CN101138079A - 载入机以及转接器 - Google Patents

载入机以及转接器 Download PDF

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Publication number
CN101138079A
CN101138079A CNA2004800443381A CN200480044338A CN101138079A CN 101138079 A CN101138079 A CN 101138079A CN A2004800443381 A CNA2004800443381 A CN A2004800443381A CN 200480044338 A CN200480044338 A CN 200480044338A CN 101138079 A CN101138079 A CN 101138079A
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CN
China
Prior art keywords
mentioned
box
loading stage
substrate
loaded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800443381A
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English (en)
Chinese (zh)
Inventor
伊藤博
吉村武彦
关优
前嶋信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Right Manufacturing Co Ltd
Original Assignee
Right Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Right Manufacturing Co Ltd filed Critical Right Manufacturing Co Ltd
Publication of CN101138079A publication Critical patent/CN101138079A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNA2004800443381A 2004-11-09 2004-11-09 载入机以及转接器 Pending CN101138079A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/016560 WO2006051577A1 (ja) 2004-11-09 2004-11-09 ロードポート及びアダプタ

Publications (1)

Publication Number Publication Date
CN101138079A true CN101138079A (zh) 2008-03-05

Family

ID=36336263

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800443381A Pending CN101138079A (zh) 2004-11-09 2004-11-09 载入机以及转接器

Country Status (4)

Country Link
US (1) US20110303125A1 (ja)
JP (1) JPWO2006051577A1 (ja)
CN (1) CN101138079A (ja)
WO (1) WO2006051577A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103779253A (zh) * 2012-10-17 2014-05-07 沈阳芯源微电子设备有限公司 兼容不同基板装载的装载机构
CN105390426A (zh) * 2014-08-28 2016-03-09 英飞凌科技股份有限公司 适配器工具和晶片搬运系统
CN105960704A (zh) * 2014-02-07 2016-09-21 村田机械株式会社 气体注入装置以及辅助构件
CN112687600A (zh) * 2021-01-06 2021-04-20 天津中环领先材料技术有限公司 一种晶圆片承载装置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585892B (zh) * 2010-09-17 2017-06-01 昕芙旎雅股份有限公司 卡匣轉接器
US9701431B2 (en) * 2011-05-25 2017-07-11 Murata Machinery, Ltd. Load port device, transport system, and container carrying out method
JP5875316B2 (ja) * 2011-10-06 2016-03-02 株式会社ディスコ 加工装置
JP6227334B2 (ja) * 2013-09-04 2017-11-08 ローツェ株式会社 複数種類の半導体ウエハを検出するロードポート
SG11201602194UA (en) * 2013-09-30 2016-05-30 Murata Machinery Ltd Storage warehouse
JP6248788B2 (ja) * 2014-04-28 2017-12-20 シンフォニアテクノロジー株式会社 ウエハマッピング装置およびそれを備えたロードポート
KR102221107B1 (ko) * 2015-03-13 2021-02-26 세메스 주식회사 웨이퍼 제조 설비 시스템
CN105789079B (zh) * 2016-04-12 2018-04-24 朱干军 一种位置辅助芯片晶圆映射方法
JP6817788B2 (ja) * 2016-11-08 2021-01-20 株式会社ディスコ 簡易テーブル
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
JP6447893B2 (ja) * 2017-11-21 2019-01-09 シンフォニアテクノロジー株式会社 ロードポート及びウエハマッピング装置
JP6889383B2 (ja) * 2018-05-24 2021-06-18 シンフォニアテクノロジー株式会社 容器パージ装置
US11094570B2 (en) * 2019-03-29 2021-08-17 Hirata Corporation Load port having movable member that abuts a pin
KR20220154687A (ko) * 2020-03-17 2022-11-22 니혼덴산리드가부시키가이샤 로드 포트용 어댑터
TWM600933U (zh) * 2020-05-07 2020-09-01 鈦昇科技股份有限公司 晶圓裝卸機
JP7561059B2 (ja) 2021-02-26 2024-10-03 株式会社日立ハイテク 収納容器設置台及び半導体製造装置
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6135698A (en) * 1999-04-30 2000-10-24 Asyst Technologies, Inc. Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications
US6632068B2 (en) * 2000-09-27 2003-10-14 Asm International N.V. Wafer handling system
JP4669643B2 (ja) * 2001-09-17 2011-04-13 ローツェ株式会社 ウエハマッピング装置およびそれを備えたロードポート
JP4082652B2 (ja) * 2001-11-02 2008-04-30 平田機工株式会社 載置装置
JP2004022980A (ja) * 2002-06-19 2004-01-22 Hitachi High-Technologies Corp 電子線検査装置
JP4091380B2 (ja) * 2002-08-29 2008-05-28 東京エレクトロン株式会社 被処理体基板を収容した複数種類のカセットに対応可能なロードポート
JP4487302B2 (ja) * 2003-05-20 2010-06-23 株式会社安川電機 ロードポート
JP4474922B2 (ja) * 2004-01-07 2010-06-09 シンフォニアテクノロジー株式会社 ロードポート装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103779253A (zh) * 2012-10-17 2014-05-07 沈阳芯源微电子设备有限公司 兼容不同基板装载的装载机构
CN105960704A (zh) * 2014-02-07 2016-09-21 村田机械株式会社 气体注入装置以及辅助构件
CN105960704B (zh) * 2014-02-07 2019-03-01 村田机械株式会社 气体注入装置以及辅助构件
CN105390426A (zh) * 2014-08-28 2016-03-09 英飞凌科技股份有限公司 适配器工具和晶片搬运系统
CN105390426B (zh) * 2014-08-28 2018-11-16 英飞凌科技股份有限公司 适配器工具和晶片搬运系统
US10186440B2 (en) 2014-08-28 2019-01-22 Infineon Technologies Ag Adapter tool configured to be attached to a loadport of a wafer handling system and wafer handling system with such an adapter tool
CN112687600A (zh) * 2021-01-06 2021-04-20 天津中环领先材料技术有限公司 一种晶圆片承载装置

Also Published As

Publication number Publication date
JPWO2006051577A1 (ja) 2008-08-07
US20110303125A1 (en) 2011-12-15
WO2006051577A1 (ja) 2006-05-18

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Open date: 20080305