WO2005114084A1 - Dissipateur de chaleur a conduit pour circuit integre avec trous de montage traversants - Google Patents

Dissipateur de chaleur a conduit pour circuit integre avec trous de montage traversants Download PDF

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Publication number
WO2005114084A1
WO2005114084A1 PCT/US2005/006370 US2005006370W WO2005114084A1 WO 2005114084 A1 WO2005114084 A1 WO 2005114084A1 US 2005006370 W US2005006370 W US 2005006370W WO 2005114084 A1 WO2005114084 A1 WO 2005114084A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
heat pipe
particles
spreading
heat
Prior art date
Application number
PCT/US2005/006370
Other languages
English (en)
Inventor
Peter M. Dussinger
Thomas L. Myers
John H. Rosenfeld
Kenneth G. Minnerly
Original Assignee
Thermal Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermal Corp. filed Critical Thermal Corp.
Priority to DE112005001051T priority Critical patent/DE112005001051T5/de
Publication of WO2005114084A1 publication Critical patent/WO2005114084A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates generally to active solid state devices, and more specifically to a heat pipe for cooling an integrated circuit chip, with the heat pipe designed to be held in direct contact with the integrated circuit.
  • Heat sinks are most effective when there is a uniform heat flux applied over the entire heat input surface. When a heat sink with a large heat input surface is attached to a heat source of much smaller contact area, there is significant resistance to the flow of heat along the heat input surface of the heat sink to the other portions of the heat sink surface which are not in direct contact with the contact area of the integrated circuit chip.
  • the present invention is an inexpensive heat pipe heat spreader for integrated circuit chips which is of simple, light weight construction. It is easily manufactured, requires little additional space, and provides additional surface area for cooling the integrated circuit and for attachment to heat transfer devices for moving the heat away from the integrated circuit chip to a location from which the heat can be more easily disposed of. Furthermore, the heat pipe heat spreader is constructed to assure precise flatness and to maximize heat transfer from the heat source and to the heat sink, and has holes through its body to facilitate mounting. [0007]
  • the heat spreader of the present invention is a heat pipe which requires no significant modification of the circuit board or socket because it is held in intimate contact with the integrated circuit chip by conventional screws attached to the integrated mounting board. This means that the invention uses
  • the internal structure of the heat pipe is an evacuated vapor chamber with a limited amount of liquid and includes a pattern of spacers extending between and contacting the two plates or any other boundary structure forming the vapor chamber.
  • the spacers prevent the plates from bowing inward, and therefore maintain the vital flat surface for contact with the integrated circuit chip.
  • These spacers can be solid columns, embossed depressions formed in one of the plates, or a mixture of the two.
  • Porous capillary wick material also covers the inside surfaces of the heat pipe and has a substantial thickness surrounding the surfaces of the spacers within the heat pipe, thus forming pillars of porous wick surrounding the supporting spacers.
  • the wick therefore spans the space between the plates in multiple locations, and comprises a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles.
  • the spacers thus serve important purposes. They support the flat plates and prevent them from deflecting inward and distorting the plates to deform the flat surfaces which are required for good heat transfer.
  • the spacers also serve as critical support for the portions of the capillary wick pillars which span the space between the plates provide a gravity independent characteristic
  • the spacers also make it possible to provide holes into and through the vapor chamber, an apparent inconsistency since the heat pipe vacuum chamber is supposed to be vacuum tight. This is accomplished by bonding the spacers, if they are solid, to both plates of the heat pipe, or, if they are embossed in one plate, bonding the portions of the depressions which contact the opposite plate to that opposite plate.
  • An alternate embodiment of the invention provides the same provision for mounting the heat pipe spreader with simple screws even when the heat pipe is constructed without internal spacers.
  • This embodiment forms the through holes in the solid boundary structure around the outside edges of the two plates.
  • This region of the heat pipe is by its basic function already sealed off from the vapor chamber by the bond between the two plates, and the only additional requirement for forming a through hole within it is that the width of the bonded region be larger than the diameter of the hole.
  • the heat pipe boundary structure can be any shape.
  • Another alternative embodiment of the invention provides for improved heat transfer between the integrated circuit chip and the heat pipe
  • Fig. 1 is a cross-sectional view of one embodiment of a flat plate heat pipe with through holes through its vapor chamber and in contact with a finned heat sink;
  • Fig. 2 is a cross-sectional view of the flat plate heat pipe shown in Fig. 1 , with the finned heat sink removed for clarity of illustration;
  • Fig. 3 is a plan view of the flat plate heat pipe shown in Figs. 1 and 2;
  • Fig. 4 is an exploded and enlarged view of a portion of the wick structure formed in accordance with the present invention;
  • Fig. 5 is a representation of a brazed wick formed in accordance with one embodiment of the present invention; and
  • Fig. 6 is a representation of another brazed wick formed in accordance with a further embodiment of the present invention.
  • Heat pipe 10 is constructed by forming a boundary structure by sealing together two formed plates, contact plate 18 and cover plate 20. Contact plate 18 and cover plate 20 are sealed together at their peripheral lips 22 and 24 by conventional means, such as soldering or brazing, to form heat pipe 10. Heat pipe 10 is then evacuated to remove all non-condensible gases and a suitable quantity of heat transfer fluid is placed within it. This is the conventional method of constructing a heat pipe, and is well understood in the art of heat pipes. [0022] The interior of heat pipe 10 is, however, constructed unconventionally. While contact plate 18 is essentially flat with the exception of peripheral lip 24, cover plate 20 includes multiple depressions 26. Depressions
  • Heat pipe 10 also includes internal sintered metal capillary wick 30 which covers the entire inside surface of contact plate 18. As is well understood in the art of heat pipes, a capillary wick provides the mechanism by which liquid condensed at the cooler condenser of a heat pipe is transported back to the hotter evaporator where it is evaporated.
  • heat pipe 10 also has capillary wick pillars 32 which bridge the space between contact plate 18 and cover plate 20. Pillars 32 thereby interconnect cover plate 16 and contact plate 14 with continuous capillary wick. This geometry assures that, even if heat pipe 10 is oriented so that cover plate 16 is lower than contact plate 14, liquid condensed upon inner surface 34 of cover plate 20 will still be in contact with capillary pillars 32. The liquid will therefore be moved back to raised surface 28 which functions as the evaporator because it is in contact with a heat generating integrated circuit (not
  • FIG. 1 also shows frame 36 which is typically used to surround and protect heat pipe 10.
  • Frame 34 completely surrounds heat pipe 10 and contacts lip 24 of contact plate 18.
  • heat pipe 10 The entire assembly of heat pipe 10, frame 34, and fin plate 38 is held together and contact plate 18 is held against an integrated circuit chip by conventional screws 40, shown in dashed lines, which are placed in holes 42 in fin plate 38 and through holes 12 in heat pipe 10, and are threaded into the mounting plate (not shown) for the integrated circuit chip.
  • Holes 12 penetrate heat pipe 10 without destroying its vacuum integrity because of their unique location. Holes 12 are located within sealed structures such as solid columns 44, and since columns 44 are bonded to cover plate 20 at locations 46, holes 12 passing through the interior of columns 44 have no affect on the interior of heat pipe 10.
  • the preferred embodiment of the invention has been constructed as heat pipe 10 as shown in FIG. 1.
  • This heat pipe is approximately 3.0 inches by 3.5 inches with a total thickness of .200 inch.
  • Cover plate 20 and contact plate 18 are constructed of OFHC copper .035 inch thick, and depressions 26 span the .100 inch height of the internal volume of heat pipe 10. The flat
  • FIG. 2 is a cross section view of an alternate embodiment of the flat plate heat pipe 11 of the invention with through holes 48 located within peripheral lips 22 and 24 of the heat pipe and hole 50 shown in another sealed structure, one of the depressions 26.
  • the only requirement for forming hole 50 within a depression 26 is that the bottom of depression 26 must be bonded to inner surface 28 of contact plate 18 to prevent loss of vacuum within the heat pipe.
  • FIG. 3 is a plan view of the internal surface of the contact plate 18 of the heat pipe 10 of the invention showing region 31 of capillary wick 30.
  • Region 31 is constructed of sintered silver powder. While the balance of capillary wick 30 is conventional sintered metal such as copper, region 31 of capillary wick 30, which is on the opposite surface of contact plate 18 from the integrated circuit chip (not shown), is formed of powdered silver. The higher thermal conductivity of silver yields significantly better heat conduction through region 31 of the wick 30, and thereby reduces the temperature difference between the integrated circuit chip and the vapor within heat pipe 10. This reduction of temperature difference directly affects the operation of heat pipe 10, and essentially results in a similar reduction in the operating temperature of the chip. [0031] In one embodiment of the present invention, a brazed wick 65 is l located on the inner surface of contact 18.
  • Brazed wick 65 comprises a plurality of metal particles 67 combined with a filler metal or combination of metals that is often referred to as a "braze” or brazing compound 70. It will be understood that “brazing” is the joining of metals through the use of heat and a filler metal, i.e., brazing compound 70. Brazing compound 70 very often comprises a melting temperature that is above 450°C-1000C but below the melting point of metal particles 67 that are being joined to form brazed wick 65.
  • brazed wick 65 In general, to form brazed wick 65 according to the present invention, a plurality of metal particles 67 and brazing compound 70 are heated together to a brazing temperature that melts brazing compound 70, but does not melt plurality of metal particles 67. Significantly, during brazing metal particles 67 are not fused together as with sintering, but instead are joined together by
  • brazing compound 70 is drawn through the porous mixture of metal particles 67 to create fillets 73 is "capillary action", i.e., the movement of a liquid within the spaces of a porous material due to the inherent attraction of molecules to each other on a liquid's surface.
  • brazing compound 70 liquefies, the molecules of molten brazing metals attract one another as the surface tension between the molten braze and the surfaces of individual metal particles 67 tends to draw the molten braze toward each location where adjacent metal particles 67 are in contact with one another.
  • Fillets 73 are formed at each such location as the molten braze metals resolidify.
  • brazing compound 70 and fillets 73 create a higher thermal conductivity wick than, e.g., sintering or fusing techniques. This higher thermal conductivity wick directly improves the thermal conductance of the heat transfer device in which it is formed, e.g., heat pipe, loop heat pipe, etc.
  • the conductance of brazed wick 65 has been found to increase between directly proportional to and the square root of the thermal conductivity increase.
  • brazing compound 70 must be selected so as not to introduce chemical incompatibility into the materials system comprising flat plate heat pipe 10.
  • Metal particles 67 may be selected from any of the materials having high thermal conductivity, that are suitable for fabrication into brazed porous structures, e.g., carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, beryllium oxide, or the like, and may comprise either substantially spherical, oblate or prolate spheroids, ellipsoid, or less preferably, arbitrary or regular polygonal, or filament-shaped particles of varying cross-sectional shape. For example, when metal particles 67 are formed from copper spheres (Fig. 5) or oblate spheroids (Fig.
  • the overall wick brazing temperature for flat plate heat pipe 10 will be about 1000C.
  • the percentage brazing compound 70 within the mix of metal particles 67 or, by using a more "sluggish" alloy for brazing compound 70 a wide range of heat-conduction characteristics may be provided between metal particles 67 and fillets 73.
  • any ratio of copper/gold braze could be used, although brazes with more gold are more expensive.
  • brazing compound 30 has been found to be about six percent (6)% by weight of a finely divided (-325 mesh), 65%/35% copper/gold brazing compound, that has been well mixed with the copper powder (metal particles 67). More or less braze is also possible, although too little braze reduces the thermal conductivity of brazed wick 65, while too much braze will start to fill the wick pores with solidified braze metal.
  • One optimal range has been found to be between about 2% and about 10% braze compound, depending upon the braze recipe used.
  • H 1799-00232 powder as metal particles 67 a preferred shape of particle is spherical or spheroidal.
  • Metal particles 67 should often be coarser than about 200 mesh, but finer than about 20 mesh. Finer wick powder particles often require use of a finer braze powder particle.
  • the braze powder of brazing compound 70 should often be several times smaller in size than metal particles 67 so as to create a uniformly brazed wick 65 with uniform properties.
  • Other brazes can also be used for brazing copper wicks, including nickel-based Nicrobrazes, silver/copper brazes, tin/silver, lead/tin, and even polymers.
  • the invention is also not limited to copper/water heat pipes.
  • brazing compound 70 should often be well distributed over each metal particle surface. This distribution of brazing compound 70 may be accomplished by mixing brazing compound 70 with an organic liquid binder, e.g., ethyl cellulose, that creates an adhesive quality on the surface of each metal particle 67 (i.e., the surface of each sphere or spheroid of metal) for brazing compound 70 to adhere to.
  • an organic liquid binder e.g., ethyl cellulose
  • one and two tenths grams by weight of copper powder (metal particles 67) is mixed with two drops from an eye dropper of an organic liquid binder, e.g., ISOBUTYL METHACRYLATE LACQUER to create an adhesive quality on the surface of each metal particle 67 (i.e., the surface of each sphere or spheroid of metal) for braze compound 70 to adhere to.
  • a finely divided (e.g., -325 mesh) of braze compound 70 is mixed into the liquid binder coated copper powder particles 67
  • vacuum brazing or hydrogen brazing at about 1020C for between two to eight minutes, and preferably about five minutes, has been found to provide adequate fillet formation within a brazed wick.
  • a vacuum of at least 10 "5 torr or lower has been found to be sufficient, and if hydrogen furnaces are to be used, the hydrogen furnace should use wet hydrogen.
  • the assembly is vacuum fired at 1020° C, for 5 minutes, in a vacuum of about 5 x 10 "5 torr or lower.
  • through holes could also penetrate heat pipe boundary structures with curved surfaces or heat pipe boundary structures with offset planes which create several different levels for contact with heat sources or heat sinks.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cette invention concerne un conduit de chaleur (10) doté de caractéristiques de transfert thermique supérieures entre lui et la source chaude ainsi qu'un puits thermique (16). Le conduit de chaleur (10) est maintenu fermement contre la source de chaleur au moyen de trous de montage (12) qui pénètrent dans la structure dudit conduit, mais qui sont isolés de la chambre de vapeur du fait qu'ils sont situés chacun à l'intérieur d'une structure fermée telle qu'un pilier (32) ou les couches solides de l'enveloppe entourant la chambre de vapeur. Une autre caractéristique du conduit thermique réside dans l'emploi d'une pluralité de particules (67) réunies par un composé de brasage (70) de telle sorte que des filets (73) dudit composé de brasage (70) sont formés entre des particules adjacentes (67) pour constituer un réseau de passages capillaires entre les particules.
PCT/US2005/006370 2004-05-07 2005-02-28 Dissipateur de chaleur a conduit pour circuit integre avec trous de montage traversants WO2005114084A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112005001051T DE112005001051T5 (de) 2004-05-07 2005-02-28 Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/841,784 US6896039B2 (en) 1999-05-12 2004-05-07 Integrated circuit heat pipe heat spreader with through mounting holes
US10/841,784 2004-05-07

Publications (1)

Publication Number Publication Date
WO2005114084A1 true WO2005114084A1 (fr) 2005-12-01

Family

ID=35428471

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/006370 WO2005114084A1 (fr) 2004-05-07 2005-02-28 Dissipateur de chaleur a conduit pour circuit integre avec trous de montage traversants

Country Status (4)

Country Link
US (3) US6896039B2 (fr)
CN (1) CN1957221A (fr)
DE (1) DE112005001051T5 (fr)
WO (1) WO2005114084A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011119174A1 (de) 2011-11-23 2013-05-23 Inheco Industrial Heating And Cooling Gmbh Vapor Chamber

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US20020084061A1 (en) * 2001-01-03 2002-07-04 Rosenfeld John H. Chemically compatible, lightweight heat pipe
US7575043B2 (en) * 2002-04-29 2009-08-18 Kauppila Richard W Cooling arrangement for conveyors and other applications
US7615005B2 (en) * 2003-05-16 2009-11-10 Ethicon Endo-Surgery, Inc. Medical apparatus for use with an endoscope
US6987317B2 (en) 2003-09-30 2006-01-17 Intel Corporation Power delivery using an integrated heat spreader
WO2006007721A1 (fr) * 2004-07-21 2006-01-26 Xiao Huang Materiaux a effet meche hybrides conçus pour etre utilises dans des caloducs haut rendement
TW200637017A (en) * 2005-04-14 2006-10-16 Chipmos Technologies Inc Image sensor module package
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
TWI317414B (en) * 2005-10-21 2009-11-21 Foxconn Tech Co Ltd Sintered heat pipe and method for manufacturing the same
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
US7360581B2 (en) * 2005-11-07 2008-04-22 3M Innovative Properties Company Structured thermal transfer article
FR2896443B1 (fr) * 2006-01-25 2008-02-29 Alcatel Sa Procede de fabrication de panneaux a caloducs et/ou inserts integres maintenus par des languettes
US7518868B2 (en) 2006-02-28 2009-04-14 International Business Machines Corporation Apparatus, system, and method for efficient heat dissipation
US20080035313A1 (en) * 2006-08-09 2008-02-14 Hul-Chun Hsu Heat-Conducting Base and Isothermal Plate having the same
KR20080053556A (ko) * 2006-12-11 2008-06-16 현대자동차주식회사 하이브리드 전기자동차의 인버터 및 ｌｄｃ용 냉각장치
CN200994225Y (zh) * 2006-12-29 2007-12-19 帛汉股份有限公司 电路基板结构
KR100809587B1 (ko) 2007-02-02 2008-03-04 이용덕 판형 열전달장치
TWM318115U (en) * 2007-04-09 2007-09-01 Tai Sol Electronics Co Ltd Flat heat pipe
US7957134B2 (en) * 2007-04-10 2011-06-07 Hewlett-Packard Development Company, L.P. System and method having evaporative cooling for memory
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden
US20090260785A1 (en) * 2008-04-17 2009-10-22 Wang Cheng-Tu Heat plate with capillary supporting structure and manufacturing method thereof
US20090314472A1 (en) * 2008-06-18 2009-12-24 Chul Ju Kim Evaporator For Loop Heat Pipe System
DE102008054233A1 (de) * 2008-10-31 2010-05-06 Osram Opto Semiconductors Gmbh Leuchtmodul
CN101782342B (zh) * 2009-01-16 2013-03-20 富瑞精密组件（昆山）有限公司 热管及其毛细结构的制作方法
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
JP5407749B2 (ja) * 2009-10-26 2014-02-05 日本電気株式会社 インサーキットテストフィクスチャの冷却構造
US20120000530A1 (en) * 2010-07-02 2012-01-05 Miles Mark W Device for harnessing solar energy with integrated heat transfer core, regenerator, and condenser
US8921702B1 (en) * 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
EP2395309A1 (fr) * 2010-06-08 2011-12-14 Thermal Corp. Caloduc
KR20120085397A (ko) * 2011-01-24 2012-08-01 삼성전자주식회사 백라이트 어셈블리
TWI524046B (zh) * 2011-08-17 2016-03-01 奇鋐科技股份有限公司 散熱元件之固定結構
CN102958318B (zh) * 2011-08-17 2015-06-24 奇鋐科技股份有限公司 散热元件的固定结构
TWI479302B (zh) * 2011-08-17 2015-04-01 Asia Vital Components Co Ltd 散熱裝置之固定結構
TWI484890B (zh) * 2011-08-17 2015-05-11 Asia Vital Components Co Ltd 散熱單元之固定結構
CN102297395A (zh) * 2011-09-07 2011-12-28 福建蓝蓝高科技发展有限公司 Led灯具高散热装置
US20130098592A1 (en) 2011-10-25 2013-04-25 Asia Vital Components Co., Ltd. Heat dissipation device and manufacturing method thereof
US20130168057A1 (en) * 2011-12-30 2013-07-04 Teledyne Scientific & Imaging, Llc Modular heat shield and heat spreader
US20130168052A1 (en) * 2011-12-30 2013-07-04 Celsia Technologies Taiwan, Inc. Heat pipe and composition of capillary wick thereof
US9417015B2 (en) 2012-02-22 2016-08-16 Thermal Corp. Heat exchanger backing plate and method of assembling same
US9599408B1 (en) * 2012-03-03 2017-03-21 Advanced Cooling Technologies, Inc. Loop heat pipe evaporator including a second heat pipe
JP6191137B2 (ja) * 2012-05-14 2017-09-06 富士通株式会社 冷却装置
CN102818467B (zh) * 2012-09-12 2014-06-18 锘威科技(深圳)有限公司 平板热管及其制作方法
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US20150173243A1 (en) * 2013-12-13 2015-06-18 General Electric Company Integrated heat exchange assembly and an associated method thereof
US9498858B2 (en) 2014-08-08 2016-11-22 SEAKR Engineering, Inc. System and method for dissipating thermal energy
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
EP3213022A4 (fr) * 2014-10-28 2018-06-13 Kelvin Thermal Technologies, Inc. Plan de masse thermique micro-usiné à base d'un polymère
US20170010048A1 (en) * 2015-07-09 2017-01-12 Chaun-Choung Technology Corp. Thin vapor chamber and manufacturing method thereof
CN105658032B (zh) * 2016-01-22 2019-06-04 白鹏飞 一种超薄均热板及其制作方法
CN106052435A (zh) * 2016-06-02 2016-10-26 吴本刚 蜗杆式饲料供给装置
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
WO2018198375A1 (fr) * 2017-04-28 2018-11-01 株式会社村田製作所 Chambre à vapeur
US10211125B2 (en) 2017-07-19 2019-02-19 Heatscape.Com, Inc. Configurable mounting hole structure for flush mount integration with vapor chamber forming plates
DE112018003831T5 (de) * 2017-07-28 2020-04-09 Dana Canada Corporation Ultradünne wärmetauscher für das wärmemanagement
CN107660102A (zh) * 2017-09-14 2018-02-02 南京理工大学 槽道‑纳米花复合毛细芯结构及其制备方法
US10458718B2 (en) * 2017-11-29 2019-10-29 Asia Vital Components Co., Ltd. Airtight penetration structure for heat dissipation device
TWI707118B (zh) * 2018-01-23 2020-10-11 訊凱國際股份有限公司 均溫板
US20200024763A1 (en) * 2018-07-23 2020-01-23 Microsoft Technology Licensing, Llc Electroform vapor chamber integrated thermal module into pcb layout design
US11076510B2 (en) * 2018-08-13 2021-07-27 Facebook Technologies, Llc Heat management device and method of manufacture
JP7146524B2 (ja) * 2018-08-13 2022-10-04 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
CN109152298B (zh) * 2018-09-30 2020-05-08 航天特种材料及工艺技术研究所 一种轻质温控装置及其制造方法
CN110336902B (zh) * 2019-06-28 2021-03-12 Oppo广东移动通信有限公司 电子设备的后壳、其制备方法、壳体组件以及电子设备
US11745264B2 (en) 2019-11-14 2023-09-05 Rolls-Royce Corporation Fused filament fabrication of thermal management article
US11707788B2 (en) 2019-11-14 2023-07-25 Rolls-Royce Corporation Fused filament fabrication of vacuum insulator
US11680753B2 (en) * 2019-11-14 2023-06-20 Rolls-Royce Corporation Fused filament fabrication of heat pipe
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
CN114543569A (zh) * 2020-11-24 2022-05-27 亚浩电子五金塑胶（惠州）有限公司 立体传热装置
US20210136956A1 (en) * 2020-12-18 2021-05-06 Intel Corporation Heat pipe for improved thermal performance at cold plate interface
CN115548523B (zh) * 2022-09-30 2024-01-23 厦门海辰储能科技股份有限公司 电芯、电池模组、电池包及储能设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762011A (en) * 1971-12-16 1973-10-02 Trw Inc Method of fabricating a capillary heat pipe wick
US3821018A (en) * 1969-10-10 1974-06-28 Union Carbide Corp Porous metallic layer formation
US4101691A (en) * 1976-09-09 1978-07-18 Union Carbide Corporation Enhanced heat transfer device manufacture
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US5076351A (en) * 1989-07-19 1991-12-31 Showa Aluminum Corporation Heat pipe

Family Cites Families (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209062A (en) 1963-01-25 1965-09-28 Westinghouse Electric Corp Mounting and coolant system for semiconductor heat generating devices
DE1284506B (de) 1964-10-24 1968-12-05 Linde Ag Traegerblech fuer temperaturempfindliche elektrische Schaltungsteile
US3490718A (en) 1967-02-01 1970-01-20 Nasa Capillary radiator
US3543841A (en) 1967-10-19 1970-12-01 Rca Corp Heat exchanger for high voltage electronic devices
US3519067A (en) 1967-12-28 1970-07-07 Honeywell Inc Variable thermal conductance devices
US3519063A (en) * 1968-07-18 1970-07-07 United Aircraft Corp Shell mold construction with chill plate having uniform roughness
US3613778A (en) 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3537514A (en) 1969-03-12 1970-11-03 Teledyne Inc Heat pipe for low thermal conductivity working fluids
US3681843A (en) 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3675711A (en) * 1970-04-08 1972-07-11 Singer Co Thermal shield
US3680189A (en) 1970-12-09 1972-08-01 Noren Products Inc Method of forming a heat pipe
US3834457A (en) 1971-01-18 1974-09-10 Bendix Corp Laminated heat pipe and method of manufacture
US3788388A (en) 1971-02-19 1974-01-29 Q Dot Corp Heat exchange system
DE2120475A1 (de) * 1971-04-27 1972-11-02 Brown, Boveri & Cie Ag, 6800 Mannheim Wärmerohr
DE2120477C3 (de) 1971-04-27 1980-07-31 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisch isolierende Wärmerohranordnung für hohe Wärmestromdichte
US3934643A (en) * 1971-07-26 1976-01-27 Nikolaus Laing Controllable heat pipe
SU407160A1 (ru) 1972-02-07 1973-11-21 Плоская тепловая труба
DE2235792A1 (de) 1972-07-21 1974-01-31 Dornier System Gmbh Vorrichtung zur uebertragung von waermeenergie
DE2502138C3 (de) 1975-01-21 1978-10-12 Rowenta-Werke Gmbh, 6050 Offenbach Gasfeuerzeugbrenner
GB1484831A (en) 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
US4046190A (en) 1975-05-22 1977-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flat-plate heat pipe
US4047198A (en) 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
SU589531A1 (ru) 1976-05-20 1978-01-25 Предприятие П/Я А-1665 Теплообменное устройство
FR2371633A1 (fr) 1976-11-19 1978-06-16 Dupont S T Appareil a gaz liquefie, notamment briquet a gaz pour fumeurs
US4145708A (en) 1977-06-13 1979-03-20 General Electric Company Power module with isolated substrates cooled by integral heat-energy-removal means
US4231423A (en) 1977-12-09 1980-11-04 Grumman Aerospace Corporation Heat pipe panel and method of fabrication
JPS54154277A (en) 1978-05-25 1979-12-05 Sharp Corp Heat radiation device
DE2854298C3 (de) 1978-12-15 1981-06-04 Anschuetz & Co Gmbh, 2300 Kiel Schmierstoffkreislauf für das Lager einer umlaufenden Welle
US4327752A (en) 1979-12-05 1982-05-04 Braun, Aktiengesellschaft Rotary ignition system for a catalytically heated curling device
US4279479A (en) 1980-05-29 1981-07-21 Melvin Schrier Vision screening kit
DE3072058D1 (en) 1980-09-30 1988-01-21 Braun Ag Hair curling apparatus
US4366526A (en) 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
US4382448A (en) 1981-07-10 1983-05-10 Braun Aktiengesellschaft Electrical ignition system for a catalytically heated curling device
US4641404A (en) 1981-10-05 1987-02-10 Seydel Scott O Porous warp sizing apparatus
SU987357A2 (ru) 1981-12-16 1983-01-07 Предприятие П/Я Г-4371 Плоска теплова труба
US4489777A (en) 1982-01-21 1984-12-25 Del Bagno Anthony C Heat pipe having multiple integral wick structures
US4461343A (en) 1982-01-28 1984-07-24 Mcdonnell Douglas Corporation Plated heat pipe
US4503483A (en) 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS5924538A (ja) * 1982-07-30 1984-02-08 Japan Radio Co Ltd ヒ−トパイプおよびその製造方法
US5148440A (en) 1983-11-25 1992-09-15 The United States Of America As Represented By The United States Department Of Energy Wick for metal vapor laser
US4616699A (en) 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe
SU1261029A1 (ru) 1984-04-02 1986-09-30 Ордена Трудового Красного Знамени Институт Тепло- И Массообмена Им.А.В.Лыкова Устройство дл охлаждени силовых полупроводниковых приборов
US4557413A (en) 1984-04-11 1985-12-10 Mcdonnell Douglas Heat pipe fabrication
FR2579371B1 (fr) 1985-03-19 1987-09-11 Contardo Spa Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase
US4777561A (en) 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
US4865729A (en) 1985-11-04 1989-09-12 Sepragen Corporation Radial thin layer chromatography
FR2595052B1 (fr) 1986-03-03 1990-06-01 Armines Procede et dispositif de vaporisation rapide d'un liquide
US4697205A (en) 1986-03-13 1987-09-29 Thermacore, Inc. Heat pipe
US4765396A (en) 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
US4960202A (en) 1987-01-14 1990-10-02 Ingersoll-Rand Company Friction control for bearing surface of roller
US4819719A (en) 1987-01-20 1989-04-11 Mcdonnell Douglas Corporation Enhanced evaporator surface
US4912548A (en) 1987-01-28 1990-03-27 National Semiconductor Corporation Use of a heat pipe integrated with the IC package for improving thermal performance
DE3862511D1 (de) 1987-04-28 1991-05-29 Sig Schweiz Industrieges Siegelbacke fuer verpackungsmaschinen.
JPH063354B2 (ja) 1987-06-23 1994-01-12 アクトロニクス株式会社 ル−プ型細管ヒ−トパイプ
US4830097A (en) 1987-07-15 1989-05-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Space vehicle thermal rejection system
SU1476297A2 (ru) 1987-09-28 1989-04-30 Институт Физико-Технических Проблем Энергетики Ан Литсср Теплова труба
US4807697A (en) 1988-02-18 1989-02-28 Thermacore, Inc. External artery heat pipe
USH971H (en) 1988-10-24 1991-10-01 The United States Of America As Represented By The Secretary Of The Air Force Regidized porous material and method
US5101560A (en) 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US4929414A (en) 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
US4885129A (en) 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US4931905A (en) 1989-01-17 1990-06-05 Grumman Aerospace Corporation Heat pipe cooled electronic circuit card
US4883116A (en) 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US4880052A (en) 1989-02-27 1989-11-14 Thermacore, Inc. Heat pipe cooling plate
US5059496A (en) 1989-03-23 1991-10-22 Globe-Union Inc. Nickel-hydrogen battery with oxygen and electrolyte management features
US5052472A (en) 1989-07-19 1991-10-01 Hitachi, Ltd. LSI temperature control system
KR100198380B1 (ko) 1990-02-20 1999-06-15 데이비드 엠 모이어 개방된 모관로 구조물, 모관로 구조물을 제조하기 위한 개선된 방법 및 그 방법에 사용하기 위한 압출 다이
US5242644A (en) 1990-02-20 1993-09-07 The Procter & Gamble Company Process for making capillary channel structures and extrusion die for use therein
US5160252A (en) 1990-06-07 1992-11-03 Edwards Thomas C Rotary vane machines with anti-friction positive bi-axial vane motion controls
US5711816A (en) 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
US5000256A (en) 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US5219020A (en) 1990-11-22 1993-06-15 Actronics Kabushiki Kaisha Structure of micro-heat pipe
US5076352A (en) 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US5333470A (en) 1991-05-09 1994-08-02 Heat Pipe Technology, Inc. Booster heat pipe for air-conditioning systems
US5103897A (en) 1991-06-05 1992-04-14 Martin Marietta Corporation Flowrate controller for hybrid capillary/mechanical two-phase thermal loops
DE69211074T2 (de) 1991-08-26 1996-10-02 Sun Microsystems Inc Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie
JPH0563385A (ja) 1991-08-30 1993-03-12 Hitachi Ltd ヒートパイプ付き電子機器及び計算機
US5386143A (en) 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US5253702A (en) 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
JPH0629683A (ja) 1992-03-31 1994-02-04 Furukawa Electric Co Ltd:The 電子機器用ヒートパイプ式放熱ユニット
US5283715A (en) 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US5305185A (en) 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
US5323292A (en) 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
US5305184A (en) 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5427174A (en) 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5408128A (en) 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
JPH07227631A (ja) * 1993-12-21 1995-08-29 Zexel Corp 積層型熱交換器の熱交換用導管及びその製造方法
US5522455A (en) 1994-05-05 1996-06-04 Northrop Grumman Corporation Heat pipe manifold with screen-lined insert
US5509496A (en) * 1994-06-07 1996-04-23 Murray, Inc. Lawn and garden tractor hydrostatic foot control system
US5465782A (en) 1994-06-13 1995-11-14 Industrial Technology Research Institute High-efficiency isothermal heat pipe
US5390077A (en) 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5784256A (en) 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
US5549394A (en) 1994-11-10 1996-08-27 Hycomp, Inc. Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein
US5513070A (en) 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
TW307837B (fr) 1995-05-30 1997-06-11 Fujikura Kk
JP3164518B2 (ja) * 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
US6056044A (en) 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
US5769154A (en) 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US5754401A (en) 1996-02-16 1998-05-19 Sun Microsystems, Inc. Pressure compliantly protected heatsink for an electronic device
US5642776A (en) 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
JP2806357B2 (ja) 1996-04-18 1998-09-30 日本電気株式会社 スタックモジュール
US5757621A (en) 1996-06-06 1998-05-26 Lucent Technologies Inc. Heat sink assembly employing spring-loaded standoffs
US6041211A (en) 1996-06-06 2000-03-21 W. L. Gore & Associates, Inc. Cleaning assembly for critical image surfaces in printer devices and method of using same
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6082443A (en) 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US5826645A (en) 1997-04-23 1998-10-27 Thermal Corp. Integrated circuit heat sink with rotatable heat pipe
US5880524A (en) 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US5847925A (en) 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
US5950710A (en) 1997-11-21 1999-09-14 Continocean Tech Inc. Overheat regulating system for vehicle passenger compartment
US6055157A (en) 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
CN1179187C (zh) * 1998-04-13 2004-12-08 古河电气工业株式会社 板式热管及采用热管的冷却装置
US6148906A (en) 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
TW493058B (en) * 1998-07-02 2002-07-01 Showa Denko Kk The remains of non condensing gas in heat pipe, the detecting method of non-remains, and the manufacturing method of pipes
US6239350B1 (en) * 1998-09-28 2001-05-29 Advanced Modular Power Systems Internal self heat piping AMTEC cell
JP2000124374A (ja) * 1998-10-21 2000-04-28 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
US6154364A (en) 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
US6169852B1 (en) * 1999-04-20 2001-01-02 The Hong Kong University Of Science & Technology Rapid vapor generator
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6356448B1 (en) * 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US6293333B1 (en) * 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US6317322B1 (en) * 2000-08-15 2001-11-13 The Furukawa Electric Co., Ltd. Plate type heat pipe and a cooling system using same
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US6388882B1 (en) * 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
TW551612U (en) * 2002-07-26 2003-09-01 Tai Sol Electronics Co Ltd Piercing type IC heat dissipating device
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821018A (en) * 1969-10-10 1974-06-28 Union Carbide Corp Porous metallic layer formation
US3762011A (en) * 1971-12-16 1973-10-02 Trw Inc Method of fabricating a capillary heat pipe wick
US4101691A (en) * 1976-09-09 1978-07-18 Union Carbide Corporation Enhanced heat transfer device manufacture
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
US5076351A (en) * 1989-07-19 1991-12-31 Showa Aluminum Corporation Heat pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011119174A1 (de) 2011-11-23 2013-05-23 Inheco Industrial Heating And Cooling Gmbh Vapor Chamber
WO2013075839A2 (fr) 2011-11-23 2013-05-30 Inheco Industrial Heating And Cooling Gmbh Chambre à vapeur

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US6896039B2 (en) 2005-05-24
US20040244951A1 (en) 2004-12-09
US20050217826A1 (en) 2005-10-06

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