607978A2 (pt) 2009-10-27
KR101247047B1 (ko) 2013-03-25
CA2599400A1 (en) 2006-09-08
US20060205897A1 (en) 2006-09-14
US7834091B2 (en) 2010-11-16
DE602006006907D1 (de) 2009-07-02
ATE431837T1 (de) 2009-06-15
EP1885764A1 (en) 2008-02-13
US7511097B2 (en) 2009-03-31

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