WO2006051577A1 - ロードポート及びアダプタ - Google Patents
ロードポート及びアダプタ Download PDFInfo
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- WO2006051577A1 WO2006051577A1 PCT/JP2004/016560 JP2004016560W WO2006051577A1 WO 2006051577 A1 WO2006051577 A1 WO 2006051577A1 JP 2004016560 W JP2004016560 W JP 2004016560W WO 2006051577 A1 WO2006051577 A1 WO 2006051577A1
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- WIPO (PCT)
- Prior art keywords
- carrier
- load port
- mounting table
- substrate
- mapping
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Definitions
- the present invention provides a substrate storage container (hereinafter referred to as a wafer carrier) which is provided in a substrate processing apparatus to which various substrates (hereinafter referred to as wafers) such as silicon wafers are transported and which holds wafers at predetermined intervals.
- a substrate storage container hereinafter referred to as a wafer carrier
- wafers various substrates
- the present invention relates to an adapter to be attached to a load port to be placed and a wafer carrier.
- this type of load port is usually used in a so-called pre-process for performing processing such as baking a circuit pattern on a wafer.
- the carrier dor of the opening of the wafer carrier which is maintained at a high degree of cleanliness inside, is engaged with the load port door of the opening of the substrate processing unit, which is maintained at high degree of cleanliness.
- a fine adjustment mechanism for finely adjusting the position of the positioning pin for positioning the carrier door, and for positioning the carrier door, and for positioning the carrier door.
- a position holding mechanism for holding the position of the engaged carrier door.
- Patent Document 1 The load port of Patent Document 1 is premised to be used in the pre-process where high cleanness is required, and the wafer subjected to the pre-process is chipped and bonded, and molding such as resin molding is performed. It is not mainly intended to be used in the so-called post-process.
- the substrate processing apparatus corresponding to both the FOSB and the open cassette has the load port for the FOSB and the open cassette for the open cassette on its front surface.
- SMIF can be used for an open cassette for 200 mm even in a substrate processing apparatus. Even if (Standard Mechanical Interface) is installed, it should be replaced with a load port that can be used for an open cassette for 300 mm according to the customer's request.
- a transmissive sensor is mainly used.
- the transmission sensor needs to detect the front end of the wafer, and it has been difficult to detect wafers of different sizes by the same mechanism.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-68362
- An object of the present invention is to selectively mount wafer carriers of different sizes on a mounting table, and map wafers of different sizes accommodated in wafer carriers mounted on a mounting table. It is an object of the present invention to provide an adapter capable of indirectly mounting a load port and wafer carrier that can be mounted on a mounting table.
- the present invention solves the above-mentioned problems by the following solutions.
- the invention according to claim 1 is provided on the front of a door opening of a substrate processing apparatus to which a substrate is transported, and a carrier for storing the substrate at a predetermined interval is placed inside the door opening, and the door opening
- the load port door for opening and closing the load port door, which is different in size from the mounting table, the first carrier directly mounted on the mounting table and storing the first substrate, and the first carrier,
- a second carrier for storing a second substrate mounted via an adapter and having a size different from that of the first substrate, and a detection unit for detecting which of the second carriers is mounted on the mounting table.
- the invention of claim 2 is the load port according to claim 1, wherein the detection unit outputs a detection signal according to the first carrier or the second carrier placed on the mounting table.
- the load port may further include a mapping unit configured to map the first substrate or the second substrate based on the detection signal.
- the invention of claim 3 is characterized in that, in the load port according to claim 2, the mapping unit changes an initial setting value when the mapping is performed based on the detection signal. It is a load port.
- the invention of claim 4 is the load port according to claim 3, wherein the initial setting value is a distance between the first substrate or a distance between the second substrate, and the first carrier or the second carrier. It is a load port provided in a carrier and characterized in that it is a distance between a lowermost or uppermost stage holding portion for holding the first substrate or the second substrate and the mounting table.
- the invention according to claim 5 is the load port according to claim 4, wherein the mapping unit moves from the lowermost level to the uppermost level of the holding section or from the uppermost level to the lowermost level. It is a load port characterized by including a mapping sensor which detects a substrate or the 2nd substrate.
- the invention of claim 6 is the load port according to claim 5, wherein the mounting table includes the load port door of the first substrate accommodated in the first carrier placed on the mounting table.
- the load port door side is arranged such that the front end portion on the side and the front end portion on the load port door side of the second substrate accommodated in the second carrier placed on the mounting table are substantially at the same position.
- the mapping unit is provided on the load port door, and includes a pop-out sensor that detects that the first substrate or the second substrate is ejected from the holding unit to the load port door side. After the mounting table is moved to the load port door side, the tip end portion is positioned within the sensor area of the pop-out sensor. Stopping the mapping when the load port is on.
- the invention of claim 7 is the load port according to claim 6, wherein the mapping unit is after the mounting table has been moved to the load port door side, and the tip end portion is the flyout. Starting the mapping when located outside the sensor area of the sensor.
- the invention of claim 8 relates to the load port according to claim 1, wherein the detection unit displaces the lower surface of the first carrier when the first carrier is placed on the mounting table.
- the load port includes a second sensor that detects a displacement amount of the moving unit moving to the mounting table side when mounted on the mounting table via the adapter.
- the invention of claim 9 is the load port according to claim 8, wherein the adapter includes a pressing portion provided on the upper surface thereof and depressed by a protrusion provided on the lower surface of the second carrier,
- the moving unit is a load port characterized by moving to the side of the mounting table by pressing the pressing unit.
- the invention according to claim 10 differs in size from the first carrier directly mounted on the mounting table and containing the first substrate, and the first carrier, and is indirectly mounted on the mounting table.
- a second carrier containing a second substrate different in size from the first substrate can be selectively mounted on the mounting table, and a detection indicating that the second carrier is mounted on the mounting table
- An adapter for use in a load port system including a detection unit for outputting a signal, the adapter being disposed between the second carrier and the mounting table, the adapter being provided on the upper surface thereof, on the lower surface of the second carrier
- the first carrier and the second carrier detects which of the first carrier and the second carrier has been placed on the mounting table, and maps the first substrate or the second substrate based on the detection signal corresponding to the first carrier or the second carrier. Therefore, substrates of different sizes can be mapped by the same mechanism.
- FIG. 1 is a perspective view showing a load port and an adapter according to an embodiment of the present invention.
- FIG. 2 is a perspective view showing a load port according to an embodiment of the present invention, a wafer carrier mounted on a mounting table via an adapter, and a wafer carrier directly mounted on the mounting table.
- FIG. 3 It is an enlarged view which shows the inside of the mounting base of a load port shown in FIG. 1, and an adapter.
- FIG. 4 is a cross-sectional view of an adapter according to an embodiment of the present invention taken along line AA.
- FIG. 5 is a top view and a side view showing an adapter according to an embodiment of the present invention.
- FIG. 6 is a bottom view showing an adapter according to an embodiment of the present invention.
- FIG. 7 is a top view and a side view showing the positional relationship between wafer carriers of different sizes placed on the load port according to an embodiment of the present invention, and transmission sensors and mapping sensors provided on the load port. .
- FIG. 8 is a block diagram showing a load port according to an embodiment of the present invention.
- FIG. 9 is a flow chart showing the operation of the load port according to the embodiment of the present invention.
- the present invention has an object of selectively mounting wafer carriers of different sizes on the mounting table, and mapping the wafers of different sizes accommodated in the wafer carriers mounted on the mounting table.
- a mounting base on which the first carrier for storing the first substrate is directly mounted, or on which the second carrier for storing the second substrate is mounted indirectly, and a detection signal according to the first carrier or the second carrier And a mapping unit that maps the first substrate or the second substrate.
- FIG. 1 is a perspective view showing a load port and an adapter according to an embodiment of the present invention.
- FIG. 2 is a perspective view showing a load port according to an embodiment of the present invention, a wafer carrier mounted on a mounting table via an adapter, and a wafer carrier directly mounted on the mounting table.
- the load port 100 has a wall surface 130 or the like on which a door opening 131 for opening and closing the load port door 140 is formed. It is installed on the wall of a substrate processing apparatus (not shown) that performs chipping, bonding, and molding processing such as resin molding.
- the load port 100 is a device for mounting the carrier 200, 300 in a state where one surface is opened by the carrier openings 202, 302 and opening and closing the load port door 140 of the door opening 131.
- 101 a support base 102 for supporting the load port 100, a mounting table 110 provided movably on the table 101, and a mounting table provided inside the table 101
- a drive unit 120 (see FIG. 3) for driving the drive unit 110, and a door port door opening / closing mechanism 150 for opening and closing the load port door 140 are provided.
- the mounting table 110 is a table for selectively mounting the wafer carriers 200 and 300 transferred by the automatic transfer apparatus (not shown).
- the wafer carrier 200 is indirectly mounted via the adapter 10.
- the wafer carrier 300 is placed directly.
- the load port door 140 is used near the upper end or near the lower end when performing mapping described later, one of which is on the light emission side and the other is on the light reception side.
- the transmission type sensors 141a and 141b are provided. ing.
- the mounting table 110 is provided with a kinematic pin 11 la-11 lc, etc. for positioning the adapter 10 or the wafer carrier 300 on the top thereof.
- the wafer carrier 200 is a so-called open cassette in which wafers 200A of 200 mm are accommodated at predetermined intervals (about 6.35 mm), and the carrier shell 201 and the carrier 200 are provided. , And a slot 200B for holding the wafer 200A.
- the carrier shell 201 is provided at its upper portion with a robot flange 203 to be gripped by the automatic conveyance device, and on its lower surface 210, the pressing portions 24-1 and 24-2 provided on the upper surface of the adapter 10 are pushed.
- a pressing protrusion (not shown) for lowering is provided.
- wafer carrier 300 is a so-called FOSB in which wafers 300A of 300 mm are accommodated at predetermined intervals (about 10 mm), and carrier carrier 301 and wafer 300A are formed. / / With slot 300B etc. to hold.
- the carrier shell 301 is provided with a robot flange 303 at its upper part, and a V-shaped groove (not shown) which engages with the kinematic pins 11 la-11 lc is formed on its lower surface 310!
- FIG. 3 is an enlarged view showing the inside and the adapter of the mounting table of the load port shown in FIG. 1.
- the driving unit 120 is provided inside the table 101 as shown in FIG.
- a slide portion 123 movable to the load port door 140 side, and first sensors 121a to 121d provided around the slide portion 123 and moving with the slide portion 123, second sensors 122a and 122b, and the like are provided.
- the slide portion 123 has a projection passing through a hole formed in the mounting table 110. The projection can be lowered while moving horizontally, and as shown in FIGS. 1 and 2, when the mounting table 110 is disposed above the driving unit 120, the mounting table 110 can be moved to the driving unit 120. It abuts on the top surface of the mounting table 110 so as to hold it in place.
- the first sensors 121 a-121 d are contact sensors, and each have a first protrusion passing through a hole formed in the mounting table 110, and the wafer carrier 300 is directly mounted on the mounting table 110. At the same time, the displacement of the wafer carrier 300 with the lower surface 310 is detected, and when the adapter 10 is placed on the mounting table 110, the displacement of the adapter 10 with the lower surface is detected.
- the second sensors 122a and 122b are contact sensors, and each have a second protrusion passing through a hole formed in the mounting table 110.
- the second sensor 122a, 122b is provided on the lower surface of the adapter 10, and is a wafer carrier 20 When 0 is mounted on the mounting table 110 via the adapter 10, the displacement amount with the movable bodies 22-1 and 22-2 (see FIG. 4) moving to the mounting table 110 side is detected.
- FIG. 4 is an AA sectional view showing an adapter according to an embodiment of the present invention.
- FIG. 5 is a top view and a side view showing an adapter according to an embodiment of the present invention.
- FIG. 6 is a bottom view of an adapter according to an embodiment of the present invention.
- the adapter 10 is disposed between the wafer carrier 200 and the mounting table 110, as shown in FIG. 2, for indirectly mounting the wafer carrier 200 on the mounting table 110.
- a base plate 11 and gripping portions 12a and 12b attached to side surfaces of the base plate 11 are provided.
- the base plate 11 has a cutout 16 formed on the side facing the load port door 140 when the base plate 11 is placed on the mounting table 110, and a groove 15 is formed substantially in the center of the cutout 16.
- the base plate 11 is provided on the upper surface thereof with the groove portion 15 and is provided with a plurality of transfer plates 14 having the claw portions 14a and 14b at both ends, and disposed substantially parallel to the transfer plate 14.
- An engaging plate 13 having engaging holes 13a and 13b formed on the lower surface 210 and engaged with projections (not shown), and formed along the longitudinal direction of the passing plate 14 and holding screw portions 21-1, 1, 21-2 and the pressing parts 24-1 and 24-2 are provided with insertion holes 11c, l id and the like to be inserted, respectively.
- the base plate 11 accommodates the V-shaped groove 17a-17c engaged with the kinematic pin 11la-11c and the movable bodies 22-1 and 22-2 on its lower surface, and the holding screw 21-1 , 21-2 and the pressing unit A groove 1 la and a circular groove 1 lb, etc. corresponding to positions 24-1 and 24-2 are provided.
- a holder 23 having a flange portion is attached to the insertion hole l id formed in the base plate 11.
- the upper surface side of the holding stand 23 is cylindrical, and the pressing portion 24-1 is inserted into the inside 23a thereof.
- the depressed portion 24-1 is urged toward the upper surface by the spring 25 so that the upper end thereof also projects the upper surface force of the base plate 11.
- the lower end of the pressing portion 24-1 penetrates the holding stand 23 and is fixed to an engagement hole 22a formed in the movable body 22-1.
- a holding screw portion 21-1 is screwed into the wedge hole 11 c formed in the base plate 11, and a support 26 is attached to the lower end thereof.
- the support 26 passes through the engagement hole 22b formed in the movable body 22-1, and the movable body 22-1 is separated with a gap so that the movable body 22-1 can move in the vertical direction of the base plate 11. keeping.
- the adapter 10 when the wafer carrier 200 is attached to the upper surface of the adapter 10, the adapter 10 is configured to press the pressing portion 2 41 against the pressing convex force spring 25 provided on the lower surface 210 of the wafer carrier 200. Press down to the lower side of plate 11. As the pressing portion 24-1 is depressed, the movable body 22-1 moves to the lower surface side of the base plate 11 while being held by the support column 26.
- the lower surface 210 of the wafer carrier 200 is in a stable state on the upper surface of the adapter 10 by engaging with the claws 14 a and 14 b of the transfer plate 14 and the engagement holes 13 a and 13 b of the engagement plate 13. Installed.
- the V-shaped groove portions 17a to 17c engage with the kinematic pins 11 la to 11 lc.
- the groove 15 of the notched portion 16 engages with the uneven portion of the slide portion 123.
- the mobile unit 22-1 is moved to the mounting table 110 side when the wafer carrier 200 is mounted on the mounting table 110 via the adapter 10, and thus, the second sensor 122a, 122b Protrusion Contact with the upper end of contact point 22A.
- the adapter 10 is configured such that the carrier carrier 200 is indirectly mounted on the mounting table 110 by bringing the movable body 22-1 into contact with the second sensor 122 a, 122 b as shown in FIG. (See below) (the details will be described later).
- FIG. 7 a state in which the wear carrier 200 or the wafer carrier 300 is mounted on the mounting table 110 of the load port 100 will be described with reference to FIGS. 7 and 8.
- FIG. 7 a state in which the wear carrier 200 or the wafer carrier 300 is mounted on the mounting table 110 of the load port 100 will be described with reference to FIGS. 7 and 8.
- FIG. 7 is a top view and a side view showing the positional relationship between wafer carriers of different sizes placed on the load port according to an embodiment of the present invention, and transmission sensors and mapping sensors provided on the load port. .
- FIG. 7 shows that the front end portions of the wafers 200A and 300A on the side of the load port door 140 coincide in order to show the positional relationship between the wafers 200A and 300A, the transmissive sensors 1 41a and 141b, and the mapping sensors 152a and 152b.
- the wafer carrier 200 and the wafer carrier 300 are shown in an overlapping manner.
- FIG. 8 is a block diagram illustrating a load port according to an embodiment of the present invention.
- the load port 100 includes a control unit 160, a carrier determination unit 161, a mapping half IJ definition, first sensors 121a to 121d, second sensors 122a and 122b, and transmission type sensors.
- the sensor 141a, 141b, the initial value setting unit, the mapping sensor 152a, 152b, the load port door opening / closing mechanism 150, etc. are electrically connected via the control unit 160. There is.
- Carrier determination unit 161 detects which of wafer carriers 200 and 300 has been mounted on mounting table 110, and determines a detection signal corresponding to wafer carriers 200 and 300 mounted on mounting table 110 as a mapping determination. It is a device that outputs to the part 162.
- the mapping determination unit 162 is a device that maps the wafers 200 A and 300 A based on the detection signal output from the carrier determination unit 161.
- mapping refers to the determination of the presence or absence of Ueno, 200A, 300A in a specific slot 200B, 300B, and generation of information indicating the presence and location of the Ueno, 200A, 300A in the wafer carrier 200, 300.
- the wafer transfer robot of the substrate processing apparatus changes its movement based on the determination result of this mapping.
- Initial value setting unit 163 sets an initial setting value when mapping is performed based on the detection signal. It is an apparatus to change.
- the initial setting values are the distance between the wafers 200A or the distance between the wafers 300A, the uppermost or lowermost slot 200B or 300B (see FIG. 7B) holding the wafer 200A or the wafer 300A, and the mounting table 110. Distance.
- the mapping sensors 152a and 152b are rotatably provided on a support shaft 151 disposed along the vicinity of the upper end portion of the load port door opening / closing mechanism 150, as shown in FIG. 7 (b).
- the mapping sensor 152a, 152b rotates counterclockwise in FIG. 7 (b), and along with the vertical movement of the support shaft 151, the slot 200B, It is an apparatus for detecting Ueno, 200A or wafer 300A while moving from the top to the bottom of 300B.
- the mapping sensors 152a and 152b can detect the wafers 200A and 300A that do not interfere with other members.
- the mounting table 110 is movable toward the load port door 140 as shown in FIG. 7, and when the wafer carrier 200 or the wafer carrier 300 is mounted on the mounting table 110, the wafer 200 A
- the tip of the load port door 140 can be substantially at the same position as the tip of the load port door 140 of the wafer 300B.
- the mapping determination unit 162 sets the tip of the wafer 200A or the wafer 300A out of the sensor area of the transmissive sensors 141a and 141b. It is a device that causes the mapping sensors 152a and 152b to start detecting the Ueno 200A or the wafer 300A when it is positioned.
- FIG. 9 is a flow chart illustrating the operation of the load port according to an embodiment of the present invention.
- the wafer carrier 300 or the adapter 10 is mounted on the mounting table 110.
- the detection signal A1 output from the first sensors 121a to 121d is detected (S101).
- the detection signal A1 is generated when the first protrusions of the first sensors 121a to 121d contact the lower surface 310 of the wafer carrier 300 or the lower surface of the adapter 10.
- the carrier determination unit 161 detects whether or not the detection signal A2 is output from the second sensors 122a and 122b (S102).
- the second sensors 122a and 122b output a detection signal A2 to the carrier determination unit 161 when the wafer carrier 200 is mounted on the mounting table 110 via the adapter 10.
- the detection signal A2 is generated when the second projecting portions of the second sensors 122a and 122b contact the contact points 22A and 22B of the moving bodies 22-1 and 22-2 of the adapter 10.
- the carrier determination unit 161 mounts the wafer carrier 200 on the mounting table 110 via the adapter 10. Detection result, and outputs the detection result to the mapping determination unit 162.
- Mapping determination unit 162 reads signal B 1 from initial value setting unit 163 in order to map wafer 200 A held in each slot 200 B of wafer carrier 200 (S 103).
- Signal B1 indicates the pitch between wafers 200A (e.g. 6.35 mm) and the distance between top stage slot 200B and placement stage 110 indicating the position where mapping sensors 152a, 152b start detecting wafer 200A.
- the signal B1 may have the number of slots 200B as information, whereby the mapping determination unit 162 can calculate the position at which the detection of the wafer 200A ends.
- the carrier determination unit 161 detects that the wafer carrier 300 has been mounted on the mounting table 110. At the same time, the detection result is output to the mapping determination unit 162. Even when only the adapter 10 is mounted on the mounting table 110, only the detection signal A1 is output to the carrier determination unit 161, but the upper surface of the adapter 10 is used in a manufacturing line that performs processing in a later step. Since the wafer carrier 200 is always attached to the sensor, the carrier determination unit 161 detects that the wafer carrier 300 has been mounted on the mounting table 110 as described above.
- the mapping judgment unit 162 reads the signal B2 from the initial value setting unit 163 in order to map the wafer 300A held in each slot 300B of the wafer carrier 300 (S104).
- the signal B2 has a pitch (for example, 10 mm) between the wafers 300A and the mapping sensor 1 It has information indicating the distance between the mounting slot 110 and the uppermost slot 300B indicating the position where the detection of the wafer 300A by the 52a and 152b starts.
- the signal B2 may have the number of slots 300B as information, so that the mapping judgment unit 162 can calculate the position at which the detection of the wafer 300A ends.
- the mapping determination unit 162 After reading the signal C1 output from the transmission type sensor 141a, 141b (S105), the mapping determination unit 162 outputs the signal D1 to the mapping sensor 152a, 152b, and the Ueno 200 A or wafer 300A. Detection is started (S106).
- Signal C1 is a preferred position to which wafer 200A or wafer 300A is mapped, that is, all of the tip end mounts 110 on the side of load port door 140 of wafer 200A or wafer 300A are on the side of load port door 140. , And has information indicating that the sensor is located outside the sensor area of the transmission sensors 141a and 141b.
- the front end of the wafer 200A or the wafer 300A is, for example, vibrated by the movement of the mounting table 110, etc., and each slot 200A or 300A force 200A or 300A force 300mm force is not lost! If a problem such as popping out to the load port door 140 occurs, it will be located in the sensor area of the transmissive sensor 141a, b.
- the transmission sensor 141a, 141b outputs a signal indicating that the position of the wafer 200A or the wafer 300A is shifted to the mapping determination unit 162, and the mapping determination unit 162 transmits the wafer 200A or the wafer 200A to the mapping sensor 152a, 152b.
- the mapping is aborted without starting the detection of the wafer 300A.
- the mapping determination unit 162 outputs a signal for generating a warning sound to a voice output unit (not shown) to warn an operator or the like that the position of the wafer 200A or the wafer 300A is shifted.
- a signal for displaying a warning display on an appropriate display unit may be output.
- the mapping determination unit 162 can also output these signals to a substrate processing apparatus or the like.
- the mapping determination unit 162 reads the signal C 1 again and outputs the signal D 1 to perform mapping. Inspection of wafer 200A or wafer 300A on sensor 152a, 152b Start out.
- the control unit 160 outputs the signal E1 to the load port door opening and closing mechanism 150 (S107).
- the load port door opening / closing mechanism 150 opens the load port door 140 of the door opening 131.
- the wafer openings 202 and 302 of the carrier 200 and 300 and the processing space in the substrate processing apparatus become continuous.
- the wafers 200A and 300A are transferred to the processing space by the wafer transfer robot of the substrate processing apparatus, and the processing of the post process is performed.
- wafer carrier 300 can be directly mounted on mounting table 110, and wafer carrier 200 can be mounted indirectly on mounting table 110 via adapter 10, so Different wafer carriers 200 and 300 can be selectively mounted on the mounting table 110.
- the substrate processing apparatus can cope with wafer carriers of different sizes simply by installing the load port 100 on the front surface, thereby achieving cost reduction and space saving.
- load port 100 detects which of wafer carriers 200 and 300 has been mounted on mounting table 110, and wafer carriers 200 and 300 having different sizes are mounted on mounting table 110. Also, the wafers 200A and 300A having different sizes can be mapped by the same mechanism only by changing the initial value in the initial value setting unit 163.
- the adapter 10 is disposed between the wafer carrier 200 and the mounting table 110, whereby the movable bodies 22-1 and 22-2 move to the mounting table 110 side, and the second sensors 122a and 122b are moved. Since the detection signal A2 is output, the load port 100 can detect that the wafer carrier 200 has been indirectly mounted on the mounting table 110.
- the wafer carriers 200 and 300 can be selectively mounted on the mounting table 110.
- the present invention is not limited to this.
- 1 sensor 121a-121d, the second sensor 122a, 122b, the position of the pressing part 24-1, 24-2 May be changed.
- the carrier determination unit 161 outputs the detection signal A1 from the first sensors 121a to 121d, and does not output the detection signal A2 from the second sensors 122a and 122b. Although it was detected that it was placed (S101, S102), for example, when the detection signal A1 is output, the timer etc. are operated, and the detection signal A2 is not output even if a predetermined time has elapsed. In the case of pressure, it may be detected that the wafer carrier 300 has been mounted on the mounting table 110.
- the first sensors 121a to 121d and the second sensors 122a and 122b are not limited to the force used as the contact type sensor, and the lower surface 310 of the wafer carrier 300 or the lower surface of the adapter 10, the movable body 24-1, 24- As long as the displacement amount of 2 can be detected, it may be a noncontact sensor.
- the mapping sensor 152a, 152b is not limited to such a force that starts detection of the wafer 200A or the wafer 300A from the uppermost slot 200B, 300B, and the support shaft 151 is lowered in advance.
- the lowermost slot 200B, 300B can be started. Too! ⁇
- the load port 100 is not limited to this, as long as it is used in a clean room whose inside is kept at a high degree of cleanliness, it may be used in the previous process. The details will be described below.
- the general load port is assumed to be used at a 300 mm factory that mainly processes 300 mm wafers.
- the 300 mm factory is maintaining the cleanliness inside the clean room and maintaining high cleanliness locally.
- the 300 mm front-end process factory which carries out the pre-process requiring high cleanness, uses a wafer carrier with a carrier door to process 300 mm wafers.
- high cleanness is not required compared to the previous process.
- the wafer carrier 200, 300 with one side open is used, and only the 300 mm wafer is used.
- 200 mm wafers may be processed. Therefore, the load port 100 can be suitably used in a 300 mm post-process plant.
- the 200 mm factory that processes 200 mm wafers keeps the inside of the clean room at a high degree of tardiness, so the wafer carrier 200 with one side open is used not only in the 200 mm back process plant but also in the 200 mm front process plant. And 200 mm wafers may be processed. For this reason, the load port 100 can be used in a 200 mm back processing plant only by 200 mm back processing plant.
- the load port 100 can be used in the previous process not only in each of the above-described factories but also in a laboratory having a clean room whose interior is kept at a high degree of cleanliness.
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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US11/667,339 US20110303125A1 (en) | 2004-11-09 | 2004-11-09 | Load port and adaptor |
PCT/JP2004/016560 WO2006051577A1 (ja) | 2004-11-09 | 2004-11-09 | ロードポート及びアダプタ |
CNA2004800443381A CN101138079A (zh) | 2004-11-09 | 2004-11-09 | 载入机以及转接器 |
JP2006544683A JPWO2006051577A1 (ja) | 2004-11-09 | 2004-11-09 | ロードポート及びアダプタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2004/016560 WO2006051577A1 (ja) | 2004-11-09 | 2004-11-09 | ロードポート及びアダプタ |
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WO2006051577A1 true WO2006051577A1 (ja) | 2006-05-18 |
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PCT/JP2004/016560 WO2006051577A1 (ja) | 2004-11-09 | 2004-11-09 | ロードポート及びアダプタ |
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US (1) | US20110303125A1 (ja) |
JP (1) | JPWO2006051577A1 (ja) |
CN (1) | CN101138079A (ja) |
WO (1) | WO2006051577A1 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013084682A (ja) * | 2011-10-06 | 2013-05-09 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015050410A (ja) * | 2013-09-04 | 2015-03-16 | ローツェ株式会社 | 複数種類の半導体ウエハを検出するロードポート |
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JPWO2015045711A1 (ja) * | 2013-09-30 | 2017-03-09 | 村田機械株式会社 | 保管庫 |
JP2018029210A (ja) * | 2017-11-21 | 2018-02-22 | シンフォニアテクノロジー株式会社 | ロードポート及びウエハマッピング装置 |
JP2018078159A (ja) * | 2016-11-08 | 2018-05-17 | 株式会社ディスコ | 簡易テーブル |
JP2020038984A (ja) * | 2018-05-24 | 2020-03-12 | シンフォニアテクノロジー株式会社 | 容器パージ装置 |
CN111755370A (zh) * | 2019-03-29 | 2020-10-09 | 平田机工株式会社 | 装载端口 |
WO2021187340A1 (ja) * | 2020-03-17 | 2021-09-23 | 日本電産リード株式会社 | ロードポート用アダプタ |
JP2022103434A (ja) * | 2017-11-06 | 2022-07-07 | シンフォニアテクノロジー株式会社 | マッピング方法、efem |
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WO2012160917A1 (ja) * | 2011-05-25 | 2012-11-29 | 村田機械株式会社 | ロードポート装置、搬送システム、及びコンテナ搬出方法 |
CN103779253A (zh) * | 2012-10-17 | 2014-05-07 | 沈阳芯源微电子设备有限公司 | 兼容不同基板装载的装载机构 |
JP6098737B2 (ja) * | 2014-02-07 | 2017-03-22 | 村田機械株式会社 | ガス注入装置及び補助部材 |
JP6248788B2 (ja) * | 2014-04-28 | 2017-12-20 | シンフォニアテクノロジー株式会社 | ウエハマッピング装置およびそれを備えたロードポート |
US9698038B2 (en) | 2014-08-28 | 2017-07-04 | Infineon Technologies Ag | Adapter tool and wafer handling system |
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CN112687600A (zh) * | 2021-01-06 | 2021-04-20 | 天津中环领先材料技术有限公司 | 一种晶圆片承载装置 |
TWI831162B (zh) * | 2022-03-24 | 2024-02-01 | 上銀科技股份有限公司 | 裝載埠及其映射裝置 |
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JP2003142551A (ja) * | 2001-11-02 | 2003-05-16 | Hirata Corp | 載置装置 |
Cited By (15)
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US9171748B2 (en) * | 2010-09-17 | 2015-10-27 | Sinfonia Technology Co., Ltd. | Cassette adapter, adapter main body locking apparatus and seating sensor mechanism |
TWI585892B (zh) * | 2010-09-17 | 2017-06-01 | 昕芙旎雅股份有限公司 | 卡匣轉接器 |
JP2013084682A (ja) * | 2011-10-06 | 2013-05-09 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015050410A (ja) * | 2013-09-04 | 2015-03-16 | ローツェ株式会社 | 複数種類の半導体ウエハを検出するロードポート |
JPWO2015045711A1 (ja) * | 2013-09-30 | 2017-03-09 | 村田機械株式会社 | 保管庫 |
KR102221107B1 (ko) | 2015-03-13 | 2021-02-26 | 세메스 주식회사 | 웨이퍼 제조 설비 시스템 |
KR20160109747A (ko) * | 2015-03-13 | 2016-09-21 | 세메스 주식회사 | 웨이퍼 제조 설비 시스템 |
JP2018078159A (ja) * | 2016-11-08 | 2018-05-17 | 株式会社ディスコ | 簡易テーブル |
JP7385151B2 (ja) | 2017-11-06 | 2023-11-22 | シンフォニアテクノロジー株式会社 | マッピング方法、efem |
JP2022103434A (ja) * | 2017-11-06 | 2022-07-07 | シンフォニアテクノロジー株式会社 | マッピング方法、efem |
JP2018029210A (ja) * | 2017-11-21 | 2018-02-22 | シンフォニアテクノロジー株式会社 | ロードポート及びウエハマッピング装置 |
JP2020038984A (ja) * | 2018-05-24 | 2020-03-12 | シンフォニアテクノロジー株式会社 | 容器パージ装置 |
CN111755370A (zh) * | 2019-03-29 | 2020-10-09 | 平田机工株式会社 | 装载端口 |
CN111755370B (zh) * | 2019-03-29 | 2023-05-30 | 平田机工株式会社 | 装载端口 |
WO2021187340A1 (ja) * | 2020-03-17 | 2021-09-23 | 日本電産リード株式会社 | ロードポート用アダプタ |
Also Published As
Publication number | Publication date |
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US20110303125A1 (en) | 2011-12-15 |
CN101138079A (zh) | 2008-03-05 |
JPWO2006051577A1 (ja) | 2008-08-07 |
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