200936997 九、發明說明： 【發明所屬之技術領域】 册右ϋ係有關一種電子元件取出與置放裝置，尤指一種 ;有=力檢測之電子元件取出與置放裝置。尤有進 進-步提供-種電子元件取出及置放之接觸壓力 【先兩技術】 ο 诵堂元件，例如積體電路(IC)或晶片（chip)製成後， 後’以_子元件之品f’方能完成 知之述f有測試與包裝之自動化機械’亦即業界所熟 件之機’該測試與幫裝機依據電子元 不論何種值刀ίΐ形傳送和直線傳送兩種機台，而 ❹ 盤30周緣供1子元#_=轉 其中該旋轉盤3G周緣設有複數個吸嘴 f f越， ’其可隨旋轉盤3〇同步旋轉並升降，使旋^般 ϊ固子疋件70，並可逐步移载至下-製魅。 、 圖3所示，該升降盤下降時，人 並縣其下方知料齡5Q，峨電子元·;取下= 5 200936997 放在，，8G ’以便進行功_試或成品包裝。 放電子元件時，常構件50在取出或置 元件外觀或内邻的為指不*或碰撞，而造成電子 而從而造成非製程因素之不良品。 中心ίΓΐΐϊ!牛於某些製程站中，例如入料站、定 射二t ΐ方向判別站、旋轉站、測試站、分料盒站、 ❹ 則將會造成電子元件外ί’否 註裝ΐ過ί中’右未被檢測並經由包裝出貨，往 在以成电子兀件之製造商面臨貨 的受損，而亟待改善。 g 甚至每成商譽 【發明内容】 有鑑於此，本案申請人本於多年來 產銷的經驗，潛心研 導f;子元件於測試或包裝時，因接觸壓力高於i子3 ^力植，而令其外觀或内部受損之嚴重缺失，^ fft進而發展出本案之「帶有接_力檢測 兀件取出裝置及接觸壓力檢測方法」。 电于 本案之目的及所增益之功效在於，該電子元 置之推桿適當位置接震―壓力感應器，例如^：；專 感裔(bad cells) ’以便設定-壓力值，當電子元件 = 置放裝置在取出或置放電子元件過程中，因該推 ^ 後的接觸壓力受到該壓力感應器的檢測及控制， 常，力產生’使電子元件有受損之疑慮時，可立即將 良品之電子元件立即排除，從而增加電子元件之良率了並 6 200936997 減少因不良品所造成之商業損失。 應器，且該壓力感應器與機立^妾力感 ϊ; ："； ❹ ❹ ，的過程中取出或置放電子 ΐ壓桿的接觸壓力是:超過i設:壓》 制系統以進行I理者。生，5紐力感應11即通知機台之控 ^案，採取之另—技術手段係提供 :ίίίίΓ==方法’該方法包括：提供一 程吸嘴構件在取出或置放電子元件的過 ϊ行=產生’該壓力感應器即通知機台之控制系統^ 式，揭示本案之具體技術内容，首先請參閱圖 圖1為習知電子元件測試與找機之示意圖； mif示電子元件取出與置放裝置之局部放大示意 與置放裝置之另-局部放大示意= 干〃吸嘴構件下移狀態；圖4為本案電子元件測試與 200936997 ίίΐίίΐ圖；® 5細4所示電子元件取*盘置放供 ^之局4放大不意圖，其顯示推桿及吸嘴構件尚^ ^ ί大圖!ί圖甘4所示電子元件取出與置放裝置 示推桿及吸嘴構件下移狀態；圖 ，【實=卜機台控制系統之方塊圖。 iHf示，本魏子元件取出與置«置1 係裝叹於-電子凡件測試與包錢2 =㈣移二 =旋轉運動或= 舰H71?取出與置放裝置1伽—轉11及一吸嘴 ❿ 雜向移動，而推桿11下方則設有一堡 ίΓ即桿11隨著升降件3下降時，該®掣件 量纩f 一套接於伸縮件121之彈性體122，例如彈； [縮，、而令伸縮件121下方之吸嘴123於一製程站4，: 如測試站取出或置放一電子元件5。 ' 掣株^it案，产作樣點在於，該推桿11之連接段1”與壓 櫨雷；-^間之適當位置設有一屢力感應器113，其可依 ίί θ 1 所可承受之接峨力，而設最佳化之壓 力值。疋以，虽該電子元件測試與包裝機2之機台21運作 8 200936997 時，該電子元件取出與置放褒置，之推桿Ή ϋ各，程站4取出或置放電子树5的過程中， :產生義力超過設定之值力_，如圖i斤 產生—訊號，該訊號經由一訊號 之^轉24 3 7傳送至該電子元件峨與包裝機2 ^制糸統24進行處王里後，其可發出―辦虎，而令二 Ιί 電ίΪΊ5排除。而為取得較精密之壓^感^ cells)為佳。μ力感應為113實施時以荷重傳感器(丨0ad 請再參閱圖5及圖6,為提供該吸嘴構件12較佳導 ，是以，該吸嘴構件12側向突伸一導引桿124，: =套接於移位件23所預設之導引孔231 N，使該導引^ 12能隨著伸縮件121，而在導引孔231内縱向升降。 ^尤有進者，本案進一步提供一種電子元件取出及置放 接壓ί檢測方法’該方法包括：提供一壓力感應器113 ^於-電子元件取出與置放裝置彳之推桿彳彳適當位置。 ❹ j桿11及下方之吸嘴構件12在取出或置放電子元件的 中，因推桿11之下壓，使該壓力感應器113檢測該推 :γ的壓力是否超過預設之壓力值，若有不正常壓力產 〜_力感應器113即產生-訊號，其經由一訊號轉換 14之轉換，並傳送至機台21之控制系統24進行處理， 遠控制系統24發出一警示訊號，例如令該機台停機或將 该電子元件5排除。 _所以’經由本案電子元件取出與置放裝置，以及電子 元件取出及置放之接觸壓力檢測方法之實施，其在取出或 放電子元件的過程中，在某些需做壓力檢測與控制之製 耘站，例如入料站、定中心站、極性方向判別站、旋轉站、 9 200936997 二ΐϊίϊ、Ϊ裝站’及溢料排除站等，該電子元 =程Γί 嘴或置放電子元 =接讎力是否超過^設之·！力值，若桿 測之準確性，從而提高產品。藉以確保電子元件檢 ^案所揭示者，乃較佳實施例之一種 ❹ ❹ ίΐ2Γ:Τ本案之技術思—習該項技ΪΪ人λ 易【=;說::Γ本案之專利權範嘴。' Ξ子70件測試與包裝機之示意圖。 以之局部⑽ 認5^ ί元件測試與包裝機之示意圖。 以一、 示意圖，局部放大 圖與機台控=之方塊 ί=Τ出與置放裝置1推桿” =2113 =”4 伸縮件121 200936997 彈性體122 導引桿124 電子元件測試與包裝機2 分割器22 導引孔231 升降件3 電子元件5 機台10 旋轉盤30 ❹吸嘴構件50 電子元件70 吸嘴123 機台21 移位件23 控制系統24 製程站4 分割器20 推桿40 升降盤60 製程站80200936997 IX. Description of the invention: [Technical field to which the invention pertains] The right-hand side of the book relates to an electronic component take-out and placement device, especially one; the electronic component take-out and placement device with = force detection. In particular, the step-by-step provides the contact pressure for the removal and placement of electronic components. [First two technologies] ο After the components are fabricated, such as integrated circuits (ICs) or chips, the _ sub-components are The product f' can complete the knowledge of the machine. There is an automated machine for testing and packaging 'that is the machine of the industry.' The test and the help machine are based on the electronic element, regardless of the value of the knife, the transfer and the linear transmission. , ❹ 盘 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 Piece 70, and can be gradually transferred to the next - enchantment. As shown in Fig. 3, when the lifting plate is lowered, the person under the county knows that the age is 5Q, and the electronic element is removed; and the =5 200936997 is placed in the 8G ’ for the work or the finished product packaging. When the electronic component is discharged, the component 50 is taken out or placed in the appearance of the component or the adjacent element is not * or collided, causing electrons and causing defective products of non-process factors. Center Γΐΐϊ Γΐΐϊ! In some process stations, such as the loading station, the fixed-point two-way direction discriminating station, the rotating station, the test station In the past, 'the right is not detected and shipped through the package, and the manufacturer facing the electronic components is suffering from damage, and needs to be improved. g Even every goodwill [invention content] In view of this, the applicant's experience in production and sales over the years, painstakingly researched f; sub-components in the test or packaging, because the contact pressure is higher than i 3 3, In the case of serious lack of appearance or internal damage, ^fft developed the "with force detection device and contact pressure detection method". The purpose of the electricity in this case and the gain of the gain is that the electronic component is placed at the appropriate position to pick up the shock-pressure sensor, such as ^:; bad cells (to set the pressure value, when the electronic component = During the process of removing or placing electronic components, the placement pressure of the device is detected and controlled by the pressure sensor, and when the force is generated, the electronic component may be damaged. The electronic components are immediately eliminated, thereby increasing the yield of electronic components and 6 200936997 reducing the commercial losses caused by defective products. The contact pressure of the pressure sensor and the machine is ϊ ϊ; :"; ❹ ❹ , the process of taking out or placing the electronic pressure bar is: more than i set: pressure system to carry out I rationale. Health, 5 New Force Induction 11 is to inform the machine control case, take another - technical means to provide: ίίίίΓ == method 'This method includes: providing one-way nozzle member in the removal or placement of electronic components Line = generate 'the pressure sensor that informs the machine control system ^, reveal the specific technical content of this case, first of all, please refer to Figure 1 is a schematic diagram of the conventional electronic component test and machine; mif shows the electronic component removal and placement Partial enlargement of the discharge device and other partial enlargement of the placement device = dry nozzle member down state; Figure 4 is the electronic component test and 200936997 ίίΐίίΐ; The release of the ^ ^ 4 is not intended to be enlarged, the display of the push rod and the nozzle member is still ^ ^ ί big picture! The electronic component removal and placement device shown in Figure 4 shows the push rod and nozzle member down state; , [real = block diagram of the machine control system. iHf shows that the Weizi component is taken out and placed «set 1 tie sighs - electronic parts test and package money 2 = (four) shift two = rotary motion or = ship H71? take out and placement device 1 gamma - turn 11 and one The suction nozzle ❿ is moved in a miscellaneous direction, and a pusher is provided below the push rod 11 , that is, the rod 11 is lowered with the lifting member 3, and the set of the elastic member 122 is connected to the elastic body 122 of the telescopic member 121, for example, a bullet; [Shrinking, so that the nozzle 123 below the telescopic member 121 is at a process station 4, such as an electronic component 5 is taken out or placed at the test station. ' 掣 ^ ^ ^ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The pressure is optimized, and the optimized pressure value is set. Therefore, although the machine 21 of the electronic component testing and packaging machine 2 operates 8 200936997, the electronic component is taken out and placed, and the push rod is 推In the process of taking out or placing the electronic tree 5, the process station 4 generates a force that exceeds the set value _, as shown in Fig. 1, the signal is transmitted to the electronic via a signal. After the component 峨 and the packaging machine 2 ^ system 24 are in the king, it can issue "running the tiger, and the second Ι 电 电 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ For the implementation of 113, the load sensor (refer to FIG. 5 and FIG. 6 , in order to provide the nozzle member 12 preferably, the nozzle member 12 protrudes laterally by a guiding rod 124, := The guiding hole 231 N is preset to the guiding member 23, so that the guiding device 12 can be vertically raised and lowered in the guiding hole 231 along with the telescopic member 121. Further, the method further provides an electronic component taking-out and placing and pressing ί detecting method. The method includes: providing a pressure sensor 113 in a proper position of the electronic component taking-out and placing device 推 push rod 。. The lower nozzle member 12 is in the middle of taking out or placing the electronic component, and the pressure sensor 113 detects whether the pressure of the push: γ exceeds a preset pressure value due to the depression of the push rod 11, and if there is abnormal pressure The power sensor 113 generates a signal, which is converted by a signal conversion 14 and transmitted to the control system 24 of the machine 21 for processing. The remote control system 24 sends a warning signal, for example, the machine is stopped or The electronic component 5 is excluded. _ Therefore 'through the electronic component extraction and placement device, and the electronic component extraction and placement contact pressure detection method, in the process of taking out or discharging the electronic component, in some need Dozing stations for pressure detection and control, such as loading stations, centering stations, polarity direction discriminating stations, rotating stations, 9 200936997 ΐϊ ϊ ϊ, Ϊ 站 ' and overflowing stations, etc. = Γ Γ 或 或 置 或 或 或 嘴 嘴 嘴 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = One kind of ❹ ❹ ΐ ΐ Γ Γ Γ Τ 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术 技术Recognize the schematic diagram of the 5^ ί component test and packaging machine. Take one, the schematic diagram, the partial enlargement diagram and the machine control = the box ί = the extraction and placement device 1 push rod" = 2113 = "4 telescopic member 121 200936997 elastomer 122 Guide rod 124 Electronic component testing and packaging machine 2 Splitter 22 Guide hole 231 Lifting piece 3 Electronic component 5 Machine table 10 Rotary disk 30 ❹ nozzle member 50 Electronic component 70 Nozzle 123 Machine 21 Shifting part 23 Control System 24 Process Station 4 Splitter 20 Pusher 40 Lifting Plate 60 Process Station 80
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