WO2006093136A1 - Appareil de traitement de substrat et procédé de fabrication de dispositif semi-conducteur - Google Patents

Appareil de traitement de substrat et procédé de fabrication de dispositif semi-conducteur Download PDF

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Publication number
WO2006093136A1
WO2006093136A1 PCT/JP2006/303731 JP2006303731W WO2006093136A1 WO 2006093136 A1 WO2006093136 A1 WO 2006093136A1 JP 2006303731 W JP2006303731 W JP 2006303731W WO 2006093136 A1 WO2006093136 A1 WO 2006093136A1
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WIPO (PCT)
Prior art keywords
processing
substrate
gas
electrode
plasma
Prior art date
Application number
PCT/JP2006/303731
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English (en)
Japanese (ja)
Inventor
Nobuo Ishimaru
Original Assignee
Hitachi Kokusai Electric Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc. filed Critical Hitachi Kokusai Electric Inc.
Priority to KR1020077019904A priority Critical patent/KR100909750B1/ko
Priority to JP2007505948A priority patent/JP4951501B2/ja
Priority to US11/885,483 priority patent/US8251012B2/en
Publication of WO2006093136A1 publication Critical patent/WO2006093136A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P17/00—Metal-working operations, not covered by a single other subclass or another group in this subclass
    • B23P17/04—Metal-working operations, not covered by a single other subclass or another group in this subclass characterised by the nature of the material involved or the kind of product independently of its shape
    • B23P17/06—Making steel wool or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21F—WORKING OR PROCESSING OF METAL WIRE
    • B21F45/00—Wire-working in the manufacture of other particular articles
    • B21F45/006—Wire-working in the manufacture of other particular articles of concrete reinforcement fibres
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B14/00—Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
    • C04B14/38—Fibrous materials; Whiskers
    • C04B14/48—Metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C5/00—Reinforcing elements, e.g. for concrete; Auxiliary elements therefor
    • E04C5/01—Reinforcing elements of metal, e.g. with non-structural coatings
    • E04C5/012—Discrete reinforcing elements, e.g. fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12201—Width or thickness variation or marginal cuts repeating longitudinally
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12201—Width or thickness variation or marginal cuts repeating longitudinally
    • Y10T428/12208—Variation in both width and thickness

Definitions

  • the present invention relates to a substrate processing apparatus and a semiconductor device manufacturing method, and more particularly to a substrate processing apparatus and a semiconductor device that perform etching of a substrate surface such as a silicon wafer and thin film formation processing on the substrate surface using plasma. It relates to the manufacturing method.
  • FIG. 1 is a schematic cross-sectional view for explaining a vertical substrate processing furnace of a conventional substrate processing apparatus
  • FIG. 2 is a schematic vertical cross-sectional view taken along line AA in FIG. 1
  • FIG. Fig. 1 is a schematic longitudinal sectional view of line BB.
  • An elongated buffer chamber 237 is provided near the wall surface inside the reaction tube 203 in a vertical manner, and rod-shaped discharge electrodes 269, 270 covered with two electrode protection tubes 275, 276, respectively, which also have dielectric force inside.
  • a gas nozzle 233 for obtaining an even gas flow is installed in the buffer chamber 237.
  • the high frequency power generated by the oscillator of the high frequency power source 273 is applied to the end 277 of the discharge electrode 270 to the end 277 of the discharge electrode 269, and a plasma 224 is generated between the discharge electrodes 269 and 270 in the buffer chamber 237. Then, the reactive gas supplied from the gas nozzle 233 is excited by plasma, and the excited species force thus excited is supplied from the gas supply hole 248a opened in the side wall of the S buffer chamber 237. It has a structure to be supplied to.
  • this conventional discharge method is capacitively coupled plasma, and when the power of the oscillator is increased to increase the plasma density, the stray capacitance of the discharge electrodes 269 and 270 causes the plasma to move into the buffer chamber. Only by spreading outside 237, the increase in the amount of active species was unattainable.
  • a main object of the present invention is to provide a substrate processing apparatus and a semiconductor device manufacturing method capable of increasing the amount of active species generated by plasma. Disclosure of the invention
  • a processing vessel A processing vessel;
  • a gas supply unit for supplying a desired processing gas into the processing container
  • a gas discharge unit for discharging excess processing gas from the processing container
  • a substrate mounting member that is mounted in a state where a plurality of substrates are stacked in the processing container; and an electrode that generates plasma for exciting the processing gas and to which high-frequency power is applied,
  • the electrode is a first electrode
  • a substrate processing apparatus is provided.
  • a gas supply unit for supplying a desired processing gas into the processing container
  • a gas discharge unit for discharging excess processing gas from the processing container
  • a substrate mounting member that is mounted in a state where a plurality of substrates are stacked in the processing container; and an electrode that generates plasma for exciting the processing gas and to which high-frequency power is applied,
  • the electrode is a first electrode
  • a plurality of the substrates are stacked on the substrate mounting member in the processing container.
  • a method of manufacturing a semiconductor device comprising: supplying the desired processing gas from the gas supply unit into the processing container, applying high-frequency power to the electrode to generate plasma, and processing the substrate. Is provided.
  • a method of manufacturing a semiconductor device which is a process executed by applying high-frequency power, is provided.
  • FIG. 1 is a schematic cross-sectional view for explaining a vertical substrate processing furnace of a conventional substrate processing apparatus.
  • FIG. 2 is a schematic longitudinal sectional view taken along line AA in FIG.
  • FIG. 3 is a schematic longitudinal sectional view taken along line BB in FIG. 1.
  • FIG. 4 is a schematic longitudinal sectional view for explaining a vertical substrate processing furnace of a substrate processing apparatus according to a preferred embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view for explaining a vertical substrate processing furnace of a substrate processing apparatus according to a preferred embodiment of the present invention.
  • FIG. 6 is a schematic longitudinal sectional view taken along line CC of FIG.
  • FIG. 7 is a schematic longitudinal sectional view taken along the line DD in FIG.
  • FIG. 8 is a schematic cross-sectional view for explaining the operation of the vertical substrate processing furnace of the substrate processing apparatus according to a preferred embodiment of the present invention.
  • FIG. 9 is a view taken along the line EE in FIG.
  • FIG. 10 is a schematic cross-sectional view for explaining the operation of a substrate processing furnace for comparison.
  • FIG. 11 is a view taken along line FF in FIG.
  • FIG. 12 is a schematic perspective view for explaining a substrate processing apparatus according to a preferred embodiment of the present invention.
  • FIG. 13 is a schematic longitudinal sectional view for explaining a substrate processing apparatus according to a preferred embodiment of the present invention.
  • a substrate processing apparatus preferably includes a vertical processing chamber for processing stacked substrates, a gas supply system for supplying processing gas to the substrate, and a gas supply system to the substrate.
  • a buffer chamber that temporarily stores the supplied gas and uniformly supplies the gas to the stacked substrates, generates plasma, generates electrically neutral active species, and processes multiple substrates collectively To do.
  • a U-shaped elongated conductive electrode as a plasma generation source is covered with a U-shaped dielectric tube and installed inside the buffer chamber, and the end of the U-shaped elongated conductive electrode High-frequency power is applied from the section to generate plasma in the space inside the u-shaped dielectric tube.
  • the tips of two parallel electrodes are connected to form a 1-turn U-shaped coil.
  • the plasma becomes inductively coupled plasma that is induced by the high-frequency current flowing in the discharge electrode, and the plasma generation part is limited to the magnetic field part by the high-frequency current.
  • the magnetic field due to the high-frequency current flowing in the opposite direction to two parallel discharge electrodes is localized around the electrodes, so that the plasma is also limited to the vicinity of the electrodes, so that the plasma density can be increased effectively.
  • the ALD method supplies two types (or more) of raw material gases used for film formation one by one alternately onto the substrate under certain film formation conditions (temperature, time, etc.). This is a technique in which film formation is performed by adsorbing in atomic layer units and utilizing surface reactions. That is, the chemical reaction used is, for example, in the case of forming a SiN (silicon nitride) film.
  • D CS SiH C1, dichlorosilane
  • NH ammonia
  • the gas supply alternately supplies multiple types of reactive gases one by one.
  • film thickness control is controlled by the cycle number of reactive gas supply.
  • FIG. 4 is a schematic configuration diagram for explaining a vertical substrate processing furnace according to the present embodiment, in which the processing furnace portion is shown in a longitudinal section
  • FIG. 5 is related to the present embodiment. It is a schematic block diagram for demonstrating a vertical type
  • a reaction tube 203 made of quartz is provided inside a heater 207 serving as a heating means as a reaction vessel for processing a wafer 200 serving as a substrate, and a lower end opening of the reaction tube 203 is a seal serving as a lid.
  • the cap 219 is airtightly closed through an O-ring 220 which is an airtight member.
  • a heat insulating member 208 is provided outside the reaction tube 203 and the heater 207.
  • the heat insulating member 208 is provided so as to cover the upper end of the heater 207.
  • the processing furnace 202 is formed by at least the heater 207, the heat insulating member 208, the reaction tube 203, and the seal cap 219. Further, the processing chamber 201 is formed by at least the reaction tube 203 and the seal cap 219.
  • a boat 217 as a substrate holding means is erected on the seal cap 219 via a quartz cap 218, and the quartz cap 218 is a holding body that holds the boat 217. Then, the boat 217 is inserted into the processing furnace 202. A plurality of wafers 200 to be batch-processed are loaded on the boat 217 in a horizontal posture in multiple stages in the tube axis direction.
  • the heater 207 heats the wafer 200 inserted into the processing furnace 202 to a predetermined temperature.
  • the processing furnace 202 is provided with two gas supply pipes 232a and 232b as supply pipes for supplying a plurality of types, here two types of gases.
  • the gas supply pipe 232a reacts with the processing chamber 201 via a mass flow controller 241a which is a flow rate control means and a valve 243a which is an on-off valve, and further through a buffer chamber 237 formed in a reaction tube 203 which will be described later.
  • Gas is supplied, and from the gas supply pipe 232b, a mass flow controller 241b that is a flow control means, a valve 243b that is an on-off valve, a gas reservoir 247, and a valve 24 that is an on-off valve
  • the reaction gas is supplied to the processing chamber 201 through 3c and further through a gas supply unit 249 described later.
  • the two gas supply pipes 232a and 232b are prevented from adhering NH C1 as a reaction by-product.
  • a piping heater (not shown) that can be heated to about 120 ° C is installed.
  • the processing chamber 201 is connected to a vacuum pump 246, which is an exhaust means, through a valve 243d by a gas exhaust pipe 231 which is an exhaust pipe for exhausting gas, and is evacuated.
  • the valve 243d is an open / close valve that can open and close the valve to stop evacuation / evacuation of the processing chamber 201, and further adjust the pressure by adjusting the valve opening.
  • a buffer room 237 which is a distributed space, is provided!
  • a gas supply hole 248a which is a supply hole for supplying a gas is provided in the vicinity of the end of the inner wall adjacent to the wafer 200 in the buffer chamber 237.
  • the gas supply hole 248a opens toward the center of the reaction tube 203.
  • the gas supply holes 248a have the same opening area over a predetermined length from the lower part to the upper part along the stacking direction of the wafers 200, and are further provided at the same opening pitch.
  • the nozzle 233 is also arranged along the stacking direction of the wafer 200 from the lower part to the upper part of the reaction tube 203. It is established.
  • the nozzle 233 is provided with a plurality of gas supply holes 248b that are gas supply holes.
  • the plurality of gas supply holes 248b are disposed along the stacking direction of the wafer 200 over the same predetermined length as in the case of the gas supply holes 248a.
  • a plurality of gas supply holes 248b and a plurality of gas supply holes 248a are arranged in a one-to-one correspondence.
  • the opening area of the gas supply holes 248b may be the same opening pitch from the upstream side to the downstream side with the same opening pitch when the differential pressure between the nother chamber 237 and the processing furnace 202 is small. However, if the differential pressure is large, the opening area should be increased from the upstream side to the downstream side, or the opening pitch should be reduced by / J.
  • the opening area and opening pitch of the gas supply holes 248b are adjusted from the upstream side to the downstream side.
  • a gas having a difference in gas flow velocity from each gas supply hole 248b is ejected.
  • the gas ejected from each gas supply hole 248b can be ejected into the buffer chamber 237 and introduced, and the difference in gas flow rate can be made uniform.
  • the gas ejected from each gas supply hole 248b is ejected from the gas supply hole 248a into the processing chamber 201 after the particle velocity of each gas is relaxed in the buffer chamber 237.
  • the gas ejected from each gas supply hole 248b can be a gas having a uniform flow rate and flow velocity when ejected from each gas supply hole 248a.
  • a U-shaped discharge electrode 301 is disposed in the buffer chamber 237 so as to be covered with a U-shaped electrode protection tube (electrode housing tube) 311 that protects the discharge electrode 301.
  • the electrode protection tube 311 also has a dielectric force.
  • the discharge electrode 301 includes two straight portions 302 and 303 arranged in parallel to each other, a short-circuit portion 304, and lead-out portions 305 and 306.
  • the straight portions 302 and 303 are arranged extending in the vertical direction.
  • a short circuit portion 304 is disposed by short-circuiting the upper ends of the straight portions 302 and 303.
  • Derived portions 307 and 308 are connected to the lower ends of the straight portions 302 and 303, respectively.
  • the straight portions 302 and 303 are arranged on the side of the wafer 200 so as to extend in a direction perpendicular to the main surface of the wafer 200.
  • the electrode protection tube 311 has a structure in which the discharge electrode 301 can be inserted into the buffer chamber 237 while being isolated from the atmosphere of the buffer chamber 237. If the inside of the electrode protection tube 311 has the same atmosphere as the outside air (atmosphere), the discharge electrode 301 inserted into the electrode protection tube 311 is oxidized by the heating of the heater 207. Therefore, the inside of the electrode protection tube 311 is filled or purged with an inert gas such as nitrogen, and an inert gas purge mechanism (not shown) for preventing the oxidation of the discharge electrode 301 by suppressing the oxygen concentration sufficiently low. Is provided. The electrode protection tube 311 is fixed to the reaction tube 203.
  • One end 307 of the discharge electrode 301 is connected to a high-frequency power source 273 via a matching unit 272, and the other end 308 is connected to ground as a reference potential.
  • the straight electrodes 302, 303 of the discharge electrode 301 are arranged in parallel with each other, and one end portions of the straight electrodes ⁇ 302, 303 are short-circuited.
  • High frequency currents flow through 303 in opposite directions.
  • the magnetic field due to the high-frequency current is rapidly attenuated as it moves away from the straight portions 302 and 303.
  • the generated magnetic field is localized inside the straight portions 302 and 303, and as a result, a high-density plasma localized inside the straight portions 302 and 303 is obtained.
  • the straight portions 302 and 303 are in a straight line shape and are arranged in parallel to each other, the plasma density in the extending direction of the straight portions 302 and 303 is constant, so that the straight portions 302 and 303 extend. With respect to the wafers 200 stacked in the direction, uniform processing can be performed between the wafers 200.
  • the plasma becomes inductively coupled plasma induced by the high-frequency current flowing in the 301 discharge electrode, and the plasma generation part is limited to the magnetic field part by the high-frequency current. Since the magnetic field due to the high-frequency current flowing in the opposite direction to the two parallel straight portions 302 and 303 is localized around the straight portions 302 and 303, the plasma is also limited to the vicinity of the straight portions 302 and 303, effectively increasing the plasma density. Can be raised.
  • the straight portions 302 and 303 are arranged along the direction perpendicular to the main surface of the wafer 200 when measuring the wafer 200.
  • a high-frequency current of 333 forces is applied to the straight rods 302 and 303, which are inductively coupled electrodes, and a magnetic field of 331 force is generated in a circular shape in the same manner as the straight rods 302 and 303.
  • the inductively coupled electrodes positioned on the upper portion of the wafer 200 are used.
  • a high-frequency current 333 flows through certain straight line portions 302 and 303, and a concentric magnetic field 331 is generated around the straight line portions 302 and 303. Since the straight portions 302 and 303 are arranged in parallel to the main surface of the wafer 200, the generated magnetic field 331 is generated so as to penetrate the wafer 200.
  • a magnetic field 331 penetrating the wafer 200 generates an eddy current 332 on the surface of the wafer 200.
  • High frequency eddy current 3 In particular, 32 concentrates on the conductor surface and is formed on the surface of the wafer 200! In addition, a pattern that normally constitutes a circuit is formed on the surface of the wafer 200, and high-frequency eddy currents 332 flow on the circuit pattern, resulting in destruction of active elements connected to the pattern. May also occur.
  • a gas supply unit 249 is provided on the inner wall of the reaction tube 203 rotated about 120 ° from the position of the gas supply hole 248a.
  • the gas supply unit 249 is a supply unit that shares the gas supply species with the notch chamber 237 when alternately supplying a plurality of types of gases one by one to the UENO 200 in film formation by the ALD method.
  • the gas supply unit 249 has gas supply holes 248c, which are supply holes for supplying gas at the same pitch, at a position adjacent to the wafer, and a gas supply pipe 232b is connected to the lower part. Yes.
  • the gas supply hole 248c may have the same opening area and the same opening pitch from the upstream side to the downstream side. If it is large, it is better to increase the opening area or reduce the opening pitch by directing the force from the upstream side to the downstream side.
  • a boat 217 for mounting a plurality of wafers 200 in the vertical direction at the same interval in multiple stages, and this boat 217 is a boat elevator mechanism not shown in the figure.
  • the reaction tube 203 can be entered and exited.
  • a boat rotation mechanism 267 that is a rotation means for rotating the boat 217 is provided. By rotating the boat rotation mechanism 267, the boat held by the quartz cap 218 is provided. 217 starts to rotate.
  • Controller 321 serving as a control means includes mass flow controllers 241a and 241b, valves 243a, 243b, 243c, and 243d, heater 207, vacuum pump 246, boat rotation mechanism 267, boat elevator 121, high-frequency power supply 273, and matching unit 272, mass flow controllers 241a, 241b flow rate adjustment, valve 243a, 243b, 243c open / close operation, valve 24 3d open / close and pressure adjustment operation, regulator 302 open / close and pressure adjustment operation, heater 2 07 Temperature control, vacuum pump 246 activation 'stop, boat rotation mechanism 267 rotation speed adjustment, boat elevator 121 lift control, high frequency electrode 273 power supply control, matching device Impedance control by 272 is performed.
  • a SiN film is formed using DCS and NH gas.
  • a wafer 200 to be deposited is loaded into a boat 217 and loaded into a processing furnace 202. After loading, perform the following three steps in sequence.
  • Step 1 NH gas that requires plasma excitation and DC that does not require plasma excitation
  • valve 243a provided in the gas supply pipe 232a and the valve 243d provided in the gas exhaust pipe 231 are both opened, and the NH gas whose flow rate is adjusted by the mass flow controller 243a is supplied from the gas supply pipe 232a to the gas supplied to the nozzle 233. Buff from hole 248b
  • Gas chamber 237, and high frequency power is applied to discharge electrode 301 from high frequency power supply 273 via matching unit 272 to excite NH plasma and supply gas to process chamber 201 as active species.
  • the pressure in the processing chamber 201 is set to 10 to 100 Pa by appropriately adjusting the valve 243d.
  • the NH supply flow rate controlled by the mass flow controller 241a is 1,000 to 10,000 sccm.
  • the time for exposing the wafer 200 to the active species obtained by plasma excitation of NH is 2 to 12
  • the temperature of the heater 207 is set so that the wafer becomes 500 to 600 ° C. Since NH has a high reaction temperature, it does not react at the above wafer temperature.
  • the wafer temperature can be kept at the set low temperature range.
  • step 2 the valve 243a of the gas supply pipe 232a is closed to stop the NH supply.
  • the apparatus is configured so that the conductance between the gas reservoir 247 and the processing chamber 201 is 1.5 ⁇ 10_3 m 3 Zs or more.
  • the volume ratio of 100 to 300 cc is preferable when the volume of the reaction tube 203 is 1001 (liters).
  • the gas reservoir 247 is preferably 1 Z1000 to 3Z1000 times the reaction chamber volume.
  • step 3 when the exhaust of the processing chamber 201 is finished, the valve 243c of the gas exhaust pipe 231 is closed to stop the exhaust. Open the valve 243c on the downstream side of the gas supply pipe 232b. As a result, the DCS stored in the gas reservoir 247 is supplied to the processing chamber 201 at once. At this time, since the valve 243d of the gas exhaust pipe 231 is closed, the pressure in the processing chamber 201 is rapidly increased to about 931 Pa (7 Torr). The time for supplying DCS was set to 2 to 4 seconds, and then the time for exposure to the increased pressure atmosphere was set to 2 to 4 seconds, for a total of 6 seconds. The wafer temperature at this time is 500 to 600 ° C, which is the same as when NH is supplied. DCS supply
  • the valve 243c is closed, the valve 243d is opened, and the processing chamber 201 is evacuated to remove the gas after contributing to the film formation of the remaining DCS.
  • an inert gas such as N
  • valve 243b is opened to start supplying DC S to gas reservoir 247.
  • Steps 1 to 3 are defined as one cycle, and this cycle is repeated a plurality of times to form a SiN film having a predetermined thickness on the wafer.
  • gas is adsorbed on the surface of the base film.
  • the amount of gas adsorption is proportional to the gas pressure and the gas exposure time. Therefore, in order to adsorb the desired amount of gas in a short time, it is necessary to increase the gas pressure in a short time.
  • the DCS stored in the gas reservoir 247 is instantaneously supplied after the valve 243d is closed, the pressure of the DCS in the processing chamber 201 can be rapidly increased. The desired amount of gas can be absorbed instantaneously.
  • a cassette stage 105 is provided as a holder transfer member for transferring the cassette 100 as a substrate storage container to and from an external transfer device (not shown).
  • a cassette elevator 115 as an elevating means is provided on the rear side of 105, and a cassette transfer machine 114 as a conveying means is attached to the cassette elevator 115.
  • a cassette shelf 109 as a means for placing the cassette 100 is provided on the rear side of the cassette elevator 115, and a spare cassette shelf 110 is also provided above the cassette stage 105.
  • a clean unit 118 is provided above the spare cassette shelf 110 and is configured to circulate clean air inside the housing 101.
  • a processing furnace 202 is provided above the rear portion of the casing 101, and a boat 217 serving as a substrate holding unit that holds the wafers 200 as substrates in multiple stages in a horizontal posture is processed below the processing furnace 202.
  • a boat elevator 121 is installed as an elevating means for raising and lowering the furnace 202, and a seal cap 219 as a lid is attached to the tip of an elevating member 122 attached to the boat elevator 121 to support the boat 217 vertically. .
  • a transfer elevator 113 as an elevating means is provided, and a wafer transfer machine 112 as a transfer means is attached to the transfer elevator 113.
  • a furnace opening shirt 116 as a closing means that has an opening / closing mechanism and hermetically closes the lower side of the processing furnace 202.
  • the cassette 100 loaded with the wafer 200 is rotated by 90 ° on the set stage 105 so that the wafer 200 is loaded into the cassette stage 105 in an upward posture and the wafer 200 is in a horizontal posture even with an external transfer device force (not shown). Be made. Further, the cassette 100 is transported from the cassette stage 105 to the cassette shelf 109 or the spare cassette shelf 110 by the cooperation of the raising / lowering operation of the cassette elevator 115, the transverse operation, the advance / retreat operation of the cassette transfer machine 114, and the rotation operation.
  • the cassette shelf 109 has a transfer shelf 123 in which the cassette 100 to be transferred by the wafer transfer device 112 is stored.
  • the cassette 100 to which the wafer 200 is transferred is a cassette elevator 115, a cassette transfer. It is transferred to the transfer shelf 123 by the mounting machine 114.
  • the boat 217 When a predetermined number of wafers 200 are transferred to the boat 217, the boat 217 is inserted into the processing furnace 202 by the boat elevator 121, and the processing furnace 202 is hermetically closed by the seal cap 219. The wafer 200 is heated in the hermetically closed processing furnace 202 and the processing gas is supplied into the processing furnace 202 to process the wafer 200.
  • the wafer 200 is transferred from the boat 217 to the cassette 100 of the transfer shelf 123 by the reverse procedure of the above-described operation, and the cassette 100 is transferred by the cassette transfer machine 1 14. It is transferred from the mounting shelf 123 to the cassette stage 105, and is carried out of the casing 101 by an external transfer device (not shown).
  • the furnace logo 116 hermetically closes the lower surface of the processing furnace 202 when the boat 217 is in a lowered state, thereby preventing outside air from being caught in the processing furnace 202.
  • the amount of active species generated by plasma can be increased.
  • the present invention can be particularly suitably used for a substrate processing apparatus for processing a semiconductor wafer and a method for manufacturing a semiconductor device.

Abstract

L’invention concerne un appareil de traitement de substrat pourvu d’un conteneur de traitement (203) ; de sections d’injection de gaz (232a, 232b) permettant d’injecter un gaz de traitement désiré dans le conteneur de traitement (203) ; d'une section d’échappement de gaz (246) permettant de rejeter le surplus de gaz de traitement depuis le conteneur de traitement (203) ; d'un élément de placement de substrat (217) afin de placer une pluralité de substrats (200) dans un état empilé dans le conteneur de traitement (203) ; et d'une électrode (301) à laquelle on applique une puissance haute fréquence afin de générer du plasma pour exciter le gaz de traitement. L’électrode (301) est munie de deux sections linéaires longues et minces (302, 303) disposées en parallèle ; et d'une section de mise en court-circuit (304) où les extrémités sur un côté des sections linéaires (302, 303) sont mises en court-circuit électriquement. Les sections linéaires (302, 303) s’étendent vers un côté du substrat (200) dans une direction verticale à un plan principal du substrat (200).
PCT/JP2006/303731 2005-03-01 2006-02-28 Appareil de traitement de substrat et procédé de fabrication de dispositif semi-conducteur WO2006093136A1 (fr)

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KR1020077019904A KR100909750B1 (ko) 2005-03-01 2006-02-28 기판 처리 장치 및 반도체 디바이스의 제조 방법
JP2007505948A JP4951501B2 (ja) 2005-03-01 2006-02-28 基板処理装置および半導体デバイスの製造方法
US11/885,483 US8251012B2 (en) 2005-03-01 2006-02-28 Substrate processing apparatus and semiconductor device producing method

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JP2005-056314 2005-03-01

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US20080286980A1 (en) 2008-11-20
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